SN54ACT241, SN74ACT241
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS516C − JUNE 1995 − REVISED OCTOBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D4.5-V to 5.5-V VCC Operation
DInputs Accept Voltages to 5.5 V
DMax tpd of 8.5 ns at 5 V
DInputs Are TTL Compatible
SN54ACT241 ...J OR W PACKAGE
SN74ACT241 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54ACT241...FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
description/ordering information
These octal buffers and line drivers are designed specifically to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The ’ACT241 devices are organized as two 4-bit buffers/drivers with separate complementary output-enable
(1OE and 2OE) inputs. When 1OE is low or 2OE is high, the device passes noninverted data from the A inputs
to the Y outputs. When 1OE is high or 2OE is low, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking or the current-sourcing capability of the driver.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube SN74ACT241N SN74ACT241N
SOIC DW
Tube SN74ACT241DW
ACT241
40°Cto85°C
SOIC − DW Tape and reel SN74ACT241DWR ACT241
−40°C to 85°CSOP − NS Tape and reel SN74ACT241NSR ACT241
SSOP − DB Tape and reel SN74ACT241DBR AD241
TSSOP − PW Tape and reel SN74ACT241PWR AD241
CDIP − J Tube SNJ54ACT241J SNJ54ACT241J
−55°C to 125°CCFP − W Tube SNJ54ACT241W SNJ54ACT241W
LCCC − FK Tube SNJ54ACT241FK SNJ54ACT241FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54ACT241, SN74ACT241
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS516C − JUNE 1995 − REVISED OCTOBER 2002
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLES
INPUTS OUTPUT
1OE 1A
OUTPUT
1Y
L H H
LLL
H X Z
INPUTS OUTPUT
2OE 2A
OUTPUT
2Y
H H H
HLL
L X Z
logic diagram (positive logic)
1
2
4
6
812
14
16
18
1A1
1A2
1Y1
1Y2
1Y3
1Y4
1OE 19
11
13
15
17 3
5
7
9
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
2A1
2OE
1A3
1A4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54ACT241, SN74ACT241
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS516C − JUNE 1995 − REVISED OCTOBER 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54ACT241 SN74ACT241
UNIT
MIN MAX MIN MAX UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
IOH High-level output current −24 −24 mA
IOL Low-level output current 24 24 mA
Δt/ΔvInput transition rise or fall rate 8 8 ns/V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
V
TA = 25°C SN54ACT241 SN74ACT241
UNIT
PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT
I50 A
4.5 V 4.4 4.49 4.4 4.4
IOH = −50 μA5.5 V 5.4 5.49 5.4 5.4
V
I24 A
4.5 V 3.86 3.7 3.76
V
VOH IOH = −24 mA 5.5 V 4.86 4.7 4.76 V
IOH = −50 mA†5.5 V 3.85
IOH = −75 mA†5.5 V 3.85
I50 A
4.5 V 0.001 0.1 0.1 0.1
IOL = 50 μA5.5 V 0.001 0.1 0.1 0.1
V
I24 mA
4.5 V 0.36 0.5 0.44
V
VOL IOL = 24 mA 5.5 V 0.36 0.5 0.44 V
IOL = 50 mA†5.5 V 1.65
IOL = 75 mA†5.5 V 1.65
IOZ VO = VCC or GND 5.5 V ±0.25 ±5±2.5 μA
IIVI = VCC or GND 5.5 V ±0.1 ±1±1μA
ICC VI = VCC or GND, IO = 0 5.5 V 4 80 40 μA
ΔICC‡One input at 3.4 V,
Other inputs at GND or VCC 5.5 V 0.6 1.6 1.5 mA
CiVI = VCC or GND 5 V 2.5 pF
CoVI = VCC or GND 5 V 8 pF
†Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
‡This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
SN54ACT241, SN74ACT241
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS516C − JUNE 1995 − REVISED OCTOBER 2002
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO TA = 25°C SN54ACT241 SN74ACT241
UNIT
PARAMETER
(INPUT)
(OUTPUT) MIN TYP MAX MIN MAX MIN MAX UNIT
tPLH
1.5 6 8.5 1 9.5 1.5 9.5
ns
tPHL
A Y 1.5 5.5 7.5 1 9 1.5 8.5 ns
tPZH
1.5 7 8.5 1 10 1 9.5
ns
tPZL
OE or OE Y2 7 9.5 1 11.5 1.5 10.5 ns
tPHZ
2 8 9.5 1 11 2 10.5
ns
tPLZ
OE or OE Y2.5 6.5 10 1 11.5 2 10.5 ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per buffer/driver CL = 50 pF, f = 1 MHz 45 pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × VCC
500 Ω
500 Ω
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
1.5 V 1.5 V ≈VCC
3 V
0 V
50% VCC 50% VCC
VOH
VOL
0 V
50% VCC VOL + 0.3 V
50% VCC
≈0 V
3 V
Open
Input
Output
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
Open
TEST S1
VOH − 0.3 V
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-89847012A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
89847012A
SNJ54ACT
241FK
5962-8984701RA ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8984701RA
SNJ54ACT241J
5962-8984701SA ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8984701SA
SNJ54ACT241W
SN74ACT241DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD241
SN74ACT241DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT241
SN74ACT241DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT241
SN74ACT241N ACTIVE PDIP N 20 20 RoHS &
Non-Green NIPDAU N / A for Pkg Type -40 to 85 SN74ACT241N
SN74ACT241NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT241
SN74ACT241PW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD241
SN74ACT241PWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD241
SNJ54ACT241FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
89847012A
SNJ54ACT
241FK
SNJ54ACT241J ACTIVE CDIP J 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8984701RA
SNJ54ACT241J
SNJ54ACT241W ACTIVE CFP W 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8984701SA
SNJ54ACT241W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ACT241, SN74ACT241 :
•Catalog: SN74ACT241
•Military: SN54ACT241
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ACT241DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ACT241DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74ACT241NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
SN74ACT241PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ACT241DBR SSOP DB 20 2000 853.0 449.0 35.0
SN74ACT241DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74ACT241NSR SO NS 20 2000 367.0 367.0 45.0
SN74ACT241PWR TSSOP PW 20 2000 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
18X 0.65
2X
5.85
20X 0.38
0.22
8.2
7.4 TYP
SEATING
PLANE
0.05 MIN
0.25
GAGE PLANE
0 -8
2 MAX
B5.6
5.0
NOTE 4
A
7.5
6.9
NOTE 3
0.95
0.55
(0.15) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
1
10 11
20
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
A 15
DETAIL A
TYPICAL
SCALE 2.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
10 11
20
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
20X (1.85)
20X (0.45)
18X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
10 11
20
www.ti.com
PACKAGE OUTLINE
C
TYP
10.63
9.97
2.65 MAX
18X 1.27
20X 0.51
0.31
2X
11.43
TYP
0.33
0.10
0 - 8
0.3
0.1
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
13.0
12.6
B7.6
7.4
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
120
0.25 C A B
11
10
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(9.3)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
20X (2)
20X (0.6)
18X (1.27)
(R )
TYP
0.05
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
10 11
20
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(9.3)
18X (1.27)
20X (0.6)
20X (2)
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
10 11
20
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
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