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Component Stenciling Templates
OK International has designed a unique tool, Component
Stenciling Templates, for printing on the underside of
components. This easy procedure is designed for use on
PBGA, CBGA, CSP balled devices as well as Land Grid
Array (LGA) components. This is an ideal process for small
components and situations where traditional stencil access
is limited by the close proximity of adjacent components.
Dip Transfer
This process involves dipping a component into gel flux,
depositing an exact amount of flux. This process is quick,
consistent and clean, and negates the need to clean after
reflow. Available for both solder balled and leaded devices.
All kits are supplied with a metal spatula.
Tape Feeder
Picking up small surface mount components
with tweezers is not practical and may
damage the component. This is a unique way
of presenting small components to a rework
machine.
Nozzles
A comprehensive range of standard reflow
nozzles available to suit the most common
array packages is available. The reflow
nozzle works with vacuum pickup, the
tweezer nozzle works with devices with
limited area or multilayer structure by
providing mechanical tweezer action pickup
instead of vacuum pickup e.g. PoP, sockets,
connectors, inductors, potentiometers and
through-hole components.
Part No. Description
APR-NK
APR-5000 Nozzle Kit (*Includes 1 of each)
APR-NK-CSP
APR-5000 CSP and Micro SMD Nozzle Kit (**Includes 1 of each)
NZA-555-555-CGA
APR Reflow Nozzle 55.5mm x 55.5mm (column grid array nozzle)
NZA-470-470-CGA
APR Reflow Nozzle 47mm x 47mm (column grid array nozzle)
NZA-355-455-CGA
APR Reflow Nozzle 35.5mm x 45.5mm (column grid array nozzle)
NZA-350-350-CGA
APR Reflow Nozzle 35mm x 35mm (column grid array nozzle)
NZA-490-490*
APR Reflow Nozzle 49mm x 49mm
NZA-450-450
APR Reflow Nozzle 45mm x 45mm
NZA-400-400*
APR Reflow Nozzle 40mm x 40mm
NZA-350-350*
APR Reflow Nozzle 35mm x 35mm
NZA-300-300
APR Reflow Nozzle 30mm x 30mm
NZA-270-270
APR Reflow Nozzle 27mm x 27mm
NZA-250-290
APR Reflow Nozzle 25mm x 29mm
NZA-230-230*
APR Reflow Nozzle 23mm x 23mm
NZA-200-200**
APR Reflow Nozzle 20mm x 20mm
NZA-180-180***
APR Reflow Nozzle 18mm x 18mm
NZA-150-150**
APR Reflow Nozzle 15mm x 15mm
NZA-130-130***
APR Reflow Nozzle 13mm x 13mm
NZA-100-100***
APR Reflow Nozzle 10mm x 10mm
NZA-080-095***
APR Reflow Nozzle 8mm x 9.5mm
NZA-080-080**
APR Reflow Nozzle 8mm x 8mm
NZA-060-060***
APR Reflow Nozzle 6mm x 6mm
NZA-030-ROUND
APR Reflow Nozzle 3mm ID round
NZA-TW-180-180
APR Tweezer Nozzle 18mm x 18mm
NZA-TW-150-150
APR Tweezer Nozzle 15mm x 15mm
NZA-TW-130-130
APR Tweezer Nozzle 13mm x 13mm
NZA-TW-100-100
APR Tweezer Nozzle 10mm x 10mm
NZA-TW-080-080
APR Tweezer Nozzle 8mm x 8mm
NZA-TW-060-060
APR Tweezer Nozzle 6mm x 6mm
(*** included in both kits)
Part No. Description
BST-169
169 Full Matrix Array
BST-225
225 Full Matrix Array
BST-256
256 Full Matrix Array
BST-226P
256 Perimeter Array
BST-256FP
256 Fine-Pitch Full Matrix Array
BST-272P+16
272 Perimeter Array With 16 Inner
BST-303
303 Full Matrix Array
BST-324
324 Full Matrix Array
BST-352P
352 Perimeter Array
BST-357
357 Full Matrix Array
BST-492
492 Full Matrix Array
CST-46
46 Ball Micro BGA
BRP-LDA16A
NSC LLP 16 Pin Dual In-Line
BRP-LQA16A
NSC LLP 16 Pin Quad
BRP-LQA24A
NSC LLP 24 Pin Quad
BRP-LQA44A
NSC LLP 44 Pin Quad
Part No. Description
DTP-BGA
Set of 3 plates, apertures 28, 35 & 45mm, depth
0.012" (0.30mm)
DTP-CSP
Set of 3 plates, apertures 10, 16 & 21mm, depth
0.006" (0.15mm)
DTBK-USMD
Kit, uSMD Flux Transfer Blocks, set of 2 blocks, depth
0.003" (0.08mm) and 0.004" (0.10mm)
DTBK-FC
Kit, Flip Chip Flux Transfer Blocks, set of 2 blocks,
depth 0.001" (0.025mm) and 0.002" (0.051mm)
Part No. Description
TF-1T
Tape Feeder, Micro SMD with thumbwheel
TF-2T
Tape Feeder, 0603 and 0402 with thumbwheel
TF-3T
Tape Feeder, 0201 with thumbwheel
APR-5000 Series Advanced Package Rework