Sample & Buy Product Folder Support & Community Tools & Software Technical Documents bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 bq500410A Free Positioning, Qi-Compliant Wireless Power Transmitter Manager Not Recommended for New Designs 1 Features 3 Description * The bq500410A device is a free-positioning digital wireless power controller that integrates all functions required to control wireless power transfer to a WPC compliant receiver. It is WPC 1.1 ready and designed for 12-V systems but applicable to other supply voltages. The bq500410A pings the surrounding environment for WPC compliant devices to be powered, safely engages the device, reads the packet feedback from the powered device, and manages the power transfer. A charging area of at least 70 mm x 20 mm provides flexible receiver placement on a transmitter pad. The bq500410A supports both Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) by continuously monitoring the efficiency of the established power transfer, protecting from power lost due to metal objects misplaced in the wireless power transfer path. Should any abnormal condition develop during power transfer, the bq500410A handles it and provides fault indicator outputs. Comprehensive protection features provide a robust design to protect the system in all receiver placements. 1 * * * * * * * Expanded Free Positioning Using Three-Coil Transmit Array Intelligent Control of Wireless Power Transfer Conforms to Wireless Power Consortium (WPC) A6 Transmitter Specification Digital Demodulation Reduces Components WPC1.1 Ready, Including Foreign Object Detection (FOD) Enhanced Parasitic Metal Detection (PMOD) Assures Safety Overcurrent Protection LED Indication of Charging State and Fault Status 2 Applications * * WPC 1.1 Ready Wireless Chargers for: - Smart Phones and Other Handhelds - Hermetically Sealed Devices and Tools - Cars and Other Vehicles - Tabletop Charge Surfaces See www.ti.com/wirelesspower for More Information on TI's Wireless Charging Solutions space The bq500410A is available in an area-saving 48-pin, 7-mm x 7-mm VQFN package and operates over a temperature range from -40C to 110C. Device Information(1) PART NUMBER bq500410A PACKAGE VQFN (48) BODY SIZE (NOM) 7.00 mm x 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space Functional Diagram Transmitter Efficiency Vs System Output Current Receiver 80 Power Power Stage Rectification Voltage Conditioning Communication BQ500410 A Controller Feedback bq51k 70 Load Efficiency (%) AC-DC 60 50 40 30 20 0 1 2 3 Output Power (W) 4 5 G000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 5 6.1 6.2 6.3 6.4 5 5 5 5 Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 9 7.3 Feature Description................................................... 9 8 Application and Implementation ........................ 16 8.1 Typical Application ................................................. 16 8.2 System Examples ................................................... 18 9 Layout ................................................................... 20 9.1 Layout Guidelines ................................................... 20 10 Device and Documentation Support ................. 21 10.1 10.2 10.3 10.4 10.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 21 11 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History Changes from Original (November 2012) to Revision A * 2 Page Added Feature Description section, Application and Implementation section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 5 Pin Configuration and Functions COMM_B- COMM_A- COMM_A+ 38 37 RESERVED 41 COMM_B+ I_SENSE 42 39 LOSS_THR 43 40 LED_MODE V_IN 46 44 GND 47 45 ADCREF 48 RGZ Package 48-Pin VQFN Top View 1 36 GND T_SENSE 2 35 BPCAP AD03 3 34 V33A AD08 4 33 V33D 5 32 GND 6 31 RESERVED 30 RESERVED COIL_PEAK RESET FOD bq500410A MSP_RST/LED1 7 MSP_MISO/LED2 8 29 RESERVED MSP _TEST 9 28 RESERVED PMB_CLK 10 27 RESERVED 26 MSP _RDY 25 MSP _MOSI /LPWR_EN PMB _DATA EPAD 49 11 22 DOUT_RX 24 21 DOUT_TX BUZ_DC 20 RESERVED RESERVED 23 19 BUZ_AC 18 16 Coil 1.1 Coil 1.2 MSP_CLK 15 17 14 MSP_SYNC Coil 1.3 13 PMOD DPWM_A 12 Pin Functions PIN NAME AD03 NO. 3 I/O DESCRIPTION I This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding. AD08 4 I Reserved. Connect to 3.3-V supply. ADCREF 48 I External reference voltage input. Connect this input to GND. BPCAP 35 -- Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND. BUZ_AC 23 O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins. BUZ_DC 24 O DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED through 470- resistor. COIL 1.1 15 O Enables the first coil drive train and COMM signal selector. COIL 1.2 16 O Enables the second coil drive train and COMM signal selector. COIL 1.3 17 O Enables the third coil drive train and COMM signal selector. COIL_PEAK 1 I Input from peak detect circuit. COMM_A- 38 I Digital demodulation inverting input A, connect parallel to input B-. COMM_A+ 37 I Digital demodulation noninverting input A, connect parallel to input B+. COMM_B- 40 I Digital demodulation inverting input B, connect parallel to input A-. COMM_B+ 39 I Digital demodulation noninverting input B, connect parallel to input A+. DOUT_RX 22 I Reserved, leave this pin open. DOUT_TX 21 I Reserved, leave this pin open. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 3 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com Pin Functions (continued) PIN NAME NO. I/O DESCRIPTION DPWM_A 12 O PWM Output to half bridge driver. Switching dead times must be externally generated. EPAD 49 -- Flood with copper GND plane and stitch vias to PCB internal GND plane. FOD 6 O FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It controls the FOD threshold resistor read at startup. GND 32 -- GND GND 36 -- GND GND 47 -- GND I_SENSE 42 I Transmitter input current, used for parasitic loss calculations. Use 20-m sense resistor and A=50 gain current sense amp. LED_MODE 44 I LED Mode Select. LOSS_THR 43 I Input to program foreign metal object detection (FOD) threshold. MSP_CLK 18 I/O MSP_MISO/LED2 8 MSP_MOSI/LPWR_EN 25 MSP_RDY 26 MSP_RST/LED1 7 MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor. I A dual function pin. MSP - MISO provided serial communication to the external supervisor. LED2 -- If external MSP430 is not used, connect to a (red) LED through 470- resistor for status indication. Grounding pin 25 determines this pin's function. I/O MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate MSP430 low power supervisor is not used. I/O MSP_RDY, MSP430 Programmed Indication. I A dual function pin. MSP - RST provides serial communication to the external supervisor. LED1 -- If external MSP430 is not used, connect to a (green) LED through 470- resistor for status indication. Grounding pin 25 determines this pin's function. MSP_SYNC 14 O MSP SPI_SYNC, If external MSP430 is not used, leave this pin open. MSP_TEST 9 I MSP - Test, If external MSP430 is not used, leave this pin open. PMB_CLK 10 I/O 10-k pullup resistor to 3.3-V supply. I2C/PMBus is for factory use only. PMB_DATA 11 I/O 10-k pullup resistor to 3.3-V supply. I2C/PMBus is for factory use only. PMOD 13 O PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It controls the PMOD threshold resistor read at startup. RESERVED 19 O Reserved, leave this pin open. RESERVED 20 I Reserved, connect to GND. RESERVED 27 I/O Reserved, leave this pin open. RESERVED 28 I/O Reserved, leave this pin open. RESERVED 29 I/O Reserved, leave this pin open. RESERVED 30 I/O Reserved, leave this pin open. RESERVED 41 I Reserved, leave this pin open. RESERVED 31 I/O RESET 5 I Device reset. Use 10-k to 100-k pullup resistor to 3.3-V supply. T_SENSE 2 I Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3-V supply. V33A 34 -- Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22- resistor and additional bypass capacitors. V33D 33 -- Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible. V_IN 46 I System input voltage selector. Connect this input to GND for 12-V operation. V_SENSE 45 I Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample point should be after current input sense resistor. Use 76.8-k to 10-k divider to minimize quiescent loss. 4 Reserved, connect 10-k pulldown resistor to GND. Do not leave open. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX Voltage applied at V33D to DGND -0.3 3.6 Voltage applied at V33A to AGND -0.3 3.6 -0.3 3.6 -40 150 Voltage applied to any pin (2) Storage temperature, TSTG (1) (2) UNIT V C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to GND. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 TA Operating free-air temperature range -40 TJ Junction temperature UNIT V 110 C 110 6.3 Thermal Information bq500410A THERMAL METRIC (1) RGZ [VQFN] UNIT 48 PINS RJA Junction-to-ambient thermal resistance 27.1 C/W RJC(top) Junction-to-case (top) thermal resistance 12.9 C/W RJB Junction-to-board thermal resistance 4.3 C/W JT Junction-to-top characterization parameter 0.2 C/W JB Junction-to-board characterization parameter 4.3 C/W RJC(bot) Junction-to-case (bottom) thermal resistance 0.6 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor IC Package Thermal Metrics application report, SPRA953. 6.4 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX V33A = 3.3 V 8 15 V33D = 3.3 V 42 55 V33D = V33A = 3.3 V 52 60 3.3 3.6 4 4.6 UNIT SUPPLY CURRENT IV33A IV33D Supply current ITotal mA INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS V33 3.3-V linear regulator V33FB 3.3-V linear regulator feedback IV33FB Series pass base drive Beta Series NPN pass device Emitter of NPN transistor 3.25 VIN = 12 V; current into V33FB pin 10 V mA 40 EXTERNALLY SUPPLIED 3.3 V POWER V33D Digital 3.3-V power TA = 25C 3 3.6 V33A Analog 3.3-V power TA = 25C 3 3.6 V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 V and 2.9 V, V33A = V33D 0.25 V V/ms DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B- Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 5 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com Electrical Characteristics (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VCM Common mode voltage each pin COMM+, COMM- Modulation voltage digital resolution REA Input Impedance Ground reference 0.5 IOFFSET Input offset current 1-k source impedance -5 TYP -0.15 MAX UNIT 1.631 V 1 1.5 mV 3 M 5 A 0.36 V ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground 2.37 VADC_RANGE Measurement range for voltage monitoring ALL ANALOG INPUTS INL ADC integral nonlinearity Ilkg Input leakage current 3 V applied to pin RIN Input impedance Ground reference CIN Input capacitance 0 -2.5 2.5 2.5 100 8 mV nA M 10 pF DIGITAL INPUTS/OUTPUTS DGND1 + 0.25 VOL Low-level output voltage IOL = 6 mA , V33D = 3 V VOH High-level output voltage IOH = -6 mA , V33D = 3 V VIH High-level input voltage V33D = 3 V VIL Low-level input voltage V33D = 3.5 V IOH(MAX) Output high source current 4 IOL(MAX) Output low sink current 4 V33D - 0.6 V 2.1 V 3.6 1.4 mA SYSTEM PERFORMANCE VRESET Voltage where device comes out of reset V33D Pin tRESET Pulse width needed for reset RESET pin fSW Switching Frequency tdetect Time to detect presence of device requesting power 6 2.3 112 Submit Documentation Feedback 2.4 2 V s 205 kHz 0.5 s Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 7 Detailed Description 7.1 Overview 7.1.1 Fundamentals The principle of wireless power transfer is simply an open-cored transformer consisting of a transmitter and receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and electronics are typically built into a portable device, such as a cell phone. When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be managed through any of various familiar closed-loop control schemes. 7.1.2 Wireless Power Consortium (WPC) The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC Standard was developed to facilitate cross-compatibility of compliant transmitters and receivers. The standard defines the physical parameters and the communication protocol to be used in wireless power. For more information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com. 7.1.3 Power Transfer Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency, and duty cycle. Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer. The closer the space between the coils is, the better the coupling. However, the practical distance is set to be less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces. Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to contain the fields to avoid coupling to other adjacent system components. Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed. Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz, (that is, the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the power band and is reduced only once 205 kHz is reached. The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system efficiency. 7.1.4 Communication Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM), sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual message, and a checksum, as defined by the WPC standard. The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A device features internal digital demodulation circuitry. The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 7 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com Overview (continued) Rectifier Receiver Coil Receiver Capacitor Amax Modulation Resitor Operating state at logic "0" A(0) Operating state at logic "1" A(1) Comm Fsw a) F, kHz b) Figure 1. Receiver Resistive Modulation Circuit Rectifier Receiver Coil Receiver Capacitor Modulation Capacitors Amax Comm A(0) Operating state at logic " 0" A(1) Operating state at logic " 1" Fsw F, kHz Fo(1) < Fo(0) a) b) Figure 2. Receiver Capacitive Modulation Circuit 8 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 7.2 Functional Block Diagram bq500410A LED Control / Low Power Supervisor Interface COMM _A+ 37 COMM_A- 38 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 14 MSP_SYNC 18 MSP_CLK Digital Demodulation COMM _B+ 39 7 25 MSP_MOSI/LPWR_EN 26 MSP_RDY COMM_B- 40 12 DPWM_A FOD 6 Controller PMOD 13 PWM/ Coil_Select V_IN 46 15 Coil 1.1 16 Coil 1.2 17 Coil 1.3 V_SENSE 45 12-Bit ADC I_SENSE 42 T_SENSE 2 COIL_PEAK 1 LOSS _THR 43 23 BUZ_AC Buzzer Control 24 BUZ_DC Power Control LED_MODE 44 11 PMB_DATA I2C 10 PMB_CLK TEMP_INT 5 RESET 7.3 Feature Description The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven, note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential ping sequence and detection to determine the best matching coil to drive continues to repeat. 7.3.1 Capacitor Selection Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF x 68 nF (+5.6-nF center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline. NOTE A total capacitance value of 2 nF x 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G dielectric type) is required in the resonant tank to achieve the correct resonance frequency. The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as the minimum modulation or ensured power requirements, might fail. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 9 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com Feature Description (continued) The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types. 7.3.2 A6 Coil Specification The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This is fixed and cannot be changed on the transmitter side. The bq500410A is primarily intended to drive a 3-coil array but it can also be used to drive a single coil. For single coil operation the two outer coils and associated electronics are simply omitted. Please refer to Figure 6. Doo Dol Doe Diw Dow Dil Figure 3. Coil Specification Drawing Table 1. Coil Specification PARAMETER SYMBOL SPECIFICATION Outer length Dol 53.2, (0.5) Inner length Dil 27.5, (0.5) Outer width Dow 45.2, (0.5) Inner width Diw 19.5, (0.5) Thickness Dc 1.5, (0.5) Turns N 12 UNIT mm Turns Layers - 1 Odd displacement Doo 49.2, (4) Even displacement Doe 24.6, (2) mm NOTE The performance of an A6 transmitter can vary based on the design of the A6 coil set. For best performance with small receiver coils under heavy loading, it is best to design the coil set such that the Doo dimension is on the low end of the specified tolerance. For a current list of coil vendors, please see: * bqTESLA Transmitter Coil Vendors, SLUA649 10 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 7.3.3 Option Select Pins Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting voltage measured in order to identify the value of the attached programming resistor. The values of the operating parameters set by these pins are determined using Table 3. For LED_MODE, the selected bin determines the LED behavior based on Table 2; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section). bq500410A LED_MODE Resistors to set options 44 LOSS_THR 43 To 12-bit ADC Figure 4. Option Programming 7.3.4 LED Modes The bq500410A device can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor (typically 470 ), based on the mode selected. The two current limit resistors can be individually adjusted to tune or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device. The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes presented in Table 2. Table 2. LED Modes OPERATIONAL STATES LED CONTROL OPTION LED SELECTION RESISTOR 0 <36.5 k LEDs off 1 42.2 k Generic 2 3 4 48.7 k 56.2 k 64.9 k > 75 k DESCRIPTION LED STANDBY POWER TRANSFER CHARGE COMPLETE FAULT LED1, Green Off Blink slow (1) On Off Off LED2, Red Off Off Off On Blink fast (2) LED1, Green On Blink slow (1) On Off Off LED2, Red On Off Off On Blink fast (2) LED1, Green Off Off On Off Off LED2 Red Off On Off Blink fast (2) On LED1, Green Off On Off Off Off LED2 Red Off Off Off On Blink fast (2) Generic + standby Generic Opt 1 Generic Opt 2 PMOD or FOD WARNING Reserved 7.3.5 Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD) The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the value of power reported by the RX device being charged, the bq500410A can estimate how much power is unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being charged. (1) (2) Blink slow = 0.625 Hz Blink fast = 2.5 Hz Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 11 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0 Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43 open should issues with compliance or interoperability arise. The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1 specification additionally uses the Received Power packet which more accurately tracks power used by the receiver. As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting point is 400 mW (selected by a 56.2-k resistor on the LOSS_THR option pin 43). If, for some reason, the application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be used. Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines (FOD and PMOD) are driven briefly at power-up when the resistor values are read. To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design. Table 3. Option Select Bins BIN NUMBER RESISTANCE (k) LOSS THRESHOLD (mW) 0 <36.5 250 1 42.2 300 2 48.7 350 3 56.2 400 4 64.9 450 5 75.0 500 6 86.6 550 7 100 600 8 115 650 9 133 700 10 154 750 11 178 800 12 205 850 13 >237 Feature Disabled SEE_NOTE SEE_NOTE R22 R39 Q8-A R24 Q8-B FOD A. AGND PMOD Either one of these circuits is connected to LOSS_THR, but not both. Figure 5. LOSS_THR Connection Circuits 7.3.6 Shut Down by Thermal Sensor or Trigger Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down. 12 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the system shuts down and a fault is indicated (depending on LED mode chosen). To 1. 2. 3. 4. implement this feature follow these steps: Consult the NTC datasheet and find the resistence vs temperature curve. Determine the actual temperature where the NTC will be placed by using a thermal probe. Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC. Use the following formula to determine the upper leg resistor (R_Setpoint): R _ Setpoint = 2.3 R _ NTC (1) The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature is not used, this pin must be pulled high. NOTE Pin 2 must always be terminated, else erratic behavior may result. 7.3.7 Fault Handling and Indication The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the condition or fault. Table 4. Fault Handling and Indication CONDITION DURATION (before retry) HANDLING EPT-00 Immediate Unknown EPT-01 5 seconds Charge complete EPT-02 Infinite Internal fault EPT-03 5 minutes Over temperature EPT-04 Immediate Over voltage EPT-05 Immediate Over current EPT-06 Infinite Battery failure EPT-07 Not applicable Reconfiguration No response EPT-08 Immediate OVP (over voltage) Immediate OC (over current) 1 minute NTC (external sensor) 5 minutes PMOD/FOD warning 12 seconds PMOD/FOD 5 minutes 10 seconds LED only, 2 seconds LED + buzzer 7.3.8 Power Transfer Start Signal The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms duration, 4-kHz square wave for driving low-cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400 ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized indication scheme. Do not exceed 4-mA loading from either of these pins which is more than adequate for small signaling and actuation. If not used, these pins should be left open. 7.3.9 Power-On Reset The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 13 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com 7.3.10 External Reset, RESET Pin The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-k pull-up resistor. 7.3.11 Trickle Charge and CS100 CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete. The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has changed, assuming it receives another EPT, the LED mode stays the same. The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery charging applications, there is a benefit to continue the charging process in trickle-charge mode to top off the battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%' message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode. 7.3.12 Current Monitoring Requirements The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be provided in the design. Current monitoring is optional however, it is used for the foreign metal protection features and over current protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant. Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This would enable a forward migration path to future WPC1.1 compatibility. For proper scaling of the current monitor signal, the current sense resistor should be 20 m and the current shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature stability of 200 PPM. Proper current sensing techniques in the application hardware should also be observed. 7.3.13 Overcurrent Protection The bq500410A has an integrated current protection feature which monitors the input current reported by the current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power transfer is halted for one minute. If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE input pin to the bq500410A (pin 42) should be grounded. NOTE Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor circuit or by connecting to ground. 7.3.14 MSP430G2101 Low Power Supervisor This is an optional low-power feature. By adding the MSP430G2101, as recommended in Figure 6, the bq500410A device is periodically shut down to conserve power, yet all relevant states are recalled and all running LED status indicators remain active. Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge state, fault condition, operating mode, and indicator pins driven would be cleared. The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care should be taken not to exceed the pin output current drive limit. 14 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected making it possible to achieve Energy Star rating. The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field update. The MSP430G2101 code cannot be modified by the user. NOTE The user cannot program the MSP430G2101 in this system. 7.3.15 All Unused Pins All unused pins can be left open unless otherwise indicated. Please refer to . Grounding of unused pins, if it is an option, can improve PCB layout. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 15 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Typical Application The application schematic for the transmitter with reduced standby power is shown in Figure 7. CAUTION Please check the bq500410A product page for the most up-to-date schematic and list of materials reference design package before starting a new project. 12V-IN VIN_BRD R69 0.020 C25 10uF N/C 0.1uF DC in 1 BOOT 3 EN PH 8 4 SS VSENS 5 7 GND COMP 6 12V-IN C26 0.1uF 3V3_VCC Q1 BSS215P L1 330uH D1 MBR0540 R37 76.8k C33 47uF 0.1uF 1 JP1 JP2 JP3 2 C29 C32 2700pF R9 475 R32 475 MSP_CLK MSP_MISO 1 VCC GND 14 2 P1.0 XIN 13 3 P1.1 XOUT 12 4 P1.2 TEST 11 5 P1.3 RST 10 6 P1.4 7 P1.5 U4 MSP430G2101 C11 4.7uF R20 10.0K R14 47K TP14 I_SENSE C78 0.1uF MSP_SYNC R6 100K P1.7 9 P1.6 8 C7 47p VIN_BRD MSP_TEST MSP_RST 12V-IN MSP_RDY PILOT TP32 Q14 BC847CL Q2 BSS215P V_GATE DPWM-1A C12 R13 10.0K COIL1.2 R67 150k 2.2nF R27 10.0 6 VDD UGATE 1 3 PWM BOOT 2 7 EN/PG 4 GND PHSE 8 LGATE 5 C72 R68 249k Q13 U18 TPS28225D MSP_MOSI D2 STATUS D7 C30 0.01uF R71 1.00k GND ties 475 V+ R21 10.0K R4 3.16k C10 0.01uF R3 3V3_VCC REF GND 10.0K NoPop 0.01uF U17 INA199A1 1.0nF R19 10.0 R1 R18 1.00 C69 0.1uF C34 C2 C28 J2 R15 1.00 1.0 R29 C76 0.068uF TP31 C73 C21 5.6nF C77 22uF TP33 0.22uF F C6 VIN IN- 2 IN+ 2 VCC U5 TPS54231D 1 OUT 12V-IN J1 Q15 C79 R35 0 C70 C75 0.068uF C23 5.6nF 4700pF 0.1uF 3V3_VCC 0.1uF 3V3_VCC TP34 3V3_VCC R46 R28 200k 22 R25 R70 23.2k D5 10.0K 1.0uF 5 U11 BQ500410A I_SENSE 330pF R31 10.0K NTC C16 MSP_RST 4.7nF MSP_MISO MSP_TEST MSP_CLK D3 BAT54SW COMM+ COMM- N/C 1.0uF COMM+ 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 37 COMM_A+ 38 COMM_A39 COMM_B+ 40 COMM_B- 3V3_VCC 35 31 30 29 28 27 3V3_VCC R66 10.0K C74 33pF COMM- R7 10.0K R72 R12 10.0K R11 10.0K RESERVED 20 RESERVED 19 11 PMB_DATA 10 PMB_CLK 46 V_IN 45 V_SENSE 42 I_SENSE TP18 12 13 14 15 16 17 DPWM-1A R8 10.0 MSP_SYNC COIL1.2 MSP_RDY 26 MSP_MOSI/LPWR_EN 25 BUZ_DC 24 BUZ_AC 23 47 GND 36 GND 32 GND 49 EPAD R10 NoPop C31 4.7nF C20 BAT54SW R2 TP15 V33D 33 RESET 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK C4 1.0uF 10.0 COMM+ 10.0 41 RESERVED 48 ADCREF R5 10.0K R33 76.8K C3 4.7uF C22 0.1uF R40 100K C5 TP16 C1 3V3_VCC 4.7uF V33A 34 3V3_VCC VIN_BRD C19 R17 10.0K MSP_RDY MSP_MOSI R45 10.0K BUZ LED_MODE 44 LOSS_THR 43 R22 100K R23 42.2k Figure 6. bq500410A Single Coil Application Diagram 8.1.1 Detailed Design Procedure 8.1.1.1 Input Regulator The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with respect to cost or efficiency. Figure 6 utilizes a low-cost buck regulator, TPS54231. 16 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 Typical Application (continued) 8.1.1.2 Power Trains The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates. 8.1.1.3 Signal Processing Components The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V offset. Series connected diodes are provided for protection from any possible transients. The three signal processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain and COMM signal used to control power transfer is from the coil being driven. 8.1.1.4 Low-Power Supervisor Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores previous charge state during this bq500410A reset period. This bq500410A off period is set by the MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms to produce an analog ping and check if a valid device is present. This time constant can not be altered to further reduce power. 8.1.1.5 Disabling Low-Power Supervisor Mode For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic example. 8.1.1.6 Input Power Requirements For full wireless power system capability and WPC compliance, the AC power adapter selected for the application should have a minimum rating of 12 V at 750 mA. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 17 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com 8.2 System Examples VIN_BRD VIN_BRD 12V-IN R69 0.020 8 VSENS 5 7 DC in BOOT GND 6 COMP 12V-IN R37 76.8k C33 47uF 0.1uF JP1 JP2 JP3 2 R19 10.0 R1 J2 C32 2700pF R9 R32 475 475 MSP_CLK MSP_MISO VCC GND 14 P1.0 XIN 13 3 P1.1 XOUT 12 4 P1.2 TEST 11 2 5 P1.3 6 P1.4 7 P1.5 EN/PG PHSE 8 4 GND LGATE 5 RST U4 MSP430G2101 R20 10.0K R14 47K C11 4.7uF Q15 C79 R35 0 COMM+ TP34 3V3_VCC COMM- C30 0.01uF TP16 R28 200k TP15 R70 23.2k 3V3_VCC TP14 C81 0.1uF COIL1.1 S U19 A C7 47p C74 B2 VCC 33pF GND VIN_BRD B1 MSP_TEST V_GATE MSP_RST 10 U20 TPS28225D Q2 BSS215P 9 MSP_RDY P1.6 8 MSP_MOSI R13 10.0K COIL1.2 2.2nF 6 VDD UGATE 1 3 PWM BOOT 2 7 EN/PG 4 GND PHSE 8 LGATE 5 C82 Q16 R74 10.0 Middle Coil TP36 Q17 C88 R36 0 COMM+ TP38 3V3_VCC R77 200k R79 I_SENSE RESET NTC MSP_MISO MSP_TEST MSP_CLK DOUT_TX DOUT_RX D3 BAT54SW 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX COMM+ 35 31 30 29 28 27 12 13 14 15 16 17 MSP_RDY 26 MSP_MOSI/LPWR_EN 25 BUZ_DC 24 BUZ_AC 23 37 COMM_A+ 38 COMM_A39 COMM_B+ 40 COMM_B- COMM+ COMM- N/C DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST MSP_RST 4.7nF BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED R11 10.0K U22 TPS28225D TP18 DPWM-1A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 R8 10.0 R17 10.0K 6 VDD UGATE 1 DPWM-1A 3 PWM BOOT 2 COIL1.3 7 EN/PG PHSE 8 4 GND LGATE 5 C90 VIN_BRD B1 Q18 R82 10.0 C94 0.068uF TP40 C24 NoPop 0.22uF C91 Q19 C96 R41 0 C27 NoPop C93 0.068uF 4700pF COMM+ TP42 3V3_VCC COMM- R83 200k BUZ R85 23.2k LED_MODE 44 LOSS_THR 43 3V3_VCC LOSS_THR C97 0.1uF S VCC A SEE_NOTE B2 U23 D11 BAT54SW R84 10.0K COIL1.1 C95 22uF TP41 0.1uF MSP_RDY MSP_MOSI R45 10.0K 33pF GND V_GATE R23 42.2k SEE_NOTE U21 A R12 10.0K C84 B2 VCC R7 10.0K RESERVED 20 RESERVED 19 11 PMB_DATA 10 PMB_CLK 46 V_IN 45 V_SENSE 42 I_SENSE FOD C16 U11 BQ500410A 47 GND 36 GND 32 GND 49 EPAD C31 4.7nF S 3V3_VCC F 5 3V3_VCC V33A 34 V33D 33 41 RESERVED 48 ADCREF R5 10.0K R10 NoPop R31 10.0K R78 10.0K 1.0uF COIL1.2 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK C4 C20 C22 D10 BAT54SW 10.0 1.0uF R80 C3 R73 1.0uF 10.0 C1 C89 0.1uF R86 4.7uF R81 C5 10.0 VIN_BRD 3V3_VCC 4.7uF 10.0 23.2k 3V3_VCC 0.1uF C15 5.6nF C85 0.068uF 22 10.0K C19 C87 22uF COMM- R46 R25 3V3_VCC C14 5.6nF 4700pF 3V3_VCC 3V3_VCC C86 0.068uF TP37 0.22uF C83 0.1uF 330pF D5 BAT54SW R66 10.0K C78 0.1uF C12 R33 76.8K C23 NoPop 0.1uF MSP_SYNC P1.7 STATUS C75 0.068uF 4700pF 0.1uF DPWM-1A R40 100K C77 22uF 0.22uF C73 V+ I_SENSE R6 100K C21 NoPop TP33 C70 D2 PILOT D7 1 7 R71 1.00k GND ties 475 COIL1.1 TP31 R21 10.0K R4 3.16k C10 0.01uF R3 2 C72 R68 249k 3V3_VCC REF GND 10.0K C29 NoPop 0.01uF U17 INA199A1 1.0nF C28 1 C69 0.1uF C34 C2 1 BOOT R67 150k 1.0 R29 D1 MBR0540 UGATE PWM 10.0 PH SS R18 1.00 VDD 3 R72 EN 4 R15 1.00 6 DPWM-1A C76 0.068uF F VIN 3 L1 330uH R27 10.0 R2 N/C 0.1uF C26 Q13 U18 TPS28225D 10.0 C25 0.1uF 1 V_GATE IN- C6 10uF 2 3V3_VCC Q1 BSS215P IN+ 1 2 VCC U5 TPS54231D OUT 12V-IN J1 TP32 Q14 BC847CL F 12V-IN C92 33pF GND B1 R22 R39 Q8-A FOD R24 Q8-B AGND PMOD Note: Either one of these circuits is connected to LOSS_THR but not both 1 Parts labeled "NoPop" are not installed Figure 7. bq500410A Low-Power Application Diagram 18 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 System Examples (continued) VIN_BRD TP32 Q14 BC847CL 12V-IN J1 1 2 C6 10uF VCC U5 TPS54231D C25 N/C 0.1uF DC in 2 VIN BOOT 1 3 EN PH 8 4 SS VSENS 5 7 GND COMP 6 12V-IN C26 0.1uF D1 MBR0540 R37 76.8k C2 C33 47uF 0.1uF R27 10.0 6 VDD UGATE 1 3 PWM BOOT 2 COIL1.1 7 EN/PG PHSE 8 4 GND LGATE 5 C72 R68 249k Q13 U18 TPS28225D DPWM-1A R67 150k L1 330uH V_GATE C76 0.068uF TP31 Q15 C79 R35 0 C70 3V3_VCC 0.1uF COMM+ TP34 COMM- R28 200k R1 10.0K TP16 TP15 R70 COIL1.1 S U19 A VCC 6 VDD UGATE 1 DPWM-1A 3 PWM BOOT 2 COIL1.2 7 EN/PG PHSE 8 4 GND LGATE 5 22 R25 VCC C19 4.7uF C5 4.7uF C1 1.0uF C3 1.0uF C20 1.0uF C82 RESET 4 AD08 3 AD03 2 T_SENSE 1 COIL_PEAK 475 COMM+ COMM- N/C D2 STATUS COMM+ 37 COMM_A+ 38 COMM_A39 COMM_B+ 40 COMM_B- BPCAP RESERVED RESERVED RESERVED RESERVED RESERVED DPWM_A PMOD MSP_SYNC COIL1.1 COIL1.2 COIL1.3 6 FOD 7 MSP_RST/LED1 8 MSP_MISO/LED2 9 MSP_TEST 18 MSP_CLK 21 DOUT_TX 22 DOUT_RX VCC 35 31 30 29 28 27 12 13 14 15 16 17 R72 10.0 C14 5.6nF Q17 C88 C85 0.068uF C15 5.6nF 4700pF 3V3_VCC VCC COMM+ TP38 R12 10.0K COMM- R11 10.0K R77 200k R79 23.2k 3V3_VCC C89 0.1uF TP18 R8 10.0 COIL1.2 S R17 10.0K U21 A MSP_RDY 26 MSP_MOSI/LPWR_EN 25 BUZ_DC 24 BUZ_AC 23 U22 TPS28225D 6 VDD UGATE 1 DPWM-1A 3 PWM BOOT 2 COIL1.3 7 EN/PG PHSE 8 4 GND LGATE 5 R23 42.2k C90 33pF GND VIN_BRD B1 V_GATE LED_MODE 44 LOSS_THR 43 C84 B2 VCC Q18 R82 10.0 C94 0.068uF TP40 C24 NoPop C95 22uF TP41 0.22uF C91 Q19 C96 R41 0 C27 NoPop C93 0.068uF 4700pF 0.1uF COMM+ TP42 3V3_VCC COMM- R83 200k R85 R86 R81 10.0 C97 0.1uF 10.0 23.2k 3V3_VCC S VCC A B2 U23 D11 BAT54SW R84 10.0K COIL1.1 D10 BAT54SW R78 10.0K DPWM-1A COIL1.1 COIL1.2 COIL1.3 C87 22uF 0.22uF R36 0 R7 10.0K RESERVED 20 RESERVED 19 11 PMB_DATA 10 PMB_CLK 47 GND 36 GND 32 GND 49 EPAD R9 475 R32 D3 BAT54SW U11 BQ500410A 46 V_IN 45 V_SENSE 42 I_SENSE R10 NoPop 330pF C83 C86 0.068uF TP37 10.0 5 C31 4.7nF Middle Coil TP36 F R33 76.8K V33A 34 41 RESERVED 48 ADCREF V33D 33 0.1uF R31 10.0K R74 10.0 0.1uF C22 C4 Q16 R80 VCC 12V-IN 10.0K VIN_BRD B1 F U20 TPS28225D R46 33pF GND V_GATE VCC C74 B2 VCC D5 BAT54SW R66 10.0K GND ties R40 100K R2 C81 0.1uF 2700pF 10.0 C32 3V3_VCC R73 J2 NoPop R4 3.16k 10.0 JP1 JP2 JP3 C23 NoPop C75 0.068uF 4700pF 0.1uF 23.2k C29 0.01uF C77 22uF 0.22uF C73 C28 1 2 C21 NoPop TP33 F 12V-IN C92 33pF GND B1 Figure 8. bq500410A Low-Cost Application Diagram Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 19 Not Recommended for New Designs bq500410A SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 www.ti.com 9 Layout 9.1 Layout Guidelines Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB layout techniques. A few good tips are repeated here: The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be achieved though not as easily. Ideally, the approach to the layer stack-up has been: * Layer 1 component placement and as much ground plane as possible. * Layer 2 clean ground. * Layer 3 finish routing. * Layer 4 clean ground. Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also provides a noise-free voltage reference plane for device operation. Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation, such as analog-digital conversion, clock stability and best overall EMI performance. Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds. Having several tie points defeats the purpose of separating the grounds. The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as differential routing and shielding, but the COMM signal lines do not need to be impedance matched. The DC-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a single-chip controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good layout technique. 20 Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A Not Recommended for New Designs bq500410A www.ti.com SLUSB96A - NOVEMBER 2012 - REVISED DECEMBER 2015 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation For related documentation, see the following: 1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/ 2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI's Compliant Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401) 3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number SLUSAL8) 4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas Instruments Literature Number SLVSAT9) 5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635) 6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649 10.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 10.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 10.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2012-2015, Texas Instruments Incorporated Product Folder Links: bq500410A 21 PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) BQ500410ARGZR NRND VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 110 BQ500410A BQ500410ARGZT NRND VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 110 BQ500410A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Oct-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ500410ARGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 BQ500410ARGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 BQ500410ARGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 BQ500410ARGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Oct-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ500410ARGZR VQFN RGZ 48 2500 367.0 367.0 38.0 BQ500410ARGZR VQFN RGZ 48 2500 367.0 367.0 38.0 BQ500410ARGZT VQFN RGZ 48 250 210.0 185.0 35.0 BQ500410ARGZT VQFN RGZ 48 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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