APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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G1
Q1
VBUS NTC2
OUT
S1
G2
S2
Q2
0/VBU S NTC1
S2
G2
NTC2
OUT
OUT
VBUS
NTC1
S1 S2
G2
0/V B US
G1
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
Symbol Parameter Max ratings Unit
VDSS Drain - Source Breakdown Voltage 200 V
Tc = 25°C 208
ID Continuous Drain Current Tc = 80°C 155
IDM Pulsed Drain current 832
A
VGS Gate - Source Voltage ±30 V
RDSon Drain - Source ON Resistance 8 mW
PD Maximum Power Dissipation Tc = 25°C 781 W
IAR Avalanche current (repetitive and non repetitive) 100 A
EAR Repetitive Avalanche Energy 50
EAS Single Pulse Avalanche Energy 3000 mJ
VDSS = 200V
RDSon = 8mW max @ Tj = 25°C
ID = 208A @ Tc = 25°C
Application
· Welding converters
· Switched Mode Power Supplies
· Uninterruptible Power Supplies
Features
· Power MOS 7® FREDFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic reverse diode
- Avalanche energy rated
- Very rugged
· Kelvin source for easy drive
· Very low stray inductance
- Symmetrical design
- Lead frames for power connections
· Internal thermistor for temperature monitoring
· High level of integration
Benefits
· Outstanding performance at high frequency operation
· Direct mounting to heatsink (isolated package)
· Low junction to case thermal resistance
· Solderable terminals both for power and signal for
easy PCB mounting
· Low profile
Phase leg
MOSFET Power Module
APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
BVDSS Drain - Source Breakdown Voltage VGS = 0V, ID = 375µA 200 V
VGS = 0V,VDS = 200V Tj = 25°C 375
IDSS Zero Gate Voltage Drain Current VGS = 0V,VDS = 160V T
j = 125°C 1500 µA
RDS(on) Drain – Source on Resistance VGS = 10V, ID = 104A 8
mW
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 5mA 3 5 V
IGSS Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±150 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Ciss Input Capacitance 14.4
Coss Output Capacitance 4.66
Crss Reverse Transfer Capacitance
VGS = 0V
VDS = 25V
f = 1MHz 0.29
nF
Qg Total gate Charge 280
Qgs Gate – Source Charge 106
Qgd Gate – Drain Charge
VGS = 10V
VBus = 100V
ID = 208A 134
nC
Td(on) Turn-on Delay Time 32
Tr Rise Time 64
Td(off) Turn-off Delay Time 88
Tf Fall Time
Inductive switching @ 125°C
VGS = 15V
VBus = 133V
ID = 208A
RG = 2.5W 116
ns
Eon Turn-on Switching Energy u 1698
Eoff Turn-off Switching Energy v
Inductive switching @ 25°C
VGS = 15V, VBus = 133V
ID = 208A, RG = 2.5Ω 1858
µJ
Eon Turn-on Switching Energy u 1872
Eoff Turn-off Switching Energy v
Inductive switching @ 125°C
VGS = 15V, VBus = 133V
ID = 208A, RG = 2.5Ω 1972
µJ
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Tc = 25°C 208
IS Continuous Source current
(Body diode)
Tc = 80°C 155 A
VSD Diode Forward Voltage VGS = 0V, IS = - 208A 1.3 V
dv/dt Peak Diode Recovery w 5 V/ns
Tj = 25°C 230
trr Reverse Recovery Time
IS = - 208A
VR = 133V
diS/dt = 200A/µs Tj = 125°C 450 ns
Tj = 25°C 1.8
Qrr Reverse Recovery Charge
IS = - 208A
VR = 133V
diS/dt = 200A/µs Tj = 125°C 6.8 µC
u Eon includes diode reverse recovery.
v In accordance with JEDEC standard JESD24-1.
w dv/dt numbers reflect the limitations of the circuit rather than the device itself.
IS £ - 208A di/dt £ 700A/µs VR £ VDSS Tj £ 150°C
APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
RthJC Junction to Case 0.16 °C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 100
°C
Torque Mounting torque To Heatsink M5 4.7 N.m
Wt Package Weight 160 g
Temperature sensor NTC
Symbol Characteristic Min Typ Max Unit
R25 Resistance @ 25°C 68
kW
B 25/85 T
25 = 298.16 K 4080 K
ú
û
ù
ê
ë
é
÷
÷
ø
ö
ç
ç
è
æ-
=
TT
B
R
RT
11
exp
25
85/25
25
Package outline
T: Thermistor temperature
RT: Thermistor value at T
APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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Typical Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
6.5V
7V
7.5V
8V
8.5V
10V
VGS=15V
9V
0
100
200
300
400
500
600
700
0 4 8 1216202428
VDS, Drain to Source Voltage (V)
I
D
, Drain Current (A)
Low Voltage Output Characteristics Transfert Characteristics
TJ=-55°C
TJ=25°C
TJ=125°C
0
100
200
300
400
500
600
012345678910
VGS, Gate to Source Voltage (V)
I
D
, Drain Current (A)
VDS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
RDS(on) vs Drain Current
VGS=10V
VGS=20V
0.8
0.9
1
1.1
1.2
0 50 100 150 200 250 300
ID, Drain Current (A)
R
DS(on)
Drain to Source ON Resistance
Normalized to
VGS=10V @ 104A
0
50
100
150
200
250
25 50 75 100 125 150
TC, Case Temperature (°C)
I
D
, DC Drain Current (A)
DC Drain Current vs Case Temperature
APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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0.90
0.95
1.00
1.05
1.10
1.15
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
BV
DSS
, Drain to Source Breakdown
Volta
g
e
(
Normalized
)
Breakdown Voltage vs Temperature ON resistance vs Temperature
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
RDS(on), Drain to Source ON resistance
(Normalized)
VGS=10V
ID= 104A
Threshold Voltage vs Temperature
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
V
GS
(TH), Threshold Voltage
(Normalized)
Maximum Safe Operating Area
100ms
10ms
1ms
100µs
1
10
100
1000
1 10 100 1000
VDS, Drain to Source Voltage (V)
I
D
, Drain Current (A)
Single pulse
TJ=150°C
limited by
RDSon
Ciss
Crss
Coss
100
1000
10000
100000
0 1020304050
VDS, Drain to Source Voltage (V)
C, Capacitance (pF)
Capacitance vs Drain to Source Voltage
VDS=40V
VDS=100V
VDS=160V
0
2
4
6
8
10
12
14
0 40 80 120 160 200 240 280 320
Gate Charge (nC)
V
GS
, Gate to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
ID=208A
TJ=25°C
APTM20AM08FT
APTM20AM08FT – Rev 1 May, 2004
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Delay Times vs Current
td(on)
td(off)
0
20
40
60
80
100
120
0 50 100 150 200 250 300 350
ID, Drain Current (A)
t
d(on)
and t
d(off)
(ns)
VDS=133V
RG=2.5Ω
TJ=125°C
L=100µH
Rise and Fall times vs Current
tr
tf
0
20
40
60
80
100
120
140
160
0 50 100 150 200 250 300 350
ID, Drain Current (A)
t
r
and t
f
(ns)
VDS=133V
RG=2.5Ω
TJ=125°C
L=100µH
Switching Energy vs Current
Eon
Eoff
0
1
2
3
4
0 50 100 150 200 250 300 350
ID, Drain Current (A)
E
on
and E
off
(mJ)
VDS=133V
RG=2.5Ω
TJ=125°C
L=100µH
Eon
Eoff
1
2
3
4
5
6
0 5 10 15 20 25
Gate Resistance (Ohms)
Switching Energy (mJ)
Switching Energy vs Gate Resistance
VDS=133V
ID=208A
TJ=125°C
L=100µH
0
50
100
150
200
250
300
25 50 75 100 125 150 175 200
ID, Drain Current (A)
Frequency (kHz)
Operating Frequency vs Drain Current
VDS=133V
D=50%
RG=2.5Ω
TJ=125°C
TJ=25°C
TJ=150°C
1
10
100
1000
0.20.40.60.8 1 1.21.41.61.8
VSD, Source to Drain Voltage (V)
I
DR
, Reverse Drain Current (A)
Source to Drain Diode Forward Voltage
APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
