DS1742P-100+ - Maxim Integrated Products, Inc.

1 of 15 REV: 060706

FEATURES

 Integrated NV SRAM, Real-Time Clock,

Crystal, Power-Fail Control Circuit and

Lithium Energy Source

 Clock Registers are Accessed Identically to the

Static RAM; These Registers are Resident in

the Eight Top RAM Locations

 Century Byte Register

 Totally Nonvolatile with Over 10 Years of

Operation in the Absence of Power

 BCD Coded Century, Year, Month, Date, Day,

Hours, Minutes, and Seconds with Automatic

Leap Year Compensation Valid Up to the year

2100

 Battery Voltage Level Indicator Flag

 Power-Fail Write Protection Allows for ±10%

VCC Power Supply Tolerance

 Lithium Energy Source is Electrically

Disconnected to Retain Freshness until Power

is Applied for the First Time

 Standard JEDEC Bytewide 2k x 8 Static RAM

Pinout

 Quartz Accuracy ±1 Minute a Month at +25°C,

Factory Calibrated

 UL Recognized

PIN CONFIGURATION

ORDERING INFORMATION

PART VOLTAGE (V) TEMP RANGE PIN-PACKAGE TOP MARK**

DS1742-70 5.0 0°C to +70°C

24 EDIP (0.740a) DS1742-070

DS1742-70+ 5.0 0°C to +70°C

24 EDIP (0.740a) DS1742+070

DS1742-100 5.0 0°C to +70°C

24 EDIP (0.740a) DS1742-100

DS1742-100+ 5.0 0°C to +70°C

24 EDIP (0.740a) DS1742+100

DS1742-100IND 5.0 -40°C to +85°C 24 EDIP (0.740a) DS1742-100 IND

DS1742-100IND+ 5.0 -40°C to +85°C 24 EDIP (0.740a) DS1742+100 IND

DS1742W-120 3.3 0°C to +70°C

24 EDIP (0.740a) DS1742W-120

DS1742W-120+ 3.3 0°C to +70°C

24 EDIP (0.740a) DS1742W+120

DS1742W-150 3.3 0°C to +70°C

24 EDIP (0.740a) DS1742W-150

DS1742W-150+ 3.3 0°C to +70°C

24 EDIP (0.740a) DS1742W+150

DS1742P-100+ 5.0 0°C to +70°C

34 PowerCap®* DS1742P+100

+Denotes a lead-free/RoHS-compliant device.

*DS9034-PCX, DS9034I-PCX, DS9034-PCX+ required (must be ordered separately).

** The top mark will include a “+” on lead-free devices.

PowerCap is a registered trademark of Dallas Semiconductor.

DS1742

Y2KC Nonvolatile Timekeeping

RAM

www.maxim-ic.com

VCC

DQ7

DQ6

DQ5

DQ4

DQ3

DQ0

DQ1

DQ2

GND

DS1742

ENCAPSULATED DIP

TOP VIEW

DS1742

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PIN DESCRIPTION

PIN NAME FUNCTION

1 A7

2 A6

3 A5

4 A4

5 A3

6 A2

7 A1

8 A0

19 A10

22 A9

23 A8

Address Input

9 DQ0

10 DQ1

11 DQ2

13 DQ3

14 DQ4

15 DQ5

16 DQ6

17 DQ7

Data Input/Output

12 GND Ground

18 CE Active-Low Chip-Enable Input

20 OE Active-Low Output-Enable Input

21 WE Active-Low Write-Enable Input

24 VCC Power-Supply Input

DESCRIPTION

The DS1742 is a full-function, year 2000-compliant (Y2KC), real-time clock/calendar (RTC) and 2k x 8

nonvolatile static RAM. User access to all registers within the DS1742 is accomplished with a bytewide

interface as shown in Figure 1. The RTC information and control bits reside in the eight uppermost RAM

locations. The RTC registers contain century, year, month, date, day, hours, minutes, and seconds data in

24-hour BCD format. Corrections for the day of the month and leap year are made automatically.

The RTC clock registers are double-buffered to avoid access of incorrect data that can occur during clock

update cycles. The double-buffered system also prevents time loss as the timekeeping countdown

continues unabated by access to time register data. The DS1742 also contains its own power-fail circuitry,

which deselects the device when the VCC supply is in an out-of-tolerance condition. This feature prevents

loss of data from unpredictable system operation brought on by low VCC as errant access and update

cycles are avoided.

DS1742

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CLOCK OPERATIONS—READING THE CLOCK

While the double-buffered register structure reduces the chance of reading incorrect data, internal updates

to the DS1742 clock registers should be halted before clock data is read to prevent reading of data in

transition. However, halting the internal clock register updating process does not affect clock accuracy.

Updating is halted when a 1 is written into the read bit, bit 6 of the century register, see Table 2. As long

as a 1 remains in that position, updating is halted. After a halt is issued, the registers reflect the count, that

is day, date, and time that was current at the moment the halt command was issued. However, the internal

clock registers of the double-buffered system continue to update so that the clock accuracy is not affected

by the access of data. All of the DS1742 registers are updated simultaneously after the internal clock

0. The READ bit must be a zero for a minimum of 500ms to ensure the external registers will be updated.

Figure 1. DS1742 BLOCK DIAGRAM

Table 1. TRUTH TABLE

VCC CE OE WE MODE DQ POWER

VIH X X Deselect High-Z Standby

VIL X VIL Write Data In Active

VIL V

IL V

IH Read Data Out Active

VCC > VPF

VIL V

IH V

IH Read High-Z Active

VSO < VCC < VPF X X X Deselect High-Z CMOS Standby

VCC < VSO < VPF X X X Deselect High-Z Data Retention Mode

DS1742

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SETTING THE CLOCK

As shown in Table 2, bit 7 of the century register is the write bit. Setting the write bit to a 1, like the read

bit, halts updates to the DS1742 registers. The user can then load them with the correct day, date and time

data in 24-hour BCD format. Resetting the write bit to a 0 then transfers those values to the actual clock

counters and allows normal operation to resume.

STOPPING AND STARTING THE CLOCK OSCILLATOR

The clock oscillator may be stopped at any time. To increase the shelf life, the oscillator can be turned off

to minimize current drain from the battery. The OSC bit is the MSB (bit 7) of the seconds registers, see

Table 2. Setting it to a 1 stops the oscillator.

FREQUENCY TEST BIT

As shown in Table 2, bit 6 of the day byte is the frequency test bit. When the frequency test bit is set to

logic 1 and the oscillator is running, the LSB of the seconds register will toggle at 512 Hz. When the

seconds register is being read, the DQ0 line will toggle at the 512 Hz frequency as long as conditions for

access remain valid (i.e., CE low, OE low, WE high, and address for seconds register remain valid and

stable).

CLOCK ACCURACY

The DS1742 is guaranteed to keep time accuracy to within ±1 minute per month at 25°C. Dallas

Semiconductor calibrates the RTC at the factory using nonvolatile tuning elements. The DS1742 does not

require additional calibration. For this reason, methods of field clock calibration are not available and not

necessary. Clock accuracy is also affected by the electrical environment and caution should be taken to

place the RTC in the lowest level EMI section of the PCB layout. For additional information refer to

Application Note 58.

Table 2. REGISTER MAP

DATA

ADDRESS B7 B

6 B

5 B

4 B

3 B

2 B

1 B

0 FUNCTION RANGE

7FF 10 Year Year Year 00–99

7FE X X X

Month Month Month 01–12

7FD X X 10 Date Date Date 01–31

7FC BF FT X X X Day Day 01–07

7FB X X 10 Hour Hour Hour 00–23

7FA X 10 Minutes Minutes Minutes 00–59

7F9 OSC 10 Seconds Seconds Seconds 00–59

7F8 W R 10 Century Century Control 00–39

OSC = STOP BIT R = READ BIT FT = FREQUENCY TEST

W = WRITE BIT X = SEE NOTE BELOW BF = BATTERY FLAG

Note: All indicated “X” bits are not used but must be set to “0” during write cycle to ensure proper clock operation.

DS1742

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RETRIEVING DATA FROM RAM OR CLOCK

The DS1742 is in the read mode whenever OE (output enable) is low, WE (write enable) is high, and CE

(chip enable) is low. The device architecture allows ripple-through access to any of the address locations

in the NV SRAM. Valid data will be available at the DQ pins within tAA after the last address input is

stable, providing that the CE and OE access times and states are satisfied. If CE or OE access times and

states are not met, valid data will be available at the latter of chip enable access (tCEA) or at output enable

access time (tOEA). The state of the data input/output pins (DQ) is controlled by CE , and OE . If the

outputs are activated before tAA, the data lines are driven to an intermediate state until tAA. If the address

inputs are changed while CE and OE remain valid, output data will remain valid for output data hold

time (tOH) but will then go indeterminate until the next address access.

WRITING DATA TO RAM OR CLOCK

The DS1742 is in the write mode whenever WE and CE are in their active state. The start of a write is

referenced to the latter occurring transition of WE on CE . The addresses must be held valid throughout

the cycle. CE or WE must return inactive for a minimum of tWR prior to the initiation of another read or

write cycle. Data in must be valid tDS prior to the end of write and remain valid for tDH afterward. In a

typical application, the OE signal will be high during a write cycle. However, OE can be active provided

that care is taken with the data bus to avoid bus contention. If OE is low prior to WE transitioning low

the data bus can become active with read data defined by the address inputs. A low transition on WE will

then disable the outputs tWEZ after WE goes active.

DATA RETENTION MODE

The 5V device is fully accessible and data can be written or read only when VCC is greater than VPF.

However, when VCC is below the power fail point, VPF, (point at which write protection occurs) the

internal clock registers and SRAM are blocked from any access. When VCC falls below the battery switch

point VSO (battery supply level), device power is switched from the VCC pin to the backup battery. RTC

operation and SRAM data are maintained from the battery until VCC is returned to nominal levels. The

3.3V device is fully accessible and data can be written or read only when VCC is greater than VPF. When

VCC falls below the power fail point, VPF, access to the device is inhibited. If VPF is less than Vso, the

device power is switched from VCC to the backup supply (VBAT) when VCC drops below VPF. If VPF is

greater than Vso, the device power is switched from VCC to the backup supply (VBAT) when VCC drops

below Vso. RTC operation and SRAM data are maintained from the battery until VCC is returned to

nominal levels.

DS1742

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BATTERY LONGEVITY

The DS1742 has a lithium power source that is designed to provide energy for clock activity, and clock

and RAM data retention when the VCC supply is not present. The capability of this internal power supply

is sufficient to power the DS1742 continuously for the life of the equipment in which it is installed. For

specification purposes, the life expectancy is 10 years at 25°C with the internal clock oscillator running in

the absence of VCC power. Each DS1742 is shipped from Dallas Semiconductor with its lithium energy

source disconnected, guaranteeing full energy capacity. When VCC is first applied at a level greater than

VPF, the lithium energy source is enabled for battery backup operation. Actual life expectancy of the

DS1742 will be much longer than 10 years since no lithium battery energy is consumed when VCC is

present.

BATTERY MONITOR

The DS1742 constantly monitors the battery voltage of the internal battery. The Battery Flag bit (bit 7) of

the day register is used to indicate the voltage level range of the battery. This bit is not writable and

should always be a 1 when read. If a 0 is ever present, an exhausted lithium energy source is indicated

and both the contents of the RTC and RAM are questionable.

DS1742

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ABSOLUTE MAXIMUM RATINGS

Voltage Range on Any Pin Relative to Ground……………………………………………..-0.3V to +6.0V

Operating Temperature Range……………………………………………...0°C to +70°C (noncondensing)

Storage Temperature Range………………………………………………………………...-40°C to +85°C

Soldering Temperature (EDIP, leads)..………………………………..+260°C for 10 seconds (See Note 7)

This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation

sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect

reliability.

OPERATING RANGE

RANGE TEMPERATURE VCC

Commercial 0°C to +70°C (noncondensing) 3.3V ±10% or 5V ±10%

Industrial -40°C to +85°C (noncondensing) 3.3V ±10% or 5V ±10%

RECOMMENDED DC OPERATING CONDITIONS

(Over the operating range)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

VCC = 5V ±10% VIH 2.2 VCC + 0.3V V 1

Logic 1

Voltage

(All Inputs) VCC = 3.3V ±10% VIH 2.0 VCC + 0.3V V 1

VCC = 5V ±10% VIL -0.3 +0.8 V 1

Logic 0

Voltage (All

Inputs) VCC = 3.3V ±10% VIL -0.3 +0.6 V 1

DC ELECTRICAL CHARACTERISTICS

(VCC = 5.0V ±10%, Over the operating range.)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

Active Supply Current ICC 15 50 mA 2, 3

TTL Standby Current ( CE = VIH) ICC1 1 3 mA 2, 3

CMOS Standby Current

(CE ≥ VCC - 0.2V) ICC2 1 3 mA 2, 3

Input Leakage Current

(Any Input) IIL -1 +1

µA

Output Leakage Current

(Any Output) IOL -1 +1

µA

Output Logic 1 Voltage

(IOUT = -1.0mA) VOH 2.4 1

Output Logic 0 Voltage

(IOUT = +2.1mA) VOL 0.4 1

Write Protection Voltage VPF 4.25 4.50 V 1

Battery Switchover Voltage VSO V

BAT 1, 4

DS1742

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DC ELECTRICAL CHARACTERISTICS

(VCC = 3.3V ±10%, Over the operating range.)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

Active Supply Current ICC 10 30 mA 2, 3

TTL Standby Current ( CE = VIH) ICC1 0.7 2 mA 2, 3

CMOS Standby Current

(CE ³ VCC - 0.2V) ICC2 0.7 2 mA 2, 3

Input Leakage Current (any input) IIL -1 +1

Output Leakage Current

(Any Output) IOL -1 +1

Output Logic 1 Voltage

(IOUT = -1.0mA) VOH 2.4 1

Output Logic 0 Voltage

(IOUT =2.1mA) VOL 0.4 1

Write Protection Voltage VPF 2.80 2.97 V 1

Battery Switchover Voltage VSO

VBAT or

VPF

V 1, 4

AC CHARACTERISTICS—READ CYCLE (5V)

(VCC = 5.0V ±10%, Over the operating range.)

70ns ACCESS 100ns ACCESS

PARAMETER SYMBOL MIN MAX MIN MAX

UNITS NOTES

Read Cycle Time tRC 70 100 ns

Address Access Time tAA 70 100 ns

CE to DQ Low-Z tCEL 5 5 ns

CE Access Time tCEA 70 100 ns

CE Data Off time tCEZ 25 35 ns

OE to DQ Low-Z tOEL 5 5 ns

OE Access Time tOEA 35 55 ns

OE Data Off Time tOEZ 25 35 ns

Output Hold from Address tOH 5 5 ns

DS1742

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AC CHARACTERISTICS—READ CYCLE (3.3V)

(VCC = 3.3V ±10%, Over the operating range.)

120ns ACCESS 150ns ACCESS

PARAMETER SYMBOL MIN MAX MIN MAX

UNITS NOTES

Read Cycle Time tRC 120 150 ns 5

Address Access Time tAA 120 150 ns 5

CE to DQ Low-Z tCEL 5 5 ns 5

CE Access Time tCEA 120 150 ns 5

CE Data Off time tCEZ 40 50 ns 5

OE to DQ Low-Z tOEL 5 5 ns 5

OE Access Time tOEA 100 130 ns 5

OE Data Off Time tOEZ 35 35 ns 5

Output Hold from Address tOH 5 5 ns 5

READ CYCLE TIMING DIAGRAM

DS1742

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AC CHARACTERISTICS—WRITE CYCLE (5V)

(VCC = 5.0V ±10%, Over the operating range.)

70ns ACCESS 100ns ACCESS

PARAMETER SYMBOL MIN MAX MIN MAX

UNITS NOTES

Write Cycle Time tWC 70 100 ns

Address Access Time tAS 0 0 ns

WE Pulse Width tWEW 50 70 ns

CE Pulse Width tCEW 60 75 ns

Data Setup Time tDS 30 40 ns

Data Hold time tDH 0 0 ns

Address Hold Time tAH 5 5 ns

WE Data Off Time tWEZ 25 35 ns

Write Recovery Time tWR 5 5 ns

AC CHARACTERISTICS—WRITE CYCLE (3.3V)

(VCC = 3.3V ±10%, Over the operating range.)

120ns ACCESS 150ns ACCESS

PARAMETER SYMBOL MIN MAX MIN MAX

UNITS NOTES

Write Cycle Time tWC 120 150 ns

Address Setup Time tAS 0 0 ns

WE Pulse Width tWEW 100 130 ns

CE Pulse Width tCEW 110 140 ns

Data Setup Time tDS 80 90 ns

Data Hold Time tDH 0 0 ns

Address Hold Time tAH 0 0 ns

WE Data Off Time tWEZ 40 50 ns

Write Recovery Time tWR 10 10 ns

DS1742

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WRITE CYCLE TIMING DIAGRAM—WRITE-ENABLE CONTROLLED

WRITE CYCLE TIMING DIAGRAM—CHIP-ENABLE CONTROLLED

DS1742

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POWER-UP/POWER-DOWN CHARACTERISTICS (5V)

(VCC = 5.0V ±10%, Over the operating range.)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

CE or WE at VIH, Before Power-Down tPD 0 ms

VCC Fall Time: VPF(MAX) to VPF(MIN) tF 300 ms

VCC Fall Time: VPF(MIN) to VSO t

FB 10 ms

VCC Rise Time: VPF(MIN) to VPF(MAX) t

R 0

Power-Up Recover Time tREC 35 ms

Expected Data Retention Time

(Oscillator On) tDR 10 years 5, 6

POWER-UP/POWER-DOWN WAVEFORM TIMING (5V DEVICE)

DS1742

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POWER-UP/POWER-DOWN CHARACTERISTICS (3.3V)

(VCC = 3.3V ±10%, Over the operating range.)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

CE or WE at VIH, Before Power-Down tPD 0

VCC Fall Time: VPF(MAX) to VPF(MIN) tF 300 ms

VCC Rise Time: VPF(MIN) to VPF(MAX) t

R 0

Power-Up Recovery Time tREC 35 ms

Expected Data Retention Time

(Oscillator On) tDR 10 years 5, 6

POWER-UP/POWER-DOWN WAVEFORM TIMING (3.3V DEVICE)

CAPACITANCE

(TA = +25°C)

PARAMETER SYMBOL MIN TYP MAX UNITS NOTES

Capacitance on All Input Pins CIN 7 pF

Capacitance on All Output Pins CO 10 pF

DS1742

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AC TEST CONDITIONS

Output Load: 100pF + 1TTL Gate

Input Pulse Levels: 0.0 to 3.0V

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5ns

NOTES:

1) Voltage referenced to ground.

2) Typical values are at 25°C and nominal supplies.

3) Outputs are open.

4) Battery switchover occurs at the lower of either the battery voltage or VPF.

5) Data retention time is at 25°C.

6) Each DS1742 has a built-in switch that disconnects the lithium source until VCC is first applied by the

user. The expected tDR is defined as a cumulative time in the absence of VCC starting from the time

power is first applied by the user.

7) Real-time clock modules can be successfully processed through conventional wave-soldering

techniques as long as temperature exposure to the lithium energy source contained within does not

exceed +85°C. Post-solder cleaning with water washing techniques is acceptable, provided that

ultrasonic vibration is not used to prevent damage to the crystal.

DS1742

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Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.

No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.

PACKAGE INFORMATION

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package

outline information, go to www.maxim-ic.com/DallasPackInfo.)

DS1742 24-PIN PACKAGE