TDA7056/N2/S5 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

File under Integrated Circuits, IC01 May 1992

INTEGRATED CIRCUITS

TDA7056

3 W mono BTL audio output

amplifier

May 1992 2

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

FEATURES

•No external components

•No switch-on/off clicks

•Good overall stability

•Low power consumption

•Short circuit proof

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7056 is a mono output amplifier contained in a

9 pin medium power package.

The device is designed for battery-fed portable mono

recorders, radios and television.

QUICK REFERENCE DATA

ORDERING INFORMATION

Note

1. SOT110-1; 1996 August 21.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage 3 11 18 V

POoutput power in 16 ΩVP = 11 V 2.5 3 −W

GVinternal voltage gain 39 40.5 42 dB

IPtotal quiescent current VP = 11 V; −57mA

= ∞

THD total harmonic distortion PO = 0.5 W −0.25 1 %

EXTENDED

TYPE NUMBER PACKAGE

PINS PIN POSITION MATERIAL CODE

TDA7056 9 SIL plastic SOT110(1)

May 1992 3

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

Fig.1 Block diagram.

PINNING

PIN DESCRIPTION

1 n.c.

3 input (+)

4 signal ground

5 n.c.

6 output (+)

7 power ground

8 output (−)

9 n.c.

FUNCTIONAL DESCRIPTION

The TDA7056 is a mono output amplifier, designed for

battery-fed portable radios and mains-fed equipment such

as television. For space reasons there is a trend to

decrease the number of external components. For

portable applications there is also a trend to decrease the

number of battery cells, but still a reasonable output power

is required.

The TDA7056 fulfills both of these requirements. It needs

no peripheral components, because it makes use of the

Bridge-Tied-Load (BTL) principle. Consequently it has, at

the same supply voltage, a higher output power compared

to a conventional Single Ended output stage. It delivers an

output power of 1 W into a loudspeaker load of 8 Ωwith 6

V supply or 3 W into 16 Ωloudspeaker at 11 V without

need of an external heatsink. The gain is internally fixed at

40 dB. Special attention is given to switch-on/off click

suppression, and it has a good overall stability. The load

can be short circuited at all input conditions.

May 1992 4

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

Note

1. The load can be short-circuited at all input conditions.

THERMAL RESISTANCE

POWER DISSIPATION

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage −18 V

IORM Peak output current repetitive −1A

OSM Peak output current non-repetitive −1.5 A

Tstg storage temperature range −55 150 °C

Tjjunction temperature −150 °C

Ptot total power dissipation Tcase < 60 °C−9W

sc short circuiting time see note 1 −1hr

SYMBOL PARAMETER NOM. UNIT

Rth j-c from junction to case 10 K/W

Rth j-a from junction to ambient in free air 55 K/W

Assume: VP = 11 V; RL = 16 Ω.

The maximum sine-wave dissipation is 1.52 W.

The Rth j-a of the package is 55 K/W.

Tamb max = 150 −55 × 1.52 = 66.4 °C.

May 1992 5

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

CHARACTERISTICS

At Tamb = 25 °C; f = 1 kHz; VP = 11 V; RL = 16 Ω (see Fig.2).

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted (20 Hz to 20 kHz).

3. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ωand bandwidth = 5 kHz.

With a practical load (RL = 16 Ω, LL = 200 µH) the noise output current is only 50 nA.

4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz.

The ripple voltage (200 mV) is applied to the positive supply rail.

5. RS = 5 kΩ.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPoperating supply voltage 3 11 18 V

IORM repetitive peak output current −− 0.6 A

IPtotal quiescent current note 1 −57mA

= ∞

POoutput power THD = 10% 2.5 3 −W

THD total harmonic distortion PO = 0.5 W −0.25 1 %

Gvvoltage gain 39 40.5 42 dB

Vno noise output voltage note 2 −180 300 µV

Vno noise output voltage note 3 −60 −µV

frequency response −20 to 20.000 −Hz

RR ripple rejection note 4 36 50 −dB

∆V DC-output offset voltage note 5 −− 200 mV

|Zi| input impedance −100 −kΩ

Iiinput bias current −100 300 nA

May 1992 6

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

Fig.2 Test and application diagram.

(1) This capacitor can be omitted if the supply electrolytic capacitor is placed closer to pin 2.

May 1992 7

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

PACKAGE OUTLINE

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1.0

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 92-11-17

95-02-25

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1

May 1992 8

Philips Semiconductors Product speciﬁcation

3 W mono BTL audio output ampliﬁer TDA7056

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.