Ver. 201207
※Rated Current (A)
＊1
:DC current value when Inductance dropsto 30% of nominal Inductance value (ONLY REFERENCE)
※Rated Current (A)
＊2
:DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
22 2.5±0.2 2.0±0.2 0.9±0.1 0.55±0.25
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
＊1
Typ. Rated Current (A)
＊2
Max.
CIG22BR27MNE 1008/2520 0.27 ±20 % 0.047±30 % 2.80 1.80
CIG22BR33MNE 1008/2520 0.33 ±20 % 0.047±30 % 2.40 1.70
CIG22BR47MNE 1008/2520 0.47 ±20 % 0.0655±30 % 2.40 1.60
CIG22BR56MNE 1008/2520 0.56 ±20 % 0.090±30 % 2.70 1.30
CIG22B1R0MNE 1008/2520 1.0 ±20 % 0.125±20 % 2.00 1.20
CIG22B1R5MNE 1008/2520 1.5 ±20 % 0.148±20 % 1.70 1.15
CIG22B2R2MNE 1008/2520 2.2 ±20 % 0.183±20 % 1.20 1.10
CIG22B3R3MNE 1008/2520 3.3 ±20 % 0.216±20 % 0.96 1.05
CIG22B4R7MNE 1008/2520 4.7 ±20 % 0.250±20 % 0.65 1.00
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG22B Series (2520/ EIA 1008)
Excellent efficiency (High Q)
High Current
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 22 B 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (B:High Current Type& Low Profile)
(5) Inductance (1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
