HPDL-1414 - Agilent / Hewlett-Packard

Features

• Smart Alphanumeric Display

Built-in RAM, ASCII Decoder

and LED Drive Circuitry

• Wide Operating Temperature

Range

–40°C to +85°C

• Fast Access Time

160 ns

• Excellent ESD Protection

Built-in Input Protection Diodes

• CMOS IC for Low Power

Consumption

• Full TTL Compatibility Over

Operating Temperature

Range

VIL = 0.8 V

VIH = 2.0 V

• Wave Solderable

• Rugged Package

Construction

• End-Stackable

• Wide Viewing Angle

Typical Applications

• Portable Data Entry Devices

• Medical Equipment

• Process Control Equipment

• Test Equipment

• Industrial Instrumentation

• Computer Peripherals

• Telecommunication

Instrumentation

Description

The HPDL-1414 is a smart, four

character, sixteen-segment, red

GaAsP display. The HPDL-1414

has a character height of

2.85 mm (0.112"). The on-board

CMOS IC contains memory, ASCII

decoder, multiplexing circuitry

and drivers. The monolithic LED

characters are magnified by an

immersion lens which increases

both character size and luminous

intensity. The encapsulated dual-

in-line package provides a

rugged, environmentally sealed

unit.

The HPDL-1414 incorporates

many improvements over

competitive products. It has a

wide operating temperature

range, very fast IC access time,

and improved ESD protection.

The displays are also fully TTL

compatible, wave solderable, and

highly reliable. These displays are

ideally suited for industrial and

commercial applications where a

good-looking, easy-to-use

alphanumeric display is required.

ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED

WITH THE HPDL-1414.

Four Character Smart

Alphanumeric Displays

HPDL-1414

Technical Data

Package Dimensions

HPDL-1414

Absolute Maximum Ratings

Supply Voltage, VDD to Ground ......................................–0.5 V to 7.0 V

Input Voltage, Any Pin to Ground ....................... –0.5 V to VDD + 0.5 V

Free Air Operating Temperature Range, TA[1] .............. –40°C to +85°C

Relative Humidity (non-condensing) at 65°C .................................. 90%

Storage Temperature, TS.............................................. –40°C to +85°C

Maximum Solder Temperature, 1.59 mm (0.063 in.)

below Seating Plane, t < 5 sec. ................................................ 260°C

ESD Protection @ 1.5 kΩ, 100 pF ...................... VZ = 2 kV (each Pin)

Optical Characteristics at 25°C[6]

Parameter Sym. Min. Typ. Units Test Conditions

Peak Luminous Intensity per Digit, VDD = 5.0 V,

8 segments ON (character average) IV Peak 0.4 1.0 mcd “*” illuminated in all

4 digits

Peak Wavelength λPeak 655 nm

Dominant Wavelength λd640 nm

Off Axis Viewing Angle ±40 degrees

Notes:

1. “%” illuminated in all four characters.

2. Measured at five seconds.

3. Power Dissipation = (VDD)(IDD) for 10 segments ON.

Recommended Operating Conditions

Parameter Sym. Min. Nom. Max. Units

Supply Voltage VDD 4.5 5.0 5.5 V

DC Electrical Characteristics

25°C25°C

Parameter Sym. Min. Typ. Max. Units Test Conditions

Input Current IIL 45 100 µAV

DD = 5.0 V, VIL = 0.8 V

IDD Blank IDD (BL) 1.5 2.7 mA VDD = 5.0 V, BL = 0.8 V

IDD 4 Digits ON

(10 Segments per digit)[1,2] IDD 70 90 mA VDD = 5.0 V

Input Voltage High VIH 2.0 V

Input Voltage Low VIL GND 0.8 V

Power Dissipation[3] PD350 450 mW VDD = 5.0 V

Timing Diagram

AC Timing Characteristics over Operating Temperature Range at VCC = 4.5 V

Parameter Symbol -20°C tMIN 25°C tMIN 70°C tMIN Units

Address Setup Time tAS 90 115 150 ns

Write Delay Time tWD 10 15 20 ns

Write Time tW80 100 130 ns

Data Setup Time tDS 40 60 80 ns

Data Hold Time tDH 40 45 50 ns

Address Hold Time tAH 40 45 50 ns

Access Time 130 160 200 ns

Character Set

Magnified Character Font Description

HPDL-1414

Figure 2. HPDL-1414 Write Truth Table.

Electrical Description

Display Internal Block

Diagram HPDL-1414

Figure 1 shows the internal block

diagram of the HPDL-1414. It

consists of two parts: the display

LEDs and the CMOS IC. The

CMOS IC consists of a four-word

ASCII memory, a 64-word charac-

ter generator, 17 segment drivers,

four digit drivers, and the

scanning circuitry necessary to

multiplex the four monolithic

LED characters. In normal

operation, the divide-by-four

counter sequentially accesses

each of the four RAM locations

and simultaneously enables the

appropriate display digit driver.

The output of the RAM is decoded

by the character generator which,

in turn, enables the appropriate

display segment drivers. Seven-

bit ASCII data is stored in RAM.

Since the display uses a 64-

character decoder, half of the

possible 128 input combinations

are invalid. For each display

location where D5 = D6 in the

ASCII RAM, the display character

is blanked.

Data Entry HPDL-1414

Figure 2 shows a truth table for

the HPDL-1414. Data is loaded

into the display through the

DATA inputs (D6-D0), ADDRESS

inputs (A1-A0), and WRITE (WR).

After a character has been

written to memory, the IC

decodes the ASCII data, drives

the display and refreshes it

without any external hardware or

software.

Figure 1. HPDL-1414 Internal Block Diagram.

Optical Considerations/

Contrast Enhancement

The HPDL-1414 display uses a

precision aspheric immersion

lens to provide excellent

readability and low off-axis

distortion. The aspheric lens

produces a magnified character

height of 2.85 mm (0.112 in.)

and a viewing angle of ±40°.

These features provide excellent

readability at distances up to 1.5

metres (4 feet).

Each display is tested for

luminous intensity and marked

with an intensity category on the

side of the display package. To

ensure intensity matching for

multiple package applications,

mixing intensity categories for a

given panel is not recommended.

The display is designed to

provide maximum contrast when

placed behind an appropriate

contrast enhancement filter. For

further information on contrast

enhancement, see Application

Note 1015.

Mechanical and Electrical

Considerations

The HPDL-1414 is a dual in-line

package that can be stacked

horizontally and vertically to

create arrays of any size. These

displays are designed to operate

continuously between –40°C to

+85°C with a maximum of 10

segments on per digit.

The HPDL-1414 is assembled by

die attaching and wire bonding

the four GaAsP/GaAs monolithic

LED chips and the CMOS IC to a

printed circuit board. An

immersion lens is formed by

placing the PC board assembly

into a nylon lens filled with

epoxy. Backfill epoxy environ-

mentally seals the display

package. This package

construction provides the display

with a high tolerance to

temperature cycling.

The inputs to the CMOS IC are

protected against static discharge

and input current latchup.

However, for best results

standard CMOS handling

precautions should be used. Prior

to use, the HPDL-1414 should be

stored in anti-static tubes or

conductive material. During

assembly a grounded conductive

work area should be used, and

assembly personnel should wear

conductive wrist straps. Lab

coats made of synthetic material

should be avoided since they are

prone to static charge build-up.

Input current latchup is caused

when the CMOS inputs are

subjected either to a voltage

below ground (VIN < ground) or

to a voltage higher than VDD

(VIN > VDD) and when a high

current is forced into the input.

To prevent input current latchup

and ESD damage, unused inputs

should be connected either to

ground or to VDD. Voltages should

not be applied to the inputs until

VDD has been applied to the

display. Transient input voltages

should be eliminated.

Soldering and Post Solder

Cleaning Instructions

The HPDL-1414 may be hand

soldered or wave soldered with

SN63 solder. Hand soldering may

be safely performed only with an

electronically temperature-

controlled and securely grounded

soldering iron. For best results,

the iron tip temperature should

be set at 315°C (600°F). For

wave soldering, a rosin-based

RMA flux can be used. The solder

wave temperature should be

245°C±5°C (473°F±9°F),

and the dwell in the wave should

be set at 11/2 to 3 seconds for

optimum soldering. Preheat

temperature should not exceed

93°C (200°F) as measured on the

solder side of the PC board.

For further information on

soldering and post solder

cleaning, see Application Note

1027, Soldering LED

Components.

www.semiconductor.agilent.com

Data subject to change.

July 11, 2001

Obsoletes 5988-1652EN

5988-3271EN

Intensity Range (mcd)

Bin Min. Max.

E 0.43 0.58

F 0.50 0.70

G 0.59 0.84

H 0.71 1.01

I 0.85 1.24

J 1.02 1.52

K 1.23 1.83

Note:

Test conditions as specified in Optical Characteristic table.

Intensity Bin Limits