AN48841B-NL - Panasonic - Datasheet.Directory

Publication date: October 2010 Ver. BEB

DATA SHEET

Part No.

Package Code No.

AN48841B

SMINI-5DE

AN48841B

Ver. BEB

Contents

Overview ……………………………………………………………………………………………………………. 3

Features …………………………………………………………………………………………………………….. 3

Applications ………………………………………………………………………………………………………… 3

Package ……………………………………………………………………………………………………………. 3

Type ………………………………….……………………………………………………………………………… 3

Block Diagram ……………….…………… ………………………………………… ……………………………. 4

Pin Descriptions ………………………………………………………………………… …………………………. 4

Absolut e Maximum Ratings ………………………………………………………………………………………. 5

Operating Supply Voltage Range …………….………………………………………………………………….. 5

Allowable Voltage Range …………………………………………………………………………………………. 5

Electrical Charact eristics …………………………………………………………………………………………. 6

Electrical Charact eristics (Reference values for desig n) ……………………………………………………… 7

Technical Data ………………………………………………………… …………………………………… …….. 8

yPD⎯Tadiagram ………………………………………………………………………………………………… 8

Usage Notes ……………………………………….………………………………………………………………. 9

Caution o n Use of Hall ICs …………… ………….…………………………… …………………………………. 10

AN48841B

Ver. BEB

AN48841B

Low current consumption, high sensitivity CMOS Hall IC

Operates on Alternating Magnetic Field (low-speed rotation for lock detection)

Overview

AN48841B is a Hall IC (a magnetic sensor) which has 2 times or more sensitivity and a low current consumption of about one

fifties compared with our conventional one.

In this Hall IC, a Hall element, a offset cancel circuit, an amplifier circuit, a sample and hold circuit, a Schmidt circuit, and output

stage FET are integrated on a single chip housed in a small package by IC technique.

Features

yHigh sensitivity (8mT max) due to offset cancel circuit and a new sample and hold circuit.

ySmall current by using intermittent action. (average supply current : 56 μA typ. sampling cycle : 670 μs typ.)

ySmall package. (SMD)

yCMOS inverter output. (no pull-up resistance)

Applications

yMagneto-electric conversion switch.

Package

y5 pin Plastic Small Surface Mount Package (SMINI Type).

Type

yBi-CMOS IC.

AN48841B

Ver. BEB

Block Diagram

CLK ON / OFF control

GND

VCC

Sample

and

hold

Swich

Hall

element OUT5

N.C.

Amplifier

Pin Descriptions

DescriptionTypePin namePin No.

Output pinOutputOUT5

Supply pinPower supplyVCC

N.C.—N.C3

Ground pinGroundGND2

N.C.—N.C.1

AN48841B

Ver. BEB

Absolute Maximum Rati ngs

Operating supply voltage range

NotesUnitRatingSymbolParameter

No.

⎯

mA5ICC

Supply current2

°C−55 to +125

Tstg

Storage temperature5

°C−25 to +75

Topr

Operating ambient temperature4

*2mW60PD

Power dissipation3

*1V5.4VCC

Supply voltage1

NotesUnitRangeSymbolParameter

*V2.5 to 5.25VCC

Supply voltage range

Note) *:The values under the condition not exceeding the above absolute m a ximum ratings and the power dissipation.

0GND

NoteUnitRangePin namePin No.

*V– 0.3 to (VCC + 0.3)OUT5

*V2

Note) *: (VCC + 0.3) V ≤5.4 V.

Notes)*1 : The values under the condition not excee ding the above absolute maximum ratings and the power dissipation.

*2 : The power dissipation shown is the value at Ta=75°C for the independent (unmounted) IC package without a heat sink.

When using this IC, refer to the •PD-Tadiagram in the Technical Data and design the heat radiation with sufficient margin so that the

allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temper ature.

*3 : Except for the power dissipation, operating am bient temperature, and storage temperature, all ratings are for Ta=25°C.

Allowable Voltage Range

Notes) Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guarant eed within

these limit ranges.

Voltage values, unless otherwise specified, are with respect to GND.

Do not apply external curr ents or voltages to any pin not speci fically mentioned.

Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.

AN48841B

Ver. BEB

Electrical Characteristics

Note) Ta= 25°C±2°C unless otherwise specified.

—

μs

850670490VCC = 3 VTsamIntermittent operation time (1)

VCC = 5 V

VCC = 5 V, IO = –2 mA

B = –8.0 mT

VCC = 5 V, IO = 2 mA

B = 8.0 mT

VCC = 3 V, 5 V

μA

300100

ICC2

(AVE)

Supply current (2) —

*1mT–0.5—BLHOperating magnetic flux density (2) –8

*1mT8—0.5VCC = 3 V, 5 VBHLOperating magnetic flux density (1)1

—V0.30.1 —

VCC = 3 V, IO = 2 mA

B = 8.0 mT

VOL1

Output voltage Low (1)3

—V0.30.1—VOL2

Output voltage Low (2)4

—V—2.92.7

VCC = 3 V, IO = –2 mA

B = –8.0 mT

VOH1

Output voltage High (1)5

—V—4.94.7VOH2

Output voltage High (2)6

μA

70.056.0—VCC = 3 V

ICC

(AVE)

Supply current (1)7

—

μs

790623456VCC = 5 VTsam2Intermittent operation time (2)10

Limits

Typ Unit

Max Notes

Min

ConditionsSymbolParameter

No.

Notes)*1: Symbol BHL shows the operating magnetic flux density at which output level is changed from high to low, and Symbol BLH shows the

operating magnetic flux density at which output level is changed from low to high.

*2: ICC(AVE) = {ICC(ON) ×t(ON) +ICC(OFF) ×t(OFF)} / {t(ON) +t(OFF)}.

AN48841B

Ver. BEB

μs

939600329

Ta= –25°C to 75°C, VCC = 5 V

t2 (OFF)Stop time 2

Ta= –25°C to 75°C, VCC = 5 V

Ta= –25°C to 75°C, VCC = 3 V

VCC = 5 V

VCC = 3 V

μs

3723t2 (ON)Operation time 2 9

*mA2.11.4

ICC

(ON)

Supply current (3) —

*mT—7—VCC = 3 V, 5 VBWHysteresis width11

μA

—2.5—VCC = 3 V

ICC

(OFF)

Supply current (4)13

*mA3.52.4—

ICC2

(ON)

Supply current (5)14

μA

—3.7—VCC = 5 V

ICC2

(OFF)

Supply current (6)15

μs

422610t (ON)Operation time16

μs

1 030644258

Ta= –25°C to 75°C, VCC = 3 V

t (OFF)Stop time17

Reference values

Typ Unit

Max Notes

Min

ConditionsSymbolParameter

No.

Icc

Icc(ON)

Icc(OFF)

t(ON) = 26 μs

t(OFF) = 644 μs

Electrical Characteristics (Reference values for design)

Note) Ta = 25°C±2°C unless otherwise specified.

The characteristics listed below are reference values derived from the design of the IC and are not guarantee d by inspection.

If a problem does occur related to these characteristics, we will respond in good faith to user concerns.

Note) *: Power Supply Timing Chart

Normal operation starts approx. 670 μs after power supply is turned on.

AN48841B

Ver. BEB

Technical Data

yPD⎯Tadiagram

AN48841B

Ver. BEB

Usage Notes

ySpecial attention and precaution in using

1. This IC is intended to be used for general electronic equipment.

Consult our sales staff in advance for information on the following applications:

xSpecial applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may

directly jeopardize life or harm the human body.

xAny applications other than the standard applications intended.

(1) Space appliance (such as artificial satellite, and rocket)

(2) Traffic control equipment (such as for automobile, airplane, train, and ship)

(3) Medical equipment for life support

(4) Submarine transponder

(5) Control equipment for power plant

(6) Disaster prevention and security device

(7) Weapon

(8) Others : Applications of which reliability equivalent to (1) to (7) is required

2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might

smoke or ignite.

3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In

addition, refer to the Pin Description for the pin configuration.

4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-

bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because

the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during

transportation.

5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-

VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .

And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and

smoke emission will depend on the current capability of the power supply.

6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

7. When using the LSI for new models, verify the safety including the long-term reliability for each product.

8. When the application system is designed by using this LSI, be sure to confirm notes in this book.

Be sure to read the notes to descriptions and the usage notes in the book.

9. This IC is not applicable to automotive electronic parts.

AN48841B

Ver. BEB

Cautions when using Hall-IC

As the Hall-IC often detects movement, the position of the Hall-IC may be changed, and there is the risk of a change in detection

level, if exposed to shock or vibration over a long period. Secure the IC by applying adhesive to the package or placing in a

dedicated case.

1.When using an adhesive

Some kinds of adhesive generate gas (such as chrole gas) during curing. This corrosive gas corrodes the aluminum on the surface

of the Hall-IC, and may cause a functional defect of disconnection.

If Hall-IC is to be sealed after installation, attention should be given to the adhesive used for Hall-IC installation, as well as for

the adhesive or resin used for peripherals and substrate cleaner.

Please confirm the above matter to those manufacturers before using.

We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.

2.When bending lead wire

Bend the lead wire without stressing the package.

Bending method of lead wire

ＷFixed

Fixed

ＷＷ

3 mm

Bending position of lead wire

(a)

(b)

3.Power supply line/ Power transmission line

If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line. In this case,

set the capacitor of 0.1 μF to 10 μF near the Hall IC to prevent it.

If a voltage of 5.4 V or more is thought to be applied to the power supply line (reverse electromotive force from coil or the ignition

pulse, etc.), protect it with external components (capacitor, resistor, zener diode, diode, surge absorbing elements, etc.).

4.Mounting the surface mount type (MINI-3D and SMINI-5D packages)

When mounted on printed circuit board, the Hall-IC may be highly stressed by the warpage that may occur from the soldering.

This may also cause a change in the operating magnetic flux density and a deterioration of its resistance to moisture.

Observe the recommended conditions since electrical characteristics can easily change due to stress when mounting. Avoid

solding by using soldoring iron or solder flow (dip) method.

AN48841B

Ver. BEB

Cautions when using Hall-IC (continued)

5.Mounting the insertion type (SE-3S package)

If the insertion type Hall-IC is inserted to the bottom of its lead into the printed circuit board, it will be stressed so that reliability

can not be maintained. Set a space of at least 2.0 mm between the package and printed circuit board.

6.VCC and GND

Do not connect VCC and GND pins reversely. Otherwise, the IC will be damaged. If the voltage of GND pin is set higher than

that of the other pins, which is the same configuration as diode forward connection, it is set to ON at current may flow, resulting in

damage to the IC. (This is common to monolithic IC.)

7.Cautions of Hall IC at Power-On

When a Hall IC is turned on, the position of the magnet or looseness may cause the output of a Hall IC to be changed, and a pulse

may be generated.

Therefore, care should be exercised whenever the output state of a Hall IC is critical when the supply power is ON.

8.When Hall-IC is fixed with holder

When a Hall-IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder is large, the

lead wire of the Hall-IC will be stretched and it may give a stress to the Hall IC.

If the lead wire is stressed intensely due to the distortion of holder or substrate, the adhesiveness between the package and the lead

wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.

9. On using flux in soldering

Choose a flux which does not include ingredients from the chloric group. The ingredients of chloric group may enter through the

joint of the lead frame and package resin, causing corrosion and disconnection of the aluminum wiring on the surface of IC chip.

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any

other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any

other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications

equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.

Consult our sales staff in advance for information on the following applications:

– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,

life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of

the products may directly jeopardize life or harm the human body.

It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with

your using the products described in this book for any special application, unless our company agrees to your using the products in

this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

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