IRC Advanced Film Division
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
QSOP Series Issue February 2005
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Surface Mount QSOP
Resistor Networks
• Reliable, no internal cavity
• High resistor density - .025” lead spacing
• Standard JEDEC 16, 20, and 24 pin packages
• Ultra-stable TaNSil® resistors on silicon substrates
• Standard Sn/Pb and Pb-free terminations available
QSOP Series
IRC’s TaNSil® QSOP resistor networks are the perfect solution for high volume applications that demand a
small wiring board footprint. The .025” lead spacing provides higher lead density, increased component count,
lower resistor cost, and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking, low cost
and miniature package. Excellent performance in harsh, humid environments is a trademark of IRC’s self-pas-
sivating TaNSil® resistor film.
The QSOP series is ideally suited for the latest surface mount assembly techniques and each lead can be
100% visually inspected. The compliant gull wing leads relieve thermal expansion and contraction stresses
created by soldering and temperature excursions.
For applications requiring high performance resistor networks in a low cost, surface mount package, specify
IRC QSOP resistor networks.
Electrical Data Environmental Data
Resistance Range 10 − 250KΩ
Absolute Tolerance To ±0.1%
Ratio Tolerance to R1 To ±0.05%
Absolute TCR To ±25ppm/°C
Tracking TCR To ±5ppm/°C
Element Power Rating @ 70°C
Isolated Schematic
Bussed Schematic
100mW
50mW
Package Power Rating @ 70°C 16-Pin 750mW
20-Pin 1.0W
24-Pin 1.0W
Rated Operating Voltage
(not to exceed Power X Resistance) 100 Volts
Operating Temperature -55°C to +125°C
Noise <-30dB
Test Per
MIL-PRF-83401
Typical
Delta R
Max
Delta R
Thermal Shock ±0.02% ±0.1%
Power
Conditioning ±0.03% ±0.1%
High Temperature
Exposure ±0.03% ±0.05%
Short-time
Overload ±0.02% ±0.05%
Low Temperature
Storage ±0.03% ±0.05%
Life ±0.05% ±0.1%
√
________________
QSOP Series Issue February 2005
IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Manufacturing Capability Data
Surface Mount QSOP
Resistor Networks
etulosbA
RCT
)C°/mpp(
ACITAMEHCSDETALOSI BCITAMEHCSDESSUB
cimhO
egnaR
(ΩΩ
Ω
ΩΩ)
elbaliavA
secnareloT
elbaliavA
oitaR
secnareloT
RCTtseB
gnikcarT
)C°/mpp±(
cimhO
egnaR
(ΩΩ
Ω
ΩΩ)
elbaliavA
secnareloT
elbaliavA
oitaR
secnareloT
RCTtseB
gnikcarT
)C°/mpp(
052
52-01 JGF GF 05 52-01 JGF GF 002
05-62 JGFD GFDC 01 05-62 JGF GFD 001
002-15 JGFDC GFDC 5 001-15 JGFD GFDC 05
K052-102 JGFDCB GFDCBA 5 002-101 JGFD GFDCB 52
005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
001
05-62 JGFD GFDC 01 05-62 JGF GFD 001
002-15 JGFDC GFDC 5 001-15 JGFD GFDC 05
K052-102 JGFDCB GFBA 5 002-101 JGFD GFDCB 52
005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
05
05-62 JGFD GFDC 01 001-15 JGFD GFDC 05
002-15 JGFDC GFDC 5 002-101 JGFD GFDCB 52
K052-102 JGFDCB GFBA 5 005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
52
002-15 JGFDC GFDC 5 005-102 JGFDCB GFDCB 02
K052-102 JGFDCB GFBA 5 K001-105 JGFDCB GFDCBA 5
IRC Advanced Film Division
QSOP Series Issue February 2005
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Ordering Data
Prefix GUS - QS8 A - 01 - 1002 - F B
Style
QS8 = 16-pin Network
QS0 = 20-pin Network
QSC = 24-pin Network
Schematic and Termination
A = Isolated network w/ standard Sn/Pb terminations
ALF= Isolated network w/ Pb-free terminations
B = Bussed network w/ standard Sn/Pb terminations
BLF= Bussed network w/ Pb-free terminations
Absolute TCR Code
00 = ±250ppm/°C; 01 = ±100ppm/°C
02 = ±50ppm/°C; 03 = ±25ppm/°C
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10KΩ, 50R1 = 50.1Ω
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%; D = ±0.5%
C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (optional)
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Specify tubes or tape & reel.
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
Surface Mount QSOP
Resistor Networks
Power Derating Data
25° 70° 125°
100
50
10
% Of Rated Power
Temperature in °C
Physical Data
N
0.025" Typ
L
1
0.236" ±.008"
0.154" ±.003"
0.064" ±.003"
0.006" ±.002"
0.010" ±.002"
N
N
Schematic A
Isolated
Schematic B
Bussed
Note: N = number of pins (16, 20, 24)
R1
1 2 3
R1
1 2 3
SNIPFO# "L"NOISNEMID
61 "400.0±"391.0
02 "400.0±"143.0
42 "400.0±"143.0
Note: All dimesions exclude mold flash and
end flash which shall not exceed 0.006” per side.
QF008: IRC Lead Free Product Availability and Material Declaration Sheets
Index
Worksheet
Number Product
Family Product Description
1 PFC W0 603 LF Pre cis io n Thin Film Chip Resistor
2 PFC W0805LF
Pre cis io n Thin Film Chip Resistor
3 PFC W1206LF
Pre cis io n Thin Film Chip Resistor
4 LRC LR1206LF Thick Film Cur rent Sense Resistor
5 LRC LR2010LF Thick Film Cur rent Sense Resistor
6 LRC LR2512LF Thick Film Cur rent Sense Resistor
7 LRC LRF3 W LF 3 Wat t Cur r ent Se nse Re sistor
8 SCW SC3L F 3 Wa tt Chip Resis t or
9 LRZ LRZ1206LF
Ultr a Low Resist ance Jum per Res istor
10 LRZ LRZ2010LF
Ultr a Low Resist ance Jum per Res istor
11 LRZ LRZ2512 L F Ultr a Low Re s ist anc e Jumper Res istor
12 SON N999LF Flat Precision Resistor Array
13 WCR W CR0 60 3LF General Pur pose Thick Film Re s ist or
14 WCR WCR0805LF
General Pur pose Thick Film Resist or
15 WCR WCR1206LF
General Pur pose Thick Film Resist or
16 WCR WCR1210LF
General Pur pose Thick Film Resist or
17 WCR WCR2010LF
General Pur pose Thick Film Resist or
18 WCR WCR2512LF
General Pur pose Thick Film Resist or
19 QSC QSCXL F 24 Lead QSOP Network
20 QS0 QS0XLF 20 Lead QSOP Net wor k
21 QS8 QS8XLF 16 Lead QSOP Net wor k
22 SS 4 SS4X LF 8 Lead Nar r ow S O IC Netw or k
23 SS7 QS7XLF 14 Le ad Nar row SOIC Networks
24 SS8 SS8XLF 16 Lead Narrow S OIC Network
25 SL0 SL0XLF 20 Lead Wide SOIC Networ k
26 SL8 SL8XLF 16 Lead Wide SOIC Networ k
27 SLC SLCXLF 24 Lead Wide SO IC Netw ork
28 PWC PWC0805LF
Pulse W ithst a ndin g Chi p
29 PWC PWC1206LF Pulse Withstanding Chip
30 PWC PWC2010LF
Pulse W ithst a ndin g Chi p
31 PWC PWC2512LF
Pulse W ithst a ndin g Chi p
32 PCF PCF0603LF Precis io n Nichr om e Ch ip Res is t or
33 PCF PCF0805LF Pr ec is io n Nic hr om e Ch ip Resis t or
34 PCF PCF1206LF Pr ec is io n Nic hr om e Ch ip Resis t or
35 PCF PCF1210LF Pr ec is io n Nic hr om e Ch ip Resis t or
36 WCA WCA0804LF
T hick Film Resistor Arra y
37 WCA WCC0804LF
T hick Film Resistor Arra y
38 SOT SOT23LF
3 Lead Resis t or Net w or k
39 SOT SOT143LF
4 Lead Resis t or Net w or k
Rev: April 10, 2006
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part Number Weight (mg) Rev Date:
LRC-LR2512LF-XX-XXXX-
Y
LRC-LRF2512LF-XX-XXXX-Y 54.985 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 78.19% 43.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 41.458 75.399%
78.190% Magnesium oxide 1309-48-4 1.19% 0.512 0.930%
Silicon Dioxide 14808-60-7 2.38% 1.023 1.861%
100.00% 42.993 78.190% 78.19%
Thick Film 17.11% 9.408 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 4.613 8.390%
8.634% Copper Oxide 1317-39-1 2.83% 0.134 0.244%
100.00% 4.748 8.634%
Resistor Copper 7440-50-8 42.64% 0.658 1.20%
2.807% Nickel 7440-02-0 39.36% 0.607 1.10%
Silicon Dioxide 14808-60-7 3.60% 0.056 0.10%
Barium Oxide 7440-39-3 9.38% 0.145 0.26%
Copper Alloy Titanium Dioxide 13463-67-7 0.72% 0.011 0.02%
Aluminum Oxide 1344-28-1 0.72% 0.011 0.02%
Boric Acid , Anhygrous 10043-35-3 3.58% 0.055 0.10%
100.00% 1.543 2.807%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 1.154 2.099%
5.613% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.546 0.994%
Silane Diclorodimethly 68611-44-9 2.40% 0.074 0.135%
Molybdenum 7439-98-7 6.40% 0.198 0.359%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 1.114 2.026%
100.00% 3.086 5.613%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.011 0.020%
0.056% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.018 0.033%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.003%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.031 0.056%
9.408 17.110% 17.11%
Termination 4.70% 2.584 Sputter Titanium 7440-32-6 26.09% 0.023 0.041%
0.158% Palladium 7440-05-3 73.91% 0.064 0.117%
100.00% 0.087 0.158%
Plating Copper 7440-50-8 66.03% 1.649 2.999%
4.54% Nickel 7440-02-0 11.24% 0.281 0.510%
Tin 7440-31-5 22.73% 0.567 1.032%
100.00% 2.497 4.541%
2.584 4.699% 4.70%
54.985 100.00%
Substrate+Thick
film+Termination 100.00% 54.985 Total wt (mg) 54.985 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
LRC-LRF3WLF-XX-XXXX-
Y
56.918 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 75.47% 43.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 41.424 72.779%
75.473% Magnesium oxide 1309-48-4 1.19% 0.511 0.898%
Silicon Dioxide 14808-60-7 2.38% 1.022 1.796%
100.00% 42.958 75.473% 75.47%
Thick Film 16.53% 9.408 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 4.613 8.105%
8.341% Copper Oxide 1317-39-1 2.83% 0.134 0.236%
100.00% 4.748 8.341%
Resistor Copper 7440-50-8 42.64% 0.658 1.16%
2.711% Nickel 7440-02-0 39.36% 0.607 1.07%
Silicon Dioxide 14808-60-7 3.60% 0.056 0.10%
Barium Oxide 7440-39-3 9.38% 0.145 0.25%
Copper Alloy Titanium Dioxide 13463-67-7 0.72% 0.011 0.02%
Aluminum Oxide 1344-28-1 0.72% 0.011 0.02%
Boric Acid , Anhygrous 10043-35-3 3.58% 0.055 0.10%
100.00% 1.543 2.711%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 1.154 2.028%
5.423% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.546 0.960%
Silane Diclorodimethly 68611-44-9 2.40% 0.074 0.130%
Molybdenum 7439-98-7 6.40% 0.198 0.347%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 1.114 1.958%
100.00% 3.086 5.423%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.011 0.019%
0.054% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.018 0.032%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.003%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.031 0.054%
9.408 16.529% 16.53%
Termination 8.00% 4.552 Sputter Titanium 7440-32-6 26.09% 0.040 0.071%
0.272% Palladium 7440-05-3 73.91% 0.115 0.201%
100.00% 0.155 0.272%
Plating Copper 7440-50-8 66.03% 2.903 5.101%
7.73% Nickel 7440-02-0 11.24% 0.494 0.868%
Tin 7440-31-5 22.73% 0.999 1.756%
100.00% 4.397 7.725%
4.552 7.997% 8.00%
56.918 100.00%
Substrate+Thick
film+Termination 100.00% 56.918 Total wt (mg) 56.918 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
SCW-SC3LF-XX-XXXX-
Y
56.918 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 75.47% 43.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 41.424 72.779%
75.473% Magnesium oxide 1309-48-4 1.19% 0.511 0.898%
Silicon Dioxide 14808-60-7 2.38% 1.022 1.796%
100.00% 42.958 75.473% 75.47%
Thick Film 16.53% 9.408 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 4.613 8.105%
8.341% Copper Oxide 1317-39-1 2.83% 0.134 0.236%
100.00% 4.748 8.341%
Resistor Copper 7440-50-8 42.64% 0.658 1.16%
2.711% Nickel 7440-02-0 39.36% 0.607 1.07%
Silicon Dioxide 14808-60-7 3.60% 0.056 0.10%
Barium Oxide 7440-39-3 9.38% 0.145 0.25%
Copper Alloy Titanium Dioxide 13463-67-7 0.72% 0.011 0.02%
Aluminum Oxide 1344-28-1 0.72% 0.011 0.02%
Boric Acid , Anhygrous 10043-35-3 3.58% 0.055 0.10%
100.00% 1.543 2.711%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 1.154 2.028%
5.423% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.546 0.960%
Silane Diclorodimethly 68611-44-9 2.40% 0.074 0.130%
Molybdenum 7439-98-7 6.40% 0.198 0.347%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 1.114 1.958%
100.00% 3.086 5.423%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.011 0.019%
0.054% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.018 0.032%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.003%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.031 0.054%
9.408 16.529% 16.53%
Termination 8.00% 4.552 Sputter Titanium 7440-32-6 26.09% 0.040 0.071%
0.272% Palladium 7440-05-3 73.91% 0.115 0.201%
100.00% 0.155 0.272%
Plating Copper 7440-50-8 66.03% 2.903 5.101%
7.73% Nickel 7440-02-0 11.24% 0.494 0.868%
Tin 7440-31-5 22.73% 0.999 1.756%
100.00% 4.397 7.725%
4.552 7.997% 8.00%
56.918 100.00%
Substrate+Thick
film+Termination 100.00% 56.918 Total wt (mg) 56.918 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
LRC-LRZ1206LF-R000 13.796 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 60.89% 8.4 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 8.100 58.713%
60.887% Magnesium oxide 1309-48-4 1.19% 0.100 0.725%
Silicon Dioxide 14808-60-7 2.38% 0.200 1.449%
100.00% 8.400 60.887% 60.89%
Thick Film 34.37% 4.741 Conductor Metal Copper Alloy Copper 7440-50-8 97.17% 3.886 28.170%
28.991% Copper Oxide 1317-39-1 2.83% 0.113 0.820%
100.00% 4.000 28.991%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 0.252 1.827%
4.885% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.119 0.865%
Silane Diclorodimethly 68611-44-9 2.40% 0.016 0.117%
Molybdenum 7439-98-7 6.40% 0.043 0.313%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 0.243 1.764%
100.00% 0.674 4.885%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.024 0.176%
0.489% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.040 0.289%
Silane Diclorodimethly 68611-44-9 4.90% 0.003 0.024%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.067 0.489%
4.741 34.365% 34.37%
Termination 4.75% 0.655 Sputter Titanium 7440-32-6 26.09% 0.006 0.043%
0.167% Palladium 7440-05-3 73.91% 0.017 0.123%
100.00% 0.023 0.167%
Plating Copper 7440-50-8 66.03% 0.417 3.025%
4.58% Nickel 7440-02-0 11.24% 0.071 0.515%
Tin 7440-31-5 22.73% 0.144 1.041%
100.00% 0.632 4.581%
0.655 4.748% 4.75%
13.796 100.00%
Substrate+Thick
film+Termination 100.00% 13.796 Total wt (mg) 13.796 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
LRC-LRZ2010LF-R00
0
37.012 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 78.42% 29.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 27.990 75.624%
78.424% Magnesium oxide 1309-48-4 1.19% 0.345 0.933%
Silicon Dioxide 14808-60-7 2.38% 0.691 1.866%
100.00% 29.026 78.424% 78.42%
Thick Film 16.24% 6.012 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 3.883 10.491%
10.797% Copper Oxide 1317-39-1 2.83% 0.113 0.306%
100.00% 3.996 10.797%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 0.739 1.997%
5.340% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.350 0.945%
Silane Diclorodimethly 68611-44-9 2.40% 0.047 0.128%
Molybdenum 7439-98-7 6.40% 0.126 0.342%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 0.713 1.928%
100.00% 1.976 5.340%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.014 0.038%
0.107% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.023 0.063%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.005%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.040 0.107%
6.012 16.243% 16.24%
Termination 5.33% 1.974 Sputter Titanium 7440-32-6 26.09% 0.014 0.039%
0.149% Palladium 7440-05-3 73.91% 0.041 0.110%
100.00% 0.055 0.149%
Plating Copper 7440-50-8 66.03% 1.267 3.424%
5.18% Nickel 7440-02-0 11.24% 0.216 0.583%
Tin 7440-31-5 22.73% 0.436 1.178%
100.00% 1.919 5.185%
1.974 5.333% 5.33%
37.012 100.00%
Substrate+Thick
film+Termination 100.00% 37.012 Total wt (mg) 37.012 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
WCR0603LF-XXXX-X-X-XX 2.5 10-Apr-06
Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) CAS no Substance Mass (mg)
Base (body) Alumina Alumina (Al2O3) 1344-28-1 1.8000
1.8000
Silver Silver (Ag) 7440-22-4 0.0880
Palladium Palladium (Pd) 7440-05-3 0.0020
Silicon Oxide (SiO2) 14808-60-7 0.0010
Cupric Oxide (Cuo) 1317-38-0 0.0010
Vanadiumu Oxide 1314-62-1 0.0010
Managanese Oxide (Mno2) 1313-13-9 0.0010
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0030
Zirconium Oxide Zirconium Oxide 1314-23-4 0.0030
0.1000
Silver Silver (Ag) 7440-22-4 0.0702
Palladium Palladium (Pd) 7440-05-3 0.0250
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0080
Lead Oxide (PbO) 1317-36-8 0.0009
Ruthenium Oxide(RuO2) 12036-10-1 0.0050
Lead Oxide (PbO) 1317-36-8 0.0004
Silicon Oxide (SiO2) 14808-60-7 0.0080
Boron Oxide (B2O3) 1303-86-2 0.0050
Aluminium Oxide (Al2O3) 1344-28-1 0.0030
Others 0.0030
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0006
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0009
0.1300
Lead Oxide (PbO) 1317-36-8 0.0180
Others 0.0240
Pigment Pigment Not Available 0.0080
Epoxy Resin Epoxy Resin 68928-70-1 0.0450
Phenolic Resin Phenolic Resin 9003-35-4 0.0250
Filler Filler 12141-46-7 0.0220
Carbon Black Carbon Black 1333-86-4 0.0080
0.1500
Epoxy Resin Epoxy Resin 68928-70-1 0.0090
Phenolic Resin Phenolic Resin 9003-35-4 0.0054
Filler Filler 12141-46-7 0.0050
Titanium Dioxide Titanium Dioxide 13463-67-7 0.0006
0.0200
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0050
Silver Silver (Metallic) 7440-22-4 0.0950
Plated Electrode 4% Nickel Nickel (Ni) 10101-97-0 0.1000
Plated Electrode 4% Solder Solder (Sn) 7440-31-5 0.1000
0.3000
SUM (mg) 2.5000
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Printed Electrode 76% Glass
Resistive body 5.2%
Lead Ruthenium Oxide
Glass
Glass
Overcoat 4%
Marking .8%
Terminations 4%
Pre-Coat 2%
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part number Weight (mg) Rev Date:
WCR0805LF-XXXX-X-X-XX 5.2 10-Apr-06
Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) CAS no Substance Mass (mg)
Base (body) Alumina Alumina (Al2O3) 1344-28-1 3.7440
72.00% 3.7440
Silver Silver (Ag) 7440-22-4 0.1830
Palladium Palladium (Pd) 7440-05-3 0.0042
Silicon Oxide (SiO2) 14808-60-7 0.0021
Cupric Oxide (Cuo) 1317-38-0 0.0021
Vanadiumu Oxide 1314-62-1 0.0021
Managanese Oxide (Mno2) 1313-13-9 0.0021
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0062
Zirconium Oxide Zirconium Oxide 1314-23-4 0.0062
4.00% 0.2080
Silver Silver (Ag) 7440-22-4 0.1070
Palladium Palladium (Pd) 7440-05-3 0.0946
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0166
Lead Oxide (PbO) 1317-36-8 0.0066
Ruthenium Oxide(RuO2) 12036-10-1 0.0104
Lead Oxide (PbO) 1317-36-8 0.0110
Silicon Oxide (SiO2) 14808-60-7 0.0166
Boron Oxide (B2O3) 1303-86-2 0.0104
Aluminium Oxide (Al2O3) 1344-28-1 0.0062
Others 0.0062
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0012
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0019
5.56% 0.2889
Lead Oxide (PbO) 1317-36-8 0.0190
Others 0.0499
Pigment Pigment Not Available 0.0166
Epoxy Resin Epoxy Resin 68928-70-1 0.0936
Phenolic Resin Phenolic Resin 9003-35-4 0.0520
Filler Filler 12141-46-7 0.0458
Carbon Black Carbon Black 1333-86-4 0.0166
5.65% 0.2936
Epoxy Resin Epoxy Resin 68928-70-1 0.0187
Phenolic Resin Phenolic Resin 9003-35-4 0.0112
Filler Filler 12141-46-7 0.0104
Titanium Dioxide Titanium Dioxide 13463-67-7 0.0012
0.80% 0.0416
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0104
Silver Silver (Metallic) 7440-22-4 0.1976
Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.2080
Plated Electrode Solder Solder (Sn) 7440-31-5 0.2080
12.00% 0.6240
100.00% SUM (mg) 5.2000
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Printed Electrode Glass
Resistive body
Lead Ruthenium Oxide
Glass
Glass
Overcoat
Marking
Terminations
Pre-Coat
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part number Weight (mg) Rev Date:
WCR1206LF-XXXX-X-X-XX 9.8 10-Apr-06
Base (body) Alumina Alumina (Al2O3) 1344-28-1 7.0560
72.00% 7.0560
Silver Silver (Ag) 7440-22-4 0.3450
Palladium Palladium (Pd) 7440-05-3 0.0078
Silicon Oxide (SiO2) 14808-60-7 0.0039
Cupric Oxide (Cuo) 1317-38-0 0.0039
Vanadiumu Oxide 1314-62-1 0.0039
Managanese Oxide (Mno2) 1313-13-9 0.0039
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0118
Zirconium Oxide Zirconium Oxide 1314-23-4 0.0118
4.00% 0.3920
Silver Silver (Ag) 7440-22-4 0.2207
Palladium Palladium (Pd) 7440-05-3 0.1588
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0314
Lead Oxide (PbO) 1317-36-8 0.0133
Ruthenium Oxide(RuO2) 12036-10-1 0.0196
Lead Oxide (PbO) 1317-36-8 0.0140
Silicon Oxide (SiO2) 14808-60-7 0.0314
Boron Oxide (B2O3) 1303-86-2 0.0196
Aluminium Oxide (Al2O3) 1344-28-1 0.0118
Others 0.0118
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0024
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0035
5.49% 0.5381
Lead Oxide (PbO) 1317-36-8 0.0420
Others 0.0941
Pigment Pigment Not Available 0.0314
Epoxy Resin Epoxy Resin 68928-70-1 0.1764
Phenolic Resin Phenolic Resin 9003-35-4 0.0980
Filler Filler 12141-46-7 0.0862
Carbon Black Carbon Black 1333-86-4 0.0314
5.71% 0.5594
Epoxy Resin Epoxy Resin 68928-70-1 0.0353
Phenolic Resin Phenolic Resin 9003-35-4 0.0212
Filler Filler 12141-46-7 0.0196
Titanium Dioxide Titanium Dioxide 13463-67-7 0.0024
0.80% 0.0784
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0196
Silver Silver (Metallic) 7440-22-4 0.3724
Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.3920
Plated Electrode Solder Solder (Sn) 7440-31-5 0.3920
12.00% 1.1760
SUM (mg) 9.8000
Resistive body
Lead Ruthenium Oxide
Glass
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Printed Electrode Glass
Terminations
Pre-Coat Glass
Overcoat
Marking
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part number Weight (mg) Rev Date:
WCR1210LF-XXXX-X-X-XX 16.0 10-Apr-06
Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) CAS no Substance Mass (mg)
Ceramic Alumina Alumina (Al2O3) 1344-28-1 2.1750
13.59% 2.1750
Silver Silver (Ag) 7440-22-4 0.4630
Palladium Palladium (Pd) 7440-05-3 0.3770
Silicon Oxide (SiO2) 14808-60-7 0.3760
Cupric Oxide (Cuo) 1317-38-0 0.3760
Vanadiumu Oxide 1314-62-1 0.3760
Managanese Oxide (Mno2) 1313-13-9 0.3760
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.3780
Zirconium Oxide Zirconium Oxide 1314-23-4 0.3780
19.38% 3.1000
Silver Silver (Ag) 7440-22-4 0.4452
Palladium Palladium (Pd) 7440-05-3 0.4000
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.3830
Lead Oxide (PbO) 1317-36-8 0.3759
Ruthenium Oxide(RuO2) 12036-10-1 0.3800
Lead Oxide (PbO) 1317-36-8 0.3754
Silicon Oxide (SiO2) 14808-60-7 0.3830
Boron Oxide (B2O3) 1303-86-2 0.3800
Aluminium Oxide (Al2O3) 1344-28-1 0.3780
Others 0.3780
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.3756
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.3759
28.94% 4.6300
Lead Oxide (PbO) 1317-36-8 0.3930
Others 0.3990
Pigment Pigment Not Available 0.3830
Epoxy Resin Epoxy Resin 68928-70-1 0.4200
Phenolic Resin Phenolic Resin 9003-35-4 0.4000
Filler Filler 12141-46-7 0.3970
Carbon Black Carbon Black 1333-86-4 0.3830
17.34% 2.7750
Epoxy Resin Epoxy Resin 68928-70-1 0.3840
Phenolic Resin Phenolic Resin 9003-35-4 0.3804
Filler Filler 12141-46-7 0.3800
Titanium Dioxide Titanium Dioxide 13463-67-7 0.3756
9.50% 1.5200
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.3800
Silver Silver (Metallic) 7440-22-4 0.4700
Plated Electrode Nickel Nickel (Ni) 7440-22-4 0.4750
Plated Electrode Solder Solder (Sn) 7440-31-5 0.4750
1.8000
11.25%
SUM (mg)
16.0000
Terminations
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Conductor Glass
Resistive body
Lead Ruthenium Oxide
Glass
Coating
Glass
Marking
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part number Weight (mg) Rev Date:
WCR2010LF-XXXX-X-X-XX 24.0 10-Apr-06
Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) CAS no Substance Mass (mg)
Ceramic Alumina Alumina (Al2O3) 7440-50-8 4.2662
4.2662
Silver Silver (Ag) 7440-22-4 0.7052
Palladium Palladium (Pd) 7440-05-3 0.5264
Silicon Oxide (SiO2) 14808-60-7 0.5243
Cupric Oxide (Cuo) 1317-38-0 0.5243
Vanadiumu Oxide 1314-62-1 0.5243
Managanese Oxide (Mno2) 1313-13-9 0.5243
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.5284
Zirconium Oxide Zirconium Oxide 1314-23-4 0.5284
4.3857
Silver Silver (Ag) 7440-22-4 0.6292
Palladium Palladium (Pd) 7440-05-3 0.6168
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.5388
Lead Oxide (PbO) 1317-36-8 0.5288
Ruthenium Oxide(RuO2) 12036-10-1 0.5326
Lead Oxide (PbO) 1317-36-8 0.5332
Silicon Oxide (SiO2) 14808-60-7 0.5388
Boron Oxide (B2O3) 1303-86-2 0.5326
Aluminium Oxide (Al2O3) 1344-28-1 0.5284
Others 0.5282
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.5234
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.5241
6.5551
Lead Oxide (PbO) 1317-36-8 0.5412
Others 0.5721
Pigment Pigment Not Available 0.5388
1.6522
Epoxy Resin Epoxy Resin 68928-70-1 0.6158
Phenolic Resin Phenolic Resin 9003-35-4 0.5742
Filler Filler 12141-46-7 0.5680
Carbon Black Carbon Black 1333-86-4 0.5388
2.2969
Epoxy Resin Epoxy Resin 68928-70-1 0.5409
Phenolic Resin Phenolic Resin 9003-35-4 0.5334
Filler Filler 12141-46-7 0.5333
Titanium Dioxide Titanium Dioxide 13463-67-7 0.5234
2.1311
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.5326
Silver Silver (Metallic) 7440-22-4 0.7198
Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.7302
Plated Electrode Solder Solder (Sn) 7440-31-5 0.7302
2.7129
SUM (mg) 24.0000
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Conductor Glass
Resistive body
Lead Ruthenium Oxide
Marking
Terminations
Glass
Glass
Coating
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part number Weight (mg) Rev Date:
WCR2512LF-XXXX-X-X-XX 40.0 10-Apr-06
Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) CAS no Substance Mass (mg)
Ceramic Alumina Alumina (Al2O3) 1344-28-1 7.8949
19.74%
Silver Silver (Ag) 7440-22-4 1.1839
Palladium Palladium (Pd) 7440-05-3 0.8467
Silicon Oxide (SiO2) 14808-60-7 0.8428
Cupric Oxide (Cuo) 1317-38-0 0.8428
Vanadiumu Oxide 1314-62-1 0.8428
Managanese Oxide (Mno2) 1313-13-9 0.8428
Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.8507
Zirconium Oxide Zirconium Oxide 1314-23-4 0.8507
17.76% 7.1032
Silver Silver (Ag) 7440-22-4 1.0596
Palladium Palladium (Pd) 7440-05-3 0.9977
Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.8703
Lead Oxide (PbO) 1317-36-8 0.8522
Ruthenium Oxide(RuO2) 12036-10-1 0.8585
Lead Oxide (PbO) 1317-36-8 0.8529
Silicon Oxide (SiO2) 14808-60-7 0.8703
Boron Oxide (B2O3) 1303-86-2 0.8585
Aluminium Oxide (Al2O3) 1344-28-1 0.8507
Others 0.8507
Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.5050
Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.8424
25.67% 10.2687
Lead Oxide (PbO) 1317-36-8 1.1476
Others 1.1997
Pigment Pigment Not Available 1.1370
Epoxy Resin Epoxy Resin 68928-70-1 1.0153
Phenolic Resin Phenolic Resin 9003-35-4 0.9369
Filler Filler 12141-46-7 0.9660
Carbon Black Carbon Black 1333-86-4 0.8703
18.18% 7.2726
Epoxy Resin Epoxy Resin 68928-70-1 0.8742
Phenolic Resin Phenolic Resin 9003-35-4 0.8601
Filler Filler 12141-46-7 0.8585
Titanium Dioxide Titanium Dioxide 13463-67-7 0.8413
8.59% 3.4341
Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.8585
Silver Silver (Metallic) 7440-22-4 1.2113
Plated Electrode Nickel Nickel (Ni) 10101-97-0 1.2309
Plated Electrode Solder Solder (Sn) 7440-31-5 1.2309
11.33% 4.5316
SUM (mg) 40.5050
Terminations
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Conductor Glass
Resistive body
Lead Ruthenium Oxide
Glass
Glass
Coating
Marking
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Material Declaration
PWC0805LF
Rev. Date
Pb free terminations 10-Apr-06
Component Weight
Name (mg)
Substrate
A
lumina 3.10
A
luminium oxid
e
1344-28-1 2.98 96%
Other oxides 0.12 4%
Printed
Terminations Silver alloy in
g
lass 0.25 Silver 7440-22-4 0.22 88%
Palladium 7440-05-3 0.01 2%
Metal oxides 0.03 10%
Resistive Element Metals/metal
oxides in Lead
g
lass
0.25 Silver 7440-22-4 0.09 35%
Palladium 7440-05-3 0.04 15%
Lead in
g
lass 65997-18-4 0.04 17%
Ruthenium oxide 12036-10-1 0.03 13%
Silicon dioxide 7631-86-9 0.02 8%
Other oxides 0.03 12%
Inner Protection Lead
g
lass 0.15 Lead in
g
lass 65997-18-4 0.09 60%
Other oxides 0.05 30%
Pi
g
ments 0.02 10%
Outer Protection
and Epoxy resin 0.15 Epoxy resin 0.07 45%
Markin
g
Phenolic resin 0.04 25%
Fillers 0.03 23%
Pi
g
ments 0.01 7%
Inner
Terminations Silver in resin 0.20 Silver 7440-22-4 0.19 95%
Epox
y
resin 0.01 3%
Cobalt oxide 1307-96-6 0.00 2%
Outer
Terminations Nickel 0.20 Nickel 7440-02-0 0.20 100%
Tin 0.20 Tin 7440-31-5 0.20 100%
Product Weight: 4.50 mg April 2005 IR
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Composition (%
by weight)
Material Weight
(mg) Constituent CAS Number
Material Declaration
PWC1206LF
Rev. Date
Pb free terminations 10-Apr-06
Component Weight
Name (mg)
Substrate
A
lumina 7.49
A
luminium oxid
e
1344-28-1 7.19 96%
Other oxides 0.30 4%
Printed
Terminations Silver alloy in
g
lass 0.38 Silver 7440-22-4 0.33 88%
Palladium 7440-05-3 0.01 2%
Metal oxides 0.04 10%
Resistive Element Metals/metal
oxides in Lead
g
lass
0.32 Silver 7440-22-4 0.11 35%
Palladium 7440-05-3 0.05 15%
Lead in
g
lass 65997-18-4 0.05 17%
Ruthenium oxide 12036-10-1 0.04 13%
Silicon dioxide 7631-86-9 0.03 8%
Other oxides 0.04 12%
Inner Protection Lead
g
lass 0.32 Lead in
g
lass 65997-18-4 0.19 60%
Other oxides 0.10 30%
Pi
g
ments 0.03 10%
Outer Protection Epox
y
resin 0.27 Epox
y
resin 0.12 45%
Phenolic resin 0.07 25%
Fillers 0.06 23%
Pi
g
ments 0.02 7%
Inner
Terminations Silver in resin 0.44 Silver 7440-22-4 0.42 95%
Epox
y
resin 0.01 3%
Cobalt oxide 1307-96-6 0.01 2%
Outer
Terminations Nickel 0.28 Nickel 7440-02-0 0.28 100%
Tin platin
g
0.28 Tin 7440-31-5 0.28 100%
Product Weight: 9.8 mg IR August 2004
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Composition (%
by weight)
Material Weight
(mg) Constituent CAS Number
Material Declaration
PWC2010LF
Rev. Date
Pb free terminations 10-Apr-06
Component Weight
Name (mg)
Substrate
A
lumina 20.37
A
luminium oxid
e
1344-28-1 19.56 96%
Other oxides 0.81 4%
Printed
Terminations Silver alloy in
g
lass 0.67 Silver 7440-22-4 0.59 88%
Palladium 7440-05-3 0.01 2%
Metal oxides 0.07 10%
Resistive Element Metals/metal
oxides in Lead
g
lass
0.64 Silver 7440-22-4 0.22 35%
Palladium 7440-05-3 0.10 15%
Lead in
g
lass 65997-18-4 0.11 17%
Ruthenium oxide 12036-10-1 0.08 13%
Silicon dioxide 7631-86-9 0.05 8%
Other oxides 0.08 12%
Inner Protection Lead
g
lass 0.80 Lead in
g
lass 65997-18-4 0.48 60%
Other oxides 0.24 30%
Pi
g
ments 0.08 10%
Outer Protection Epox
y
resin 0.67 Epox
y
resin 0.30 45%
Phenolic resin 0.17 25%
Fillers 0.15 23%
Pi
g
ments 0.05 7%
Inner
Terminations Silver in resin 0.80 Silver 7440-22-4 0.76 95%
Epox
y
resin 0.02 3%
Cobalt oxide 1307-96-6 0.02 2%
Outer
Terminations Nickel 0.50 Nickel 7440-02-0 0.50 100%
Tin platin
g
0.50 Tin 7440-31-5 0.50 100%
Product Weight: 25.0 mg IR August 2004
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Composition (%
by weight)
Material Weight
(mg) Constituent CAS Number
Material Declaration
PWC2512LF
Rev. Date
Pb free terminations 10-Apr-06
Component Weight
Name (mg)
Substrate
A
lumina 34.80
A
luminium oxid
e
1344-28-1 33.41 96%
Other oxides 1.39 4%
Printed
Terminations Silver alloy in
g
lass 0.80 Silver 7440-22-4 0.70 88%
Palladium 7440-05-3 0.02 2%
Metal oxides 0.08 10%
Resistive Element Metals/metal
oxides in Lead
g
lass
0.80 Silver 7440-22-4 0.28 35%
Palladium 7440-05-3 0.12 15%
Lead in
g
lass 65997-18-4 0.14 17%
Ruthenium oxide 12036-10-1 0.10 13%
Silicon dioxide 7631-86-9 0.06 8%
Other oxides 0.10 12%
Inner Protection Lead
g
lass 1.20 Lead in
g
lass 65997-18-4 0.72 60%
Other oxides 0.36 30%
Pi
g
ments 0.12 10%
Outer Protection Epox
y
resin 1.00 Epox
y
resin 0.45 45%
Phenolic resin 0.25 25%
Fillers 0.23 23%
Pi
g
ments 0.07 7%
Inner
Terminations Silver in resin 1.20 Silver 7440-22-4 1.14 95%
Epox
y
resin 0.04 3%
Cobalt oxide 1307-96-6 0.02 2%
Outer
Terminations Nickel 0.60 Nickel 7440-02-0 0.60 100%
Tin platin
g
0.60 Tin 7440-31-5 0.60 100%
Product Weight: 41.0 mg IR August 2004
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Composition (%
by weight)
Material Weight
(mg) Constituent CAS Number
Material Declaration
PCF0603LF Rev. Date
10-Apr-06
Component Name Material Weight (mg) Substance Name CAS number Weight (mg) Weight (%)
Substrate Alumina 1.892 Aluminum oxide 1344-28-1 1.7974 95.0%
Silicon Dioxide 14808-60-7 0.0568 3.0%
Magnesium oxide 1309-48-4 0.0378 2.0%
Resistive element Nichrome alloy 0.0003 Nickel 7440-02-0 0.0002 80.0%
Chrome 7440-47-3 0.0001 20.0%
Inner electrode Copper alloy 0.065 Copper 7440-50-8 0.0026 4.0%
Nickel 7440-02-0 0.0624 96.0%
Protection coat (1) Epoxy Resin 0.015 Epoxy Resin 29690-82-2 0.0041 27.5%
Polyimide 25036-53-7 0.0021 14.0%
Packed agent 14807-96-6 0.0024 16.0%
Packed agent 14808-60-7 0.0024 16.0%
Iron oxide 1309-38-2 0.0005 3.0%
Silica 7631-86-6 0.0005 3.0%
Antifoaming agent 63148-62-9 0.0001 0.5%
Ethel diglycol 124-17-4 0.0030 20.0%
Protection coat (2) Epoxy Resin 0.015 Epoxy Resin 29690-82-2 0.0045 30.0%
Phenol 108-95-2 0.0002 1.3%
Carbon black 1333-86-4 0.0005 3.0%
Pigment 0.0005 3.0%
Silicon dioxide 60676-86-0 0.0023 15.0%
Pigment 0.0002 1.0%
Antimony trioxide 1309-64-4 0.0005 3.5%
Addition agent 0.0015 10.0%
Diglycol monobutyl ethel 112-34-5 0.0038 25.0%
Solvent naphtha 64742-94-5 0.0012 8.2%
Marking Epoxy Resin 0.007 Epoxy Resin 29690-82-2 0.0026 37.5%
Titanium oxide 13463-67-7 0.0025 35.0%
Pigment 0.0011 15.0%
Silica 7440-21-3 0.0005 7.5%
Addition agent 0.0004 5.0%
Outer electrode Tin Plating 0.051 Tin 7440-31-5 0.0510 100.0%
2.0
Product Weight:
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Material Declaration
PCF0805LF Rev. Date
10-Apr-06
Component Name Material Weight (mg) Substance Name CAS number Weight (mg) Weight (%)
Substrate Alumina 3.61 Aluminum oxide 1344-28-1 3.4295 95.0%
Silicon Dioxide 14808-60-7 0.1083 3.0%
Magnesium oxide 1309-48-4 0.0722 2.0%
Resistive element Nichrome alloy 0.0007 Nickel 7440-02-0 0.0006 80.0%
Chrome 7440-47-3 0.0001 20.0%
Inner electrode Copper alloy 0.119 Copper 7440-50-8 0.0048 4.0%
Nickel 7440-02-0 0.1142 96.0%
Protection coat (1) Epoxy Resin 0.028 Epoxy Resin 29690-82-2 0.0077 27.5%
Polyimide 25036-53-7 0.0039 14.0%
Packed agent 14807-96-6 0.0045 16.0%
Packed agent 14808-60-7 0.0045 16.0%
Iron oxide 1309-38-2 0.0008 3.0%
Silica 7631-86-6 0.0008 3.0%
Antifoaming agent 63148-62-9 0.0001 0.5%
Ethel diglycol 124-17-4 0.0056 20.0%
Protection coat (2) Epoxy Resin 0.028 Epoxy Resin 29690-82-2 0.0084 30.0%
Phenol 108-95-2 0.0004 1.3%
Carbon black 1333-86-4 0.0008 3.0%
Pigment 0.0008 3.0%
Silicon dioxide 60676-86-0 0.0042 15.0%
Pigment 0.0003 1.0%
Antimony trioxide 1309-64-4 0.0010 3.5%
Addition agent 0.0028 10.0%
Diglycol monobutyl ethel 112-34-5 0.0070 25.0%
Solvent naphtha 64742-94-5 0.0023 8.2%
Marking Epoxy Resin 0.015 Epoxy Resin 29690-82-2 0.0056 37.5%
Titanium oxide 13463-67-7 0.0053 35.0%
Pigment 0.0023 15.0%
Silica 7440-21-3 0.0011 7.5%
Addition agent 0.0008 5.0%
Outer electrode Tin Plating 0.094 Tin 7440-31-5 0.0940 100.0%
3.9
Product Weight:
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Material Declaration
PCF1206LF Rev. Date
10-Apr-06
Component Name Material Weight (mg) Substance Name CAS number Weight (mg) Weight (%)
Substrate Alumina 6.93 Aluminum oxide 1344-28-1 6.5835 95.0%
Silicon Dioxide 14808-60-7 0.2079 3.0%
Magnesium oxide 1309-48-4 0.1386 2.0%
Resistive element Nichrome alloy 0.0003 Nickel 7440-02-0 0.0002 80.0%
Chrome 7440-47-3 0.0001 20.0%
Inner electrode Copper alloy 0.22 Copper 7440-50-8 0.0088 4.0%
Nickel 7440-02-0 0.2112 96.0%
Protection coat (1) Epoxy Resin 0.1 Epoxy Resin 29690-82-2 0.0275 27.5%
Polyimide 25036-53-7 0.0140 14.0%
Packed agent 14807-96-6 0.0160 16.0%
Packed agent 14808-60-7 0.0160 16.0%
Iron oxide 1309-38-2 0.0030 3.0%
Silica 7631-86-6 0.0030 3.0%
Antifoaming agent 63148-62-9 0.0005 0.5%
Ethel diglycol 124-17-4 0.0200 20.0%
Protection coat (2) Epoxy Resin 0.1 Epoxy Resin 29690-82-2 0.0300 30.0%
Phenol 108-95-2 0.0013 1.3%
Carbon black 1333-86-4 0.0030 3.0%
Pigment 0.0030 3.0%
Silicon dioxide 60676-86-0 0.0150 15.0%
Pigment 0.0010 1.0%
Antimony trioxide 1309-64-4 0.0035 3.5%
Addition agent 0.0100 10.0%
Diglycol monobutyl ethel 112-34-5 0.0250 25.0%
Solvent naphtha 64742-94-5 0.0082 8.2%
Marking Epoxy Resin 0.0015 Epoxy Resin 29690-82-2 0.0006 37.5%
Titanium oxide 13463-67-7 0.0005 35.0%
Pigment 0.0002 15.0%
Silica 7440-21-3 0.0001 7.5%
Addition agent 0.0001 5.0%
Outer electrode Tin Plating 0.11 Tin 7440-31-5 0.1100 100.0%
7.5
Product Weight:
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Material Declaration
PCF1210LF Rev. Date
10-Apr-06
Component Name Material Weight (mg) Substance Name CAS number Weight (mg) Weight (%)
Substrate Alumina 11.81 Aluminum oxide 1344-28-1 11.2195 95.0%
Silicon Dioxide 14808-60-7 0.3543 3.0%
Magnesium oxide 1309-48-4 0.2362 2.0%
Resistive element Nichrome alloy 0.0005 Nickel 7440-02-0 0.0004 80.0%
Chrome 7440-47-3 0.0001 20.0%
Inner electrode Copper alloy 0.36 Copper 7440-50-8 0.0144 4.0%
Nickel 7440-02-0 0.3456 96.0%
Protection coat (1) Epoxy Resin 0.2 Epoxy Resin 29690-82-2 0.0550 27.5%
Polyimide 25036-53-7 0.0280 14.0%
Packed agent 14807-96-6 0.0320 16.0%
Packed agent 14808-60-7 0.0320 16.0%
Iron oxide 1309-38-2 0.0060 3.0%
Silica 7631-86-6 0.0060 3.0%
Antifoaming agent 63148-62-9 0.0010 0.5%
Ethel diglycol 124-17-4 0.0400 20.0%
Protection coat (2) Epoxy Resin 0.2 Epoxy Resin 29690-82-2 0.0600 30.0%
Phenol 108-95-2 0.0026 1.3%
Carbon black 1333-86-4 0.0060 3.0%
Pigment 0.0060 3.0%
Silicon dioxide 60676-86-0 0.0300 15.0%
Pigment 0.0020 1.0%
Antimony trioxide 1309-64-4 0.0070 3.5%
Addition agent 0.0200 10.0%
Diglycol monobutyl ethel 112-34-5 0.0500 25.0%
Solvent naphtha 64742-94-5 0.0164 8.2%
Marking Epoxy Resin 0.025 Epoxy Resin 29690-82-2 0.0094 37.5%
Titanium oxide 13463-67-7 0.0088 35.0%
Pigment 0.0038 15.0%
Silica 7440-21-3 0.0019 7.5%
Addition agent 0.0013 5.0%
Outer electrode Tin Plating 0.19 Tin 7440-31-5 0.1900 100.0%
Product Weight: 12.8
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Material Declaration
WCA0804LF
Rev. Date
10-Apr-06
Alumina substrate 6.086 Alumina Aluminum Oxide 1344-28-1 96.45 5.870
88.20% Magnesium Oxide 1309-48-4 1.11 0.068
Silicon Dioxide 14808-60-7 2.09 0.127
Calcium Oxide 1305-78-8 0.35 0.021
Thick film circuit 0.505 Thick film Boron Trioxide 1303-86-2 10.56 0.053
7.32% Bismuth Oxide 1304-76-3 0.80 0.004
Chromic Oxide 1308-38-9 0.79 0.004
Antimony Trioxide 1309-64-4 0.06 0.0003
Manganese Dioxide 1313-13-9 1.01 0.005
Zinc Oxide 1314-13-2 0.47 0.002
Vanadium Pentoxide 1314-62-1 0.16 0.001
Lead Monoxide 1317-36-8 30.52 0.154
Copper Oxide 1317-38-0 1.28 0.006
Aluminum Oxide 1344-28-1 3.14 0.016
Ruthenium Oxide 12036-10-1 1.85 0.009
Silicon Dioxide 14808-60-7 10.72 0.054
Palladium 7440-05-3 1.64 0.008
Silver 7440-22-4 36.75 0.186
Others 0.25 0.001
Electrode plating 0.309 Plating Nickel 7440-02-0 55.00 0.170
4.48% Tin 7440-31-5 45.00 0.139
Product weight: 6.9 mg
Component name wt (mg) Material
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Substance wt
%Substance wt
(mg)
CAS numberSubstance name
Material Declaration
WCC0804LF
Rev. Date
10-Apr-06
Alumina substrate 8.977 Alumina Aluminum Oxide 1344-28-1 96.45 8.658
90.68% Magnesium Oxide 1309-48-4 1.11 0.100
Silicon Dioxide 14808-60-7 2.09 0.188
Calcium Oxide 1305-78-8 0.35 0.031
Thick film circuit 0.616 Thick film Boron Trioxide 1303-86-2 10.46 0.064
6.22% Bismuth Oxide 1304-76-3 1.43 0.009
Chromic Oxide 1308-38-9 0.89 0.005
Antimony Trioxide 1309-64-4 0.07 0.0004
Manganese Dioxide 1313-13-9 1.24 0.008
Zinc Oxide 1314-13-2 0.62 0.004
Vanadium Pentoxide 1314-62-1 0.29 0.002
Lead Monoxide 1317-36-8 29.83 0.184
Copper Oxide 1317-38-0 1.24 0.008
Aluminum Oxide 1344-28-1 2.84 0.017
Ruthenium Oxide 12036-10-1 1.99 0.012
Silicon Dioxide 14808-60-7 10.74 0.066
Palladium 7440-05-3 1.80 0.011
Silver 7440-22-4 36.08 0.222
Others 0.48 0.003
Electrode plating 0.307 Plating Nickel 7440-02-0 55.00 0.169
3.10% Tin 7440-31-5 45.00 0.138
Product weight: 9.9 mg
Component name wt (mg) Material
IRC Lead Free Product Availability & Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Substance wt
%Substance wt
(mg)
CAS numberSubstance name