2001-2012 Microchip Technology Inc. DS21484D-page 1
TC962
Features:
• Pin Compatible With TC7662/ICL7662/SI7661
• High Output Current 80 mA
• No External Diodes Required
• Wide Operating Range 3V to 18V
• Low Output Impedance 28 Typ.
• No Low Voltage Terminal Required
• Application Zener On-Chip
• OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications:
• Laptop Computers
•Disk Drives
• Process Instrumentation
•P-Based Controllers
Device Selection Table
General Description:
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
constru ction, the TC96 2 can sourc e as much as 80 mA
versus the 7662’s 20 mA capability.
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28 (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator freq uency from 12
kHz to 24 kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
Pin 1, which is used as a test pin on the 7662, is a
voltage reference Zener on the TC962. This Zener (6.4V
at 5 mA) has a dynamic impedance of 12 and is
intended for use where the TC962 is supplying current to
external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
Information” Applications Information).
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
Part
Number Package Operating
Temp.
Range
TC962CO E 16-Pin SOIC Wide 0°C to +70°C
TC962CPA 8-Pin Plastic DIP 0°C to +70°C
TC962EPA 8-Pin Plastic DIP -40°C to +85°C
TC962IJA 8-Pin CERDIP -25°C to +85°C
TC962MJA 8-Pin CERDIP -55°C to + 125° C
VDD
1
2
3
4
5
6
7
8
16
13
12
11
10
9
NC
GND
COSC
NC
15
14
NC
NC
NC
TC962COE
NC
NC
Zener
Cathode
NC
FREQ x 2
16-Pin SOIC Wide
C+
C–VOUT
1
2
3
4
8
7
6
5
FREQ x 2
GND
TC962CPA
TC962EPA
TC962IJA
TC962MJA
C+
C–VOUT
8-Pin CERDIP
8-Pin DIP
•
Zener
Cathode
COSC
VDD
High Current Charge Pump DC-to-DC Converter
TC962
DS21484D-page 2 2001-2012 Microchip Technology Inc.
Functional Block Diagram
+
–
Comparator
with Hysteresis
C
F/F
Q
Q
V
REF
Level
Shift
Level
Shift
Level
Shift
Level
Shift
V
DD
P SW1
CAP
C
P
External
N SW4
N SW2
N SW3
CAP
C
R
EXT
R
L
V
OUT
I I
OSC/C–
Timing
Zener
Cathode
FREQ x 2
+
GND
–
8
2
3
OUT
5
4
7
1
6.4V
6
+
+
TC962
2001-2012 Microchip Technology Inc. DS21484D-page 3
TC962
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (VDD to GND)..............................+18V
Input Voltage Any Pin
.........................(VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin...........................................10 mA
ESD Protection ................................................±2000V
Output Short Circuit .......... . Continuous (at 5.5V Input)
Package Power Dissipation (TA 70°C)
SOIC .......................................................760 mW
PDIP........................................................730 mW
CERDIP ..................................................800 mW
Package Thermal Resistance
CERDIP, RJ-A .........................................90°C/W
PDIP, RJ-A ............................................140°C/W
Operati ng Temperature Ra nge
CPA, COE.......................................0°C to +70°C
IJA................................................-25°C to +85°C
EPA..............................................-40°C to +85°C
MJA............................................-55°C to +125°C
Storage Temperature Range .............-65°C to +150°C
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the devi ce. These are stress ratin gs only and fun ctional
operatio n of the devic e at these or an y other con ditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted.
Symbol Paramet e r Min Typ Max Units Test Condit ions
VDD Supply Voltage 3 — 18 V
ISSupply Current
VDD = 15V
VDD = 5V
—
—
—
—
—
—
—
—
510
560
650
190
210
210
—
700
—
—
—
—
—
AR
L =
TA = +25°C
0 TA 70°C
-55°C TA 125°C
TA = +25°C
0 TA 70°C
-55°C TA 125°C
ROOutput Source
Resistance —
—
—
32
35
—
37
40
50
IL = 20 mA, VDD = 15V
IL = 80 mA, VDD = 15V
IL = 3 mA, VDD = 5V
FOSC Oscillator Frequency —
—12
24 —
—kHz Pin 6 Open
Pin 6 GND
PEFF Power Efficiency 93
—97
——
—%R
L = 2 k
VDEF Voltage Efficiency 99
—
96
99.9
—
—
—
—
—
%R
L =
Over temperature range
VZZener Voltage 6.0 6.2 6.4 V IZ = 5 mA
ZZT Zener Impedance — 12 — IL = 2.5 mA to 7.5 mA
Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.
TC962
DS21484D-page 4 2001-2012 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
(8-Pin CERDIP) Symbol Description
1 Zener Cathode Cathode of internal Zener diode.
2C
+Positive side of external CP capacitor (pump cap).
3 GND Ground terminal.
4C
-Negative side of external CP capacitor (pump cap).
5V
OUT Output voltage.
6 FREQ x 2 If grounded, frequency doubles.
7C
OSC Capacitor to GND will decrease frequency.
8V
DD Input voltage.
Pin No.
(16-Pin SOIC) Symbol Description
1 Zener Cathode Cathode of internal Zener diode.
2 NC No connect.
3C
+Positive side of external CP capacitor (pump cap).
4 NC No connect.
5 GND Ground terminal.
6 NC No connect.
7C
-Negative side of external CP capacitor (pump cap).
8 NC No connect.
9 NC No connect.
10 VOUT Output voltage.
11 NC No connect.
12 FREQ x 2 If grounded, frequency doubles.
13 NC No connect.
14 COSC Capacitor to GND will decrease frequency.
15 NC No connect.
16 VDD Input voltage.
2001-2012 Microchip Technology Inc. DS21484D-page 5
TC962
3.0 APPLICATIONS INFORMATION
3.1 Theory of Operation
The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
The functi ona l block diagram sho w s how the sw itc hin g
action works. SW1 and SW2 are turned on simultane-
ously, charging CP to the supply voltage, VIN. This
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants ) that is les s than the on tim e provided
by the oscillator frequency as shown:
3 (RDS(ON) CP) < CP/(0.5 fOSC)
In the ne xt cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduc tio n), SW 3 an d SW4 are turn ed o n. Th e c harg e
in CP is then transferred to CR, but with the polarity
inverted. In this way, a negati ve voltage is now deri ved.
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
The osci llator has two pins that con trol the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to grou nd. This will lower the freq uen cy of th e
oscill ator by adding cap acit ance to the tim ing c apa citor
internal to the TC962. Grounding pin 6 will turn on a
current source and double the frequency. This will
double the charge current going into the internal
capac itor, as well as any capacitor added t o pin 7.
A Zener dio de has be en added to the TC962 fo r use as
a reference in building external regulators. This Zener
runs from pin 1 to ground.
3.2 Latch-Up
All CMOS structures contain a parasitic SCR. Care
must be t aken to prevent any inpu t from going above or
below the supply rail, or latch-up will occur. The result
of latch-up is an effective short between VDD and VSS.
Unless the power supply input has a current limit, this
latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
Drivers.)
FIGURE 3-1: Test Circuit
FIGURE 3-2: Typical Applications
TC962
1
2
3
4
8
690
7
5
C
P
+
10 μFC
OSC
R
L
V
OUT
(–5V)
10 μF
C
R
I
L
I
S
V
(+5V)
+
NC
+
1
2
3
TC962
4
8
7
6
5
C
P2
C
P1
C
R1
10 μF
V+
+
+
+
10 μF
V
OUT
= –V+
V
D1
V
D2
V
OUT
=
+
10 μF
Combined Negative Converter and Positive Multiplier
+
C
P
10 μF
+
1
2
3
4
8
7
6
5
10 μF
C
R
+V
OUT
= V
2
+
Split V+ In Half
TC962
Positive Voltage MultiplierLowering Output Resistance by Paralleling Devices
2V –2V
D
TC962
1
2
3
4
8
7
6
510 μF10 μF
V
OUT
=
+
V
D2
V
D1
++
V+
C
P
C
P
2V –2V
D
C
P1
10 μF
+C
P2
10 μF
+
TC962 TC962
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
+
V+
V
OUT
10 μF
C
R
V+
TC962
DS21484D-page 6 2001-2012 Microchip Technology Inc.
4.0 TYPICAL CHARACTERISTICS
Circuit of Figure , CP = CR = 10 F, CPESR CRESR 1.
Note: The g r aph s a nd t ables provide d fo llo w ing thi s n ote a r e a st a t istic al summary based on a lim ited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
700
600
500
400
300
200
100
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
SUPPLY CURRENT (μA)
Supply Current vs. Temperature
0
10k
1k
100
110 100 1000 10,000
CAPACITANCE (pF)
FREQUENCY (Hz)
Oscillator Frequency vs. C
10
OSC
T
A
= +25°C
20
18
16
14
12
10
8
FREQUENCY (kHz)
Frequency vs. Temperature
6
V = 15V
+
V = 15V
+
C
OSC
= FREQ x 2 = OPEN
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
80
70
60
50
40
30
20
OUTPUT RESISTANCE ( )
Output Resistance vs. Temperature
10
Ω
50
4.5
ZENER VOLTAGE (V)
CURRENT (mA)
Current vs. Zener Voltage
4.0 5.5 6.0 6.5 7.0
40
30
20
10
0
100
LOAD CURRENT (mA)
POWER CONVERSION EFFICIENCY (%)
Power Conversion Efficiency vs. I
16 32 48 64 80
80
60
40
20
90
70
50
30
10
0
824405672
LOAD
150
120
90
60
30
135
105
75
45
15
0
SUPPLY CURRENT (mA)
V = 5V IL = 3 mA
+
V = 15V IL = 20 mA
+
TA = +25°C TA = +25°C
EFFICIENCY
SUPPLY
CURRENT
100
INPUT VOLTAGE (V)
OUTPUT RESISTANCE (Ω)
Output Resistance vs. Input Voltage
4 8 12 16 20
80
60
40
20
90
70
50
30
10
2 6 10 14 180
110
TA = +25°C
3 μA20 μA
2001-2012 Microchip Technology Inc. DS21484D-page 7
TC962
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Pack age marking data not avail able at this time.
5.2 Taping Form
5.3 Package Dimensions
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
W
Pin 1
User Direction of Feed
Standard Reel Component Orientation
for 713 Suffix Device
P
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
16-Pin SOIC (W) 16 mm 12 mm 1000 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
.400 (10.16)
.370 (9.40)
.300 (7.62)
.230 (5.84)
.065 (1.65)
.045 (1.14)
.055 (1.40) Max. .020 (0.51) Min.
Pin 1
.200 (5.08)
.160 (4.06)
.200 (5.08)
.125 (3.18)
.110 (2.79)
.090 (2.29)
.020 (0.51)
.016 (0.41)
.040 (1.02)
.020 (0.51)
.320 (8.13)
.290 (7.37)
.150 (3.81)
Min.
3° Min.
8-Pin CDIP (Narrow)
.015 (0.38)
.008 (0.20)
.400 (10.16)
.320 (8.13)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC962
DS21484D-page 8 2001-2012 Microchip Technology Inc.
Package Dimensions (Continued)
Note: For th e mo s t c urr e nt pac kag e d r awi n gs , plea se se e th e M ic roc hi p Pa c ka gi n g Spe ci fic at i on lo c ate d
at http://www.microchip.com/packaging
8°
Max.
Pin 1
.299 (7.59)
.291 (7.40)
.413 (10.49)
.398 (10.10)
.019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
.104 (2.64)
.097 (2.46) .013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
.419 (10.65)
.398 (10.10)
.050 (1.27) Typ.
16-Pin SOIC (Wide)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21484D-page 9
TC962
6.0 REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
TC962
DS21484D-page 10 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21484D-page 11
TC962
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Technical suppo rt is avail able throug h the web si te
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TC962
DS21484D-page 12 2001-2012 Microchip Technology Inc.
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DS21484DTC962
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2001-2012 Microchip Technology Inc. DS21484D-page 13
Information contained in this publication regarding device
applications a nd the lik e is provided only for your convenien ce
and may be superseded by u pdates. It is y our responsibil it y to
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
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Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Se rial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
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All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768808
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of it s kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21484D-page 14 2001-2012 Microchip Technology Inc.
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China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Ka ohs iung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Worldwide Sales and Service
11/29/12