Features
■ Combined Protection Technology (CPT)
design
■ Common mode fi lter
■ ESD protection
■ Fast response time
■ Low capacitance
■ RoHS compliant*
Applications
■ USB 2.0
■ HDMI
■ MIPI
■ MHL
ChipGuard® CGF Series ESD/EMI Filter
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
*RoHS COMPLIANT
Description
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter Min. Typ. Max. Unit
Common Mode Impedance @100 MHz 67.5 90 112.5 Ohms
Cut-off Frequency 3 GHz
DC Resistance 1.8 2.7 3.5 Ohms
Insulation Resistance 10 Megohms
Capacitance @ 1 MHz, Any Pin to Ground) 0.6 pF
Clamping Voltage @ 60 ns after ESD Event 20 V
Leakage Current @ 5 V, Any Pin to Ground) 1 µA
The Bourns® ChipGuard® CGF Series utilizes Combined Protection Technology (CPT) to create an ESD protection device and
common mode fi lter in a single space-saving device. This series features very low capacitance and superior common mode noise
rejection, making it ideal for use in high-speed differential data lines.
Circuit Diagram
General Characteristics
Operating Temperature ...........................................................................-40 °C to +85 °C
Storage Temperature ............................................................................-40 °C to +125 °C
Response Time........................................................................................................ <1 ns
Performance Standard ................................................................ IEC 61000-4-2, Level 4
How to Order
CG F 0804 TFH - 900 - 2L
ChipGuard®
Product
Designator
Common Mode Filter
Designator
Package Dimension
Code
Technology
TFH = Thin Film High-Speed
Common Mode Impedance
@ 100 MHz (90x 100)
Lines
2L = 2 Line (0804 Package)
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
GND
43
12
GND
Absolute Maximum Ratings @ 25 °C (unless otherwise noted)
Parameter Symbol Rating Unit
Rated Voltage VDC 5V
Rated Current IDC 100 mA
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
ChipGuard® CGF Series ESD/EMI Filter
Product Dimensions
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
Impedance vs. Frequency Characteristics Insertion Loss vs. Frequency Characteristics
Impedance (Ohms)
Frequency (MHz)
Differential Mode
Common Mode
S21 (dB)
Frequency (MHz)
Differential Mode
Common Mode
Test Instrument: HP4291A Impedance/Material Analyzer Test Instrument: Agilent E4071C ENA-L Network Analyzer
0.85 ± 0.05
(.033 ± .002)
0.65 ± 0.05
(.026 ± .002)
0.50 ± 0.05
(.020 ± .002)
0.40 ± 0.10
(.016 ± .004) 0.15 ± 0.10
(.006 ± .004)
0.15 ± 0.10
(.006 ± .004)
43
12
GND GND
0.15 ± 0.10
(.006 ± .004)
0.40 ± 0.10
(.016 ± .004)
0.27 ± 0.10
(.011 ± .004)
0.10 ± 0.05
(.004 ± .002)
0.40
(.016)
0.55
(.022)
0.21
(.008)
0.097
(.004)
0.35
(.014)
4
GND
3
12
GND
0.025
(.001)
0.27
(.011)
0.67
(.026)
1.18
(.046)
0.20
(.008)
1.05
(.041)
0.136
(.006)
0.121
(.005)
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
ChipGuard® CGF Series ESD/EMI Filter
Packaging Dimensions
2.0 ± 0.5
(.079 ± .020)
178 ± 2.0
(7.008 ± .079)
9.0 ± 0.5
(.354 ± .020)
13.0 ± 1.0
(.512 ± .039)
13.0 ± 0.5
(.512 ± .020)
62.0 ± 1.5
(2.441 ± .059)
21.0 ± 0.8
(.827 ± .031)
DIMENSIONS: MM
(INCHES)
REV. B 08/14
8.0 ± 0.1
(.315 ± .004)
1.75 ± 0.05
(.069 ± .002)
3.5 ± 0.05
(.138 ± 0.002)
0.60 ± 0.03
(.024 ± .0012)
1.04 ± 0.03
(.041 ± .0012)
0.78 ± 0.03
(.031 ± .0012)
2.0 ± 0.05
(.079 ± .002)
1.55 ± 0.05
(.061 ± .002)
DIA.
2.0 ± 0.05
(.079 ± .002)
4.0 ± 0.10
(.157 ± .004)
Solder Refl ow Recommendations
Per J-STD-020C
A 1st Rising The Normal to 30 s to 60 s
Temperature Preheating
Temperature
B Preheating 140 °C to 160 °C 60 s to 120 s
C 2nd Rising Preheating to 200 °C 20 s to 40 s
Temperature
D Main Heating if 220 °C 50 s ~ 60 s
if 230 °C 40 s ~ 50 s
if 240 °C 30 s ~ 40 s
if 250 °C 20 s ~ 40 s
if 260 °C 20 s ~ 40 s
E Regular Cooling 200 °C to 100 °C 1 °C/s ~ 4 °C/s
A
C
TIME
TEMPERATURE OF TERMINATION
D E
B
STANDARD = 10,000 pieces per reel
