MBR130LSFT1G - ON Semiconductor - Datasheet.Directory

July, 2005 − Rev. 2 1Publication Order Number:

MBR130LSFT1/D

MBR130LSFT1

Surface Mount

Schottky Power Rectifier

Plastic SOD−123 Package

This device uses the Schottky Barrier principle with a large area

metal−to−silicon power diode. Ideally suited for low voltage, high

frequency rectification or as free wheeling and polarity protection

diodes in surface mount applications where compact size and weight

are critical to the system. This package also provides an easy to work

with alternative to leadless 34 package style. Because of its small size,

it is ideal for use in portable and battery powered products such as

cellular and cordless phones, chargers, notebook computers, printers,

PDAs and PCMCIA cards. Typical applications are AC−DC and

DC−DC converters, reverse battery protection, and “Oring” of

multiple supply voltages and any other application where performance

and size are critical.

Features

•Guardring for Stress Protection

•Low Forward Voltage

•125°C Operating Junction Temperature

•Epoxy Meets UL 94 V−0

•Package Designed for Optimal Automated Board Assembly

•ESD Ratings: Machine Model, C

Human Body Model, 3B

•Pb−Free Package is Available

Mechanical Characteristics

•Reel Options: MBR130LSFT1 = 3,000 per 7 in reel/8 mm tape

•Device Marking: L3L

•Polarity Designator: Cathode Band

•Weight: 11.7 mg (approximately)

•Case: Epoxy, Molded

•Lead Finish: 100% Matte Sn (Tin)

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Device Meets MSL 1 Requirements

Preferred devices are recommended choices for future use

and best overall value.

MARKING DIAGRAM

L3L = Specific Device Code

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

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SOD−123FL

CASE 498

PLASTIC

SCHOTTKY BARRIER

RECTIFIER

1.0 AMPERES

30 VOLTS

Device Package Shipping†

ORDERING INFORMATION

MBR130LSFT1 SOD−123FL 3000/Tape & Ree

† For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specificatio

Brochure, BRD8011/D.

MBR130LSFT1G SOD−123FL

(Pb−Free) 3000/Tape & Ree

L3LMG

MBR130LSFT1

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MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

30 V

Average Rectified Forward Current (At Rated VR, TL = 117°C) IO1.0 A

Peak Repetitive Forward Current

(At Rated VR, Square Wave, 100 kHz, TL = 110°C) IFRM 2.0 A

Non−Repetitive Peak Surge Current

(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz) IFSM 40 A

Storage Temperature Tstg −55 to 150 °C

Operating Junction Temperature TJ−55 to 125 °C

Voltage Rate of Change (Rated VR, TJ = 25°C) dv/dt 10,000 V/ms

THERMAL CHARACTERISTICS

Thermal Resistance, Junction−to−Lead (Note 1)

Thermal Resistance, Junction−to−Lead (Note 2)

Thermal Resistance, Junction−to−Ambient (Note 1)

Thermal Resistance, Junction−to−Ambient (Note 2)

Rtjl

Rtja

325

°C/W

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. Mounted with minimum recommended pad size, PC Board FR4.

2. Mounted with 1 in. copper pad (Cu area 700 mm2).

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (Note 3) VFTJ = 25°C TJ = 100°CV

(IF = 0.1 A)

(IF = 0.7 A)

(IF = 1.0 A)

0.29

0.36

0.38

0.18

0.27

0.30

Maximum Instantaneous Reverse Current (Note 3) IRTJ = 25°C TJ = 100°CmA

(VR = 30 V) 1.0 25

3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤2%.

MBR130LSFT1

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TYPICAL CHARACTERISTICS

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

0.1

VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

0.10 0.30 0.50

TJ = 125°C

TJ = −55°C

TJ = 25°C

IF, INSTANTANEOUS FORWARD

CURRENT (AMPS)

VR, REVERSE VOLTAGE (VOLTS)

100E−3

10E−3

10E−6

100E−6

3020100

, REVERSE CURRENT (AMPS)

100E−9

TJ = 125°C

0.20 0.40 0.80

TJ = 100°C

0.1

VF, MAXIMUM INSTANTANEOUS FORWARD

VOLTAGE (VOLTS)

0.10 0.30 0.50

TJ = 125°C

TJ = −55°C

TJ = 25°C

IF, INSTANTANEOUS FORWARD

CURRENT (AMPS)

0.20 0.40 0.7

TJ = 100°C

0.60

1E−3

1E−6

10E−9

1E−9

TJ = −55°C

TJ = 25°C

TJ = 100°C

VR, REVERSE VOLTAGE (VOLTS)

100E−3

10E−3

10E−6

100E−6

20100

IR, MAXIMUM REVERSE CURRENT (AMPS)

TJ = 125°C

1E−3

1E+0

TJ = −55°C

TJ = 25°C

TJ = 100°C

Figure 5. Current Derating

25 45 8565

1.0

, AVERAGE FORWARD CURRENT (AMPS)

TL, LEAD TEMPERATURE (°C)

Figure 6. Forward Power Dissipation

0.2 0.6 0.8 1.20 0.4 1

0.6

0.3

IO, AVERAGE FORWARD CURRENT (AMPS)

PFO, AVERAGE POWER DISSIPATION (WATTS)

0.2

0.4

0.6

0.8

1.8

1.2

1.4

1.6

SQUARE WAVE

Ipk/IO = 20

1.4 1.

1.6

0.1

0.2

0.5

0.4

105 145125

Ipk/IO = 10

Ipk/IO = 5

Ipk/IO = p

freq = 20 kHz

SQUARE

WAVE

Ipk/IO = p

Ipk/IO = 5

Ipk/IO = 10

Ipk/IO = 20

0.60 0.70

MBR130LSFT1

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TYPICAL CHARACTERISTICS

Figure 7. Capacitance Figure 8. Typical Operating Temperature

Derating

VR, REVERSE VOLTAGE (VOLTS) 302520151050

1000

C, CAPACITANCE (pF)

VR, DC REVERSE VOLTAGE (VOLTS)

1412108620

115

105

125

TJ, DERATED OPERATING TEMPERATURE (°C)

TJ = 25 °C

1816

RqJA = 25.6 °C/W

RqJA = 400 °C/W

RqJA = 130 °C/W

RqJA = 324.9 °C/W

RqJA = 235 °C/W

100

110

100

120

r(t), TRANSIENT THERMAL RESISTANCE

Figure 9. Thermal Response

100

0.10.00001

t1, TIME (sec)

1000

0.0001 0.001 0.01 1 10 1000.000001

0.1

100

P(pk)

DUTY CYCLE, D = t1/t2

qJA = 321.8 °C/W

Test Type > Min Pad < Die Size 38x38 @ 75% mils

D = 0.5

SINGLE PULSE

0.2

0.1

0.05

0.01

MBR130LSFT1

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PACKAGE DIMENSIONS

SOD−123LF

CASE 498−01

ISSUE A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

POLARITY INDICATOR

OPTIONAL AS NEEDED

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.

4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT

SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM

FROM THE LEAD TIP.

DIM

AMIN NOM MAX MIN

MILLIMETERS

0.90 0.95 1.00 0.035

INCHES

A1 0.00 0.05 0.10 0.000

b0.70 0.90 1.10 0.028

c0.10 0.15 0.20 0.004

D1.50 1.65 1.80 0.059

E2.50 2.70 2.90 0.098

L0.55 0.75 0.95 0.022

0.037 0.039

0.002 0.004

0.035 0.043

0.006 0.008

0.065 0.071

0.106 0.114

0.030 0.037

NOM MAX

3.40 3.60 3.80 0.134 0.142 0.150

HE− −

0°8°0°8°

1.22

0.048

ÉÉ

0.91

0.036

2.36

0.093

4.19

0.165

ǒmm

inchesǓ

SCALE 10:1

ÉÉ

MBR130LSFT1

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MBR130LSFT1/D

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