2N6661JAN/JANTX/JANTXV
Vishay Siliconix
www.vishay.com
11-2 Document Number: 70225
S-04279—Rev. B, 16-Jul-01
SPECIFICATIONS (TA = 25_C UNLESS OTHERWISE NOTED)
Limits
Parameter Symbol Test Conditions Min Typ
NO TAG Max Unit
Static
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 10 mA90 125
VDS = VGS, ID = 1 mA 0.8 1.6 2
Gate-Threshold Voltage VGS(th) TA = –55_C1.8 2.5 V
TA = 125_C0.3 1.3
VDS = 0 V, VGS = "20 V "100
Gate-Body Leakage IGSS TA = 125_C"500 nA
VDS = 72 V, VGS = 0 V 1
Zero Gate Voltage Drain Current IDSS TA = 125_C100 mA
On-State Drain CurrentbID(on) VDS = 10 V, VGS = 10 V 1.8 mA
VGS = 5 V, ID = 0.3 A 3.8 5.3
Drain-Source On-ResistancebrDS(on) VGS = 10 V, ID = 1 A 3.6 4 W
TA = 125_C6.7 7.5
Forward T ransconductancebgfs VDS = 7.5 V, ID = 0.475 A 170 340 mS
Diode Forward Voltage VSD IS = 0.86 A, VGS = 0 V 0.7 0.9 1.4 V
Dynamic
Input Capacitance Ciss 35 50
Output Capacitance Coss VDS = 25 V, VGS = 0 V 15 40
Reverse Transfer Capacitance Crss
VDS = 25 V, VGS = 0 V
f = 1 MHz 2 10 pF
Drain-Source Capacitance Cds 30
Switchingc
T urn-On Time tON VDD = 25 V, RL = 23 W6 10
Turn-Off Time tOFF
VDD = 25 V, RL = 23
ID ^ 1 A, VGEN = 10 V, RG = 25 W8 10 ns
Notes
a. For DESIGN AID ONLY, not subject to production testing. VNDQ09
b. Pulse test: PW v300 ms duty cycle v2%.
c. Switching time is essentially independent of operating temperature.
d. For typical characteristics curves see the 2N6661/VN88AFD data sheet.