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DS-CPC1961-R09 1
CPC1961
Dual AC Solid State Relays
Part # Description
CPC1961G 8-Pin Dip (50/Tube)
CPC1961GS 8-Pin Surface Mount (50/Tube)
CPC1961GSTR 8-Pin Surface Mount (1000/Reel)
Parameters Ratings Units
Blocking Voltage 600 VP
AC Operating Voltage 260 Vrms
Load Current 1250 mArms
On State Voltage Drop 3 Vrms (at IL = 250mArms)
1 One Pole Operating
Applications
Features
Description
Ordering Information
Pin Configuration
• Programmable Control
• Process Control
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors
• Heaters
• Load Current up to 250 mArms
• 600VP Blocking Voltage
• 5mA Sensitivity
• Zero-Crossing Detection
• DC Control, AC Output
• Optically Isolated
• Low EMI and RFI Generation
• High Noise Immunity
• Flammability Rating UL 94 V-0
The CPC1961 is a dual single-pole AC solid state
relay that uses optical coupling with dual monolithic
SCR outputs to produce an alternative to optocoupler
and Triac circuits. The CPC1961 switches are robust
enough to provide up to a 600VP blocking voltage.
In addition, tightly controlled zero cross circuitry
ensures switching of AC loads without the generation
of transients.
The input and output circuits are optically coupled
to provide 3750Vrms of isolation and noise immunity
between control and load circuits. As a result the
CPC1961 is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of electromechanical relays.
The CPC1961 is offered in a space saving 8-pin DIP
package with two independent switches.
Approvals
• UL Recognized Component: File 69938
• CSA Certified Component: File 043639
ZC
AC Load
AC Load
– LED
+ LED
3
4
6
5
ZC
AC Load
AC Load
– LED
+ LED
1
2
8
7
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2R09
CPC1961
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameter Ratings Units
Blocking Voltage 600 VP
Reverse Input Voltage 5 VP
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Package Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Operating Voltage Range VL- 20 - 260 Vrms
Load Current 1, Continuous VL=120-240Vrms IL0.005 - 250 mArms
Non-repetitive Single Cycle Surge Current t < 10ms ITSM --1A
Off State Leakage Current VL=600V ILEAK --1µA
On-State Voltage Drop IL=250 mArms ---3V
rms
Critical Rate of Rise 2- dV/dt 500 - - V/µs
Holding Current IF=5 mA IH- 300 - µA
Switching Speeds
Turn-on IF=5 mA ton - - 0.5 cycles
Turn-off toff - - 0.5
Zero-Cross Turn-On Voltage 3
1st half-cycle - - 5 20 V
Subsequent half-cycles - - - 5 V
Operating Frequency - 20 - 500 Hz
Load Power Factor for Guaranteed Turn-On 4- PF 0.25 - - -
Input Characteristics
Input Control Current to Activate 5-I
F- 1.2 5 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Input Drop-out Voltage - 0.8 - - V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3-pF
1 Maximum continuous load current of a single pole or the sum of the load currents with both poles operating simultaneously.
2 Tested in accordance with EIA/NARM standard RS-443.
3 Zero Cross 1st half-cycle @ <100Hz
4 Snubber circuits may be required at low power factors.
5 For high noise environment use at least 10mA LED drive current.
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CPC1961
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R09
LED Forward Voltage Drop (V)
1.23 1.24 1.25 1.26 1.27
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(IF=5mA, TA=25ºC)
On-State Voltage (V)
2.1 2.2 2.3 2.4 2.5
Device Count (N)
0
5
10
15
20
25
Typical On-State Output
Forward Voltage Distribution
(IF=5mA, IL=250mA, TA=25ºC)
Blocking Voltage (VP)
735 740 745 750 755
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(IF=0mA, TA=25ºC)
LED Forward Current (mA)
1.10 1.15 1.20 1.25 1.30
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(IL=250mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF On (mA)
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Typical IF for Switch Operation
vs. Temperature
(IL=250mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF Off (mA)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Typical IF for Switch Dropout
vs. Temperature
(IL=250mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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4R09
CPC1961
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
710
720
730
740
750
760
770
780
790
Typical Blocking Voltage
vs. Temperature
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
120
140
Typical Leakage vs. Temperature
Measured Between Pins 5&6 and 7&8
(IF=0mA, VL=600V)
Time (s)
0.001 0.01 0.1 1 10 100
Current (A)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Maximum Non-Repetitive Surge Current
(TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mArms)
0
50
100
150
200
250
300
Maximum Concurrent
Total Load Current vs. Temperature
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-State Voltage (V)
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
Typical On-State Voltage
vs. Temperature
(IF=5mA, IL=250mA)
-3-2-10123
-300
-200
-100
0
100
200
300
Output Voltage (V)
Output Current (mA)
Typical Output Voltage
vs. Output Current
(IF=5mA, TA=25ºC)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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CPC1961
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R09
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1961G / CPC1961GS MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1961G 250ºC 30 seconds 1
CPC1961GS 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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CPC1961
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
CPC1961G
CPC1961GS
INTEGRATED CIRCUITS DIVISION
Specification: DS-CPC1961-R09
©Copyright 2018, IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/20/2018
For additional information please visit our website at: www.ixysic.com
7
CPC1961
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P1=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
CPC1961GSTR Tape & Reel
