Technical Data 4366 Effective June 2017
Supersedes April 2009
Product features
•8.0 x12.0 x 6.0mm surface mount package
•Ferrite core material
•High current carrying capacity, low core losses
•Designed for high speed, high current switch
mode applications
•Controlled DCR tolerance for sensing circuits
•Inductance range from 120nH to 400nH
•Current range from 24 to 88 amps
•Frequency range up to 1MHz
Applications
•Storage temperature range (component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
FP1206
High frequency, high current power inductors
Pb
HALOGEN
HF
FREE
•Multi-phase regulators
•Voltage Regulator Module (VRM)
•Desktop and server VRMs and EVRDs
•Data networking and storage systems
•Graphics cards and battery power systems
•Point of load modules
•DCR current sensing
Environmental data
SMD Device
2
Technical Data 4366
Effective June 2017
FP1206
High frequency, high current power inductors
www.eaton.com/electronics
Packaging information - mm
Dimensions- mm
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3.B
p-p:(Gauss), K:
(K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).
7 Part Number Definition: FP1206Rx-Rxx-R
• FP1206 = Product code and size
• Rx= DCR indicator
• Rxx= Inductance value in uH, R = decimal point
• -R suffix = RoHS compliant
Product Specifications
Part OCL1FLL2Irms3Isat14Isat25DCR (mΩ)
Number7± 10% (nH) Min. (nH) (Amps) (Amps) @25°C (Amps) @125°C @20°C K-factor6
FP1206R1-R12-R 120 86 88 65 358
FP1206R1-R15-R 150 108 70 51 358
FP1206R1-R25-R 250 180 50 43 32 0.43 ± 6.5% 358
FP1206R1-R30-R 300 216 34 26 358
FP1206R1-R40-R 400 288 24 19 358
Top View
Side View Bottom View Schematic
1
2
7.5
Recommended Pad Layout
4.5 2.5
2.8
± 0.2
2.0
± 0.2
7.7
typ.
a
6.0
max
11.7
± 0.3
7.7
± 0.3
1206Rx
Rxx
wwllyy R
Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level
b
The nominal DCR is measured between points “a” and “b”
Part Marking: 1206Rx (Rx is the DCR indicator)
User direction of feed
S ection A -A
A
A
6.4
1.5 dia
1.5 dia
4.0
2.0
16.0
1.75
11.5
24.0
± 0.3
12.4
8.4
1206Rx
Rxx
wwllyy R
Supplied in tape-and-reel packaging, 620 parts per reel, 13” diameter reel.
3
www.eaton.com/electronics
Technical Data 4366
Effective June 2017
Core loss vs Bp-p
Inductance characteristics
FP1206
High frequency, high current power inductor
Temperature rise vs total loss
60
50
40
30
20
10
0
0 0.5 1 1.5 2 2.5
T o tal Los s (W )
T em p eratu re R ise (°C )
1500300200 100
M H z kH z kH z k H z k H z
10
1
0.1
0.0 1
0.00 1
0.0 001
100100010000
B
p
-
p
G au ss )
Core Loss (W )
% of O C L vs. % of I
sat
1
100%
80%
-40°C
60%
40%
25°
+125°C
20%
0%
0% 20%40%60%80% 100% 120% 140%
% o f I
sat
1
% o f O C L
+ C
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4366 BU-SB09349
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4366
Effective June 2017
FP1206
High frequency, high current power inductor
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
