82C84A (R) Data Sheet December 6, 2005 FN2974.3 CMOS Clock Generator Driver Features The Intersil 82C84A is a high performance CMOS Clock Generator-driver which is designed to service the requirements of both CMOS and NMOS microprocessors such as the 80C86, 80C88, 8086 and the 8088. The chip contains a crystal controlled oscillator, a divide-by-three counter and complete "Ready" synchronization and reset logic. * Generates the System Clock For CMOS or NMOS Microprocessors Static CMOS circuit design permits operation with an external frequency source from DC to 25MHz. Crystal controlled operation to 25MHz is guaranteed with the use of a parallel, fundamental mode crystal and two small load capacitors. * Generates System Reset Output From Schmitt Trigger Input All inputs (except X1 and RES) are TTL compatible over temperature and voltage ranges. * Single 5V Power Supply Power consumption is a fraction of that of the equivalent bipolar circuits. This speed-power characteristic of CMOS permits the designer to custom tailor his system design with respect to power and/or speed requirements. Ordering Information PART NUMBER PART MARKING * Up to 25MHz Operation * Uses a Parallel Mode Crystal Circuit or External Frequency Source * Provides Ready Synchronization * TTL Compatible Inputs/Outputs * Very Low Power Consumption * Operating Temperature Ranges - C82C84A . . . . . . . . . . . . . . . . . . . . . . . . . 0C to +70C - I82C84A . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C - M82C84A . . . . . . . . . . . . . . . . . . . . . . . -55C to +125C * Pb-Free Plus Anneal Available (RoHS Compliant) Pinouts TEMP. RANGE (C) PACKAGE CP82C84A CP82C84A 0 to +70 18 Ld PDIP E18.3 CP82C84AZ (See Note) CP82C84AZ 0 to +70 18 Ld PDIP* (Pb-free) E18.3 IP82C84A IP82C84A -40 to +85 18 Ld PDIP E18.3 CS82C84A CS82C84A 0 to +70 20 Ld PLCC N20.35 CS82C84AZ (Note) CS82C84AZ 0 to +70 20 Ld PLCC (Pb-free) N20.35 CS82C84AZ96 CS82C84AZ (Note) 0 to +70 N20.35 20 Ld PLCC Tape and Reel (Pb-free) IS82C84A IS82C84A -40 to +85 CD82C84A CD82C84A 0 to +70 18 Ld CERDIP F18.3 18 Ld CERDIP F18.3 PCLK 2 17 X1 AEN1 3 16 X2 RDY1 4 15 ASYNC READY 5 14 EFI RDY2 6 13 F/C AEN2 7 12 OSC CLK 8 11 RES GND 9 10 RESET ID82C84A ID82C84A -40 to +85 MD82C84A/B MD82C84A/B -55 to +125 18 Ld CERDIP F18.3 8406801VA 8406801VA -55 to +125 18 Ld CERDIP F18.3 SMD# X1 VCC VCC 18 CSYNC 1 PCLK N20.35 CSYNC AEN1 20 Ld PLCC 82C84A (PDIP, CERDIP) TOP VIEW PKG. DWG. # 3 2 1 20 19 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 4 18 X2 READY 5 17 ASYNC RDY2 6 16 EFI AEN2 7 15 F/C NC 8 14 NC 9 10 11 12 13 OSC *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. RDY1 RES -55 to +125 20 Pad CLCC J20.A SMD# RESET -55 to +125 20 Pad CLCC J20.A 84068012A GND MR82C84A/B 84068012A CLK MR82C84A/B 82C84A (PLCC, CLCC) TOP VIEW CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1997, 2002, 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. 82C84A Functional Diagram 11 D RES X1 16 X2 XTAL OSCILLATOR 10 RESET 12 OSC 13 F/C Q CK 17 /3 SYNC /2 SYNC 2 PCLK 14 EF1 1 CSYNC 4 RDY1 8 CLK 3 AEN1 6 RDY2 CK D Q FF1 7 AEN2 CK 5 D Q FF2 READY 15 ASYNC CONTROL PIN 2 LOGICAL 1 LOGICAL 0 F/C External Clock Crystal Drive RES Normal Reset RDY1, RDY2 Bus Ready Bus Not Ready AEN1, AEN2 Address Disabled Address Enable ASYNC 1 Stage Ready Synchronization 2 Stage Ready Synchronization FN2974.3 December 6, 2005 82C84A Pin Description SYMBOL NUMBER TYPE DESCRIPTION AEN1, AEN2 3, 7 I ADDRESS ENABLE: AEN is an active LOW signal. AEN serves to qualify its respective Bus Ready Signal (RDY1 or RDY2). AEN1 validates RDY1 while AEN2 validates RDY2. Two AEN signal inputs are useful in system configurations which permit the processor to access two Multi-Master System Busses. In non-Multi-Master configurations, the AEN signal inputs are tied true (LOW). RDY1, RDY2 4, 6 I BUS READY (Transfer Complete). RDY is an active HIGH signal which is an indication from a device located on the system data bus that data has been received, or is available RDY1 is qualified by AEN1 while RDY2 is qualified by AEN2. ASYNC 15 I READY SYNCHRONIZATION SELECT: ASYNC is an input which defines the synchronization mode of the READY logic. When ASYNC is low, two stages of READY synchronization are provided. When ASYNC is left open or HIGH, a single stage of READY synchronization is provided. READY 5 O READY: READY is an active HIGH signal which is the synchronized RDY signal input. READY is cleared after the guaranteed hold time to the processor has been met. X1, X2 17, 16 IO CRYSTAL IN: X1 and X2 are the pins to which a crystal is attached. The crystal frequency is 3 times the desired processor clock frequency, (Note 1). F/C 13 I FREQUENCY/CRYSTAL SELECT: F/C is a strapping option. When strapped LOW. F/C permits the processor's clock to be generated by the crystal. When F/C is strapped HIGH, CLK is generated for the EFI input, (Note 1). EFI 14 I EXTERNAL FREQUENCY IN: When F/C is strapped HIGH, CLK is generated from the input frequency appearing on this pin. The input signal is a square wave 3 times the frequency of the desired CLK output. CLK 8 O PROCESSOR CLOCK: CLK is the clock output used by the processor and all devices which directly connect to the processor's local bus. CLK has an output frequency which is 1/3 of the crystal or EFI input frequency and a 1/3 duty cycle. PCLK 2 O PERIPHERAL CLOCK: PCLK is a peripheral clock signal whose output frequency is 1/2 that of CLK and has a 50% duty cycle. OSC 12 O OSCILLATOR OUTPUT: OSC is the output of the internal oscillator circuitry. Its frequency is equal to that of the crystal. RES 11 I RESET IN: RES is an active LOW signal which is used to generate RESET. The 82C84A provides a Schmitt trigger input so that an RC connection can be used to establish the power-up reset of proper duration. RESET 10 O RESET: RESET is an active HIGH signal which is used to reset the 80C86 family processors. Its timing characteristics are determined by RES. CSYNC 1 I CLOCK SYNCHRONIZATION: CSYNC is an active HIGH signal which allows multiple 82C84As to be synchronized to provide clocks that are in phase. When CSYNC is HIGH the internal counters are reset. When CSYNC goes LOW the internal counters are allowed to resume counting. CSYNC needs to be externally synchronized to EFI. When using the internal oscillator CSYNC should be hardwired to ground. GND 9 Ground VCC 18 VCC: The +5V power supply pin. A 0.1F capacitor between VCC and GND is recommended for decoupling. NOTE: 1. If the crystal inputs are not used X1 must be tied to VCC or GND and X2 should be left open. 3 FN2974.3 December 6, 2005 82C84A Functional Description Oscillator The oscillator circuit of the 82C84A is designed primarily for use with an external parallel resonant, fundamental mode crystal from which the basic operating frequency is derived. The crystal frequency should be selected at three times the required CPU clock. X1 and X2 are the two crystal input crystal connections. For the most stable operation of the oscillator (OSC) output circuit, two capacitors (C1 = C2) as shown in the waveform figures are recommended. The output of the oscillator is buffered and brought out on OSC so that other system timing signals can be derived from this stable, crystal-controlled source. TABLE 1. CRYSTAL SPECIFICATIONS PARAMETER TYPICAL CRYSTAL SPEC Frequency 2.4 - 25MHz, Fundamental, "AT" cut Type of Operation Parallel Unwanted Modes 6dB (Minimum) Load Capacitance 18 - 32pF Capacitors C1, C2 are chosen such that their combined capacitance C1 x C2 CT = ---------------------- (Including stray capacitance) C1 + C2 matches the load capacitance as specified by the crystal manufacturer. This ensures operation within the frequency tolerance specified by the crystal manufacturer. Clock Generator The clock generator consists of a synchronous divide-bythree counter with a special clear input that inhibits the counting. This clear input (CSYNC) allows the output clock to be synchronized with an external event (such as another 82C84A clock). It is necessary to synchronize the CSYNC input to the EFI clock external to the 82C84A. This is accomplished with two flip-flops. (See Figure 1). The counter output is a 33% duty cycle clock at one-third the input frequency. NOTE: The F/C input is a strapping pin that selects either the crystal oscillator or the EFI input as the clock for the / 3 counter. If the EFI input is selected as the clock source, the oscillator section can be used independently for another clock source. Output is taken from OSC. Clock Outputs The CLK output is a 33% duty cycle clock driver designed to drive the 80C86, 80C88 processors directly. PCLK is a peripheral clock signal whose output frequency is 1/2 that of CLK. PCLK has a 50% duty cycle. Reset Logic The reset logic provides a Schmitt trigger input (RES) and a synchronizing flip-flop to generate the reset timing. The reset signal is synchronized to the falling edge of CLK. A simple RC network can be used to provide power-on reset by utilizing this function of the 82C84A. READY Synchronization Two READY input (RDY1, RDY2) are provided to accommodate two system busses. Each input has a qualifier (AEN1 and AEN2, respectively). The AEN signals validate their respective RDY signals. If a Multi-Master system is not being used the AEN pin should be tied LOW. Synchronization is required for all asynchronous active-going edges of either RDY input to guarantee that the RDY setup and hold times are met. Inactive-going edges of RDY in normally ready systems do not require synchronization but must satisfy RDY setup and hold as a matter of proper system design. The ASYNC input defines two modes of READY synchronization operation. When ASYNC is LOW, two stages of synchronization are provided for active READY input signals. Positive-going asynchronous READY inputs will first be synchronized to flipflop one of the rising edge of CLK (requiring a setup time tR1VCH) and the synchronized to flip-flop two at the next falling edge of CLK, after which time the READY output will go active (HIGH). Negative-going asynchronous READY inputs will be synchronized directly to flip-flop two at the falling edge of CLK, after which the READY output will go inactive. This mode of operation is intended for use by asynchronous (normally not ready) devices in the system which cannot be guaranteed by design to meet the required RDY setup timing, TR1VCL, on each bus cycle. When ASYNC is high or left open, the first READY flip-flop is bypassed in the READY synchronization logic. READY inputs are synchronized by flip-flop two on the falling edge of CLK before they are presented to the processor. This mode is available for synchronous devices that can be guaranteed to meet the required RDY setup time. ASYNC can be changed on every bus cycle to select the appropriate mode of synchronization for each device in the system. 4 FN2974.3 December 6, 2005 82C84A EFI CLOCK SYNCHRONIZE D EFI > Q 82C84A D Q CSYNC > (TO OTHER 82C84As) NOTE: If EFI input is used, then crystal input X1 must be tied to VCC or GND and X2 should be left open. If the crystal inputs are used, then EFI should be tied to VCC or GND. FIGURE 1. CSYNC SYNCHRONIZATION 5 FN2974.3 December 6, 2005 82C84A Absolute Maximum Ratings Thermal Information Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance. . . . . . . . . . . . . . . . . JA (oC/W) JC (oC/W) CERDIP Package. . . . . . . . . . . . . . . . . 80 20 CLCC Package . . . . . . . . . . . . . . . . . . 95 28 PDIP Package* . . . . . . . . . . . . . . . . . . 85 N/A PLCC Package. . . . . . . . . . . . . . . . . . . 85 N/A Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Max Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .+175oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . .+300oC (PLCC - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Operating Conditions Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Operating Temperature Range C82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to +70oC I82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC M82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC Die Characteristics Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Gates CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. DC Electrical Specifications VCC = +5.0V 10%, TA = 0oC to +70oC (C82C84A), TA = -40oC to +85oC (I82C84A), TA = -55oC to +125oC (M82C84A) SYMBOL PARAMETER MIN MAX UNITS TEST CONDITIONS VIH Logical One Input Voltage 2.0 2.2 - V V C82C84A, I82C84 M82C84A, Notes 1, 2 VIL Logical Zero Input Voltage - 0.8 V Notes 1, 2, 3 VIHR Reset Input High Voltage VCC -0.8 - V VILR Reset Input Low Voltage - 0.5 V Reset Input Hysteresis 0.2 VCC - - VOH Logical One Output Current VCC -0.4 - V IOH = -4.0mA for CLK Output IOH = -2.5mA for All Others VOL Logical Zero Output Voltage - 0.4 V IOL = +4.0mA for CLK Output IOL = +2.5mA for All Others -1.0 1.0 A VIN = VCC or GND except ASYNC, X1: (Note 4) - 40 mA Crystal Frequency = 25MHz Outputs Open, Note 5 VT+ - VT- II Input Leakage Current ICCOP Operating Power Supply Current NOTES: 1. F/C is a strap option and should be held either 0.8V or 2.2V. Does not apply to X1 or X2 pins. 2. Due to test equipment limitations related to noise, the actual tested value may differ from that specified, but the specified limit is guaranteed. 3. CSYNC pin is tested with VIL 0.8V. 4. ASYNC pin includes an internal 17.5k nominal pull-up resistor. For ASYNC input at GND, ASYNC input leakage current = 300A nominal, X1 - crystal feedback input. 5. f = 25MHz may be tested using the extrapolated value based on measurements taken at f = 2MHz and f = 10MHz. Capacitance TA = +25oC SYMBOL CIN COUT PARAMETER TYPICAL UNITS Input Capacitance 10 pF Output Capacitance 15 pF 6 TEST CONDITIONS FREQ = 1MHz, all measurements are referenced to device GND FN2974.3 December 6, 2005 82C84A AC Electrical Specifications VCC = +5V 10%, TA = 0oC to +70oC (C82C84A), TA = -40oC to +85oC (I82C84A), TA = -55oC to +125oC (M82C84A) LIMITS SYMBOL PARAMETER MIN MAX UNITS (NOTE 1) TEST CONDITIONS TIMING REQUIREMENTS (1) TEHEL External Frequency HIGH Time 13 - ns 90%-90% VIN (2) TELEH External Frequency LOW Time 13 - ns 10%-10% VIN (3) TELEL EFI Period 36 - ns XTAL Frequency 2.4 25 MHz (4) TR2VCL RDY1, RDY2 Active Setup to CLK 35 - ns ASYNC = HIGH (5) TR1VCH RDY1, RDY2 Active Setup to CLK 35 - ns ASYNC = LOW (6) TR1VCL RDY1, RDY2 Inactive Setup to CLK 35 - ns (7) TCLR1X RDY1, RDY2 Hold to CLK 0 - ns (8) TAYVCL ASYNC Setup to CLK 50 - ns (9) TCLAYX ASYNC Hold to CLK 0 - ns (10) TA1VR1V AEN1, AEN2 Setup to RDY1, RDY2 15 - ns (11) TCLA1X AEN1, AEN2 Hold to CLK 0 - ns (12) TYHEH CSYNC Setup to EFI 20 - ns (13) TEHYL CSYNC Hold to EFI (14) TYHYL CSYNC Width (15) TI1HCL (16) TCLI1H Note 2 20 - ns 2 TELEL - ns RES Setup to CLK 65 - ns Note 3 RES Hold to CLK 20 - ns Note 3 125 - ns Note 6 TIMING RESPONSES (17) TCLCL CLK Cycle Period (18) TCHCL CLK HIGH Time (1/3 TCLCL) +2.0 - ns Note 6 (19) TCLCH CLK LOW Time (2/3 TCLCL) -15.0 - ns Note 6 (20) (21) TCH1CH2 TCL2CL1 CLK Rise or Fall Time - 10 ns 1.0V to 3.0V (22) TPHPL PCLK HIGH Time TCLCL-20 - ns Note 6 (23) TPLPH PCLK LOW Time TCLCL-20 - ns Note 6 (24) TRYLCL Ready Inactive to CLK (See Note 4) (25) TRYHCH Ready Active to CLK (See Note 3) (26) TCLIL CLK to Reset Delay (27) TCLPH CLK to PCLK HIGH Delay - 22 ns (28) TCLPL CLK to PCLK LOW Delay - 22 ns (29) TOLCH OSC to CLK HIGH Delay -5 22 ns (30) TOLCL OSC to CLK LOW Delay 2 35 ns -8 - ns Note 4 (2/3 TCLCL) -15.0 - ns Note 5 - 40 ns NOTES: 1. Tested as follows: f = 2.4MHz, VIH = 2.6V, VIL = 0.4V, CL = 50pF, VOH 1.5V, VOL 1.5V, unless otherwise specified. RES and F/C must switch between 0.4V and VCC -0.4V. Input rise and fall times driven at 1ns/V. VIL VIL (max) - 0.4V for CSYNC pin. VCC = 4.5V and 5.5V. 2. Tested using EFI or X1 input pin. 3. Setup and hold necessary only to guarantee recognition at next clock. 4. Applies only to T2 states. 5. Applies only to T3 TW states. 6. Tested with EFI input frequency = 4.2MHz. 7 FN2974.3 December 6, 2005 82C84A Timing Waveforms NAME EFI I OSC O CLK PCLK NOTE: (3) I/O tOLCH (29) O O CSYNC I RES I RESET O tELEH tELEL (19) tCLCH (17) tCLCL tCL2CL1 (21) tCH1CH2 (20) (13) tEHYL (1) tEHEL tCHCL (18) tCLPL (28) tCLPH (27) (30) tOLCL tYHEH (12) (2) (22) tPHPL (16) (15) tCLI1H tI1HCL tPLPH (23) (14) tYHYL (26) tCLIL All timing measurements are made at 1.5V, unless otherwise noted. FIGURE 2. WAVEFORMS FOR CLOCKS AND RESETS SIGNALS CLK (7) tCLR1X tR1VCH (5) RDY1, 2 tR1VCL (6) (10) tA1VR1V tCLR1X (7) tCLA1X (11) AEN1, 2 tAYVCL (8) ASYNC (9) tCLAYX READY (25) tRYHCH (24) tRYLCL FIGURE 3. WAVEFORMS FOR READY SIGNALS (FOR ASYNCHRONOUS DEVICES) CLK (7) (4) tCLR1X tR1VCL (6) tR1VCL RDY 1, 2 (10) tA1VRIV tCLR1X (7) AEN1, 2 (8) tCLA1X tAYVCL (11) ASYNC tCLAYX READY (9) (25) tRYHCH (24) tRYLCL FIGURE 4. WAVEFORMS FOR READY SIGNALS (FOR SYNCHRONOUS DEVICES) 8 FN2974.3 December 6, 2005 82C84A Test Load Circuits 2.25V OUTPUT FROM DEVICE UNDER TEST R = 740 FOR ALL OUTPUTS EXCEPT CLK 463 FOR CLK OUTPUT CL (SEE NOTE 3) NOTES: 1. CL =100pF for CLK output. 2. CL = 50pF for all outputs except CLK. 3. CL = Includes probe and jig capacitance. FIGURE 5. TEST LOAD MEASUREMENT CONDITIONS LOAD (SEE NOTE 1) CLK X1 C1 PULSE GENERATOR CLK EF1 LOAD (SEE NOTE 1) VCC X2 C2 F/C F/C CSYNC CSYNC FIGURE 6. TCHCL, TCLCH LOAD CIRCUITS VCC CLK LOAD (SEE NOTE 1) READY LOAD (SEE NOTE 2) AEN1 C1 X1 24MHz C2 PULSE GENERATOR TRIGGER PULSE GENERATOR X2 LOAD (SEE NOTE 1) READY LOAD (SEE NOTE 2) VCC F/C AEN1 TRIGGER PULSE GENERATOR OSC RDY2 CLK EF1 RDY2 AEN2 CSYNC F/C AEN2 CSYNC FIGURE 7. TRYLCL, TRYHCH LOAD CIRCUITS AC Testing Input, Output Waveform OUTPUT INPUT VIH + 0.4V VOH 1.5V VIL - 0.4V NOTE: 1.5V VOL Input test signals must switch between VIL (maximum) -0.4V and VIH (minimum) +0.4V. RES and F/C must switch between 0.4V and VCC -0.4V. Input rise and fall times driven at 1ns/V. VIL VIL (max) -0.4V for CSYNC pin. VCC -4.5V and 5.5V. 9 FN2974.3 December 6, 2005 82C84A Burn-In Circuits MD82C84A CERDIP VCC C1 R1 F9 VCC GND R2 R2 R1 F6 F5 VCC GND F7 F8 VCC GND 1 18 2 17 3 16 R1 R2 4 R2 15 F10 R1 5 R2 14 R1 R1 R2 R2 OPEN R3 R1 F0 6 13 7 12 8 11 9 10 F1 R1 R2 R2 R1 R2 R2 F11 VCC GND F12 VCC GND MR82C84A CLCC R4 F0 F9 5 17 6 16 7 15 8 14 VCC / 2 OPEN R4 R4 R4 F10 F1 F11 OPEN 10 11 12 13 R4 R4 9 F12 OPEN R4 18 VCC / 2 F8 20 19 R4 F7 R4 C1 4 R4 VCC / 2 R4 1 VCC / 2 F5 2 R4 F6 R4 R4 3 R4 VCC / 2 VCC NOTES: VCC = 5.5V 0.5V, GND = 0V. VIH = 4.5V 10%. VIL = -0.2 to 0.4V. R1 = 47k, 5%. R2 = 10k, 5%. R3 = 2.2k, 5%. R4 = 1.2k, 5%. C1 = 0.01F (minimum). F0 = 100kHz 10%. F1 = F0/2, F2 = F1/2, . . . F12 = F11/2. 10 FN2974.3 December 6, 2005 82C84A Die Characteristics DIE DIMENSIONS: 66.1 x 70.5 x 19 1mils GLASSIVATION: Type: SiO2 Thickness: 8kA 1kA METALLIZATION: Type: Si - AI Thickness: 11kA 1kA WORST CASE CURRENT DENSITY: 1.42 x 105 A/cm2 Metallization Mask Layout 82C84A AEN1 PCLK CSYNC VCC X1 X2 RDY1 ASYNC READY RDY2 EFI AEN2 F/C CLK GND RESET RES OSC All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN2974.3 December 6, 2005