Ver 201208
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
32 3.2±0.2 2.5±0.2 1.3±0.2 0.5+0.3
-0.3
41 4.5±0.2 1.6±0.2 1.6±0.2 0.5+0.3
-0.3
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For EMI
EMIEMI
EMI Suppression
SuppressionSuppression
Suppression
RECOMMENDED LAND PATTERN
CIB32/41 Series (3225/4516 / EIA 1210/1806)
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow
or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB32P310 1.3±0.2 31 0.02 3000
CIB32P600 1.3±0.2 60 0.02 1500
CIB41P800 1.6±0.2 80 0.03 1000
CIB41P151 1.6±0.2 150 0.05 1000
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
1.9mm
3.9mm
2.7mm
(3225 land Pattern)
Ver 201208
CHARACTERISTIC DATA
Ver 201208
CI B 32 P 310 N E
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) M: Multi-layer type B:Mono-layer type
(3) Dimension (4) Material Code
(5) Nominal impedance (310:31Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Size Packaging Style Quantity(pcs/reel)
3225 Embossed Taping 2,500
4516 Embossed Taping 2,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
REFLOW SOLDERING FLOW SOLDERING
