PC901V0NSZXF
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC901V)
2. Approved by VDE, DIN EN60747-5-2() (as an
option), file No. 40008189 (as model No. PC901V)
3. Package resin : UL flammability grade (94V-0)
()DIN EN60747-5-2 : successor standard of DIN VDE0884
Features
Agency approvals/Compliance
1. Programmable controllers
2. PC peripherals
3. Electronic musical instruments
Applications
Digital Output, Normal ON
Operation DIP 6 pin OPIC
Photocoupler
1. 6 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Normal ON operation, open collector output
4. TTL and LSTTL compatible output
5. Operating supply voltage (VCC=3 to 15 V)
6. Isolation voltage (Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
Description
PC901V0NSZXF Series contains an IRED optically
coupled to an OPIC chip.
It is packaged in a 6 pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
1Sheet No.: D2-A05402EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC901V0NSZXF Series
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
VCC
VO
GND
6 5 4
1 2 3
Voltage
regulator Amp
2
Sheet No.: D2-A05402EN
Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC901V0NSZXF] 2. Through-Hole (VDE option) [ex. PC901V0YSZXF]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
0.5TYP. 3.5±0.5
PC901V
SHARP
mark
"S"
Date code
Anode
mark
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
2.9±0.5
0.5±0.1
2.54±0.25
VDE Identification mark
3.25±0.5
0.5TYP. 3.5±0.5
PC901V
Anode
mark Date code
SHARP
mark
"S"
4
PC901V0NSZXF Series
Product mass : approx. 0.36g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.36g
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A05402EN
PC901V0NSZXF Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05402EN
Electro-optical Characteristics
Parameter Symbol Unit
Input
Forward voltage VFV
Reverse current IRµA
Terminal capacitance
Operating supply voltage
CtTa=25˚C, V=0, f=1kHz
pF
Output
VOL
VCC
High level supply current
Hysteresis
ICCH mA
Low level supply current ICCL mA
Transfer
charac-
teristics
VCC=5V, RL=280
VCC=5V, RL=280
VCC=5V, RL=280
mA
Isolation voltage RISO
tPLH
µs
Rise time tr
Fall time tf
IFLH
"HighLow" input threshold
current IFHL
IFHL/IFLH
"LowHigh" input threshold
current
IF=0.3mA
Ta=25˚C, VR=4V
Ta=25˚C
VCC=5V, IF=4mA
RL=280
MIN.
0.7
5×1010
MAX.
10
250
5.5
5.0
4.0
0.9
3
6
0.5
0.5
Conditions
"LowHigh" propagation delay time
tPHL
"HighLow" propagation delay time
Response
time
IOL=16mA, VCC=5V, IF=0
IF=4mA
VCC=5V, IF=4mA
VCC=5V, IF=0
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, VCC=5V, RL=280
Ta=25˚C, VCC=5V, RL=280
TYP.
High level output current IOH VO=VCC=15V, IF=4mA µA100
30
V0.40.2
V315
2.7
2.5
2.01.1
0.4
0.5
0.8
0.7
mA
0.3
1×1011
0.1
0.05
1.0
1.41.1
1
2
(unless otherwise specified Ta=0 to +70˚C)
Low level output voltage
*4
*5
*6
Instantaneous common
mode rejection voltage
"Output : High level"
VCM=600V(peak), VO(MIN.)=2V
IF=4mA, RL=280, Ta=25˚C
VCM=600V(peak), VO(MAX.)=0.8V
IF=0, RL=280, Ta=25˚C
V/µs
CMLV/µs
CMH2 000
2 000
Instantaneous common
mode rejection voltage
"Output : Low level"
*4 IFLH represents forward current when output goes from low to high.
*5 IFHL represents forward current when output goes from high to low.
*6 Hysteresis stands for IFHL/IFLH.
Absolute Maximum Ratings
*1 Pulse width100µs, Duty ratio:0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Parameter Symbol Rating Unit
Forward current
Peak forward current
IF
IFM
50
1
Reverse voltage
Input
Output
VR6V
A
mA
V
Power dissipation
P70
Supply voltage
High level output voltage
Power dissipation
150 mW
170 mW
mW
VOH
PO
Ptot
mA
Low level output current
50
IOL
V
VCC
Viso (rms) kV
Topr
40 to +125
25 to +85
16
16
°C
°C
Total power dissipation
Operating temperature
Storage temperature
Isolation voltage
*3
*2
Soldering temperature
Tstg
*1
Tsol 260
5.0
°C
(Ta=25°C)
4
PC901V0NSZXF Series
Sheet No.: D2-A05402EN
Model Line-up
PC901V0NSZXF
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve
Through-Hole
50 pcs/sleeve
−−−−−−
PC901V0YSZXF
Approved
5
Please contact a local SHARP sales representative to inquire about production status.
PC901V0NSZXF Series
Sheet No.: D2-A05402EN
6
PC901V0NSZXF Series
Fig.1 Test Circuit for Response Time
Fig.3 Forward Current vs. Ambient
Temperature
Fig.4 Power Dissipation vs. Ambient
Temperature
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
5V
Amp
tr=tf=0.01µs
ZO=50VIN
470.1µF
VO
280
Voltage
regulator
1.5V
VIN
VO
tPLH tPHL VOH
VOL
tf
tr
50%
90%
10%
Voltage regulator
BA
Amp.
5V
600V
GND
+
VCM
Switch for
IRED
VCM
Swich for IRED at B (IF=4mA)
VO(MAX.)=0.8V
VO(MIN.)=2V
VOL
Swich for IRED at A (IF=0)
0.1µF
280
VO
IF
10
20
60
50
40
30
0
25 0 25 50 75 10085
Ambient temperature Ta (˚C)
Forward current IF (mA)
0
100
025507510085
50
150
200
170
Power dissipation PO, Ptot (mW)
Ambient temperature Ta (˚C)
Ptot
PO
25
Sheet No.: D2-A05402EN
7
PC901V0NSZXF Series
Fig.5 Forward Current vs. Forward Voltage Fig.6 Relative Input Threshold Current vs.
Supply Voltage
Fig.9 Low Level Output Voltage vs. Ambient
Temperature
Fig.10 High Level Output Current vs.
Forward Current
Fig.7 Relative Input Threshold Current vs.
Ambient Temperature
Fig.8 Low Level Output Voltage vs. Low
Level Output Current
50˚C
25˚C
0˚C
0
1
10
100
0.5 1 1.5 2 2.5 3
Forward voltage VF (V)
25˚C
Ta=75˚C
Forward current IF (mA)
0.2
Relative input threshold current IFLH, IFHL
0.4
0.6
1.4
510 20015
1.2
1
0.8
IFLH
IFHL
Supply voltage VCC (V)
Ta=25˚C
IFLH=1 at VCC=5V
0.1
0
1
10
10 6020 30 40 50
Forward current IF(mA)
High level output current IOH(µA)
VCC=5V
Ta=25˚C
0.2
0.3
0.5
025 25 50 100
0.1
0
0.4
75
16mA
5mA
Ambient temperature Ta(˚C)
Low level output voltage VOL(V)
VCC=5V IOL=30mA
0
0.4
Relative input threshold current IFLH, IFHL
0.6
0.8
1.6
02550 10025 75
1.4
1.2
1
0.2
VCC=5V
IFLH
IFHL
Ambient temperature Ta (˚C)
IFLH=1 at Ta=25˚C 0.01
1
0.1
1
10 100
Low level output voltage VOL (V)
Low level output current IOL (mA)
VCC=5V
IF=0
Ta=25˚C
Sheet No.: D2-A05402EN
8
PC901V0NSZXF Series
Fig.11 High Level Output Current vs.
Ambient Temperature
Fig.12 Supply Current vs. Supply Voltage
1
025 25 50 75 100
0.1
Ambient temperature Ta(˚C)
High level output current IOH(µA)
VCC=VO=15V
IF=4mA
0
1
2
9
012
5
4
3
6
7
8
10 146824 1618
Supply voltage VCC(V)
Supply current ICC(mA)
Ta=
25˚C{
25˚C{
85˚C{
ICCL
ICCH
ICCL
ICCH
ICCL
ICCH
Fig.13 Propagation Delay Time vs.
Forward Current
Fig.14 Rise Time, Fall Time vs. Load
Resistance
0
0.1
1100.1
0.2
0.3
0.4
0.5
0.6
Load resistance RL(k)
Rise time, fall time tr, tf(µs)
VCC=5V
IF=4mA
Ta=25˚C
tr
tf
0
1
2
3
5
6
10 20 30 40 60050
4
Forward current IF(mA)
Propagation delay time tPHL, tPLH (µs)
VCC=5V
RL=280
Ta=25˚C tPHL
tPLH
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05402EN
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
PC901V0NSZXF Series
Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
Design guide
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Please decide the input current which become 2 times of MAX. IFLH.
Sheet No.: D2-A05402EN
Manufacturing Guidelines
Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
PC901V0NSZXF Series
Sheet No.: D2-A05402EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Presence of ODC
11
PC901V0NSZXF Series
Sheet No.: D2-A05402EN
Package specification
12
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
PC901V0NSZXF Series
Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
13
Sheet No.: D2-A05402EN
Important Notices
PC901V0NSZXF Series
[E226]