1. General description
The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC244; 74HCT244 has octal non-inverting buffer/line drivers with 3-state outputs.
The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244;
74HCT244 is identical to the 74HC240; 74HCT240 but has non-inverting outputs.
2. Features
■Octal bus interface
■Non-inverting 3-state outputs
■Complies with JEDEC standard no. 7A
■ESD protection:
◆HBM EIA/JESD22-A114-C exceeds 2000 V
◆MM EIA/JESD22-A115-A exceeds 200 V
■Multiple package options
■Specified from −40 °Cto+85°C and from −40 °C to +125 °C
3. Quick reference data
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD=C
PD ×VCC2×fi×N+∑(CL×VCC2×fo) where:
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 03 — 22 December 2005 Product data sheet
Table 1: Quick reference data
GND = 0 V; T
amb
=25
°
C; t
r
=t
f
= 6 ns
Symbol Parameter Conditions Min Typ Max Unit
74HC244
tPHL,
tPLH
propagation delay
nAn to nYn VCC =5V; C
L=15pF - 9 - ns
Ciinput capacitance - 3.5 - pF
CPD power dissipation
capacitance per buffer; VI= GND to
VCC
[1] -35-pF
74HCT244
tPHL,
tPLH
propagation delay
nAn to nYn VCC =5V; C
L=15pF - 11 - ns
Ciinput capacitance - 3.5 - pF
CPD power dissipation
capacitance per buffer; VI= GND to
(VCC −1.5 V) [1] -35-pF
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 2 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL×VCC2×fo) = sum of outputs.
4. Ordering information
Table 2: Ordering information
Type number Package
Temperature range Name Description Version
74HC244
74HC244N −40 °C to +125 °C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
74HC244D −40 °C to +125 °C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
74HC244DB −40 °C to +125 °C SSOP20 plastic shrink small outline package; 20 leads;
body width 5.3 mm SOT339-1
74HC244PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
74HC244BQ −40 °C to +125 °C DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 ×4.5 × 0.85 mm
SOT764-1
74HCT244
74HCT244N −40 °C to +125 °C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
74HCT244D −40 °C to +125 °C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
74HCT244DB −40 °C to +125 °C SSOP20 plastic shrink small outline package; 20 leads;
body width 5.3 mm SOT339-1
74HCT244PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
74HCT244BQ −40 °C to +125 °C DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 ×4.5 ×0.85 mm
SOT764-1
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 3 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Functional diagram
Fig 1. Functional diagram
mna875
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
Fig 2. Logic symbol Fig 3. IEC logic symbol
mna874
8
6
4
2
1A0
1A1
1A2
1A3
1OE
18
16
1Y0
1Y1
1Y2
1Y3
14
12
1
11
13
15
17
2A0
2A1
2A2
2A3
2OE
3
5
2Y0
2Y1
2Y2
2Y3
7
9
19
12
14
2
4
6
8
18
16
1EN
mna873
3
5
11
13
15
17
9
7
19 EN
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 4 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
6. Pinning information
6.1 Pinning
6.2 Pin description
(1) The die substrate is attached to this
pad using conductive die attach
material. It can not be used as supply
pin or input
Fig 4. Pin configuration DIP20, SO20,
SSOP20 and TSSOP20 Fig 5. Pin configuration DHVQFN20
74HC244
74HCT244
1OE VCC
1A0 2OE
2Y0 1Y0
1A1 2A0
2Y1 1Y1
1A2 2A1
2Y2 1Y2
1A3 2A2
2Y3 1Y3
GND 2A3
001aae011
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
001aae012
74HC244
74HCT244
Transparent top view
1Y3
1A3
2Y3
2A2
2Y2 1Y2
1A2 2A1
2Y1 1Y1
1A1 2A0
2Y0 1Y0
1A0 2OE
GND
2A3
1OE
VCC
912
8 13
7 14
6 15
5 16
4 17
3 18
2 19
10
11
1
20
terminal 1
index area
GND(1)
Table 3: Pin description
Symbol Pin Description
1OE 1 1 output enable input (active LOW)
1A0 2 1 data input 0
2Y0 3 2 bus output 0
1A1 4 1 data input 1
2Y1 5 2 bus output 1
1A2 6 1 data input 2
2Y2 7 2 bus output 2
1A3 8 1 data input 3
2Y3 9 2 bus output 3
GND 10 ground (0 V)
2A3 11 2 data input 3
1Y3 12 1 bus output 3
2A2 13 2 data input 2
1Y2 14 1 bus output 2
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 5 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
7. Functional description
7.1 Function table
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
8. Limiting values
2A1 15 2 data input 1
1Y1 16 1 bus output 1
2A0 17 2 data input 0
1Y0 18 1 bus output 0
2OE 19 2 output enable input (active LOW)
VCC 20 supply voltage
Table 3: Pin description
…continued
Symbol Pin Description
Table 4: Function table[1]
Control Input Output
nOE nAn nYn
LLL
HH
HXZ
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7 V
IIK input clamping current VI < −0.5 V or VI>V
CC + 0.5 V - ±20 mA
IOK output clamping current VO<−0.5 V or
VO>V
CC + 0.5 V -±20 mA
IOoutput current VO = −0.5 V to (VCC + 0.5 V) - ±35 mA
ICC quiescent supply current - 70 mA
IGND ground current - −70 mA
Tstg storage temperature −65 +150 °C
Ptot total power dissipation
DIP20 package [1] - 750 mW
SO20 package [2] - 500 mW
SSOP20 package [3] - 500 mW
TSSOP20 package [3] - 500 mW
DHVQFN20 package [4] - 500 mW
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 6 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
[1] For DIP20 package: Ptot derates linearly with 12 mW/K above 70 °C.
[2] For SO20 package: Ptot derates linearly with 8 mW/K above 70 °C.
[3] For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 °C
[4] For DHVQFN20 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.
9. Recommended operating conditions
10. Static characteristics
Table 6: Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
74HC244
VCC supply voltage 2.0 5.0 6.0 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
Tamb ambient temperature −40 25 +125 °C
tr, tfinput rise and fall time VCC = 2.0 V - - 1000 ns
VCC = 4.5 V - 6.0 500 ns
VCC = 6.0 V - - 400 ns
74HCT244
VCC supply voltage 4.5 5.0 5.5 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
Tamb ambient temperature −40 25 +125 °C
tr, tfinput rise and fall time VCC = 4.5 V - 6.0 500 ns
Table 7: Static characteristics 74HC244
At recommended operating conditions; voltages are referenced to GND (ground = 0V).
Symbol Parameter Conditions Min Typ Max Unit
Tamb =25°C
VIH HIGH-state input voltage VCC = 2.0 V 1.5 1.2 - V
VCC = 4.5 V 3.15 2.4 - V
VCC = 6.0 V 4.2 3.2 - V
VIL LOW-state input voltage VCC = 2.0 V - 0.8 0.5 V
VCC = 4.5 V - 2.1 1.35 V
VCC = 6.0 V - 2.8 1.8 V
VOH HIGH-state output voltage VI = VIH or VIL ---
IO=−20 µA; VCC = 2.0 V 1.9 2.0 - V
IO=−20 µA; VCC = 4.5 V 4.4 4.5 - V
IO=−20 µA; VCC = 6.0 V 5.9 6.0 - V
IO=−6.0 mA; VCC = 4.5 V 3.98 4.32 - V
IO=−7.8 mA; VCC = 6 V 5.48 5.81 - V
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 7 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
VOL LOW-state output voltage VI = VIH or VIL
IO=20µA; VCC = 2.0 V - 0 0.1 V
IO=20µA; VCC = 4.5 V - 0 0.1 V
IO=20µA; VCC = 6.0 V - 0 0.1 V
IO= 6.0 mA; VCC = 4.5 V - 0.15 0.26 V
IO= 7.8 mA; VCC = 6 V - 0.16 0.26 V
ILI input leakage current VI=V
CC or GND; VCC = 6 V - - ±0.1 µA
IOZ OFF-state output current VI = VIH or VIL; VO=V
CC or GND - - ±0.5 µA
ICC quiescent supply current VI=V
CC or GND; IO = 0 A;
VCC = 6.0 V - - 8.0 µA
Ciinput capacitance - 3.5 - pF
Tamb =−40 °C to +85 °C
VIH HIGH-state input voltage VCC = 2.0 V 1.5 - - V
VCC = 4.5 V 3.15 - - V
VCC = 6.0 V 4.2 - - V
VIL LOW-state input voltage VCC = 2.0 V - - 0.5 V
VCC = 4.5 V - - 1.35 V
VCC = 6.0 V - - 1.8 V
VOH HIGH-state output voltage VI = VIH or VIL
IO=−20 µA; VCC = 2.0 V 1.9 - - V
IO=−20 µA; VCC = 4.5 V 4.4 - - V
IO=−20 µA; VCC = 6.0 V 5.9 - - V
IO=−6.0 mA; VCC = 4.5 V 3.84 - - V
IO=−7.8 mA; VCC = 6 V 5.34 - - V
VOL LOW-state output voltage VI = VIH or VIL
IO=20µA; VCC = 2.0 V - - 0.1 V
IO=20µA; VCC = 4.5 V - - 0.1 V
IO=20µA; VCC = 6.0 V - - 0.1 V
IO = 6.0 mA; VCC = 4.5 V - - 0.33 V
IO = 7.8 mA; VCC = 6 V - - 0.33 V
ILI input leakage current VI=V
CC or GND; VCC = 6 V - - ±1.0 µA
IOZ OFF-state output current VI = VIH or VIL; VO=V
CC or GND - - ±5.0 µA
ICC quiescent supply current VI=V
CC or GND; IO = 0 A;
VCC = 6.0 V --80µA
Table 7: Static characteristics 74HC244
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0V).
Symbol Parameter Conditions Min Typ Max Unit
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 8 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Tamb =−40 °C to +125 °C
VIH HIGH-state input voltage VCC = 2.0 V 1.5 - - V
VCC = 4.5 V 3.15 - - V
VCC = 6.0 V 4.2 - - V
VIL LOW-state input voltage VCC = 2.0 V - - 0.5 V
VCC = 4.5 V - - 1.35 V
VCC = 6.0 V - - 1.8 V
VOH HIGH-state output voltage VI = VIH or VIL
IO=−20 µA; VCC = 2.0 V 1.9 - - V
IO=−20 µA; VCC = 4.5 V 4.4 - - V
IO=−20 µA; VCC = 6.0 V 5.9 - - V
IO=−6.0 mA; VCC = 4.5 V 3.7 - - V
IO=−7.8 mA; VCC = 6 V 5.2 - - V
VOL LOW-state output voltage VI = VIH or VIL
IO=20µA; VCC = 2.0 V - - 0.1 V
IO=20µA; VCC = 4.5 V - - 0.1 V
IO=20µA; VCC = 6.0 V - - 0.1 V
IO = 6.0 mA; VCC = 4.5 V - - 0.4 V
IO = 7.8 mA; VCC = 6 V - - 0.4 V
ILI input leakage current VI=V
CC or GND; VCC = 6 V - - ±1.0 µA
IOZ OFF-state output current VI = VIH or VIL; VO=V
CC or GND - - ±10.0 µA
ICC quiescent supply current VI=V
CC or GND; IO = 0 A;
VCC = 6.0 V - - 160 µA
Table 7: Static characteristics 74HC244
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0V).
Symbol Parameter Conditions Min Typ Max Unit
Table 8: Static characteristics 74HCT244
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Tamb =25°C
VIH HIGH-state input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - V
VIL LOW-state input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 V
VOH HIGH-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=−20 µA 4.4 4.5 - V
IO=−6.0 mA 3.98 4.32 - V
VOL LOW-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=20µA - 0 0.1 V
IO= 6.0 mA - 0.16 0.26 V
ILI input leakage current VI=V
CC or GND; VCC = 5.5 V - - ±0.1 µA
IOZ OFF-state output current per input pin; VI = VIH or VIL;
VO=V
CC or GND; other pins at GND
or VCC; IO= 0 A; VCC = 5.5 V
--±0.5 µA
ICC quiescent supply current VI=V
CC or GND; IO=0A;
VCC = 5.5 V - - 8.0 µA
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 9 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
∆ICC additional quiescent supply
current per input pin; VI=V
CC −2.1 V; other
inputs at VCC or GND; IO=0A;
VCC = 4.5 V to 5.5 V
70 252 µA
Ciinput capacitance - 3.5 - pF
Tamb =−40 °C to +85 °C
VIH HIGH-state input voltage VCC = 4.5 V to 5.5 V 2.0 - - V
VIL LOW-state input voltage VCC = 4.5 V to 5.5 V - - 0.8 V
VOH HIGH-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=−20 µA 4.4 - - V
IO=−6.0 mA 3.84 - - V
VOL LOW-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=20µA - - 0.1 V
IO= 6.0 mA - - 0.33 V
ILI input leakage current VI=V
CC or GND; VCC = 5.5 V - - ±1.0 µA
IOZ OFF-state output current per input pin; VI = VIH or VIL;
VO=V
CC or GND; other pins at GND
or VCC; IO= 0 A; VCC = 5.5 V
±5.0 µA
ICC quiescent supply current VI=V
CC or GND; IO=0A;
VCC = 5.5 V --80µA
∆ICC additional quiescent supply
current per input pin; VI=V
CC −2.1 V; other
inputs at VCC or GND; IO=0A;
VCC = 4.5 V to 5.5 V
- - 315 µA
Tamb =−40 °C to +125 °C
VIH HIGH-state input voltage VCC = 4.5 V to 5.5 V 2.0 - - V
VIL LOW-state input voltage VCC = 4.5 V to 5.5 V - - 0.8 V
VOH HIGH-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=−20 µA 4.4 - - V
IO=−6.0 mA 3.7 - - V
VOL LOW-state output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=20µA - - 0.1 V
IO= 6.0 mA - - 0.4 V
ILI input leakage current VI=V
CC or GND; VCC = 5.5 V - - ±1.0 µA
IOZ OFF-state output current per input pin; VI = VIH or VIL;
VO=V
CC or GND; other pins at GND
or VCC; IO= 0 A; VCC = 5.5 V
--±10.0 µA
ICC quiescent supply current VI=V
CC or GND; IO=0A;
VCC = 5.5 V - - 160 µA
∆ICC additional quiescent supply
current per input pin; VI=V
CC −2.1 V; other
inputs at VCC or GND; IO=0A;
VCC = 4.5 V to 5.5 V
- - 343 µA
Table 8: Static characteristics 74HCT244
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 10 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
11. Dynamic characteristics
Table 9: Dynamic characteristics 74HC244
GND = 0 V; t
r
=t
f
= 6 ns; C
L
= 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Min Typ Max Unit
Tamb = 25 °C
tPHL,
tPLH
propagation delay nAn to nYn see Figure 6
VCC = 2.0 V - 30 110 ns
VCC = 4.5 V - 11 22 ns
VCC = 5 V; CL=15pF - 9 - ns
VCC = 6.0 V - 9 19 ns
tPZH,
tPZL
3-state output enable time
nOE to nYn see Figure 7
VCC = 2.0 V - 36 150 ns
VCC = 4.5 V - 13 30 ns
VCC = 6.0 V - 10 26 ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn see Figure 7
VCC = 2.0 V - 39 150 ns
VCC = 4.5 V - 14 30 ns
VCC = 6.0 V - 11 26 ns
tTHL,
tTLH
output transition time see Figure 6
VCC = 2.0 V - 14 60 ns
VCC = 4.5 V - 5 12 ns
VCC = 6.0 V - 4 10 ns
CPD power dissipation
capacitance VI= GND to VCC [1] -35-pF
Tamb = −40 °C to +85 °C
tPHL,
tPLH
propagation delay nAn to nYn see Figure 6
VCC = 2.0 V - - 145 ns
VCC = 4.5 V - - 28 ns
VCC = 6.0 V - - 24 ns
tPZH,
tPZL
3-state output enable time
nOE to nYn see Figure 7
VCC = 2.0 V - - 190 ns
VCC = 4.5 V - - 38 ns
VCC = 6.0 V - - 33 ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn see Figure 7
VCC = 2.0 V - - 190 ns
VCC = 4.5 V - - 38 ns
VCC = 6.0 V - - 33 ns
tTHL,
tTLH
output transition time see Figure 6
VCC = 2.0 V - - 75 ns
VCC = 4.5 V - - 15 ns
VCC = 6.0 V - - 13 ns
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 11 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD=C
PD ×VCC2×fi×N+∑(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL×VCC2×fo) = sum of outputs.
Tamb = −40 °C to +125 °C
tPHL,
tPLH
propagation delay nAn to nYn see Figure 6
VCC = 2.0 V - - 165 ns
VCC = 4.5 V - - 33 ns
VCC = 6.0 V - - 28 ns
tPZH,
tPZL
3-state output enable time
nOE to nYn see Figure 7
VCC = 2.0 V - - 225 ns
VCC = 4.5 V - - 45 ns
VCC = 6.0 V - - 38 ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn see Figure 7
VCC = 2.0 V - - 225 ns
VCC = 4.5 V - - 45 ns
VCC = 6.0 V - - 38 ns
tTHL,
tTLH
output transition time see Figure 6
VCC = 2.0 V - - 90 ns
VCC = 4.5 V - - 18 ns
VCC = 6.0 V - - 15 ns
Table 9: Dynamic characteristics 74HC244
…continued
GND = 0 V; t
r
=t
f
= 6 ns; C
L
= 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Min Typ Max Unit
Table 10: Dynamic characteristics type 74HCT244
GND = 0 V; t
r
=t
f
= 6 ns; C
L
= 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Min Typ Max Unit
Tamb = 25 °C
tPHL,
tPLH
propagation delay nAn to nYn see Figure 6
VCC = 4.5 V - 13 22 ns
VCC = 5 V; CL=15pF - 11 - ns
tPZH,
tPZL
3-state output enable time
nOE to nYn VCC = 4.5 V; see Figure 7 - 1530ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn VCC = 4.5 V; see Figure 7 - 1525ns
tTHL,
tTLH
output transition time VCC = 4.5 V; see Figure 6 - 5 12 ns
CPD power dissipation
capacitance VI= GND to (VCC −1.5 V) [1] -35-pF
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 12 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD=C
PD ×VCC2×fi×N+∑(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL×VCC2×fo) = sum of outputs.
12. Waveforms
Tamb = −40 °C to +85 °C
tPHL,
tPLH
propagation delay nAn to nYn VCC = 4.5 V; see Figure 6 --28ns
tPZH,
tPZL
3-state output enable time
nOE to nYn VCC = 4.5 V; see Figure 7 --38ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn VCC = 4.5 V; see Figure 7 --31ns
tTHL,
tTLH
output transition time VCC = 4.5 V; see Figure 6 --15ns
Tamb = −40 °C to +125 °C
tPHL,
tPLH
propagation delay nAn to nYn VCC = 4.5 V; see Figure 6 --33ns
tPZH,
tPZL
3-state output enable time
nOE to nYn VCC = 4.5 V; see Figure 7 --45ns
tPHZ,
tPLZ
3-state output disable time
nOE to nYn VCC = 4.5 V; see Figure 7 --38ns
tTHL,
tTLH
output transition time VCC = 4.5 V; see Figure 6 --18ns
Table 10: Dynamic characteristics type 74HCT244
…continued
GND = 0 V; t
r
=t
f
= 6 ns; C
L
= 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Min Typ Max Unit
Measurement points are given in Table 11.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 6. Propagation delay input (1An, 2An) to output (1Yn, 2Yn) and transition time output
(nYn)
001aae013
tPLH
tPHL
VM
VM
VMVM
nYn output
nAn input
VI
GND
VOH
VOL
tTLH
tTHL
90 %
10 %
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 13 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Measurement points are given in Table 11.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 7. 3-state enable and disable times
Table 11: Measurement points
Type Input Output
VMVM
74HC244 0.5VCC 0.5VCC
74HCT244 1.3 V 1.3 V
001aae014
tPLZ
tPHZ
outputs
disabled outputs
enabled
VY
VX
outputs
enabled
nYn output
LOW-to-OFF
OFF-to-LOW
nYn output
HIGH-to-OFF
OFF-to-HIGH
nOE input
VI
VOL
VOH
VCC
VM
GND
GND
tPZL
tPZH
VM
VM
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 14 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Test data is given in Table 12.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistor
S1 = Test selection switch
Fig 8. Load circuitry for switching times
Table 12: Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC244 VCC 6 ns 15 pF, 50 pF 1 kΩopen GND VCC
74HCT244 3 V 6 ns 15 pF, 50 pF 1 kΩopen GND VCC
VMVM
tW
tW
10 %
90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 %
tf
tr
tr
tf
001aad983
DUT
VCC VCC
VIVO
RT
RLS1
CL
open
PULSE
GENERATOR
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 15 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
13. Package outline
Fig 9. Package outline SOT146-1 (DIP20)
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 99-12-27
03-02-13
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 24.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0780.17 0.02 0.13
SC-603MS-001
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 16 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT163-1 (SO20)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
99-12-27
03-02-19
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 17 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 11. Package outline SOT339-1 (SSOP20)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQ(1)
Zywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 7.4
7.0 5.4
5.2 0.65 7.9
7.6 0.9
0.7 0.9
0.5 8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
A
max.
2
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 18 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 12. Package outline SOT360-1 (TSSOP20)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 19 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 13. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4 1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
29
19 12
11
10
1
20
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 20 of 22
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
14. Abbreviations
15. Revision history
Table 13: Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MM Machine Model
Table 14: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
74HC_HCT244_3 20051222 Product data sheet - - 74HC_HCT244_CNV
_2
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•Section 4 “Ordering information”,Section 6 “Pinning information” and Section 13 “Package
outline”: Added DHVQFN package information
•Section 10 “Static characteristics”: Added from the family specification
74HC_HCT244_CNV_2 19901201 Product specification - - -
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
74HC_HCT244_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 22 December 2005 21 of 22
16. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
18. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
19. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary datawill be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 22 December 2005
Document number: 74HC_HCT244_3
Published in The Netherlands
Philips Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
21. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Recommended operating conditions. . . . . . . . 6
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 20
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21
17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
20 Contact information . . . . . . . . . . . . . . . . . . . . 21
