Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 ADC128S022 8-Channel, 50 kSPS to 200 kSPS, 12-Bit A/D Converter 1 Features 3 Description * * * * * * * * * The ADC128S022 device is a low-power, eightchannel CMOS 12-bit analog-to-digital converter specified for conversion throughput rates of 50 ksps to 200 ksps. The converter is based on a successiveapproximation register architecture with an internal track-and-hold circuit. It can be configured to accept up to eight input signals at inputs IN0 through IN7. 1 Eight Input Channels Variable Power Management Independent Analog and Digital Supplies SPITM/QSPITM/MICROWIRE/DSP Compatible Packaged in 16-lead TSSOP Conversion Rate: 50 ksps to 200ksps DNL (VA = VD = 5 V): +1 / -0.7 LSB (Maximum) INL (VA = VD = 5 V): 1 LSB (Maximum) Power Consumption - 3V Supply: 1.2 mW (Typical) - 5V Supply: 7.5 mW (Typical) The output serial data is straight binary and is compatible with several standards, such as SPI, QSPI, MICROWIRE, and many common DSP serial interfaces. The ADC128S022 may be operated with independent analog and digital supplies. The analog supply (VA) can range from 2.7 V to 5.25 V, and the digital supply (VD) can range from 2.7 V to VA. Normal power consumption using a 3-V or 5-V supply is 1.2 mW and 7.5 mW, respectively. The power-down feature reduces the power consumption to 0.06 W using a 3-V supply and 0.25 W using a 5-V supply. 2 Applications * * * * * Automotive Navigation Portable Systems Medical Instruments Mobile Communications Instrumentation and Control Systems The ADC128S022 is packaged in a 16-lead TSSOP package. Operation over the extended industrial temperature range of -40C to +105C is ensured. Device Information(1) PART NUMBER ADC128S022 PACKAGE TSSOP (16) BODY SIZE (NOM) 4.40 mm x 5.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application VA is used as the $QDORJ 6XSSO\ 5DLO Reference for the ADC VD can be set independently of VA VA VIN7 'LJLWDO 6XSSO\ 5DLO VD IN7 CONTROLLER IN6 IN5 IN4 VIN3 SAR ADC IN3 4-wire SPI MCU IN2 IN1 VIN0 IN0 AGND DGND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 5 5 7 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Specifications ............................................... Typical Characteristics .............................................. Detailed Description ............................................ 14 7.1 7.2 7.3 7.4 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 14 15 15 16 7.5 Register Maps ......................................................... 17 8 Application and Implementation ........................ 18 8.1 Application Information............................................ 18 8.2 Typical Application .................................................. 18 9 Power Supply Recommendations...................... 20 9.1 Power Supply Sequence......................................... 20 9.2 Power Supply Noise Considerations....................... 20 10 Layout................................................................... 21 10.1 Layout Guidelines ................................................. 21 10.2 Layout Example .................................................... 21 11 Device and Documentation Support ................. 22 11.1 11.2 11.3 11.4 11.5 Device Support...................................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 23 23 23 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (March 2013) to Revision F * Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 Changes from Revision D (March 2013) to Revision E * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 21 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 5 Pin Configuration and Functions PW Package 16-Pin TSSOP Top View CS 1 16 SCLK VA 2 15 DOUT AGND 3 14 DIN IN0 4 13 VD ADC128S022 IN1 5 12 DGND IN2 6 11 IN7 IN3 7 10 IN6 IN4 8 9 IN5 Pin Functions PIN NAME NO. TYPE DESCRIPTION CS 1 Digital I/O Chip select. On the falling edge of CS, a conversion process begins. Conversions continue as long as CS is held low. VA 2 Power Supply Positive analog supply pin. This voltage is also used as the reference voltage. This pin should be connected to a quiet +2.7-V to +5.25-V source and bypassed to GND with 1-F and 0.1-F monolithic ceramic capacitors located within 1 cm of the power pin. AGND 3 Power Supply The ground return for the analog supply and signals. 4-11 Analog I/O DGND 12 Power Supply The ground return for the digital supply and signals. VD 13 Power Supply Positive digital supply pin. This pin should be connected to a +2.7-V to VA supply, and bypassed to GND with a 0.1-F monolithic ceramic capacitor located within 1 cm of the power pin. DIN 14 Digital I/O Digital data input. The ADC128S022's Control Register is loaded through this pin on rising edges of the SCLK pin. DOUT 15 Digital I/O Digital data output. The output samples are clocked out of this pin on the falling edges of the SCLK pin. SCLK 16 Digital I/O Digital clock input. The specified performance range of frequencies for this input is 0.8 MHz to 3.2 MHz. This clock directly controls the conversion and readout processes. IN0 to IN7 Analog inputs. These signals can range from 0 V to VREF. Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 3 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) (3) . MIN MAX UNIT Analog supply voltage VA -0.3 6.5 V Digital supply voltage VD -0.3 to VA + 0.3 6.5 V -0.3 VA + 0.3 V 10 mA 20 mA 150 C 150 C Voltage on any pin to GND Input current at any pin (4) Package input current (4) See (5) Power dissipation at TA = 25C Junction temperature Storage temperature, Tstg (1) (2) (3) (4) (5) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For soldering specifications see product folder at www.ti.com and SNOA549 If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND or VIN > VA or VD), the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax - TA)/JA. In the 16-pin TSSOP, JA is 96C/W, so PDMAX = 1,200 mW at 25C and 625 mW at the maximum operating ambient temperature of 105C. Note that the power consumption of this device under normal operation is a maximum of 12 mW. The values for maximum power dissipation listed above will be reached only when the ADC128S022 is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. 6.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) (2) (3) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) 2500 Machine Model (3) 250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Human body model is 100-pF capacitor discharged through a 1.5-k resistor. Machine model is 220 pF discharged through ZERO ohms 6.3 Recommended Operating Conditions See (1) . MIN NOM Operating temperature -40 TA VA supply voltage 2.7 VD supply voltage 2.7 VA V Digital input voltage 0 VA V Analog input voltage 0 VA 50 1600 Clock frequency (1) 4 MAX UNIT 105 C 5.25 V V kHz All voltages are measured with respect to GND = 0V, unless otherwise specified. Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 6.4 Thermal Information ADC128S022 THERMAL METRIC (1) PW (TSSOP) UNIT 16 PINS RJA Junction-to-ambient thermal resistance 110 C/W RJC(top) Junction-to-case (top) thermal resistance 42 C/W RJB Junction-to-board thermal resistance 56 C/W JT Junction-to-top characterization parameter 5 C/W JB Junction-to-board characterization parameter 55 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL = 50 pF, unless otherwise noted. Maximum and minimum limits apply for TA = TMIN to TMAX: all other limits TA = 25C. (1) PARAMETER TEST CONDITIONS MIN TYP MAX (2) UNIT STATIC CONVERTER CHARACTERISTICS Resolution with no missing codes Integral non-linearity (end-point method) INL VA = VD = 5 V Offset error OEM FSE Offset error match Full scale error FSEM Full scale error match LSB 0.4 1 LSB 0.3 0.9 LSB VA = VD = 5 V Differential non-linearity VOFF Bits 1 0.3 VA = VD = 3 V DNL 12 VA = VD = 3 V -0.7 -0.2 0.5 -0.7 LSB 1 -0.3 LSB LSB VA = VD = 3 V 0.8 2.3 LSB VA = VD = 5 V 1.2 2.3 LSB VA = VD = 3 V 0.05 1.5 LSB VA = VD = 5 V 0.2 1.5 LSB VA = VD = 3 V 0.5 2 LSB VA = VD = 5 V 0.3 2 LSB VA = VD = 3 V 0.05 1.5 LSB VA = VD = 5 V 0.2 1.5 LSB DYNAMIC CONVERTER CHARACTERISTICS FPBW SINAD SNR Signal-to-noise plus distortion ratio Signal-to-noise ratio THD Total harmonic distortion SFDR ENOB (1) (2) Full power bandwidth (-3 dB) Spurious-free dynamic range Effective number of bits VA = VD = 3 V 8 MHz VA = VD = 5 V 11 MHz VA = VD = 3 V, fIN = 39.9 kHz, -0.02 dBFS 70 73 dB VA = VD = 5 V, fIN = 39.9 kHz, -0.02 dBFS 70 73 dB VA = VD = 3 V, fIN = 39.9 kHz, -0.02 dBFS 70.8 73 dB VA = VD = 5 V, fIN = 39.9 kHz, -0.02 dBFS 70.8 73 dB VA = VD = 3 V, fIN = 39.9 kHz, -0.02 dBFS -89 -74 dB VA = VD = 5 V, fIN = 39.9 kHz, -0.02 dBFS -90 -74 dB VA = VD = 3 V, fIN = 39.9 kHz, -0.02 dBFS 75 91 dB VA = VD = 5 V, fIN = 39.9 kHz, -0.02 dBFS 75 91 dB VA = VD = 3 V, fIN = 39.9 kHz 11.3 11.8 Bits VA = VD = 5 V, fIN = 39.9 kHz, -0.02 dBFS 11.3 11.8 Bits Data sheet minimum and maximum specification limits are specified by design, test, or statistical analysis. Tested limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level). Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 5 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL = 50 pF, unless otherwise noted. Maximum and minimum limits apply for TA = TMIN to TMAX: all other limits TA = 25C.(1) PARAMETER ISO Channel-to-channel isolation Intermodulation distortion, second order terms IMD Intermodulation distortion, third order terms TEST CONDITIONS MIN TYP MAX (2) UNIT VA = VD = 3 V, fIN = 20 kHz 81 dB VA = VD = 5 V, fIN = 20 kHz, -0.02 dBFS 80 dB VA = VD = 3 V, fa = 19.5 kHz, fb = 20.5 kHz -97 dB VA = VD = 5 V, fa = 19.5 kHz, fb = 20.5 kHz -94 dB VA = VD = 3 V, fa = 19.5 kHz, fb = 20.5 kHz -88 dB VA = VD = 5 V, fa = 19.5 kHz, fb = 20.5 kHz -88 dB ANALOG INPUT CHARACTERISTICS VIN Rail-to-rail input IDCL DC leakage current CINA Input capacitance 0 VA V 1 A Track mode 33 pF Hold mode 3 pF DIGITAL INPUT CHARACTERISTICS VA = VD = 2.7 V to 3.6 V 2.1 VA = VD = 4.75 V to 5.25 V 2.4 VIH Input high voltage VIL Input low voltage VA = VD = 2.7 V to 5.25 V IIN Input current VIN = 0 V or VD CIND Digital input capacitance V V 0.8 V 0.01 1 A 2 4 pF DIGITAL OUTPUT CHARACTERISTICS VOH Output high voltage ISOURCE = 200 A, VA = VD = 2.7 V to 5.25 V VOL Output low voltage ISINK = 200 A to 1 mA, VA = VD = 2.7 V to 5.25 V IOZH, IOZL Hi-impedance output leakage current VA = VD = 2.7 V to 5.25 V COUT Hi-impedance output capacitance (1) VD - 0.5 V 2 Output coding 0.4 V 1 A 4 pF Straight (Natural) Binary POWER SUPPLY CHARACTERISTICS (CL = 10 pF) VA, VD Analog and digital supply voltages Total supply current Normal mode ( CS low) IA + ID Total supply current Shutdown mode (CS high) Power consumption Normal mode ( CS low) PC Power consumption Shutdown mode (CS high) 6 VA VD 5.25 V 0.41 1.1 mA VA = VD = +4.75 V to +5.25 V, fSAMPLE = 200 ksps, fIN = 39.9 kHz 1.5 2.3 mA VA = VD = +2.7 V to +3.6 V, fSCLK = 0 ksps 20 nA VA = VD = 4.75 V to 5.25 V, fSCLK = 0 ksps 50 nA VA = VD = 3 V, fSAMPLE = 200 ksps, fIN = 39.9 kHz 1.2 3.3 mW VA = VD = 5 V, fSAMPLE = 200 ksps, fIN = 39.9 kHz 7.5 11.5 mW VA = VD = +2.7 V to +3.6 V, fSAMPLE = 200 ksps, fIN = 39.9 kHz 2.7 VA = VD = 3 V, fSCLK = 0 ksps 0.06 W VA = VD = 5 V, fSCLK = 0 ksps 0.25 W Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Electrical Characteristics (continued) The following specifications apply for AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, CL = 50 pF, unless otherwise noted. Maximum and minimum limits apply for TA = TMIN to TMAX: all other limits TA = 25C.(1) PARAMETER TEST CONDITIONS MIN TYP MAX (2) 16 3.2 1000 200 ksps 13 SCLK cycles UNIT AC ELECTRICAL CHARACTERISTICS fSCLKMIN Minimum clock frequency VA = VD = 2.7 V to 5.25 V fSCLK Maximum clock frequency VA = VD = 2.7 V to 5.25 V 0.8 MHz 50 fS Sample rate continuous mode VA = VD = 2.7 V to 5.25 V tCONVERT Conversion (hold) time VA = VD = 2.7 V to 5.25 V DC SCLK duty cycle VA = VD = 2.7 V to 5.25 V tACQ Acquisition (track) time VA = VD = 2.7 V to 5.25 V Throughput time Acquisition time + conversion time VA = VD = 2.7 V to 5.25 V Aperture delay VA = VD = 2.7 V to 5.25 V tAD MHz ksps 40% 30% 70% 60% 3 SCLK cycles 16 SCLK cycles 4 ns 6.6 Timing Specifications The following specifications apply for VA = VD = 2.7 V to 5.25 V, AGND = DGND = 0 V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200 ksps, and CL = 50 pF. Maximum and minimum limits apply for TA = TMIN to TMAX: all other limits TA = 25C. PARAMETER TEST CONDITIONS MIN NOM MAX (1) UNIT tCSH CS hold time after SCLK rising edge 10 0 ns tCSS CS set-up time prior to SCLK rising edge 10 4.5 ns tEN CS falling edge to DOUT enabled tDACC DOUT access time after SCLK falling edge tDHLD DOUT hold time after SCLK falling edge tDS DIN set-up time prior to SCLK rising edge tDH DIN hold time after SCLK rising edge tCH SCLK high time 0.4 x tSCLK ns tCL SCLK low time 0.4 x tSCLK ns tDIS CS rising Edge to DOUT high-impedance (1) 5 30 ns 17 27 ns 4 ns 10 3 ns 10 3 ns DOUT falling 2.4 20 ns DOUT rising 0.9 20 ns Data sheet min/max specification limits are specified by design, test, or statistical analysis. Power Down Power Up Track Power Up Hold Track Hold CS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 SCLK Control register DIN DOUT ADD2 FOUR ZEROS ADD1 ADD0 DB11 DB10 DB9 ADD2 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 FOUR ZEROS ADD1 ADD0 DB11 DB10 DB9 Figure 1. ADC128S022 Operational Timing Diagram Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 7 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com CS tCONVERT tACQ tCH SCLK 1 2 3 4 5 6 7 tCL tEN DOUT 8 16 tDACC DB11 FOUR ZEROS DB10 tDHLD DB9 DB8 tDIS DB1 DB0 tDH tDS DIN DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC Figure 2. ADC128S022 Serial Timing Diagram SCLK tCSS CS tCSH CS Figure 3. SCLK and CS Timing Parameters 8 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 6.7 Typical Characteristics TA = 25C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. Figure 4. DNL Figure 5. DNL Figure 6. INL Figure 7. INL Figure 8. DNL vs Supply Figure 9. INL vs Supply Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 9 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) TA = 25C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. 10 Figure 10. SNR vs Supply Figure 11. THD vs Supply Figure 12. ENOB vs Supply Figure 13. DNL vs VD With VA = 5 V Figure 14. INL vs VD With VA = 5 V Figure 15. DNL vs SCLK Duty Cycle Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Typical Characteristics (continued) TA = 25C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. Figure 16. INL vs SCLK Duty Cycle Figure 17. SNR vs SCLK Duty Cycle Figure 18. THD vs SCLK Duty Cycle Figure 19. ENOB vs SCLK Duty Cycle Figure 20. DNL vs SCLK Figure 21. INL vs SCLK Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 11 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) TA = 25C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. 12 Figure 22. SNR vs SCLK Figure 23. THD vs SCLK Figure 24. ENOB vs SCLK Figure 25. DNL vs Temperature Figure 26. INL vs Temperature Figure 27. SNR vs Temperature Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Typical Characteristics (continued) TA = 25C, fSAMPLE = 200 ksps, fSCLK = 3.2 MHz, fIN = 39.9 kHz unless otherwise stated. Figure 28. THD vs Temperature Figure 29. ENOB vs Temperature Figure 30. SNR vs Input Frequency Figure 31. THD vs Input Frequency Figure 32. ENOB vs Input Frequency Figure 33. Power Consumption vs SCLK Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 13 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com 7 Detailed Description 7.1 Overview The ADC128S022 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter. Simplified schematics of the ADC128S022 in both track and hold operation are shown in Figure 34 and Figure 35 respectively. In Figure 34, the ADC128S022 is in track mode: switch SW1 connects the sampling capacitor to one of eight analog input channels through the multiplexer, and SW2 balances the comparator inputs. The ADC128S022 is in this state for the first three SCLK cycles after CS is brought low. Figure 35 shows the ADC128S022 in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-redistribution DAC to add or subtract fixed amounts of charge to or from the sampling capacitor until the comparator is balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of the analog input voltage. The ADC128S022 is in this state for the last thirteen SCLK cycles after CS is brought low. IN0 CHARGE REDISTRIBUTION DAC MUX SAMPLING CAPACITOR SW1 IN7 SW2 + - CONTRO L LOGI C AGND VA /2 Figure 34. ADC128S022 in Track Mode IN0 CHARGE REDISTRIBUTION DAC MUX IN7 SAMPLING CAPACITOR + SW1 SW2 CONTROL LOGIC - AGND VA /2 Figure 35. ADC128S022 in Hold Mode 14 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 7.2 Functional Block Diagram IN0 . . . MUX T/H 12-BIT SUCCESSIVE APPROXIMATION ADC VA AGND AGND IN7 VD SCLK ADC128S022 CONTROL LOGIC CS DIN DOUT DGND 7.3 Feature Description 7.3.1 Serial Interface An operational timing diagram and a serial interface timing diagram for the ADC128S022 are shown in the Specifications section. CS, chip select, initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data output pin, where a conversion result is sent as a serial data stream, MSB first. Data to be written to the ADC128S022's Control Register is placed on DIN, the serial data input pin. New data is written to DIN with each conversion. A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain an integer multiple of 16 rising SCLK edges. The ADC's DOUT pin is in a high impedance state when CS is high and is active when CS is low. Thus, CS acts as an output enable. Similarly, SCLK is internally gated off when CS is brought high. During the first 3 cycles of SCLK, the ADC is in the track mode, acquiring the input voltage. For the next 13 SCLK cycles the conversion is accomplished and the data is clocked out. SCLK falling edges 1 through 4 clock out leading zeros while falling edges 5 through 16 clock out the conversion result, MSB first. If there is more than one conversion in a frame (continuous conversion mode), the ADC will re-enter the track mode on the falling edge of SCLK after the N*16th rising edge of SCLK and re-enter the hold/convert mode on the N*16+4th falling edge of SCLK. "N" is an integer value. The ADC128S022 enters track mode under three different conditions. In Figure 1, CS goes low with SCLK high and the ADC enters track mode on the first falling edge of SCLK. In the second condition, CS goes low with SCLK low. Under this condition, the ADC automatically enters track mode and the falling edge of CS is seen as the first falling edge of SCLK. In the third condition, CS and SCLK go low simultaneously and the ADC enters track mode. While there is no timing restriction with respect to the rising edges of CS and SCLK, see Figure 3 for set-up and hold time requirements for the falling edge of CS with respect to the rising edge of SCLK. While a conversion is in progress, the address of the next input for conversion is clocked into a control register through the DIN pin on the first 8 rising edges of SCLK after the fall of CS. See Table 1, Table 2, and Table 3. There is no need to incorporate a power-up delay or dummy conversion as the ADC128S022 is able to acquire the input signal to full resolution in the first conversion immediately following power up. The first conversion result after power up will be that of IN0. 7.3.2 ADC128S022 Transfer Function The output format of the ADC128S022 is straight binary. Code transitions occur midway between successive integer LSB values. The LSB width for the ADC128S022 is VA / 4096. The ideal transfer characteristic is shown in Figure 36. The transition from an output code of 0000 0000 0000 to a code of 0000 0000 0001 is at 1/2 LSB, or a voltage of VA / 8192. Other code transitions occur at steps of one LSB. Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 15 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com Feature Description (continued) 111...111 111...000 | | ADC CODE 111...110 1LSB = VA/4096 011...111 000...010 | 000...001 000...000 0V 0.5LSB ANALOG INPUT +VA - 1.5LSB Figure 36. Ideal Transfer Characteristic 7.3.3 Analog Inputs An equivalent circuit for one of the input channels of the ADC128S022 is shown in Figure 37. Diodes D1 and D2 provide ESD protection for the analog inputs. The operating range for the analog inputs is 0 V to VA. Going beyond this range will cause the ESD diodes to conduct and result in erratic operation. The capacitor C1 in Figure 37 has a typical value of 3 pF and is mainly the package pin capacitance. Resistor R1 is the ON-resistance of the multiplexer and track / hold switch and is typically 500 . Capacitor C2 is the ADC128S022 sampling capacitor, and is typically 30 pF. The ADC128S022 will deliver best performance when driven by a low-impedance source (less than 100 ). This is especially important when using the ADC128S022 to sample dynamic signals. Also important when sampling dynamic signals is a bandpass or lowpass filter which reduces harmonics and noise in the input. These filters are often referred to as anti-aliasing filters. VA D1 R1 C2 30 pF VIN C1 3 pF D2 Conversion Phase - Switch Open Track Phase - Switch Closed Figure 37. Equivalent Input Circuit 7.3.4 Digital Inputs and Outputs The digital inputs of the ADC128S022 (SCLK, CS, and DIN) have an operating range of -0.3 V to VA. They are not prone to latch-up and may be asserted before the digital supply (VD) without any risk. The digital output (DOUT) operating range is controlled by VD. The output high voltage is VD - 0.5V (minimum) while the output low voltage is 0.4 V (maximum). 7.4 Device Functional Modes The ADC128S022 is fully powered-up whenever CS is low and fully powered-down whenever CS is high, with one exception. If operating in continuous conversion mode, the ADC128S022 automatically enters power-down mode between SCLK's 16th falling edge of a conversion and SCLK's 1st falling edge of the subsequent conversion (see Figure 1). 16 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Device Functional Modes (continued) In continuous conversion mode, the ADC128S022 can perform multiple conversions back to back. Each conversion requires 16 SCLK cycles and the ADC128S022 will perform conversions continuously as long as CS is held low. Continuous mode offers maximum throughput. In burst mode, the user may trade off throughput for power consumption by performing fewer conversions per unit time. This means spending more time in power-down mode and less time in normal mode. By using this technique, the user can achieve very low sample rates while still using an SCLK frequency within the electrical specifications. The Power Consumption vs SCLK curve in the Typical Characteristics section shows the typical power consumption of the ADC128S022. To calculate the power consumption (PC), simply multiply the fraction of time spent in the normal mode (tN) by the normal mode power consumption (PN), and add the fraction of time spent in shutdown mode (tS) multiplied by the shutdown mode power consumption (PS) as shown in Equation 1. tS tN x PN + x PS tN + t S tN + t S PC = (1) 7.5 Register Maps Table 1. Control Register Bits Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC Table 2. Control Register Bit Descriptions BIT #: SYMBOL: DESCRIPTION 7, 6, 2, 1, 0 DONTC Don't care. The values of these bits do not affect the device. 5 ADD2 4 ADD1 3 ADD0 These three bits determine which input channel will be sampled and converted at the next conversion cycle. The mapping between codes and channels is shown in Table 3. Table 3. Input Channel Selection ADD2 ADD1 ADD0 INPUT CHANNEL 0 0 0 IN0 (Default) 0 0 1 IN1 0 1 0 IN2 0 1 1 IN3 1 0 0 IN4 1 0 1 IN5 1 1 0 IN6 1 1 1 IN7 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 17 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The ADC128S022 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter. Because the ADC128S022 integrates an 8 to 1 MUX on the front end, the device is typically used in applications where multiple voltages need to be monitored. In addition to having 8 input channels, the ADC128S022 can operate at sampling rates up to 200 kSPS. As a result, the ADC128S022 is typically run in burst fashion where a voltage is sampled for several times and then the ADC128S022 can be powered down. This is a common technique for applications that are power limited. Due to the high bandwidth and sampling rate, the ADC128S022 is suitable for monitoring AC waveforms as well as DC inputs. The following example shows a common configuration for monitoring AC inputs. 8.2 Typical Application The following sections outline the design principles of data acquisition system based on the ADC128S022. A typical application is shown in Figure 38. The analog supply is bypassed with a capacitor network located close to the ADC128S022. The ADC128S022 uses the analog supply (VA) as its reference voltage, so it is very important that VA be kept as clean as possible. Due to the low power requirements of the ADC128S022, it is also possible to use a precision reference as a power supply. 5V 3.3V 1uF High Impedance Source + LMV612 0.1uF 100 IN7 0.1uF 1uF V A VD VDD 100 GPIOa SCLK 100 33n GPIOb CS MCU 100 Low Impedance Source Schottky Diode (optional) 100 IN3 ADC128S022 DOUT 100 DIN GPIOd GND IN0 33n GPIOc AGN D DGN D Figure 38. Typical Application Circuit 8.2.1 Design Requirements A positive supply only data acquisition system capable of digitizing signals ranging 0 to 5 V, BW = 10 kHz, and a throughput of 125 kSPS. The ADC128S022 has to interface to an MCU whose supply is set at 3.3 V. 8.2.2 Detailed Design Procedure The signal range requirement forces the design to use 5-V analog supply at VA, analog supply. This follows from the fact that VA is also a reference potential for the ADC. The requirement of interfacing to the MCU which is powered by 3.3-V supply, forces the choice of 3.3-V as a VD supply. 18 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Typical Application (continued) Sampling is in fact a modulation process which may result in aliasing of the input signal, if the input signal is not adequately band limited. The maximum sampling rate of the ADC128S022 when all channels are enabled is, Fs is calculated by Equation 2: FSCLK Fs = 16 8 (2) Note that faster sampling rates can be achieved when fewer channels are sampled. Single channel can be sampled at the maximum rate of Equation 3: FSCLK Fs _ sin gle = 16 (3) In order to avoid the aliasing, the Nyquist criterion has to be met by Equation 4: Fs BW signal 2 (4) Therefore it is necessary to place anti-aliasing filters at all inputs of the ADC. These filters may be single-pole lowpass filters whose pole location has to satisfy, assuming all channels sampled in sequence of Equation 5 and Equation 6: 1 FSCLK p R C 16 8 (5) 128 RC p FSCLK (6) With Fsclk = 16 MHz, a good choice for the single-pole filter is: * R = 100 * C = 33 nF This reduces the input BWsignal = 48 kHz. The capacitor at the INx input of the device provides not only the filtering of the input signal, but it also absorbs the charge kick-back from the ADC. The kick-back is the result of the internal switches opening at the end of the acquisition period. The VA and VD sources are already separated in this example, due to the design requirements. This also benefits the overall performance of the ADC, as the potentially noisy VD supply does not contaminate the VA. In the same vain, further consideration could be given to the SPI interface, especially when the master MCU is capable of producing fast rising edges on the digital bus signals. Inserting small resistances in the digital signal path may help in reducing the ground bounce, and thus improve the overall noise performance of the system. Take care when the signal source is capable of producing voltages beyond VA. In such instances the internal ESD diodes may start conducting. The ESD diodes are not intended as input signal clamps. To provide the desired clamping action use Schottky diodes as shown in Figure 38. 8.2.3 Application Curve Figure 39. Typical Performance Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 19 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com 9 Power Supply Recommendations There are three major power supply concerns with this product: power supply sequencing, power management, and the effect of digital supply noise on the analog supply. 9.1 Power Supply Sequence The ADC128S022 is a dual-supply device. The two supply pins share ESD resources, so take care to ensure that the power is applied in the correct sequence. To avoid turning on the ESD diodes, the digital supply (VD) cannot exceed the analog supply (VA) by more than 300 mV, not even on a transient basis. Therefore, VA must ramp up before or concurrently with VD. 9.2 Power Supply Noise Considerations The charging of any output load capacitance requires current from the digital supply, VD. The current pulses required from the supply to charge the output capacitance will cause voltage variations on the digital supply. If these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore, if the analog and digital supplies are tied directly together, the noise on the digital supply will be coupled directly into the analog supply, causing greater performance degradation than would noise on the digital supply alone. Similarly, discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current into the die substrate, which is resistive. Load discharge currents will cause ground bounce noise in the substrate that will degrade noise performance if that current is large enough. The larger the output capacitance, the more current flows through the die substrate and the greater the noise coupled into the analog channel. The first solution to keeping digital noise out of the analog supply is to decouple the analog and digital supplies from each other or use separate supplies for them. To keep noise out of the digital supply, keep the output load capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100- series resistor at the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge current of the output capacitance and improve noise performance. Because the series resistor and the load capacitor form a low-frequency pole, verify the signal integrity once the series resistor has been added. 20 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 10 Layout 10.1 Layout Guidelines Capacitive coupling between the noisy digital circuitry and the sensitive analog circuitry can lead to poor performance. The solution is to keep the analog circuitry separated from the digital circuitry and the clock line as short as possible. Digital circuits create substantial supply and ground current transients. The logic noise generated could have significant impact upon system noise performance. To avoid performance degradation of the ADC128S022 due to supply noise, do not use the same supply for the ADC128S022 that is used for digital logic. Generally, analog and digital lines should cross each other at 90 to avoid crosstalk. However, to maximize accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the clock line should also be treated as a transmission line and be properly terminated. The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input. Any external component (for example, a filter capacitor) connected between the input pins and ground of the converter or to the reference input pin and ground should be connected to a very clean point in the ground plane. TI recommends the use of a single, uniform ground plane and the use of split power planes. The power planes should be located within the same board layer. All analog circuitry (input amplifiers, filters, reference components, and so forth) should be placed over the analog power plane. All digital circuitry and I/O lines should be placed over the digital power plane. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the analog ground plane at a single, quiet point. 10.2 Layout Example ANALOG SUPPLY RAIL to analog signal sources CS SCLK VA DOUT AGND DIN IN0 VD IN1 DGND IN2 IN7 IN3 IN6 IN4 IN5 toMCU "DIGITAL" SUPPLY RAIL VIA to GROUND PLANE GROUND PLANE Figure 40. Layout Schematic Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 21 ADC128S022 SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Device Nomenclature 11.1.1.1 Specification Definitions ACQUISITION TIME is the time required for the ADC to acquire the input voltage. During this time, the hold capacitor is charged by the input voltage. APERTURE DELAY is the time between the fourth falling edge of SCLK and the time when the input signal is internally acquired or held for conversion. CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input voltage to a digital word. CHANNEL-TO-CHANNEL ISOLATION is resistance to coupling of energy from one channel into another channel CROSSTALK is the coupling of energy from one channel into another channel. This is similar to Channel-toChannel Isolation, except for the sign of the data. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the SCLK. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 11/2 LSB below VREF+ and is defined as: VFSE = Vmax + 1.5 LSB - VREF+ (7) where Vmax is the voltage at which the transition to the maximum code occurs. FSE can be expressed in Volts, LSB or percent of full scale range. GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5 LSB), after adjusting for offset error. INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (1/2 LSB below the first code transition) through positive full scale (1/2 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to an individual ADC input at the same time. It is defined as the ratio of the power in both the second and the third order intermodulation products to the power in one of the original frequencies. Second order products are fa fb, where fa and fb are the two sine wave input frequencies. Third order products are (2fa fb ) and (fa 2fb). IMD is usually expressed in dB. MISSING CODES are those output codes that will never appear at the ADC outputs. These codes cannot be reached with any input value. The ADC128S022 is ensured not to have any missing codes. OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB). SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including d.c. or the harmonics included in THD. 22 Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 ADC128S022 www.ti.com SNAS334F - AUGUST 2005 - REVISED NOVEMBER 2015 Device Support (continued) SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is any signal present in the output spectrum that is not present at the input and may or may not be a harmonic. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated as THD = 20 log 10 A f22 + + A f10 2 A f12 (8) where Af1 is the RMS power of the input frequency at the output and Af2 through Af10 are the RMS power in the first 9 harmonic frequencies. THROUGHPUT TIME is the minimum time required between the start of two successive conversions. It is the acquisition time plus the conversion and read out times. In the case of the ADC128S022, this is 16 SCLK periods. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. SPI, QSPI are trademarks of Motorola, Inc.. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2005-2015, Texas Instruments Incorporated Product Folder Links: ADC128S022 23 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) ADC128S022CIMT/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 128S022 CIMT ADC128S022CIMTX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 128S022 CIMT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device ADC128S022CIMTX/NOP B Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 *All dimensions are nominal Device ADC128S022CIMTX/NOP B Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSSOP PW 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.9 NOTE 3 4.55 8 9 B 0.30 0.19 0.1 C A B 16X 4.5 4.3 NOTE 4 1.2 MAX (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0 -8 0.75 0.50 DETAIL A A 20 TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE SYMM 16X (1.5) (R0.05) TYP 1 16 16X (0.45) SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.05 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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