Technical Data 4366 Effective June 2017 Supersedes April 2009 FP1206 High frequency, high current power inductors Applications * * * * * * * SMD Device Environmental data * Product features * * * * * * * * 8.0 x12.0 x 6.0mm surface mount package Ferrite core material High current carrying capacity, low core losses Designed for high speed, high current switch mode applications Controlled DCR tolerance for sensing circuits Inductance range from 120nH to 400nH Current range from 24 to 88 amps Frequency range up to 1MHz Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point of load modules DCR current sensing * * Storage temperature range (component): -40 C to +125 C Operating temperature range: -40 C to +125 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN Technical Data 4366 Effective June 2017 Product Specifications OCL1 FLL2 Irms3 Isat14 Isat25 DCR (m) 10% (nH) 120 150 250 300 400 Min. (nH) 86 108 180 216 288 (Amps) (Amps) @25C 88 70 43 34 24 (Amps) @125C 65 51 32 26 19 @20C Part 7 Number FP1206R1-R12-R FP1206R1-R15-R FP1206R1-R25-R FP1206R1-R30-R FP1206R1-R40-R 50 1 2 3 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc Full Load Inductance (FLL) Test Parameters: 100kHz, .01Vrms, Isat1 Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 4 Isat1: Peak current for approximately 20% rolloff at +25C. 0.43 6.5% K-factor6 358 358 358 358 358 5 Isat2: Peak current for approximately 20% rolloff at +125C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), I (Peak-to-peak ripple current in amps). 7 Part Number Definition: FP1206Rx-Rxx-R * FP1206 = Product code and size * Rx= DCR indicator * Rxx= Inductance value in uH, R = decimal point * -R suffix = RoHS compliant Dimensions- mm T op V iew S id e V iew a 6 .0 m ax B o tto m V iew 7 .7 0.3 2 .8 0.2 S ch em atic R eco m m ended P ad Layout 2 .0 0.2 4 .5 2 .5 1 1206Rx R xx w w llyy R 7 .7 typ. 1 1 .7 0.3 7.5 2 b The nominal DCR is measured between points "a" and "b" Rxx = Inductance value in H. (R = Decimal point). Part Marking: 1206Rx (Rx is the DCR indicator) wwllyy = Date code R = Revision level Packaging information - mm 1.5 dia 4.0 2.0 1.75 A 1.5 dia 11.5 12.4 6.4 S ection A -A Supplied in tape-and-reel packaging, 620 parts per reel, 13" diameter reel. 2 www.eaton.com/electronics 24.0 0.3 1206Rx Rxx wwllyy R 8.4 16.0 A User direction of feed FP1206 High frequency, high current power inductor Technical Data 4366 Effective June 2017 Temperature rise vs total loss 60 T em p eratu re R ise (C ) 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 T o tal L o s s (W ) Core loss vs Bp-p 1 M Hz 10 500 kH z 3 0 0 2 00 kH z k H z 100 kHz C o re L o ss (W ) 1 0.1 0.01 0.001 0.0001 100 1000 10000 Bp - p G au ss ) Inductance characteristics % o f O C L vs. % o f I s a t1 100% % of O CL 80% -40C 60% 40% + 25C +125C 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % o f I s a t1 www.eaton.com/electronics 3 FP1206 High frequency, high current power inductor Technical Data 4366 Effective June 2017 Solder Reflow Profile TP TC -5C Temperature TL 25C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s t Volume mm3 <350 235C 220C Package Thickness <2.5mm _2.5mm > Volume mm3 _350 > 220C 220C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm ts Time 25C to Peak Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak * Temperature min. (Tsmin) * Temperature max. (Tsmax) * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature Standard SnPb Solder 100C Lead (Pb) Free Solder 150C 150C 200C 60-120 Seconds 60-120 Seconds 3C/ Second Max. 3C/ Second Max. 183C 60-150 Seconds 217C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6C/ Second Max. 6C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. 4366 BU-SB09349 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. 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