MC74HC4024D - Motorola / Freescale Semiconductor



SEMICONDUCTOR TECHNICAL DATA

1REV 6

 Motorola, Inc. 1995

10/95

   

High–Performance Silicon–Gate CMOS

The MC74HC4024 is identical in pinout to the standard CMOS MC14024.

The device inputs are compatible with standard CMOS outputs; with pullup

resistors, they are compatible with LSTTL outputs.

This device consists of 7 master–slave flip–flops. The output of each

flip–flop feeds the next and the frequency at each output is half that of the

preceding one. The state of the counter advances on the negative going

edge of the Clock input. Reset is asynchronous and active–high.

State changes of the Q outputs do not occur simultaneously because of

internal ripple delays. Therefore, decoded output signals are subject to

decoding spikes and may have to be gated with the Clock of the HC4024 for

some designs.

•Output Drive Capability: 10 LSTTL Loads

•Outputs Directly Interface to CMOS, NMOS, and TTL

•Operating Voltage Range: 2 to 6 V

•Low Input Current: 1 µA

•High Noise Immunity Characteristic of CMOS Devices

•In Compliance with the Requirements Defined by JEDEC Standard

No. 7A

•Chip Complexity: 206 FETs or 51.5 Equivalent Gates

LOGIC DIAGRAM

CLOCK

RESET

PIN 14 = VCC

PIN 7 = GND

PINS 8, 10 AND 13 = NO CONNECTION



FUNCTION TABLE

PIN ASSIGNMENT

105

VCC

RESET

CLOCK

GND

Clock Reset Output State

L No Change

L Advance to Next State

X H All Outputs are Low

NC = NO CONNECTION

D SUFFIX

SOIC PACKAGE

CASE 751A–03

N SUFFIX

PLASTIC PACKAGE

CASE 646–06

ORDERING INFORMATION

MC74HCXXXXN

MC74HCXXXXD Plastic

SOIC

MC74HC4024

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS*

ÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎ

Value

ÎÎÎ

Unit

ÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to + 7.0

ÎÎÎ

Vin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 1.5 to VCC + 1.5

ÎÎÎ

Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to VCC + 0.5

ÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Current, per Pin

ÎÎÎÎÎÎ

± 20

ÎÎÎ

Iout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per Pin

ÎÎÎÎÎÎ

± 25

ÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND Pins

ÎÎÎÎÎÎ

± 50

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

ÎÎÎÎÎÎ

750

500

ÎÎÎ

Tstg

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature

ÎÎÎÎÎÎ

– 65 to + 150

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP or SOIC Package)

ÎÎÎÎÎÎ

260

ÎÎÎ

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/

C from 65

to 125

SOIC Package: – 7 mW/

C from 65

to 125

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎ

2.0

ÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage, Output Voltage (Referenced to GND)

ÎÎÎ

VCC

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature, All Package Types

ÎÎÎ

– 55

ÎÎÎ

+ 125

ÎÎÎ

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time VCC = 2.0 V

(Figure 1) VCC = 4.5 V

VCC = 6.0 V

ÎÎÎ

1000

500

400

ÎÎÎ

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎÎ

VCC

ÎÎÎ

– 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

VIH

ÎÎÎÎÎÎÎÎÎ

Minimum High–Level Input

Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = VCC – 0.1 V

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

1.5

3.15

4.2

ÎÎÎÎ

1.5

3.15

4.2

ÎÎÎÎ

1.5

3.15

4.2

ÎÎÎ

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎ

Maximum Low–Level Input

Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC – 0.1 V

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

0.3

0.9

1.2

ÎÎÎÎ

0.3

0.9

1.2

ÎÎÎÎ

0.3

0.9

1.2

ÎÎÎ

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎ

Minimum High–Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

1.9

4.4

5.9

ÎÎÎÎ

1.9

4.4

5.9

ÎÎÎÎ

1.9

4.4

5.9

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL |Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5

6.0

ÎÎÎ

3.98

5.48

ÎÎÎÎ

3.84

5.34

ÎÎÎÎ

3.70

5.20

ÎÎÎ

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎ

Maximum Low–Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout|

20 µA

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL |Iout|

4.0 mA

|Iout|

5.2 mA

ÎÎÎÎ

4.5

6.0

ÎÎÎ

0.26

ÎÎÎÎ

0.33

ÎÎÎÎ

0.40

ÎÎÎ

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎ

Maximum Input Leakage Current

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

ÎÎÎÎ

6.0

ÎÎÎ

± 0.1

ÎÎÎÎ

± 1.0

ÎÎÎÎ

± 1.0

ÎÎÎ

µA

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎ

Maximum Quiescent Supply

Current (per Package)

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

Iout = 0 µA

ÎÎÎÎ

6.0

ÎÎÎ

ÎÎÎÎ

160

ÎÎÎ

µA

NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high–impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND

(Vin or V out)

VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

MC74HC4024

High–Speed CMOS Logic Data

DL129 — Rev 6 3 MOTOROLA

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎ

– 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

fmax

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Clock Frequency (50% Duty Cycle)

(Figures 1 and 4)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

5.4

ÎÎÎÎ

4.4

ÎÎÎÎ

3.6

ÎÎÎ

MHz

ÎÎÎÎ

tPLH,

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Clock to Q1*

(Figures 1 and 4)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

210

ÎÎÎÎ

265

ÎÎÎÎ

315

ÎÎÎ

ÎÎÎÎ

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Reset to Any Q

(Figures 2 and 4)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

210

ÎÎÎÎ

265

ÎÎÎÎ

315

ÎÎÎ

ÎÎÎÎ

tPLH,

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, QN to QN + 1

(Figures 3 and 4)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

125

ÎÎÎÎ

155

ÎÎÎÎ

190

ÎÎÎ

ÎÎÎÎ

tTLH,

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Output Transition Time, Any Output

(Figures 1 and 4)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

ÎÎÎÎ

110

ÎÎÎ

ÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input Capacitance

ÎÎÎÎ

—

ÎÎÎ

ÎÎÎÎ

ÎÎÎ

NOTES:

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

*For TA = 25

C and CL = 50 pF, typical propagation delay from Clock to other Q outputs may be calculated with the following equations:

VCC = 2.0 V: tP = [205 + 100(N – 1)] ns

VCC = 4.5 V: tP = [41 + 20(N – 1)] ns

VCC = 6.0 V: tP = [35 + 17(N – 1)] ns

CPD

Power Dissipation Capacitance (Per Package)*

Typical @ 25°C, VCC = 5.0 V

CPD Power Dissipation Capacitance (Per Package)*

*Used to determine the no–load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola High–Speed CMOS Data Book (DL129/D).

TIMING REQUIREMENTS (Input tr = tf = 6 ns)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎÎ

Unit

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎ

VCC

ÎÎÎ

– 55 to

ÎÎÎÎ

125

ÎÎÎ

Unit

ÎÎÎÎ

trec

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Minimum Recovery Time, Reset Inactive to Clock

(Figure 2)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

100

ÎÎÎÎ

125

ÎÎÎÎ

150

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Minimum Pulse Width, Clock

(Figure 1)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

ÎÎÎÎ

100

ÎÎÎÎ

120

ÎÎÎ

ÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Minimum Pulse Width, Reset

(Figure 2)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

ÎÎÎÎ

100

ÎÎÎÎ

120

ÎÎÎ

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input Rise and Fall Times

(Figure 1)

ÎÎÎÎ

2.0

4.5

6.0

ÎÎÎ

1000

500

400

ÎÎÎÎ

1000

500

400

ÎÎÎÎ

1000

500

400

ÎÎÎ

NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

MC74HC4024

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

PIN DESCRIPTIONS

INPUTS

Clock (Pin 1)

Negative edge triggering clock input. A High to low transi-

tion of this input advances the state of the counter.

Reset (Pin 2)

Active high asynchronous reset. A high level applied to this

input resets the counter to its zero state, thus forcing all Q

outputs low.

OUTPUTS

Q1–Q7 (Pins 12, 11, 9, 6, 5, 4, 3)

Active–high outputs. Each QN output divides the Clock in-

put frequency by 2N.

SWITCHING WAVEFORMS

RESET

CLOCK

VCC

GND

VCC

GND

50%

tPHL

trec

Figure 1. Figure 2.

Figure 3.

CLOCK

90%

50%

10%

VCC

GND

tftr

tPLH tPHL

tTLH tTHL

QN + 1

90%

50%

10%

VCC

GND

50%

tPLH tPHL

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

tw1/fmax

Figure 4. Test Circuit

MC74HC4024

High–Speed CMOS Logic Data

DL129 — Rev 6 5 MOTOROLA

CLOCK

RESET

1 2 3 4 8 16 32 64 128

TIMING DIAGRAM

CLOCK

RESET

EXPANDED LOGIC DIAGRAM

12 Q2

11 Q3

9Q5

5Q6

4Q7

MC74HC4024

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC DIP PACKAGE

CASE 646–06

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

1 7

14 8

H G D K

SEATING

PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.715 0.770 18.16 19.56

B0.240 0.260 6.10 6.60

C0.145 0.185 3.69 4.69

D0.015 0.021 0.38 0.53

F0.040 0.070 1.02 1.78

G0.100 BSC 2.54 BSC

H0.052 0.095 1.32 2.41

J0.008 0.015 0.20 0.38

K0.115 0.135 2.92 3.43

L0.300 BSC 7.62 BSC

M0 10 0 10

N0.015 0.039 0.39 1.01

_ _ _ _

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751A–03

ISSUE F

MIN MINMAX MAX

MILLIMETERS INCHES

DIM

8.55

3.80

1.35

0.35

0.40

0.19

0.10

5.80

0.25

8.75

4.00

1.75

0.49

1.25

0.25

6.20

0.50

0.337

0.150

0.054

0.014

0.016

0.008

0.004

0.228

0.010

0.344

0.157

0.068

0.019

0.049

0.009

0.244

0.019

1.27 BSC 0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

–A–

–B– P 7 PL

SEATING

PLANE

D 14 PL MJ

R X 45°

814

0.25 (0.010) T B A

MS S

B0.25 (0.010) M M

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MC74HC4024/D

*MC74HC4024/D*

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