20
30
40
50
60
70
80
0 1 2 3 4 5
Output Power (W)
Efficiency (%)
G000
Power
Stage
AC-DC
BQ500410 A Feedback
Transmitter Receiver
Rectification Voltage
Conditioning Load
Controller
bq51k
Communication
Power
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
bq500410A Free Positioning, Qi-Compliant Wireless Power Transmitter Manager
Not Recommended for New Designs
1 Features 3 Description
The bq500410A device is a free-positioning digital
1• Expanded Free Positioning Using Three-Coil wireless power controller that integrates all functions
Transmit Array required to control wireless power transfer to a WPC
• Intelligent Control of Wireless Power Transfer compliant receiver. It is WPC 1.1 ready and designed
• Conforms to Wireless Power Consortium (WPC) for 12-V systems but applicable to other supply
voltages. The bq500410A pings the surrounding
A6 Transmitter Specification environment for WPC compliant devices to be
• Digital Demodulation Reduces Components powered, safely engages the device, reads the
• WPC1.1 Ready, Including Foreign Object packet feedback from the powered device, and
Detection (FOD) manages the power transfer. A charging area of at
• Enhanced Parasitic Metal Detection (PMOD) least 70 mm × 20 mm provides flexible receiver
placement on a transmitter pad. The bq500410A
Assures Safety supports both Parasitic Metal Detection (PMOD) and
• Overcurrent Protection Foreign Object Detection (FOD) by continuously
• LED Indication of Charging State and Fault Status monitoring the efficiency of the established power
transfer, protecting from power lost due to metal
2 Applications objects misplaced in the wireless power transfer path.
Should any abnormal condition develop during power
• WPC 1.1 Ready Wireless Chargers for: transfer, the bq500410A handles it and provides fault
– Smart Phones and Other Handhelds indicator outputs. Comprehensive protection features
– Hermetically Sealed Devices and Tools provide a robust design to protect the system in all
receiver placements.
– Cars and Other Vehicles The bq500410A is available in an area-saving 48-pin,
– Tabletop Charge Surfaces 7-mm × 7-mm VQFN package and operates over a
• See www.ti.com/wirelesspower for More temperature range from –40°C to 110°C.
Information on TI's Wireless Charging Solutions
space Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
bq500410A VQFN (48) 7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
Functional Diagram Efficiency Vs System Output Current
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
Table of Contents
7.3 Feature Description................................................... 9
1 Features.................................................................. 18 Application and Implementation ........................ 16
2 Applications ........................................................... 18.1 Typical Application ................................................. 16
3 Description............................................................. 18.2 System Examples ................................................... 18
4 Revision History..................................................... 29 Layout................................................................... 20
5 Pin Configuration and Functions......................... 39.1 Layout Guidelines ................................................... 20
6 Specifications......................................................... 510 Device and Documentation Support................. 21
6.1 Absolute Maximum Ratings ...................................... 510.1 Documentation Support ........................................ 21
6.2 Recommended Operating Conditions....................... 510.2 Community Resources.......................................... 21
6.3 Thermal Information.................................................. 510.3 Trademarks........................................................... 21
6.4 Electrical Characteristics........................................... 510.4 Electrostatic Discharge Caution............................ 21
7 Detailed Description.............................................. 710.5 Glossary................................................................ 21
7.1 Overview................................................................... 711 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram......................................... 9Information........................................................... 21
4 Revision History
Changes from Original (November 2012) to Revision A Page
• Added Feature Description section, Application and Implementation section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
2Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
V_IN
bq500410A
48
47
46
45
44
43
42
41
40
39
33
32
31
30
29
28
27
26
25
13
14
15
18
19
21
16
17
3
4
5
6
7
8
9
10
11
12
34
22
20
RESET
AD08
MSP_RST/LED1
MSP_TEST
PMB_DATA
MSP_MISO/LED2
PMB_CLK
DPWM_A
PMOD
DOUT_TX
MSP_SYNC
Coil 1.1
Coil 1.2
RESERVED
RESERVED
DOUT_RX
MSP_CLK
RESERVED
RESERVED
ADCREF
RESERVED
RESERVED
RESERVED
MSP_RDY
MSP _MOSI /LPWR_EN
GND
GND
COMM_B-
COMM_B+
LED_MODE
AD03
RESERVED
FOD
LOSS_THR
V33A
I_SENSE
V33D
23
24
BUZ_AC
BUZ_DC
38
37
COMM_A-
COMM_A+
1
2
T_SENSE
COIL_PEAK
35
36 GND
BPCAP
Coil 1.3
49
EPAD
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
5 Pin Configuration and Functions
RGZ Package
48-Pin VQFN
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
AD03 3 This pin can be either connected to GND or left open. Connecting to GND can improve
Ilayout grounding.
AD08 4 I Reserved. Connect to 3.3-V supply.
ADCREF 48 I External reference voltage input. Connect this input to GND.
BPCAP 35 — Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.
BUZ_AC 23 O AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins.
BUZ_DC 24 DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected
Oto an LED through 470-Ωresistor.
COIL 1.1 15 O Enables the first coil drive train and COMM signal selector.
COIL 1.2 16 O Enables the second coil drive train and COMM signal selector.
COIL 1.3 17 O Enables the third coil drive train and COMM signal selector.
COIL_PEAK 1 I Input from peak detect circuit.
COMM_A- 38 I Digital demodulation inverting input A, connect parallel to input B-.
COMM_A+ 37 I Digital demodulation noninverting input A, connect parallel to input B+.
COMM_B- 40 I Digital demodulation inverting input B, connect parallel to input A-.
COMM_B+ 39 I Digital demodulation noninverting input B, connect parallel to input A+.
DOUT_RX 22 I Reserved, leave this pin open.
DOUT_TX 21 I Reserved, leave this pin open.
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SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
Pin Functions (continued)
PIN I/O DESCRIPTION
NAME NO.
DPWM_A 12 O PWM Output to half bridge driver. Switching dead times must be externally generated.
EPAD 49 — Flood with copper GND plane and stitch vias to PCB internal GND plane.
FOD 6 FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
Ocontrols the FOD threshold resistor read at startup.
GND 32 — GND
GND 36 — GND
GND 47 — GND
I_SENSE 42 I Transmitter input current, used for parasitic loss calculations. Use 20-mΩsense resistor and
A=50 gain current sense amp.
LED_MODE 44 I LED Mode Select.
LOSS_THR 43 I Input to program foreign metal object detection (FOD) threshold.
MSP_CLK 18 I/O MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor.
MSP_MISO/LED2 8 A dual function pin. MSP – MISO provided serial communication to the external supervisor.
I LED2 -- If external MSP430 is not used, connect to a (red) LED through 470-Ωresistor for
status indication. Grounding pin 25 determines this pin's function.
MSP_MOSI/LPWR_EN 25 MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate
I/O MSP430 low power supervisor is not used.
MSP_RDY 26 I/O MSP_RDY, MSP430 Programmed Indication.
MSP_RST/LED1 7 A dual function pin. MSP – RST provides serial communication to the external supervisor.
I LED1 -- If external MSP430 is not used, connect to a (green) LED through 470-Ωresistor for
status indication. Grounding pin 25 determines this pin's function.
MSP_SYNC 14 O MSP SPI_SYNC, If external MSP430 is not used, leave this pin open.
MSP_TEST 9 I MSP – Test, If external MSP430 is not used, leave this pin open.
PMB_CLK 10 I/O 10-kΩpullup resistor to 3.3-V supply. I2C/PMBus is for factory use only.
PMB_DATA 11 I/O 10-kΩpullup resistor to 3.3-V supply. I2C/PMBus is for factory use only.
PMOD 13 PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
Ocontrols the PMOD threshold resistor read at startup.
RESERVED 19 O Reserved, leave this pin open.
RESERVED 20 I Reserved, connect to GND.
RESERVED 27 I/O Reserved, leave this pin open.
RESERVED 28 I/O Reserved, leave this pin open.
RESERVED 29 I/O Reserved, leave this pin open.
RESERVED 30 I/O Reserved, leave this pin open.
RESERVED 41 I Reserved, leave this pin open.
RESERVED 31 I/O Reserved, connect 10-kΩpulldown resistor to GND. Do not leave open.
RESET 5 I Device reset. Use 10-kΩto 100-kΩpullup resistor to 3.3-V supply.
T_SENSE 2 Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply
Iconnecting to 3.3-V supply.
V33A 34 — Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ωresistor
and additional bypass capacitors.
V33D 33 — Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
V_IN 46 I System input voltage selector. Connect this input to GND for 12-V operation.
V_SENSE 45 I Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample
point should be after current input sense resistor. Use 76.8-kΩto 10-kΩdivider to minimize
quiescent loss.
4Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
Not Recommended for New Designs
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SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Voltage applied at V33D to DGND –0.3 3.6
Voltage applied at V33A to AGND –0.3 3.6 V
Voltage applied to any pin (2) –0.3 3.6
Storage temperature, TSTG –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 V
TAOperating free-air temperature range –40 110 °C
TJJunction temperature 110
6.3 Thermal Information bq500410A
THERMAL METRIC(1) RGZ [VQFN] UNIT
48 PINS
RθJA Junction-to-ambient thermal resistance 27.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 12.9 °C/W
RθJB Junction-to-board thermal resistance 4.3 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 4.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor IC Package Thermal Metrics application report,
SPRA953.
6.4 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IV33A V33A = 3.3 V 8 15
IV33D Supply current V33D = 3.3 V 42 55 mA
ITotal V33D = V33A = 3.3 V 52 60
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33 3.3-V linear regulator Emitter of NPN transistor 3.25 3.3 3.6 V
V33FB 3.3-V linear regulator feedback 4 4.6
IV33FB Series pass base drive VIN = 12 V; current into V33FB pin 10 mA
Beta Series NPN pass device 40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA= 25°C 3 3.6 V
V33A Analog 3.3-V power TA= 25°C 3 3.6
3.3-V slew rate between 2.3 V and 2.9 V,
V33Slew 3.3-V slew rate 0.25 V/ms
V33A = V33D
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B-
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCM Common mode voltage each pin –0.15 1.631 V
COMM+, Modulation voltage digital resolution 1 mV
COMM-
REA Input Impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩsource impedance –5 5 µA
ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open 2.37
VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground 0.36 V
VADC_RANGE Measurement range for voltage monitoring ALL ANALOG INPUTS 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
Ilkg Input leakage current 3 V applied to pin 100 nA
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
DGND1
VOL Low-level output voltage IOL = 6 mA , V33D = 3 V + 0.25
V33D
VOH High-level output voltage IOH = –6 mA , V33D = 3 V V
– 0.6 V
VIH High-level input voltage V33D = 3 V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high source current 4 mA
IOL(MAX) Output low sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D Pin 2.3 2.4 V
tRESET Pulse width needed for reset RESET pin 2 µs
fSW Switching Frequency 112 205 kHz
Time to detect presence of device requesting
tdetect 0.5 s
power
6Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
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SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
7 Detailed Description
7.1 Overview
7.1.1 Fundamentals
The principle of wireless power transfer is simply an open-cored transformer consisting of a transmitter and
receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and
electronics are typically built into a portable device, such as a cell phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary
voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be
managed through any of various familiar closed-loop control schemes.
7.1.2 Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
Standard was developed to facilitate cross-compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com.
7.1.3 Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency, and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils is, the better the coupling. However, the practical distance is set to be
less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC
compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed.
Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz,
(that is, the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the
power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the
coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
7.1.4 Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message, and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side
electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A
device features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the
resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting
amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a
capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: bq500410A
Comm
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
A(0)
A(1)
F, kHz
Fo(1) < Fo(0)
Operating state at logic “ 0”
Operating state at logic “ 1”
Fsw
a) b)
Comm
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Resitor
Amax
A(0)
A(1)
F, kHz
Fsw
Operating state at logic “0”
Operating state at logic “1”
a) b)
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
Overview (continued)
Figure 1. Receiver Resistive Modulation Circuit
Figure 2. Receiver Capacitive Modulation Circuit
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Product Folder Links: bq500410A
PWM/
Coil_Select
Controller
TEMP_INT
LED Control /
Low Power
Supervisor
Interface
I2C
Digital
Demodulation
Buzzer
Control
Power
Control
bq500410A
37
38
39
40
46
45
2
43
44 11
10
23
24
12
15
7
6
5
COMM _A+
COMM_A-
COMM _B+
COMM_B-
FOD
RESET
V_IN
V_SENSE
T_SENSE
LOSS_THR
LED_MODE
MSP_RST/LED1
DPWM_A
Coil 1.1
BUZ_AC
BUZ_DC
PMB_DATA
PMB_CLK
8
9
14
18
25
26
MSP_MISO/LED2
MSP_TEST
MSP_SYNC
MSP_CLK
MSP_MOSI/LPWR_EN
MSP_RDY
16
17
Coil 1.2
Coil 1.3
42I_SENSE
1
COIL_PEAK
13PMOD
12-Bit
ADC
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
7.2 Functional Block Diagram
7.3 Feature Description
The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The
COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To
select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven,
note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power
is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential
ping sequence and detection to determine the best matching coil to drive continues to repeat.
7.3.1 Capacitor Selection
Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF × 68 nF (+5.6-nF
center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline.
NOTE
A total capacitance value of 2 nF × 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G
dielectric type) is required in the resonant tank to achieve the correct resonance
frequency.
The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes
also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or
below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as
the minimum modulation or ensured power requirements, might fail.
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Product Folder Links: bq500410A
Diw
Dil
Dol
Dow
Doo
Doe
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
Feature Description (continued)
The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work
depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types.
7.3.2 A6 Coil Specification
The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This
is fixed and cannot be changed on the transmitter side.
The bq500410A is primarily intended to drive a 3-coil array but it can also be used to drive a single coil. For
single coil operation the two outer coils and associated electronics are simply omitted. Please refer to Figure 6.
Figure 3. Coil Specification Drawing
Table 1. Coil Specification
PARAMETER SYMBOL SPECIFICATION UNIT
Outer length Dol 53.2, (±0.5)
Inner length Dil 27.5, (±0.5)
Outer width Dow 45.2, (±0.5) mm
Inner width Diw 19.5, (±0.5)
Thickness Dc 1.5, (±0.5)
Turns N 12 Turns
Layers - 1
Odd displacement Doo 49.2, (±4) mm
Even displacement Doe 24.6, (±2)
NOTE
The performance of an A6 transmitter can vary based on the design of the A6 coil set. For
best performance with small receiver coils under heavy loading, it is best to design the coil
set such that the Doo dimension is on the low end of the specified tolerance.
For a current list of coil vendors, please see:
•bqTESLA Transmitter Coil Vendors,SLUA649
10 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
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LED_MODE 44
Resistors
to set
options
bq500410A
To 12-bit ADC
43
LOSS_THR
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
7.3.3 Option Select Pins
Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode
of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. The values of the operating
parameters set by these pins are determined using Table 3. For LED_MODE, the selected bin determines the
LED behavior based on Table 2; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section).
Figure 4. Option Programming
7.3.4 LED Modes
The bq500410A device can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.
The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes
presented in Table 2.
Table 2. LED Modes
OPERATIONAL STATES
LED LED
CONTROL SELECTION DESCRIPTION LED POWER CHARGE PMOD or FOD
STANDBY FAULT
OPTION RESISTOR TRANSFER COMPLETE WARNING
0 <36.5 kΩLEDs off
LED1, Green Off Blink slow(1) On Off Off
1 42.2 kΩGeneric LED2, Red Off Off Off On Blink fast(2)
LED1, Green On Blink slow(1) On Off Off
2 48.7 kΩGeneric + standby LED2, Red On Off Off On Blink fast(2)
LED1, Green Off Off On Off Off
3 56.2 kΩGeneric Opt 1 LED2 Red Off On Off Blink fast(2) On
LED1, Green Off On Off Off Off
4 64.9 kΩGeneric Opt 2 LED2 Red Off Off Off On Blink fast(2)
> 75 kΩReserved
7.3.5 Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously
monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the
value of power reported by the RX device being charged, the bq500410A can estimate how much power is
unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this
unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is
halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being
charged.
(1) Blink slow = 0.625 Hz
(2) Blink fast = 2.5 Hz
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Product Folder Links: bq500410A
R22
R39
Q8-A Q8-B
R24
AGND
FOD PMOD
SEE_NOTE SEE_NOTE
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0
Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43
open should issues with compliance or interoperability arise.
The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore
more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1
specification additionally uses the Received Power packet which more accurately tracks power used by the
receiver.
As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting
point is 400 mW (selected by a 56.2-kΩresistor on the LOSS_THR option pin 43). If, for some reason, the
application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be
used.
Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines
(FOD and PMOD) are driven briefly at power-up when the resistor values are read.
To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design.
Table 3. Option Select Bins
LOSS THRESHOLD
BIN NUMBER RESISTANCE (kΩ)(mW)
0 <36.5 250
1 42.2 300
2 48.7 350
3 56.2 400
4 64.9 450
5 75.0 500
6 86.6 550
7 100 600
8 115 650
9 133 700
10 154 750
11 178 800
12 205 850
13 >237 Feature Disabled
A. Either one of these circuits is connected to LOSS_THR, but not both.
Figure 5. LOSS_THR Connection Circuits
7.3.6 Shut Down by Thermal Sensor or Trigger
Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down.
12 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
R _ Setpoint 2.3 R _ NTC= ´
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1. Consult the NTC datasheet and find the resistence vs temperature curve.
2. Determine the actual temperature where the NTC will be placed by using a thermal probe.
3. Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4. Use the following formula to determine the upper leg resistor (R_Setpoint):
(1)
The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature
is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
7.3.7 Fault Handling and Indication
The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long
the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the
condition or fault.
Table 4. Fault Handling and Indication
DURATION
CONDITION HANDLING
(before retry)
EPT-00 Immediate Unknown
EPT-01 5 seconds Charge complete
EPT-02 Infinite Internal fault
EPT-03 5 minutes Over temperature
EPT-04 Immediate Over voltage
EPT-05 Immediate Over current
EPT-06 Infinite Battery failure
EPT-07 Not applicable Reconfiguration
EPT-08 Immediate No response
OVP (over voltage) Immediate
OC (over current) 1 minute
NTC (external sensor) 5 minutes 10 seconds LED only,
PMOD/FOD warning 12 seconds 2 seconds LED +
buzzer
PMOD/FOD 5 minutes
7.3.8 Power Transfer Start Signal
The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low-cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. Do not exceed 4-mA loading from either of these pins which is more than adequate for small
signaling and actuation. If not used, these pins should be left open.
7.3.9 Power-On Reset
The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
7.3.10 External Reset, RESET Pin
The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
7.3.11 Trickle Charge and CS100
CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete.
The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon
receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output
and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has
changed, assuming it receives another EPT, the LED mode stays the same.
The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery
charging applications, there is a benefit to continue the charging process in trickle-charge mode to top off the
battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%'
message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED
is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode.
7.3.12 Current Monitoring Requirements
The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be
provided in the design.
Current monitoring is optional however, it is used for the foreign metal protection features and over current
protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.
Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This
would enable a forward migration path to future WPC1.1 compatibility.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩand the current
shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature
stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.
7.3.13 Overcurrent Protection
The bq500410A has an integrated current protection feature which monitors the input current reported by the
current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power
transfer is halted for one minute.
If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE
input pin to the bq500410A (pin 42) should be grounded.
NOTE
Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor
circuit or by connecting to ground.
7.3.14 MSP430G2101 Low Power Supervisor
This is an optional low-power feature. By adding the MSP430G2101, as recommended in Figure 6, the
bq500410A device is periodically shut down to conserve power, yet all relevant states are recalled and all
running LED status indicators remain active.
Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most
direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the
bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge
state, fault condition, operating mode, and indicator pins driven would be cleared.
The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains
charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and
controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication
during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care
should be taken not to exceed the pin output current drive limit.
14 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected
making it possible to achieve Energy Star rating.
The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required
MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field
update. The MSP430G2101 code cannot be modified by the user.
NOTE
The user cannot program the MSP430G2101 in this system.
7.3.15 All Unused Pins
All unused pins can be left open unless otherwise indicated. Please refer to . Grounding of unused pins, if it is an
option, can improve PCB layout.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: bq500410A
BUZ
C1
C19
C3
C5
C22
R22 R23
C20
R25
R8 R17
R45
R46
R2
Q13
R27
R28
R66
C72
C73
C74
C77
Q15
U18
R70
C79
D5
TP31 TP33
TP34
R72
U5
D1
R4
R37
C2
C6 C25
C32
L1
C26
C28
J1
J2
R9
U4
R13
R14
C10 C11
C12
R19
R20
Q1
R21
D7 D2
R3
R32
C33
TP18
TP16
TP15
C75
C76 C21
C23
JP1
JP2
JP3
R29
R1
C29
R5
NTC C16
R31
R33
C31
R40
R35
U17
R15 R18
C30
C69
R69
R71
C78
TP14
R67
R68
Q14
C70
TP32
R7
R10
C4
D3
C34
Q2
R6 C7
R11R12
U11
1
23
4 5
6
7 8
12
3
4 5
67
8
1
2
1
2
1
2
3
4
5
6
7 8
9
10
11
12
13
14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
BOOTVIN
EN
SS VSENS
COMPGND
PH
VCC
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5 P1.6
P1.7
RST
TEST
XOUT
XIN
GND
IN-
IN+
OUT
REF
GND
V+
COIL_PEAK
T_SENSE
AD03
AD08
RESET
FOD
MSP_RST/LED1
MSP_MISO/LED2
MSP_TEST
PMB_CLK
PMB_DATA
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
MSP_CLK
RESERVED
RESERVED
DOUT_TX
DOUT_RX
BUZ_AC
BUZ_DC
MSP_MOSI/LPWR_EN
MSP_RDY
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
V33D
V33A
BPCAP
GND
COMM_A+
COMM_A-
COMM_B+
COMM_B-
RESERVED
I_SENSE
LOSS_THR
LED_MODE
V_SENSE
V_IN
GND
ADCREF
EPAD
1.0uF
4.7uF
1.0uF
4.7uF
0.1uF
100K 42.2k
1.0uF
10.0K
10.0
10.0K
10.0K
22
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
TPS54231D
MBR0540
3.16k
76.8k
47uF
10uF 0.1uF
2700pF
330uH
0.1uF
0.01uF
475
MSP430G2101
10.0K
47K
0.01uF 4.7uF
2.2nF
10.0
10.0K
BSS215P
10.0K
475
475
0.1uF
0.068uF
0.068uF 5.6nF
5.6nF
1.0
10.0K
NoPop
10.0K
4.7nF
10.0K
76.8K
4.7nF
100K
0
INA199A1
1.00 1.00
0.01uF
0.1uF
0.020
1.00k
0.1uF
150k
249k
BC847CL
0.1uF
10.0K
NoPop
330pF
BAT54SW
1.0nF
BSS215P
100K 47p
10.0K10.0K
BQ500410A
DC in
PILOT
STATUS
GND ties
N/C
12V-IN
N/C
F
I_SENSE
COMM+
MSP_RST
MSP_MISO
MSP_TEST
MSP_CLK MSP_RDY
MSP_MOSI
DPWM-1A
COMM-
DPWM-1A
V_GATE
3V3_VCC
VIN_BRD
COMM+
COMM-
3V3_VCC
MSP_SYNC
3V3_VCC
VCC
MSP_MISO
MSP_CLK
MSP_SYNC
MSP_TEST
MSP_RDY
MSP_MOSI
3V3_VCC
12V-IN
3V3_VCC
VIN_BRD
3V3_VCC
I_SENSE
VIN_BRD
3V3_VCC
12V-IN
12V-IN
COMM+
MSP_RST
3V3_VCC 3V3_VCC
COIL1.2
COIL1.2
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Typical Application
The application schematic for the transmitter with reduced standby power is shown in Figure 7.
CAUTION
Please check the bq500410A product page for the most up-to-date schematic and list
of materials reference design package before starting a new project.
Figure 6. bq500410A Single Coil Application Diagram
8.1.1 Detailed Design Procedure
8.1.1.1 Input Regulator
The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down
from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements
with respect to cost or efficiency.
Figure 6 utilizes a low-cost buck regulator, TPS54231.
16 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
Typical Application (continued)
8.1.1.2 Power Trains
The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set
assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive
capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a
primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates.
8.1.1.3 Signal Processing Components
The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal
processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V
offset. Series connected diodes are provided for protection from any possible transients. The three signal
processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain
and COMM signal used to control power transfer is from the coil being driven.
8.1.1.4 Low-Power Supervisor
Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control
functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up
boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore
eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores
previous charge state during this bq500410A reset period. This bq500410A off period is set by the
MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms
to produce an analog ping and check if a valid device is present. This time constant can not be altered to further
reduce power.
8.1.1.5 Disabling Low-Power Supervisor Mode
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic
example.
8.1.1.6 Input Power Requirements
For full wireless power system capability and WPC compliance, the AC power adapter selected for the
application should have a minimum rating of 12 V at 750 mA.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: bq500410A
BUZ
C1
C19
C3
C5
C22
R23
C20
R25
R8 R17
R45
U11
R46
R2
Q13
R27
R28
R66
C72
C73
C74
C77
Q15
U18
R70
C79
D5
TP31 TP33
TP34
R72
U19
C81
R73
Q16
R74
R77
R78
C82
C83
C84
C85
C86
C87
Q17
U20
R79
C88
D10
TP36 TP37
TP38
R80
R81
Q18
R82
R83
R84
C90
C91
C92
C95
Q19
U22
R85
C96
D11
TP40 TP41
TP42
R86
U5
D1
R4
R37
C2
C6 C25
C32
L1
C26
C28
J1
J2
R9
U4
R13
R14
C10 C11
C12
R19
R20
Q1
R21
D7 D2
R3
R32
C33
TP18
TP16 TP15
C14
C15
C75
C76 C21
C23
C93
C94 C24
C27
JP1
JP2
JP3
R29
R1
C29
R5
NTC C16
R31
R33
C31
R40
R35
R36
R41
U17
R15 R18
C30
C69
R69
R71
C78
TP14
R67
R68
Q14
C70
TP32
R7
R10
C4
D3
C34
Q2
R6 C7
R11R12
R22
R39
Q8-A Q8-B
R24
U21
C89
U23
C97
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
1
23
4 5
6
7 8
1
23
4 5
6
7 8
1
23
4 5
6
7 8
12
3
4 5
67
8
1
2
1
2
1
2
3
4
5
6
7 8
9
10
11
12
13
14
COIL_PEAK
T_SENSE
AD03
AD08
RESET
FOD
MSP_RST/LED1
MSP_MISO/LED2
MSP_TEST
PMB_CLK
PMB_DATA
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
MSP_CLK
RESERVED
RESERVED
DOUT_TX
DOUT_RX
BUZ_AC
BUZ_DC
MSP_MOSI/LPWR_EN
MSP_RDY
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
V33D
V33A
BPCAP
GND
COMM_A+
COMM_A-
COMM_B+
COMM_B-
RESERVED
I_SENSE
LOSS_THR
LED_MODE
V_SENSE
V_IN
GND
ADCREF
EPAD
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
B2
GND
B1A
VCC
S
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
BOOTVIN
EN
SS VSENS
COMPGND
PH
VCC
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5 P1.6
P1.7
RST
TEST
XOUT
XIN
GND
IN-
IN+
OUT
REF
GND
V+
B2
GND
B1A
VCC
S
B2
GND
B1A
VCC
S
1.0uF
4.7uF
1.0uF
4.7uF
0.1uF
42.2k
1.0uF
10.0K
10.0
10.0K
10.0K
BQ500410A
22
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
0.1uF
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
0.068uF
0.068uF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
TPS54231D
MBR0540
3.16k
76.8k
47uF
10uF 0.1uF
2700pF
330uH
0.1uF
0.01uF
475
MSP430G2101
10.0K
47K
0.01uF 4.7uF
2.2nF
10.0
10.0K
BSS215P
10.0K
475
475
0.1uF
5.6nF
5.6nF
0.068uF
0.068uF NoPop
NoPop
0.068uF
0.068uF NoPop
NoPop
1.0
10.0K
NoPop
10.0K
4.7nF
10.0K
76.8K
4.7nF
100K
0
0
0
INA199A1
1.00 1.00
0.01uF
0.1uF
0.020
1.00k
0.1uF
150k
249k
BC847CL
0.1uF
10.0K
NoPop
330pF
BAT54SW
1.0nF
BSS215P
100K 47p
10.0K10.0K
0.1uF
0.1uF
DC in
PILOT
STATUS
GND ties
N/C
Middle Coil
12V-IN
1Parts labeled "NoPop" are not installed
N/C
Note: Either one of these circuits is connected to LOSS_THR but not both
F
F
F
I_SENSE
COMM+
MSP_RST
MSP_MISO
MSP_TEST
MSP_CLK MSP_RDY
MSP_MOSI
DPWM-1A
COMM-
DPWM-1A
V_GATE
3V3_VCC
COIL1.1
3V3_VCC
VIN_BRD
COMM+ COMM-
DPWM-1A
V_GATE
3V3_VCC
COIL1.2
VIN_BRD
COMM+ COMM-
DPWM-1A
V_GATE
3V3_VCC
COIL1.3
VIN_BRD
COMM+ COMM-
3V3_VCC
COIL1.1
COIL1.2
COIL1.3
MSP_SYNC
3V3_VCC
VCC
MSP_MISO
MSP_CLK
MSP_SYNC
MSP_TEST
MSP_RDY
MSP_MOSI
3V3_VCC
12V-IN
3V3_VCC
VIN_BRD
3V3_VCC
I_SENSE
VIN_BRD
3V3_VCC
12V-IN
12V-IN
COMM+
DOUT_TX
DOUT_RX
MSP_RST
3V3_VCC 3V3_VCC
AGND
FOD PMOD
SEE_NOTE
LOSS_THR
SEE_NOTE
COIL1.1
3V3_VCC
COIL1.2
3V3_VCC
COIL1.1
FOD
PMOD
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
8.2 System Examples
Figure 7. bq500410A Low-Power Application Diagram
18 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
C1
C19
C3
C5
C22
R23
C20
R25
R8 R17
R46
U5
D1
R4
R37
C2
C6 C25
C32
L1
C26
C28
J1
J2
C33
TP18
JP1
JP2
JP3
R1
C29
R31
R33
C31
R40
R7
R10
C4
D3
R11R12
R9
D2
R32
R2
Q13
R27
R28
R66
C72
C73
C74
C77
Q15
U18
R70
C79
D5
TP31 TP33
TP34
R72
U19
C81
R73
Q16
R74
R77
R78
C82
C83
C84
C85
C86
C87
Q17
U20
R79
C88
D10
TP36 TP37
TP38
R80
R81
Q18
R82
R83
R84
C90
C91
C92
C95
Q19
U22
R85
C96
D11
TP40 TP41
TP42
R86
TP16 TP15
C14
C15
C75
C76 C21
C23
C93
C94 C24
C27
R35
R36
R41
R67
R68
Q14
C70
TP32
U21
C89
U23
C97
U11
12
3
4 5
67
8
1
2
1
2
1
23
4 5
6
7 8
1
23
4 5
6
7 8
1
23
4 5
6
7 8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
BOOTVIN
EN
SS VSENS
COMPGND
PH
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
B2
GND
B1A
VCC
S
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
UGATE
BOOTPWM
GND LGATE
VDD
EN/PG PHSE
B2
GND
B1A
VCC
S
B2
GND
B1A
VCC
S
COIL_PEAK
T_SENSE
AD03
AD08
RESET
FOD
MSP_RST/LED1
MSP_MISO/LED2
MSP_TEST
PMB_CLK
PMB_DATA
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
MSP_CLK
RESERVED
RESERVED
DOUT_TX
DOUT_RX
BUZ_AC
BUZ_DC
MSP_MOSI/LPWR_EN
MSP_RDY
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
V33D
V33A
BPCAP
GND
COMM_A+
COMM_A-
COMM_B+
COMM_B-
RESERVED
I_SENSE
LOSS_THR
LED_MODE
V_SENSE
V_IN
GND
ADCREF
EPAD
1.0uF
4.7uF
1.0uF
4.7uF
0.1uF
42.2k
1.0uF
10.0K
10.0
10.0K
22
TPS54231D
MBR0540
3.16k
76.8k
47uF
10uF 0.1uF
2700pF
330uH
0.1uF
0.01uF
0.1uF
10.0K
NoPop
10.0K
76.8K
4.7nF
100K
10.0K
NoPop
330pF
BAT54SW
10.0K10.0K
475
475
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
0.1uF
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
0.068uF
0.068uF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
10.0
10.0
200k
10.0K
0.1uF
0.22uF
33pF
22uF
TPS28225D
23.2k
4700pF
BAT54SW
10.0
5.6nF
5.6nF
0.068uF
0.068uF NoPop
NoPop
0.068uF
0.068uF NoPop
NoPop
0
0
0
150k
249k
BC847CL
0.1uF
0.1uF
0.1uF
BQ500410A
DC in
GND ties
N/C
12V-IN
N/C
STATUS
Middle Coil
FFF
COMM+
DPWM-1A
COMM-
VCC
COIL1.1
COIL1.2
COIL1.3
VCC
VCC12V-IN
12V-IN
VCC
COMM+
VCC VCC
VCC
DPWM-1A
V_GATE
3V3_VCC
COIL1.1
3V3_VCC
VIN_BRD
COMM+ COMM-
DPWM-1A
V_GATE
3V3_VCC
COIL1.2
VIN_BRD
COMM+ COMM-
DPWM-1A
V_GATE
3V3_VCC
COIL1.3
VIN_BRD
COMM+ COMM-
12V-IN
COIL1.1
3V3_VCC
COIL1.2
3V3_VCC
COIL1.1
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
System Examples (continued)
Figure 8. bq500410A Low-Cost Application Diagram
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
www.ti.com
9 Layout
9.1 Layout Guidelines
Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB
layout techniques. A few good tips are repeated here:
The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be
achieved though not as easily. Ideally, the approach to the layer stack-up has been:
• Layer 1 component placement and as much ground plane as possible.
• Layer 2 clean ground.
• Layer 3 finish routing.
• Layer 4 clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise-free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation,
such as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
The DC-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a single-chip
controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the
buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge
components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good
layout technique.
20 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: bq500410A
Not Recommended for New Designs
bq500410A
www.ti.com
SLUSB96A –NOVEMBER 2012–REVISED DECEMBER 2015
10 Device and Documentation Support
10.1 Documentation Support
10.1.1 Related Documentation
For related documentation, see the following:
1. Technology, Wireless Power Consortium,http://www.wirelesspowerconsortium.com/
2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant
Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401)
3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number
SLUSAL8)
4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas
Instruments Literature Number SLVSAT9)
5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635)
6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649
10.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: bq500410A
PACKAGE OPTION ADDENDUM
www.ti.com 1-Dec-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
BQ500410ARGZR NRND VQFN RGZ 48 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 110 BQ500410A
BQ500410ARGZT NRND VQFN RGZ 48 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 110 BQ500410A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Dec-2015
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ500410ARGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2
BQ500410ARGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
BQ500410ARGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
BQ500410ARGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Oct-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ500410ARGZR VQFN RGZ 48 2500 367.0 367.0 38.0
BQ500410ARGZR VQFN RGZ 48 2500 367.0 367.0 38.0
BQ500410ARGZT VQFN RGZ 48 250 210.0 185.0 35.0
BQ500410ARGZT VQFN RGZ 48 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Oct-2015
Pack Materials-Page 2
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