
SEMICONDUCTOR TECHNICAL DATA
1REV 1
Motorola, Inc. 1996
11/96
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The MC74LCX125 is a high performance, non–inverting quad buffer
operating from a 2.7 to 3.6V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5V allows MC74LCX125 inputs to be safely driven from
5V devices. The MC74LCX125 is suitable for memory address driving
and all TTL level bus oriented transceiver applications.
Current drive capability is 24mA at the outputs. The Output Enable
(OEn) inputs, when HIGH, disable the outputs by placing them in a HIGH
Z condition.
Designed for 2.7 to 3.6V VCC Operation
5V Tolerant — Interface Capability With 5V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0V
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10µA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500mA
ESD Performance: Human Body Model >2000V; Machine Model >200V
Pinout: 14–Lead (Top View)
1314 12 11 10 9 8
21 34567
V
CC OE3D3 O3OE2D2 O2
OE0D0 O0OE1 D1 O1 GND
D0 2O0
3
OE0 1
D1 5O1
6
OE1 4D2 9O2
8
OE2 10
D3 12 O3
11
OE3 13
LOGIC DIAGRAM
DT SUFFIX
PLASTIC TSSOP
CASE 948G–01
14
1
SD SUFFIX
PLASTIC SSOP
CASE 940A–03
14
1
M SUFFIX
PLASTIC SOIC EIAJ
CASE 965–01
14
1
D SUFFIX
PLASTIC SOIC
CASE 751A–03
14
1
PIN NAMES
Function
Output Enable Inputs
Data Inputs
3–State Outputs
Pins
OEn
Dn
On

LOW–VOLTAGE CMOS
QUAD BUFFER
H = High Voltage Level; L = Low Voltage Level; Z = High Imped-
ance State; X = High or Low V oltage Level and T ransitions Are
Acceptable, for ICC reasons, DO NOT FLOAT Inputs
OEn Dn On
L
L
H
L
H
X
L
H
Z
INPUTS OUTPUTS
FUNCTION TABLE
MC74LCX125
MOTOROLA LCX DATA
BR1339 — REV 3
2
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Value Condition Unit
VCC DC Supply Voltage –0.5 to +7.0 V
VIDC Input Voltage –0.5 VI +7.0 V
VODC Output Voltage –0.5 VO +7.0 Output in 3–State V
–0.5 VO VCC + 0.5 Note 1. V
IIK DC Input Diode Current –50 VI < GND mA
IOK DC Output Diode Current –50 VO < GND mA
+50 VO > VCC mA
IODC Output Source/Sink Current ±50 mA
ICC DC Supply Current Per Supply Pin ±100 mA
IGND DC Ground Current Per Ground Pin ±100 mA
TSTG Storage Temperature Range –65 to +150 °C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage Operating
Data Retention Only 2.0
1.5 3.3
3.3 3.6
3.6 V
VIInput Voltage 0 5.5 V
VOOutput Voltage (HIGH or LOW State)
(3–State) 0
0VCC
5.5 V
IOH HIGH Level Output Current, VCC = 3.0V – 3.6V –24 mA
IOL LOW Level Output Current, VCC = 3.0V – 3.6V 24 mA
IOH HIGH Level Output Current, VCC = 2.7V – 3.0V –12 mA
IOL LOW Level Output Current, VCC = 2.7V – 3.0V 12 mA
TAOperating Free–Air Temperature –40 +85 °C
t/VInput Transition Rise or Fall Rate, VIN from 0.8V to 2.0V,
VCC = 3.0V 0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
VIH HIGH Level Input Voltage (Note 2.) 2.7V VCC 3.6V 2.0 V
VIL LOW Level Input Voltage (Note 2.) 2.7V VCC 3.6V 0.8 V
VOH HIGH Level Output Voltage 2.7V VCC 3.6V ; IOH = –100µA VCC 0.2 V
VCC = 2.7V ; IOH = –12mA 2.2
VCC = 3.0V ; IOH = –18mA 2.4
VCC = 3.0V ; IOH = –24mA 2.2
VOL LOW Level Output Voltage 2.7V VCC 3.6V; IOL = 100µA 0.2 V
VCC = 2.7V ; IOL= 12mA 0.4
VCC = 3.0V ; IOL = 16mA 0.4
VCC = 3.0V ; IOL = 24mA 0.55
2. These values of VI are used to test DC electrical characteristics only.
MC74LCX125
LCX DATA
BR1339 — REV 3 3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
IIInput Leakage Current 2.7V VCC 3.6V ; 0V VI 5.5V ±5.0 µA
IOZ 3–State Output Current 2.7 VCC 3.6V ; 0V VO 5.5V;
VI = VIH or V IL ±5.0 µA
IOFF Power–Of f Leakage Current VCC = 0V ; VI or VO = 5.5V 10 µA
ICC Quiescent Supply Current 2.7 VCC 3.6V ; VI = GND or VCC 10 µA
2.7 VCC 3.6V; 3.6 VI or VO 5.5V ±10 µA
ICC Increase in ICC per Input 2.7 VCC 3.6V ; VIH = VCC – 0.6V 500 µA
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V VCC = 2.7V
Symbol Parameter Waveform Min Max Max Unit
tPLH
tPHL Propagation Delay
Input to Output 1 1.5
1.5 6.0
6.0 6.5
6.5 ns
tPZH
tPZL Output Enable T ime to
High and Low Level 2 1.5
1.5 7.0
7.0 8.0
8.0 ns
tPHZ
tPLZ Output Disable T ime From
High and Low Level 2 1.5
1.5 6.0
6.0 7.0
7.0 ns
tOSHL
tOSLH Output–to–Output Skew
(Note 3.) 1.0
1.0 ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol Characteristic Condition Min Typ Max Unit
VOLP Dynamic LOW Peak Voltage (Note 4.) VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V 0.8 V
VOLV Dynamic LOW Valley Voltage (Note 4.) VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V 0.8 V
4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
CIN Input Capacitance VCC = 3.3V, VI = 0V or VCC 7pF
COUT Output Capacitance VCC = 3.3V, VI = 0V or VCC 8pF
CPD Power Dissipation Capacitance 10MHz, VCC = 3.3V, VI = 0V or VCC 25 pF
MC74LCX125
MOTOROLA LCX DATA
BR1339 — REV 3
4
WAVEFORM 1 – PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
0V
VOH
VOL
Dn
On
tPHL
tPLH
WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
0V
0V
OEn
On
tPZH
3.0V
tPHZ
tPZL tPLZ
On
1.5V
1.5V
1.5V1.5V
1.5V 1.5V
Figure 1. AC Waveforms
1.5V
VCC
VOH – 0.3V
VOL + 0.3V
GND
OPEN
PULSE
GENERATOR
RT
DUT
VCC
RL
R1
CL
6V
GND
TEST SWITCH
tPLH, tPHL Open
tPZL, tPLZ 6V
Open Collector/Drain tPLH and tPHL 6V
tPZH, tPHZ GND
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 or equivalent
RT = ZOUT of pulse generator (typically 50)
Figure 2. Test Circuit
MC74LCX125
LCX DATA
BR1339 — REV 3 5 MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–B
P 7 PL
GC
K
SEATING
PLANE
D 14 PL MJ
R X 45°
17
814
0.25 (0.010) T B A
MS S
B0.25 (0.010) M M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
ZD
HE
E
1
14 8
7
bA1
A
e
L
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A1
A
b
c
D
E
e
L
M
Z
HE
Q1
LE
_
10
_
0
_
10
_
LEQ1
c
M
_
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
MC74LCX125
MOTOROLA LCX DATA
BR1339 — REV 3
6
OUTLINE DIMENSIONS
DIM
AMIN MAX MIN MAX
INCHES
6.07 6.33 0.238 0.249
MILLIMETERS
B5.20 5.38 0.205 0.212
C1.73 1.99 0.068 0.078
D0.05 0.21 0.002 0.008
F0.63 0.95 0.024 0.037
G0.65 BSC 0.026 BSC
H1.08 1.22 0.042 0.048
J0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
9 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
H
A
B
14 8
71
F
M
K14X REF
S
U
M
0.12 (0.005) V S
T
L
L/2
PIN 1
IDENT
S
U
M
0.20 (0.008) T
–V– –U–
D
C
0.076 (0.003)
G
–T–
SEATING
PLANE
DETAIL E
DETAIL E
–W–
N
N
0.25 (0.010)
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
K
JJ1
K1
SECTION N–N
L7.65 7.90 0.301 0.311
M0 8 0 8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
ISSUE B
MC74LCX125
LCX DATA
BR1339 — REV 3 7 MOTOROLA
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MC74LCX125/D