XC2V3000-5FF1152I - Xilinx - Datasheet.Directory

trademarks are the property of their respective owners.

DS031 (v3.5) November 5, 2007 www.xilinx.com

Product Specification 1

Module 1:

Introduction and Overview

7pages

• Summary of Features

• General Description

• Architecture

• Device/Package Combinations and Maximum I/O

• Ordering Examples

Module 2:

Functional Description

41 pages

• Detailed Description

- Input/Output Blocks (IOBs)

- Digitally Controlled Impedance (DCI)

- Configurable Logic Blocks (CLBs)

- 18-Kb Block SelectRAM™ Resources

- 18-Bit x 18-Bit Multipliers

- Global Clock Multiplexer Buffers

- Digital Clock Manager (DCM)

•Routing

• Creating a Design

• Configuration

Module 3:

DC and Switching Characteristics

43 pages

• Electrical Characteristics

• Performance Characteristics

• Switching Characteristics

• Pin-to-Pin Output Parameter Guidelines

• Pin-to-Pin Input Parameter Guidelines

• DCM Timing Parameters

• Source-Synchronous Switching Characteristics

Module 4:

Pinout Information

226 pages

• Pin Definitions

•Pinout Tables

- CS144/CSG144 Chip-Scale BGA Package

- FG256/FGG256 Fine-Pitch BGA Package

- FG456/FGG456 Fine-Pitch BGA Package

- FG676/FGG676 Fine-Pitch BGA Package

- BG575/BGG575 Standard BGA Package

- BG728/BGG728 Standard BGA Package

- FF896 Flip-Chip Fine-Pitch BGA Package

- FF1152 Flip-Chip Fine-Pitch BGA Package

- FF1517 Flip-Chip Fine-Pitch BGA Package

- BF957Flip-Chip BGA Package

IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision

History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.

1Virtex-II Platform FPGAs:

Complete Data Sheet

DS031 (v3.5) November 5, 2007 Product Specification

trademarks are the property of their respective owners.

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 1

Summary of Virtex-II™ Features

• Industry First Platform FPGA Solution

• IP-Immersion Architecture

- Densities from 40K to 8M system gates

- 420 MHz internal clock speed (Advance Data)

- 840+ Mb/s I/O (Advance Data)

• SelectRAM™ Memory Hierarchy

- 3 Mb of dual-port RAM in 18 Kbit block SelectRAM

resources

- Up to 1.5 Mb of distributed SelectRAM resources

• High-Performance Interfaces to External Memory

- DRAM interfaces

· SDR / DDR SDRAM

·Network FCRAM

· Reduced Latency DRAM

- SRAM interfaces

· SDR / DDR SRAM

· QDR™ SRAM

- CAM interfaces

• Arithmetic Functions

- Dedicated 18-bit x 18-bit multiplier blocks

- Fast look-ahead carry logic chains

• Flexible Logic Resources

- Up to 93,184 internal registers / latches with Clock

Enable

- Up to 93,184 look-up tables (LUTs) or cascadable

16-bit shift registers

- Wide multiplexers and wide-input function support

- Horizontal cascade chain and sum-of-products

support

- Internal 3-state bussing

• High-Performance Clock Management Circuitry

- Up to 12 DCM (Digital Clock Manager) modules

· Precise clock de-skew

· Flexible frequency synthesis

· High-resolution phase shifting

- 16 global clock multiplexer buffers

• Active Interconnect Technology

- Fourth generation segmented routing structure

- Predictable, fast routing delay, independent of

fanout

• SelectIO™-Ultra Technology

- Up to 1,108 user I/Os

- 19 single-ended and six differential standards

- Programmable sink current (2 mA to 24 mA) per I/O

- Digitally Controlled Impedance (DCI) I/O: on-chip

termination resistors for single-ended I/O standards

- PCI-X compatible (133 MHz and 66 MHz) at 3.3V

- PCI compliant (66 MHz and 33 MHz) at 3.3V

- CardBus compliant (33 MHz) at 3.3V

- Differential Signaling

· 840 Mb/s Low-Voltage Differential Signaling I/O

(LVDS) with current mode drivers

· Bus LVDS I/O

· Lightning Data Transport (LDT) I/O with current

driver buffers

· Low-Voltage Positive Emitter-Coupled Logic

(LVPECL) I/O

· Built-in DDR input and output registers

- Proprietary high-performance SelectLink

Technology

· High-bandwidth data path

· Double Data Rate (DDR) link

· Web-based HDL generation methodology

• Supported by Xilinx Foundation™ and Alliance

Series™ Development Systems

- Integrated VHDL and Verilog design flows

- Compilation of 10M system gates designs

- Internet Team Design (ITD) tool

• SRAM-Based In-System Configuration

- Fast SelectMAP configuration

- Triple Data Encryption Standard (DES) security

option (Bitstream Encryption)

- IEEE 1532 support

- Partial reconfiguration

- Unlimited reprogrammability

- Readback capability

• 0.15 µm 8-Layer Metal Process with 0.12 µm

High-Speed Transistors

•1.5V (V

CCINT) Core Power Supply, Dedicated 3.3V

VCCAUX Auxiliary and VCCO I/O Power Supplies

• IEEE 1149.1 Compatible Boundary-Scan Logic

Support

• Flip-Chip and Wire-Bond Ball Grid Array (BGA)

Packages in Three Standard Fine Pitches (0.80 mm,

1.00 mm, and 1.27 mm)

• Wire-Bond BGA Devices Available in Pb-Free

Packaging (www.xilinx.com/pbfree)

• 100% Factory Tested

7Virtex-II Platform FPGAs:

Introduction and Overview

DS031-1 (v3.5) November 5, 2007 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 2

General Description

The Virtex-II family is a platform FPGA developed for high

performance from low-density to high-density designs that

are based on IP cores and customized modules. The family

delivers complete solutions for telecommunication, wire-

less, networking, video, and DSP applications, including

PCI, LVDS, and DDR interfaces.

The leading-edge 0.15 µm / 0.12 µm CMOS 8-layer metal

process and the Virtex-II architecture are optimized for high

speed with low power consumption. Combining a wide vari-

ety of flexible features and a large range of densities up to

10 million system gates, the Virtex-II family enhances pro-

grammable logic design capabilities and is a powerful alter-

native to mask-programmed gates arrays. As shown in

Table 1, the Virtex-II family comprises 11 members, ranging

from 40K to 8M system gates.

Packaging

Offerings include ball grid array (BGA) packages with

0.80 mm, 1.00 mm, and 1.27 mm pitches. In addition to tra-

ditional wire-bond interconnects, flip-chip interconnect is

used in some of the BGA offerings. The use of flip-chip

interconnect offers more I/Os than is possible in wire-bond

versions of the similar packages. Flip-chip construction

offers the combination of high pin count with high thermal

capacity.

Wire-bond packages CS, FG, and BG are optionally avail-

abe in Pb-free versions CSG, FGG, and BGG. See Virtex-II

Ordering Examples, page 6.

Table 2 shows the maximum number of user I/Os available.

The Virtex-II device/package combination table (Ta b l e 6 at

the end of this section) details the maximum number of I/Os

for each device and package using wire-bond or flip-chip

technology.

Table 1: Virtex-II Field-Programmable Gate Array Family Members

Device

System

Gates

CLB

(1 CLB = 4 slices = Max 128 bits)

Multiplier

Blocks

SelectRAM Blocks

DCMs

Max I/O

Pads(1)

Array

Row x Col. Slices

Maximum

Distributed

RAM Kbits

18 Kbit

Blocks

Max RAM

(Kbits)

XC2V40 40K 8 x 8 256 8 4 4 72 4 88

XC2V80 80K 16 x 8 512 16 8 8 144 4 120

XC2V250 250K 24 x 16 1,536 48 24 24 432 8 200

XC2V500 500K 32 x 24 3,072 96 32 32 576 8 264

XC2V1000 1M 40 x 32 5,120 160 40 40 720 8 432

XC2V1500 1.5M 48 x 40 7,680 240 48 48 864 8 528

XC2V2000 2M 56 x 48 10,752 336 56 56 1,008 8 624

XC2V3000 3M 64 x 56 14,336 448 96 96 1,728 12 720

XC2V4000 4M 80 x 72 23,040 720 120 120 2,160 12 912

XC2V6000 6M 96 x 88 33,792 1,056 144 144 2,592 12 1,104

XC2V8000 8M 112 x 104 46,592 1,456 168 168 3,024 12 1,108

Notes:

1. See details in Table 2, “Maximum Number of User I/O Pads”.

Table 2: Maximum Number of User I/O Pads

Device Wire-Bond Flip-Chip

XC2V40 88 -

XC2V80 120 -

XC2V250 200 -

XC2V500 264 -

XC2V1000 328 432

XC2V1500 392 528

XC2V2000 - 624

XC2V3000 516 720

XC2V4000 - 912

XC2V6000 - 1,104

XC2V8000 - 1,108

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 3

Architecture

Virtex-II Array Overview

Virtex-II devices are user-programmable gate arrays with

various configurable elements. The Virtex-II architecture is

optimized for high-density and high-performance logic

designs. As shown in Figure 1, the programmable device is

comprised of input/output blocks (IOBs) and internal

configurable logic blocks (CLBs).

Programmable I/O blocks provide the interface between

package pins and the internal configurable logic. Most

popular and leading-edge I/O standards are supported by

the programmable IOBs.

The internal configurable logic includes four major elements

organized in a regular array.

• Configurable Logic Blocks (CLBs) provide functional

elements for combinatorial and synchronous logic,

including basic storage elements. BUFTs (3-state

buffers) associated with each CLB element drive

dedicated segmentable horizontal routing resources.

• Block SelectRAM memory modules provide large

18 Kbit storage elements of dual-port RAM.

• Multiplier blocks are 18-bit x 18-bit dedicated

multipliers.

• DCM (Digital Clock Manager) blocks provide

self-calibrating, fully digital solutions for clock

distribution delay compensation, clock multiplication

and division, coarse- and fine-grained clock phase

shifting.

A new generation of programmable routing resources called

Active Interconnect Technology interconnects all of these

elements. The general routing matrix (GRM) is an array of

routing switches. Each programmable element is tied to a

switch matrix, allowing multiple connections to the general

routing matrix. The overall programmable interconnection is

hierarchical and designed to support high-speed designs.

All programmable elements, including the routing

resources, are controlled by values stored in static memory

cells. These values are loaded in the memory cells during

configuration and can be reloaded to change the functions

of the programmable elements.

Virtex-II Features

This section briefly describes Virtex-II features.

Input/Output Blocks (IOBs)

IOBs are programmable and can be categorized as follows:

• Input block with an optional single-data-rate or

double-data-rate (DDR) register

• Output block with an optional single-data-rate or DDR

directly or through a single or DDR register

• Bidirectional block (any combination of input and output

configurations)

These registers are either edge-triggered D-type flip-flops

or level-sensitive latches.

IOBs support the following single-ended I/O standards:

• LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, and 1.5V)

• PCI-X compatible (133 MHz and 66 MHz) at 3.3V

• PCI compliant (66 MHz and 33 MHz) at 3.3V

• CardBus compliant (33 MHz) at 3.3V

• GTL and GTLP

Figure 1: Virtex-II Architecture Overview

Global Clock Mux

DCM DCM IOB

CLB

Programmable I/Os

Block SelectRAM Multiplier

Configurable Logic

DS031_28_100900

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 4

• HSTL (Class I, II, III, and IV)

• SSTL (3.3V and 2.5V, Class I and II)

•AGP-2X

The digitally controlled impedance (DCI) I/O feature auto-

matically provides on-chip termination for each I/O element.

The IOB elements also support the following differential sig-

naling I/O standards:

•LVDS

• BLVDS (Bus LVDS)

•ULVDS

•LDT

• LVPECL

Two adjacent pads are used for each differential pair. Two or

four IOB blocks connect to one switch matrix to access the

routing resources.

Configurable Logic Blocks (CLBs)

CLB resources include four slices and two 3-state buffers.

Each slice is equivalent and contains:

• Two function generators (F & G)

• Two storage elements

• Arithmetic logic gates

• Large multiplexers

• Wide function capability

• Fast carry look-ahead chain

• Horizontal cascade chain (OR gate)

The function generators F & G are configurable as 4-input

look-up tables (LUTs), as 16-bit shift registers, or as 16-bit

distributed SelectRAM memory.

In addition, the two storage elements are either edge-trig-

gered D-type flip-flops or level-sensitive latches.

Each CLB has internal fast interconnect and connects to a

switch matrix to access general routing resources.

Block SelectRAM Memory

The block SelectRAM memory resources are 18 Kb of

dual-port RAM, programmable from 16K x 1 bit to 512 x 36

bits, in various depth and width configurations. Each port is

totally synchronous and independent, offering three

"read-during-write" modes. Block SelectRAM memory is

cascadable to implement large embedded storage blocks.

Supported memory configurations for dual-port and sin-

gle-port modes are shown in Tabl e 3 .

A multiplier block is associated with each SelectRAM mem-

ory block. The multiplier block is a dedicated 18 x 18-bit

multiplier and is optimized for operations based on the block

SelectRAM content on one port. The 18 x 18 multiplier can

be used independently of the block SelectRAM resource.

Read/multiply/accumulate operations and DSP filter struc-

tures are extremely efficient.

Both the SelectRAM memory and the multiplier resource

are connected to four switch matrices to access the general

routing resources.

Global Clocking

The DCM and global clock multiplexer buffers provide a

complete solution for designing high-speed clocking

schemes.

Up to 12 DCM blocks are available. To generate de-skewed

internal or external clocks, each DCM can be used to elimi-

nate clock distribution delay. The DCM also provides 90-,

180-, and 270-degree phase-shifted versions of its output

clocks. Fine-grained phase shifting offers high-resolution

phase adjustments in increments of 1/256 of the clock

period. Very flexible frequency synthesis provides a clock

output frequency equal to any M/D ratio of the input clock

frequency, where M and D are two integers. For the exact

timing parameters, see Virtex-II Electrical Characteristics.

Virtex-II devices have 16 global clock MUX buffers, with up

to eight clock nets per quadrant. Each global clock MUX

buffer can select one of the two clock inputs and switch

glitch-free from one clock to the other. Each DCM block is

able to drive up to four of the 16 global clock MUX buffers.

Routing Resources

The IOB, CLB, block SelectRAM, multiplier, and DCM ele-

ments all use the same interconnect scheme and the same

access to the global routing matrix. Timing models are

shared, greatly improving the predictability of the perfor-

mance of high-speed designs.

There are a total of 16 global clock lines, with eight available

per quadrant. In addition, 24 vertical and horizontal long

lines per row or column as well as massive secondary and

local routing resources provide fast interconnect. Virtex-II

buffered interconnects are relatively unaffected by net

fanout and the interconnect layout is designed to minimize

crosstalk.

Horizontal and vertical routing resources for each row or

column include:

• 24 long lines

• 120 hex lines

• 40 double lines

• 16 direct connect lines (total in all four directions)

Tabl e 3 : Dual-Port And Single-Port Configurations

16K x 1 bit 2K x 9 bits

8K x 2 bits 1K x 18 bits

4K x 4 bits 512 x 36 bits

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 5

Boundary Scan

Boundary scan instructions and associated data registers

support a standard methodology for accessing and config-

uring Virtex-II devices that complies with IEEE standards

1149.1 — 1993 and 1532. A system mode and a test mode

are implemented. In system mode, a Virtex-II device per-

forms its intended mission even while executing non-test

boundary-scan instructions. In test mode, boundary-scan

test instructions control the I/O pins for testing purposes.

The Virtex-II Test Access Port (TAP) supports BYPASS,

PRELOAD, SAMPLE, IDCODE, and USERCODE non-test

instructions. The EXTEST, INTEST, and HIGHZ test instruc-

tions are also supported.

Configuration

Virtex-II devices are configured by loading data into internal

configuration memory, using the following five modes:

• Slave-serial mode

• Master-serial mode

• Slave SelectMAP mode

• Master SelectMAP mode

• Boundary-Scan mode (IEEE 1532)

A Data Encryption Standard (DES) decryptor is available

on-chip to secure the bitstreams. One or two triple-DES key

sets can be used to optionally encrypt the configuration

information.

Readback and Integrated Logic Analyzer

Configuration data stored in Virtex-II configuration memory

can be read back for verification. Along with the configura-

tion data, the contents of all flip-flops/latches, distributed

SelectRAM, and block SelectRAM memory resources can

be read back. This capability is useful for real-time debug-

ging.

The Integrated Logic Analyzer (ILA) core and software pro-

vides a complete solution for accessing and verifying

Virtex-II devices.

Virtex-II Device/Package Combinations

and Maximum I/O

Wire-bond and flip-chip packages are available. Ta ble 4 and

Tabl e 5 show the maximum possible number of user I/Os in

wire-bond and flip-chip packages, respectively. Ta ble 6

shows the number of available user I/Os for all device/pack-

age combinations.

• CS denotes wire-bond chip-scale ball grid array (BGA)

(0.80 mm pitch).

• CSG denotes Pb-free wire-bond chip-scale ball grid

array (BGA) (0.80 mm pitch).

• FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).

• FGG denotes Pb-free wire-bond fine-pitch BGA (1.00

mm pitch).

• BG denotes standard BGA (1.27 mm pitch).

• BGG denotes Pb-free standard BGA (1.27 mm pitch).

• FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).

• BF denotes flip-chip BGA (1.27 mm pitch).

The number of I/Os per package include all user I/Os except

the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,

PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,

DXP, and RSVD) and VBATT.

Tabl e 4 : Wire-Bond Packages Information

Package(1)

CS144/

CSG144

FG256/

FGG256

FG456/

FGG456

FG676/

FGG676

BG575/

BGG575

BG728/

BGG728

Pitch (mm) 0.80 1.00 1.00 1.00 1.27 1.27

Size (mm) 12 x 12 17 x 17 23 x 23 27 x 27 31 x 31 35 x 35

I/Os 92 172 324 484 408 516

Notes:

1. Wire-bond packages include FGGnnn Pb-free versions. See Virtex-II Ordering Examples (Module 1).

Tabl e 5 : Flip-Chip Packages Information

Package FF896 FF1152 FF1517 BF957

Pitch (mm) 1.00 1.00 1.00 1.27

Size (mm) 31 x 31 35 x 35 40 x 40 40 x 40

I/Os 624 824 1,108 684

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 6

Virtex-II Ordering Examples

Tabl e 6 : Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information)

Package(1,2)

Available I/Os

XC2V

250

XC2V

500

XC2V

1000

XC2V

1500

XC2V

2000

XC2V

3000

XC2V

4000

XC2V

6000

XC2V

8000

CS144/CSG144889292--------

FG256/FGG25688120172172172------

FG456/FGG456--200264324------

FG676/FGG676 - - - - - 392 456 484 - - -

FF896 ----432528624----

FF1152 - - - - - - - 720 824 824 824

FF1517 - - - - - - - - 912 1,104 1,108

BG575/BGG575----328392408----

BG728/BGG728 - - - - - - - 516 - - -

BF957 - - - - - - 624 684 684 684 -

Notes:

1. All devices in a particular package are pinout (footprint) compatible. In addition, the FG456/FGG456 and FG676/FGG676 packages

are compatible, as are the FF896 and FF1152 packages.

2. Wire-bond packages CS144, FG256, FG456, FG676, BG575, and BG728 are also available in Pb-free versions CSG144, FGG256, FGG456,

FGG676, BGG575, and BGG728. See Virtex-II Ordering Examples for details on how to order.

Figure 2: Virtex-II Ordering Example. Regular Package

Example: XC2V1000-5FG456C

Device Type Temperature Range

C = Commercial (Tj = 0˚C to +85˚C)

I = Industrial (Tj = –40˚C to +100˚C)

Number of Pins

Package Type

Speed Grade

(-4, -5, -6)

DS031_35_033001

Figure 3: Virtex-II Ordering Example. Pb-Free Package

Example: XC2V3000-6BGG728C

Device Type Temperature Range

C = Commercial (Tj = 0˚C to +85˚C)

I = Industrial (Tj = –40˚C to +100˚C)

Number of Pins

Pb-Free Package

Package Type

Speed Grade

(-4, -5, -6)

DS031_35a_061804

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v3.5) November 5, 2007 www.xilinx.com Module 1 of 4

Product Specification 7

Revision History

This section records the change history for this module of the data sheet.

Notice of Disclaimer

THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND

CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED

WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE

SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE

PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES

THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO

APPLICABLE LAWS AND REGULATIONS.

Virtex-II Data Sheet

The Virtex-II Data Sheet contains the following modules:

•Virtex-II Platform FPGAs: Introduction and Overview

(Module 1)

•Virtex-II Platform FPGAs: Functional Description

(Module 2)

•Virtex-II Platform FPGAs: DC and Switching

Characteristics (Module 3)

•Virtex-II Platform FPGAs: Pinout Information

(Module 4)

Date Version Revision

11/07/00 1.0 Early access draft.

12/06/00 1.1 Initial release.

01/15/01 1.2 Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II

Switching Characteristics sections.

01/25/01 1.3 The data sheet was divided into four modules (per the current style standard).

04/02/01 1.5 Skipped v1.4 to sync up modules. Reverted to traditional double-column format.

07/30/01 1.6 Made minor changes to items listed under Summary of Virtex-II™ Features.

10/02/01 1.7 Minor edits.

07/16/02 1.8 Updated Virtex-II Device/Package Combinations shown in Tabl e 6 .

09/26/02 1.9 Updated Tabl e 2 and Ta b l e 6 to reflect supported Virtex-II Device/Package Combinations.

08/01/03 2.0 All Virtex-II devices and speed grades now Production. See Table 13, Module 3.

03/29/04 2.0.1 Recompiled for backward compatibility with Acrobat 4 and above. No content changes.

06/24/04 3.3 Added references to available Pb-free wire-bond packages. (Revision number advanced to

level of complete data sheet.)

03/01/05 3.4 No changes in Module 1 for this revision.