SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
State-of-the-Art Advanced BiCMOS
Technology (ABT)
Widebus
Design for
2.5-V and 3.3-V Operation and Low Static
Power Dissipation
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V VCC)
D
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
D
High Drive (–24/24 mA at 2.5-V and
–32/64 mA at 3.3-V VCC)
D
Power Off Disables Outputs, Permitting
Live Insertion
D
High-Impedance State During Power Up
and Power Down Prevents Driver Conflict
D
Uses Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
D
Auto3-State Eliminates Bus Current
Loading When Output Exceeds VCC + 0.5 V
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model; and Exceeds 1000 V
Using Charged-Device Model, Robotic
Method
D
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
description
The ’ALVTH16373 devices are 16-bit transparent D-type latches with 3-state outputs designed for 2.5-V or 3.3-V
VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices
are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working
registers.
These devices can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high,
the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up
at the D inputs.
Copyright 1999, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
SN54ALVTH16373 . . . WD PACKAGE
SN74ALVTH16373 ... DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
1LE
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2LE
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description (continued)
A buffered output-enable (OE ) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly . The high-impedance state and the increased drive provide the capability to drive bus
lines without interface or pullup components.
OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down.
However , to ensure the high-impedance state above 1.2 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ALVTH16373 is characterized for operation over the full military temperature range of –55°C to
125°C. The SN74ALVTH16373 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 8-bit section)
INPUTS OUTPUT
OE LE D Q
L H H H
LHL L
LLX Q
0
HXX Z
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
1OE
1LE
1D1
To Seven Other Channels
1Q1
2OE
2LE
2D1 2Q1
To Seven Other Channels
1
48
47
24
25
36 C1
1D 132
C1
1D
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state, VO (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . .
Output current in the low state, IO: SN54ALVTH16373 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ALVTH16373 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current in the high state, IO: SN54ALVTH16373 –48 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ALVTH16373 –64 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DGG package 89°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 93°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 94°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions, VCC = 2.5 V ± 0.2 V (see Note 3)
SN54ALVTH16373 SN74ALVTH16373
UNIT
MIN TYP MAX MIN TYP MAX
UNIT
VCC Supply voltage 2.3 2.7 2.3 2.7 V
VIH High-level input voltage 1.7 1.7 V
VIL Low-level input voltage 0.7 0.7 V
VIInput voltage 0 VCC 5.5 0 VCC 5.5 V
IOH High-level output current –6 –8 mA
IOL
Low-level output current 6 8
mA
I
OL Low-level output current; current duty cycle 50%; f 1 kHz 18 24
mA
t/vInput transition rise or fall rate Outputs enabled 10 10 ns/V
t/VCC Power-up ramp rate 200 200 µs/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions, VCC = 3.3 V ± 0.3 V (see Note 3)
SN54ALVTH16373 SN74ALVTH16373
UNIT
MIN TYP MAX MIN TYP MAX
UNIT
VCC Supply voltage 3 3.6 3 3.6 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 5.5 0 VCC 5.5 V
IOH High-level output current –24 –32 mA
IOL
Low-level output current 24 32
mA
I
OL Low-level output current; current duty cycle 50%; f 1 kHz 48 64
mA
t/vInput transition rise or fall rate Outputs enabled 10 10 ns/V
t/VCC Power-up ramp rate 200 200 µs/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SN54ALVTH16373 SN74ALVTH16373
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYPMAX MIN TYPMAX
UNIT
VIK VCC = 2.3 V, II = –18 mA –1.2 –1.2 V
VCC = 2.3 V to 2.7 V, IOH = –100 µA VCC–0.2 VCC–0.2
VOH
VCC =23V
IOH = –6 mA 1.8 V
V
CC =
2
.
3
V
IOH = –8 mA 1.8
VCC = 2.3 V to 2.7 V, IOL = 100 µA 0.2 0.2
IOL = 6 mA 0.4
VOL
VCC =23V
IOL = 8 mA 0.4 V
V
CC =
2
.
3
V
IOL = 18 mA 0.5
IOL = 24 mA 0.5
Control in
p
uts
VCC = 2.7 V, VI = VCC or GND ±1±1
Control
inp
u
ts
VCC = 0 or 2.7 V, VI = 5.5 V 10 10
IIVI = 5.5 V 10 10 µA
Data inputs VCC = 2.7 V VI = VCC 1 1
VI = 0 –5 –5
Ioff VCC = 0, VI or VO = 0 to 4.5 V ±100 µA
IBHLVCC = 2.3 V, VI = 0.7 V 115 115 µA
IBHH§VCC = 2.3 V, VI = 1.7 V –10 –10 µA
IBHLOVCC = 2.7 V, VI = 0 to VCC 300 300 µA
IBHHO#VCC = 2.7 V, VI = 0 to VCC –300 –300 µA
IEX|| VCC = 2.3 V, VO = 5.5 V 125 125 µA
IOZ(PU/PD)
k
VCC 1.2 V, VO = 0.5 V to VCC,
VI = GND or VCC, OE = don’t care ±100 ±100 µA
IOZH
VCC =27V
VO = 2.3 V,
5
5
µA
I
OZH
V
CC =
2
.
7
V
VI = 0.7 V or 1.7 V
5
5
µ
A
IOZL
VCC =27V
VO = 0.5 V,
5
5
µA
I
OZL
V
CC =
2
.
7
V
VI = 0.7 V or 1.7 V
5
5
µ
A
VCC
=
2.7 V,
Outputs high 0.04 0.1 0.04 0.1
ICC
VCC
=
2
.
7
V
,
IO = 0, Outputs low 2.3 4.5 2.3 4.5 mA
VI = VCC or GND Outputs disabled 0.04 0.1 0.04 0.1
CiVCC = 2.5 V, VI = 2.5 V or 0 3.5 3.5 pF
CoVCC = 2.5 V, VO = 2.5 V or 0 6 6 pF
All typical values are at VCC = 2.5 V, TA = 25°C.
The bus-hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND and
then raising it to VIL max.
§The bus-hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to VCC and
then lowering it to VIH min.
An external driver must source at least IBHLO to switch this node from low to high.
#An external driver must sink at least IBHHO to switch this node from high to low.
|| Current into an output in the high state when VO > VCC
k
High-impedance state during power up or power down
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SN54ALVTH16373 SN74ALVTH16373
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYPMAX MIN TYPMAX
UNIT
VIK VCC = 3 V, II = –18 mA –1.2 –1.2 V
VCC = 3 V to 3.6 V, IOH = –100 µA VCC–0.2 VCC–0.2
VOH
VCC =3V
IOH = –24 mA 2 V
V
CC =
3
V
IOH = –32 mA 2
VCC = 3 V to 3.6 V, IOL = 100 µA 0.2 0.2
IOL = 16 mA 0.4
VOL
IOL = 24 mA 0.5
V
V
OL VCC = 3 V IOL = 32 mA 0.5
V
IOL = 48 mA 0.55
IOL = 64 mA 0.55
Control in
p
uts
VCC = 3.6 V, VI = VCC or GND ±1±1
Control
inp
u
ts
VCC = 0 or 3.6 V, VI = 5.5 V 10 10
IIVI = 5.5 V 10 10 µA
Data inputs VCC = 3.6 V VI = VCC 1 1
VI = 0 –5 –5
Ioff VCC = 0, VI or VO = 0 to 4.5 V ±100 µA
IBHLVCC = 3 V, VI = 0.8 V 75 75 µA
IBHH§VCC = 3 V, VI = 2 V –75 –75 µA
IBHLOVCC = 3.6 V, VI = 0 to VCC 500 500 µA
IBHHO#VCC = 3.6 V, VI = 0 to VCC –500 –500 µA
IEX|| VCC = 3 V, VO = 5.5 V 125 125 µA
IOZ(PU/PD)
k
VCC 1.2 V, VO = 0.5 V to VCC,
VI = GND or VCC, OE = don’t care ±100 ±100 µA
IOZH
VCC =36V
VO = 3 V,
5
5
µA
I
OZH
V
CC =
3
.
6
V
VI = 0.8 V or 2 V
5
5
µ
A
IOZL
VCC =36V
VO = 0.5 V,
5
5
µA
I
OZL
V
CC =
3
.
6
V
VI = 0.8 V or 2 V
5
5
µ
A
VCC
=
3.6 V,
Outputs high 0.07 0.1 0.07 0.1
ICC
VCC
=
3
.
6
V
,
IO = 0, Outputs low 3.2 5.5 3.2 5 mA
VI = VCC or GND Outputs disabled 0.07 0.1 0.07 0.1
ICC
h
VCC = 3 V to 3.6 V, One input at VCC – 0.6 V,
Other inputs at VCC or GND 0.4 0.4 mA
CiVCC = 3.3 V, VI = 3.3 V or 0 3.5 3.5 pF
CoVCC = 3.3 V, VO = 3.3 V or 0 6 6 pF
All typical values are at VCC = 3.3 V, TA = 25°C.
The bus-hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND and
then raising it to VIL max.
§The bus-hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to VCC and
then lowering it to VIH min.
An external driver must source at least IBHLO to switch this node from low to high.
#An external driver must sink at least IBHHO to switch this node from high to low.
|| Current into an output in the high state when VO > VCC
k
High-impedance state during power up or power down
h
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
SN54ALVTH16373 SN74ALVTH16373
UNIT
MIN MAX MIN MAX
UNIT
twPulse duration, LE high 1.5 1.5 ns
t
Data high 1.1 1
ns
t
su
e
up
me,
a
a
e
ore
Data low 1.6 1.5
ns
th
Data high 1 0.9
ns
th
,
Data low 1.6 1.5
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 2)
SN54ALVTH16373 SN74ALVTH16373
UNIT
MIN MAX MIN MAX
UNIT
twPulse duration, LE high 1.5 1.5 ns
t
Data high 1.5 1.4
ns
t
su
e
up
me,
a
a
e
ore
Data low 1 0.9
ns
th
Data high 1 0.9
ns
th
,
Data low 1.5 1.4
ns
switching characteristics over recommended operating free-air temperature range, CL = 30 pF,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO SN54ALVTH16373 SN74ALVTH16373
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN MAX MIN MAX
UNIT
tPLH
D
Q
13.4 1 3.3
ns
tPHL
D
Q
1 4.3 1 4.2
ns
tPLH
LE
Q
1.4 3.9 1.5 3.8
ns
tPHL
LE
Q
1.4 4.6 1.5 4.5
ns
tPZH
OE
Q
1.7 4.4 1.8 4.3
ns
tPZL
OE
Q
1.4 4.1 1.5 4
ns
tPHZ
OE
Q
1.4 4.7 1.5 4.6
ns
tPLZ
OE
Q
13.7 1 3.6
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 2)
PARAMETER
FROM TO SN54ALVTH16373 SN74ALVTH16373
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN MAX MIN MAX
UNIT
tPLH
D
Q
13.2 1 3.1
ns
tPHL
D
Q
1 3.4 1 3.3
ns
tPLH
LE
Q
13.4 1 3.3
ns
tPHL
LE
Q
1 3.6 1 3.5
ns
tPZH
OE
Q
1.3 4.1 1.4 4
ns
tPZL
OE
Q
13.5 1 3.4
ns
tPHZ
OE
Q
1.4 5 1.5 4.9
ns
tPLZ
OE
Q
1.4 4.6 1.5 4.5
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
8POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
VCC/2
VCC/2
VCC/2VCC/2
VCC/2VCC/2
VCC/2
VCC/2
VOH
VOL
th
tsu
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
500
500
Output
Control
(low-level
enabling)
Output
W aveform 1
S1 at 2 × VCC
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.15 V
VOH – 0.15 V
0 V
VCC
0 V
0 V
tw
VCC VCC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2 ns, tf 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
0 V
VCC
VCC/2
tPHL
VCC/2 VCC/2 VCC
0 V
VOH
VOL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2 VCC/2
tPLH
2 × VCC
VCC
Figure 1. Load Circuit and Voltage Waveforms
SN54ALVTH16373, SN74ALVTH16373
2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCES067F – JUNE 1996 – REVISED JANUAR Y 1999
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VCC = 3.3 V ± 0.3 V
VOH
VOL
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
500
500
tPLH tPHL
Output Control
Output
W aveform 1
S1 at 6 V
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH – 0.3 V
0 V
3 V
0 V
0 V
tw
Input
3 V 3 V
3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Timing
Input
Data
Input
Output
Input
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6 V
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform22 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
6 V
1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
0 V
3 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
1.5 V 1.5 V
Figure 2. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74ALVTH16373DLG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373GRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373GRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373VRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373VRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ALVTH16373ZQLR ACTIVE BGA
MICROSTAR
JUNIOR
ZQL 56 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
SN74ALVTH16373DL ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVTH16373DLR ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVTH16373GR ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ALVTH16373KR LIFEBUY BGA
MICROSTAR
JUNIOR
GQL 56 1000 TBD SNPB Level-1-240C-UNLIM
SN74ALVTH16373VR ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 3-May-2012
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
74ALVTH16373ZQLR BGA MI
CROSTA
R JUNI
OR
ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1
SN74ALVTH16373DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
SN74ALVTH16373GR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
SN74ALVTH16373KR BGA MI
CROSTA
R JUNI
OR
GQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1
SN74ALVTH16373VR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74ALVTH16373ZQLR BGA MICROSTAR
JUNIOR ZQL 56 1000 333.2 345.9 28.6
SN74ALVTH16373DLR SSOP DL 48 1000 367.0 367.0 55.0
SN74ALVTH16373GR TSSOP DGG 48 2000 367.0 367.0 45.0
SN74ALVTH16373KR BGA MICROSTAR
JUNIOR GQL 56 1000 333.2 345.9 28.6
SN74ALVTH16373VR TVSOP DGV 48 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated