Product Guide H__1105W Series, Dome Lens Type SMT LED Applications Features * Dome lens provides intensified narrow, bright beam * Available for both standard and reverse mounting * Wider operating temperature: -40 ~ +100C * (HBG: -40 ~ +85C) * High-beam indicator for automotive use * Backlighting for automotive dashboards * Indoor / outdoor full-color signboards Outline Dimensions Recommended Solder Pad on a Surface Mount 1.6 1.5 Anode Cathode Mark 2.1 + 0.05 1.5 HOLE Polarity Mark 0.6 R0.8 (2) (4.6) 0.5 1.6 3.2 0.5 1.6 (1.6) 0.3 0.6 1.55 Recommended Solder Pad on a reverse mount Cathode 2.3+0.05 PCB Unit: mm Tolerance + 0.1 Electro-Optical Characteristics Part No. Luminous Intensity IV Material Emitted Lens Color Color MIN. TYP. IF (Ta=25C) Wavelength Forward Voltage V Reverse Viewing Current IR Angle Peak p TYP. Dominant d TYP. Spectral Line Half Width TYP. IF TYP. MAX. IF MAX. VR F (2 1/2) HKR1105W GaAlAs Red 70 150 20 660 647 25 20 1.8 2.5 20 100 4 30 HBR1105W GaAlAs Red 25 50 20 660 647 30 20 1.7 2.0 20 100 4 50 HAA1105W GaAsP Orange 10 20 20 605 606 30 20 2.2 2.5 20 100 4 HAY1105W GaAsP Yellow 20 20 580 590 30 20 2.2 2.5 20 100 4 HPY1105W GaP Yellow-Green Water 10 Clear 20 50 20 570 572 30 20 2.1 2.5 20 100 4 HPG1105W GaP Green 15 30 20 560 567 30 20 2.1 2.5 20 100 4 HBG1105W GaP Pure Green 6 12 20 555 558 30 20 2.1 2.5 20 100 4 mA A V Units mcd mA nm mA V 40 Deg. Absolute Maximum Ratings Red Item Symbol HBR, HKR Pd 60(HBR),75(HKR) Power Dissipation (Ta=25C) Orange HAA Yellow Yellow-Green Green Pure Green HAY HPY HPG HBG 75 75 75 75 75 mW Units Forward Current IF 30 30 30 30 30 30 mA Peak Forward Current IFM 70 70 70 70 70 70 mA Reverse Voltage V 4 4 4 4 4 4 V Operating Temperature Topr -40 to +100 -40 to +85 C Storage Temperature Tstg -40 to +120 -40 to +100 C IF 1.0 (DC) 2.33 (Pulse) 0.42 (DC) 0.93 (Pulse) mA/C Derating* R * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. The current derating for operation applies when the temperature is above 25C for HBG and 75C for HVR, HBR, HKR, HAA, HAY, HPY & HPG Center Hole 4+0.1 Quantity on tape: 2000 pieces per reel 2 + 0.05 ( 1.1) Center Hole Cathode Quantity on tape: 2000 pieces per reel (3.45) 8+0.2 Center Hole (0.5) (2.2) for Standard Mount Type (0.25) 1.75 +0.1 (1.85) 1.5 +0.1 0 3.5+0.05 2+0.05 ( 1.1) 4+0.1 (0.25) 8+0.2 (1.8) Taping Specifications for Reverse Mount Type 3.5 +0.05 1.5 +0.1 0 (3.5) 4+0.1 1.75 + 0.1 Taping Specifications (2.1) 2+0.5 4+0.1 21+0.8 +1 60 -0 13+0.2 13+0.2 Direction to pull Cathode RR 9+0.3 11.4+1 Operation Current Derating Chart (DC) +0 180 3 Direction to pull TR Precautions HAA, HAY, HPG, HPY, HBR, HKR Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: HBG * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: (X & Y) (X & Y) Operation Heating 150 ~ LED Surface Temperature Spatial Distribution C 240 Pre-heating Temperature rise: 5C/sec. Cooling: --5C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. HKR, HAA, HAY, HPY, HPG, HBG HBR Product specifications subject to change without notice. PGH__1105W-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com Product Guide HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED Features Applications * High brightness (InGaN/SiC) die material * Available in green (525nm), bluish-green (505nm) * and blue (470nm) colors * Reflow and dip soldering compatible * Available for both standard and reverse mounting * 1000V minimum ESD protection * Automotive indicator display * Various other backlight uses Outline Dimensions Recommended Solder Pad on a Surface Mount 0.3 0.6 1.55 1.6 1.5 Anode Cathode Mark 2.1 + 0.05 1.5 HOLE Polarity Mark 0.6 R0.8 (2) (4.6) 0.5 1.6 3.2 0.5 1.6 Recommended Solder Pad on a reverse mount (1.6) Cathode 2.3+0.05 PCB Unit: mm Tolerance + 0.1 Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Luminous Intensity IV MIN. HDG1105W InGaN/SiC HDC1105W InGaN/SiC Bluish-Green HDB1105W InGaN/SiC Units Green Blue (Ta=25C) TYP. IF 70 140 10 Water 70 140 10 Clear 35 70 10 mcd mA Forward Voltage V Wavelength Peak p TYP. Dominant d TYP. 522 525 502 467 Spectral Line Half Width TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 30 10 3.3 3.8 10 100 5 505 30 10 3.3 3.8 10 100 5 470 26 10 3.3 3.8 10 100 5 mA A V nm mA V (2 1/2) 40 Deg. Absolute Maximum Ratings (Ta=25C) Green Bluish-Green Blue Symbol HDG HDC HDB Pd 76 76 76 mW Forward Current IF 20 20 20 mA Peak Forward Current IFM 48 48 48 mA Reverse Voltage VR 5 5 5 V Item Power Dissipation Units Operating Temperature Topr -40 to +85 C Storage Temperature Tstg -40 to +100 C IF 0.28 (DC) 0.69 (Pulse) mA/C Derating* * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. Center Hole 4+0.1 3.5+0.05 2+0.05 ( 1.1) (1.85) 1.5 +0.1 0 Center Hole 8+0.2 (3.5) Quantity on tape: 2000 pieces per reel 2 + 0.05 ( 1.1) (0.5) Center Hole Cathode (2.2) for Standard Mount Type (0.25) 1.75 +0.1 4+0.1 (0.25) 8+0.2 (1.8) 3.5 +0.05 1.75 + 0.1 4+0.1 1.5 +0.1 0 Taping Specifications for Reverse Mount Type Quantity on tape: 2000 pieces per reel (3.45) Taping Specifications (2.1) 4+0.1 2+0.5 21+0.8 +1 60 -0 13+0.2 13+0.2 Direction to pull Cathode RR 9+0.3 11.4+1 Operation Current Derating Chart (DC) +0 180 3 Direction to pull TR Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. DG, DC, DB, 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: Operation Heating 150 ~ LED Surface Temperature Spatial Distribution C 240 Pre-heating Temperature rise: 5C/sec. Cooling: --5C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGHD1105W-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com Product Guide F_1105W Series, Dome Lens Type AlInGaP SMT LED Applications Features * High brightness AllnGaP die material * Dome lens provides intensified narrow, bright beam * Available for both standard and reverse mounting * Wider operating temperature: -40 ~ +100C * High-beam indicator for automotive use * Backlighting for automotive dashboards * Indoor / outdoor full-color signboards Outline Dimensions Recommended Solder Pad at Surface Mount (1.6) 0.3 0.6 1.55 1.6 1.5 Anode 2.1 + 0.05 1.5 HOLE Polarity Mark 0.6 R0.8 Cathode Mark (2) (4.6) 0.5 1.6 3.2 0.5 1.6 Recommended Solder Pad at reverse mount Cathode 2.3+0.05 PCB Unit: mm Tolerance + 0.1 Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Luminous Intensity IV MIN. FR1105W AlInGaP Red FA1105W AlInGaP Orange FY1105W AlInGaP Yellow Units (Ta=25C) TYP. IF 70 180 20 Water 70 200 20 Clear 70 180 20 mcd mA Forward Voltage V Wavelength Peak p TYP. Dominant d TYP. 635 626 609 592 Spectral Line Half Width TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 15 20 1.9 2.4 20 100 5 605 15 20 1.9 2.4 20 100 5 590 15 20 1.9 2.4 20 100 5 mA A V nm mA V (2 1/2) 50 Deg. Absolute Maximum Ratings Item Red-Orange Orange-Red Amber Symbol FR FA FY (Ta=25C) Units Pd 81 81 81 mW Forward Current IF 30 30 30 mA Peak Forward Current IFM 100 100 100 mA Reverse Voltage VR 5 5 5 V Power Dissipation -40 to +100 C Operating Temperature Topr Storage Temperature Tstg -40 to +120 C IF 1.0 (DC) 3.33 (Pulse) mA/C Derating* * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. 4+0.1 Center Hole 8+0.2 Quantity on tape: 2000 pieces per reel (0.5) 2 + 0.05 ( 1.1) Center Hole Cathode (2.2) for Standard Mount Type (0.25) 1.75 +0.1 (1.85) 3.5 +0.05 Center Hole 4+0.1 1.5 +0.1 0 3.5+0.05 2+0.05 ( 1.1) Taping Specifications (0.25) 8+0.2 (1.8) (3.5) 1.5 +0.1 0 1.75 + 0.1 4+0.1 for Reverse Mount Type Quantity on tape: 2000 pieces per reel (3.45) Taping Specifications (2.1) 2+0.5 4+0.1 21+0.8 +1 60 -0 13+0.2 13+0.2 Direction to pull Cathode RR 9+0.3 11.4+1 Operation Current Derating Chart (DC) +0 180 3 Direction to pull TR Precautions FR, FA, FY Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: Operation Heating 150 ~ (X & Y) LED Surface Temperature Spatial Distribution C 240 Pre-heating Temperature rise: 5C/sec. Cooling: --5C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. FR, FA, FY * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1105W-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com