ZICM2410P2-2-SN-B - CEL - Datasheet.Directory

Page 1

• High RF performance:

- Up to 123 dB RF Link Budget

- RX Sensitivity: -97 dBm and -103.0 dBm

- RF TX Power:+6 dBm and +20 dBm

• Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps

• Small footprint: 1” x 1.413” (25.4 mm x 35.9 mm)

• Voice Codec Support: µ-law/a-law/ADPCM

• 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 µA)

• Integrated PCB trace antenna

• 16 RF channels

• Range:

- ZICM2410P0: 2000+ feet (609+ meters)

- ZICM2410P2: 16000+ feet (4876+ meters)

• AES 128-bit encryption

• Extended software support:

- SNAP™

- SMAC, MAC

- Audio

• FCC, CE and IC certications

• ROHS compliant

FEATURES

MeshConnect™ Module Series

DESCRIPTION

CEL's MeshConnect™ Module Series provides high performance

and low cost 2.4 GHz IEEE 802.15.4 modules for a broad range

of wireless networks. The MeshConnect certified and quali-

ed modules, enable customer to accelerate time to market by

greatly reducing design and certication phases of development.

CEL's MeshConnect™ radio modules leverage the advanced

features of the MeshConnect™ Integrated Circuit (IC). The

IC is a true single-chip solution, compliant with IEEE 802.15.4

specications, a complete wireless solution for all applications.

The IC consists of an RF transceiver with baseband modem,

a hardwired MAC and an embedded 8051 microcontroller with

internal Flash memory. The device provides numerous general-

purpose I/O pins, peripheral functions such as timers and UARTs

and is one of the first devices to provide an embedded Voice

CODEC. This device is also ideal for low power applications.

The original MeshConnect module delivers excellent performance

at a surprisingly low cost. The module’s +6dBm output power

means better range, more reliable transmission and fewer nodes

in your network. It also makes these modules ideal for applica-

tions where cost and power constraints do not allow for external

power amplifiers or peripheral range extension components.

The MeshConnect Extended Range module adds a power ampli-

er (PA) and low noise amplier (LNA) to increase range to over

two miles - plus more reliable transmission and fewer nodes in

your network. It is especially useful for open outdoor applica-

tions where the nodes are physically far apart, or for indoor use

where the nodes have to operate in a noisy RF environment.

The Extended Range Module’s outstanding +123 dB budget link

ensures high quality connections even in such harsh environments.

Integrated Transceiver Modules for IEEE 802.15.4

Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1

The information in this document is subject to change without notice, please conrm data is current

Document No: 0007-00-07-00-000 (Issue E)

Date Published: June 14, 2012

DATA SHEET

ORDERING INFORMATION

Part Number Order Number Description Mins/Mults

MeshConnect™

Module

ZICM2410P0-1 +6 dBm Output power, PCB Trace antenna 140 / 140

ZICM2410P0-1-SN +6 dBm Output power, PCB Trace antenna, SNAP OS with MAC address 14 0 / 140

ZICM2410P0-1C +6 dBm Output power, with u.FL Connector for external antenna 140 / 140

ZICM2410P0-1C-SN +6 dBm Output power, with u.FL Connector for external antenna, SNAP OS with MAC address 14 0 / 140

ZICM2410P0-KIT2-1 +6 dBm Engineering Development Kit 1 / 1

MeshConnect™

Extended Range

Module

ZICM2410P2-2 +20 dBm Output power, PCB Trace antenna 140 /140

ZICM2410P2-2-SN +20 dBm Output power, PCB Trace antenna, SNAP OS with MAC address 14 0 / 140

ZICM2410P2-2C +20 dBm Output power, with u.FL Connector for external antenna 140 /140

ZICM2410P2-2C-SN +20 dBm Output power, with u.FL Connector for external antenna, SNAP OS with MAC address 14 0 / 140

ZICM2410P2-KIT1-1 Evaluation board for +20 dBm module 1 / 1

Home &

Building Automation

• Security

• HVAC control

• Lighting control

• Thermostats

Industrial Controls

• Food processing controls

• Trafc Management

• Sensor Networks

• Asset Management

• Barcode reader

• Patient Monitoring

• Glucose monitor

APPLICATIONS

• 96 kB FLASH Memory

• 8 kB SRAM

• 8051 MCU core

• up to 22 GPIO Pins

• SPI (Master/Slave) + UARTs

• I2S/PCM Interface with two 128-byte FIFOs

• µ-law/a-law/ADPCM Voice Codec

• 4-channel 8-bit ADC

MeshConnect™ Module Series

Module and Extended Range Module

MeshConnect™ Module Series

Page 2

MODULE BLOCK DIAGRAM

16 MHz

XTAL

Radio

Micro

processor

ANT

Castellation Edge

Connector

PWR

Reg

MeshConnect™ IC

Module

16 MHz

XTAL

Radio

Micro

processor

ANT

Castellation Edge

Connector

PWR

Reg

MeshConnect™ IC

LNA

Extended Range Module

DEVELOPMENT KIT

CEL's MeshConnect Development Kit assist users in

both evaluation and development. As a stand-alone radio

system, the kit allows users to place the modules in to the

target environment and evaluate performance on-site. The

MeshConnect Development Kit also serves as an invalu-

able aid in application development. Through the many

interface headers on the board, the user has access to all

the MeshConnect module pins enabling easy connection

to target systems for application development. The key

components of the MeshConnect Development Kits are

the CEL’s MeshConnect radio module and the interface

board.

The MeshConnect module contains the CEL transceiver

IC, Crystals, Power Regulator and an integrated PCB

antenna or connector for an external antenna

(optional). The interface board features a serial com-

munication interface, a power management module, and

peripherals such as potentiometers, LEDs, and GPIO

headers.

For more detail information regarding MeshConnect

Development Kits, refer to the respective development

kit user guides documents. (Available at CEL’s website

http://www.cel.com)

Order Number Description

ZICM2410P0-KIT2-1 +6 dBm Engineering Development Kit

ZICM2410P2-KIT1-1 Evaluation board for +20 dBm module

Kit Contents:

• Evaluation Boards w/Module (3)

• USB Cables (1)

• Jumpers (10)

• USB/WNA w/Cable (1)

• AA Batteries (4)

• Universal AC/DC Power Supply (2)

• Software & Technical Information CD (2)

MeshConnect™ Module Development Kit

Kit Contents:

• Evaluation Boards w/Module (1)

• USB Cables (1)

• Jumpers (2)

• Software & Technical Information CD (2)

MeshConnect™ Extended Range Module Development Kit

MeshConnect™ Module Series

Page 3

Introduction and Overview

Description.............................................................................................................................................................................................. 1

Features.................................................................................................................................................................................................. 1

Applications............................................................................................................................................................................................ 1

Ordering Information............................................................................................................................................................................. 1

Module Block Diagram........................................................................................................................................................................... 2

Development Kit..................................................................................................................................................................................... 2

System Level Function

Transceiver IC......................................................................................................................................................................................... 4

Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... 5

Power Amplier....................................................................................................................................................................................... 6

Interface.................................................................................................................................................................................................. 6

Software Tools........................................................................................................................................................................................ 6

Electrical Specication

Absolute Maximum Ratings................................................................................................................................................................... 8

Recommended (Operating Condition).................................................................................................................................................. 8

DC Characteristics.................................................................................................................................................................................. 8

RF Characteristics.................................................................................................................................................................................. 8

Pin Signal & Interfaces

Pin Signals I/O Conguration................................................................................................................................................................ 9

I/O Pin Assignment................................................................................................................................................................................. 9

Module Dimensions................................................................................................................................................................................ 11

Processing 13

Agency Certications 14

Shipment, Storage & Handling 15

References & Revision History 16

TABLE OF CONTENTS

MeshConnect™ Module Series

Page 4

TRANSCEIVER IC

A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC,

and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4

applications.

With an industry best +6 dBm output power, the MeshConnect IC will support a wide a variety of applications without the

need for external amplication. Combined with a highly sensitive -97 dBm receiver the MeshConnect IC leads the industry

with 103 dB link budget.

In addition to excellent RF performance at 250 kbps data rates, the IC adds high speed modes, Turbo (500 kbps) and

Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O pins,

peripheral functions such as timers and UARTs and is one of the rst devices to provide an embedded Voice CODEC.

CEL provides its customers with the IEEE 802.15.4 stack as part of the software library. Also available are the hardware &

software tools required to develop custom applications.

The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinct

single chip solution.

The Extended Range module adds both an PA and LNA to maximize RF performance. The PA enable the Extended Range

module to output up to +20 dBm transmit power. In the receive path the addition of the LNA boosts the already sensitive

receiver up to -103 dBm. The Extended Range link budget boasts a very robust 123 dB enabling a line of sight range over

3 miles.

PS/2

UART/2

SPI

WDT

GPIO/24

Timer/4

PWM/2

Quad

Key Scan

Digital

Regulator

Oscillator

Clock

PLL POR

RF TX

RF RX

PLL

Temp.

Sensor

Bat

Monitor

ADC

(4CH)

Analog

Regulator

Ciruitry

MCU

(8051) FLASH

96KB

MODEM

MAC

DMA

ADPCM Voice

FIFFO

AES

Engine

a-law

μ-law

DATA

8KB

ROM

MeshConnect™ Module Series

Page 5

CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector

can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on

page 1.

The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern.

To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the

ground plane on the host PCB will contribute signicantly to the antenna performance (it should not be directly under

the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to

antenna perfor mance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the

transmitted signal.

Here are some design guidelines to help ensure antenna performance:

• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.

• Never place the antenna close to metallic objects.

• In the overall design, ensure that wiring and other components are not placed near the antenna.

• Do not place the antenna in a metallic or metalized plastic enclosure.

• Keep plastic enclosures 1cm or more from the antenna in any direction.

For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna

overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board

under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the

module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.

There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register

and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption

and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8

describes the three power down modes.

Table 8 – Power Down Modes

PDMODE [1:0] Description Wake-Up Source Regulator for Digital

block

0 Active (Normal Operation) - -

1 PM1 mode

Hardware Reset,

Sleep Timer interrupt,

External interrupt

2 PM2 mode

Hardware Reset,

Sleep Timer interrupt,

External interrupt

OFF

(After wake-up, register

conguration is required)

3 PM3 mode Hardware Reset,

External interrupt

OFF

(After wake-up, register

conguration is required)

ANTENNA

MODES OF OPERATION

MeshConnect™ Module Series

Page 6

POWER AMPLIFIER

VOICE CODEC

SOFTWARE TOOLS

The ZICM2410P0 MeshConnect module does not incorporate an external Power Amplier and therefore the RF output port

is connected directly (through matching components) to the RF antenna. As CEL’s IC IEEE 802.15.4 transceiver already

offers the industry’s best link budget at 103 dB, even without an external PA the MeshConnect can maintain wireless

connection over long distance (2,000 ft line-of-sight).

The Extended Range module adds both an PA and LNA to maximize RF performance. The PA enable the Extended Range

module to output up to +20 dBm transmit power. In the receive path the addition of the LNA boosts the already sensitive

receiver up to -103 dBm. The Extended Range link budget boasts a very robust 123 dB enabling a line of sight range over

3 miles.

INTERFACE

The MeshConnect has all major communication interfaces routed from the IC to the module edge connectors:

• UART1 & UART 2

• I2S

• SPI

The MeshConnect IC includes three voice codec algorithms: µ-law, a-law and ADPCM.

The µ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America

and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the

analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it

can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be

traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in

European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing.

The a-law algorithm provides a slightly larger dynamic range than the µ-law at the cost of worse proportional distortion for

small signals.

Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the

quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes

the PCM values as differences between the current and the previous value. For audio applications this type of encoding

reduces the number of bits required per sample by about 25% compared to PCM.

CEL offers complete SW tools for MeshConnect that customers need to create their application.

DEVICE PROGRAMMER

• Device Programmer is used to program the application rmware to the on-chip Flash program memory of the

IC device.

• Device Programmer supports:

• ISP Mode: Download the rmware from the host PC via serial communication through the IC’s

UART1 interface.

• The evaluation boards utilize a USB -> Serial converter.

• OTA Mode: Download the rmware from the host PC using wireless communication (Over-The-Air).

• This requires two nodes, the host (connected to a PC) and the target device to be programmed.

Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the

aforementioned communication modes.

MeshConnect™ Module Series

Page 7

SOFTWARE TOOLS (Continued)

PACKET ANALYZER AND WIRELESS NETWORK ANALYZER

• Packet Analyzer monitors trafc over a wireless network channel by capturing RF packet data in real-time.

• Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets.

• Packet Analyzer also includes diagnostic tools:

• Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel

yielding available channels.

• Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame.

• Can be used in conjunction with any IEEE 802.15.4 or network.

KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit).

• Supports all 8051 derivatives and variants.

• Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle.

• Supports memory banking for CODE and variables beyond the 64 kbyte threshold.

Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.

MeshConnect™ Module Series

Page 8

ABSOLUTE MAXIMUM RATINGS

Description

MeshConnect™

Module

MeshConnect™

Extended Range Module Unit

Min Max Min Max

Power Supply Voltage (Vcc) -0.3 3.3 -0.3 3.3 VDC

Voltage on any digital pin -0.3 3.3 -0.3 3.3 VDC

Input RF Level 10 -6 dBm

Storage Temperature -55 125 -55 125 °C

Reow Soldering Temperature 250 250 °C

Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.

RECOMMENDED (OPERATING CONDITIONS)

Description

MeshConnect™ Module

MeshConnect™ Extended Range Module Unit

Min Typ Max

Operating ambient temperature range, TA-40 25 85 °C

Operating Supply Voltage 2.1 3.0 3.3 VDC

Input Frequency 2.405 2.48 GHz

DC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)

Description

MeshConnect™

Module

MeshConnect™

Extended Range Module Unit

Min Typ Max Min Typ Max

Vcc Supply (Vcc) 2.1 3.3 2.1 3.3 VDC

Rx mode Current (Vcc = 3.0V) 35 38 38 42 mA

Tx mode Current (Vcc = 3.0V, Pout Max) 44 48 200 mA

Tx mode Current (Vcc = 2.1V, Pout Max) 44 48 295 mA

Tx mode Current (Vcc = 3.0V, 0 dBm) 31 75 mA

Sleep Mode (Deep) Current 11µA

RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)

Description

MeshConnect™

Module

MeshConnect™

Extended Range Module Unit

Min Typ Max Min Typ Max

Frequency Band (16 – 5MHz wide channels) 2.405 2.480 2.405 2.480 GHz

Rx Sensitivity for 1% PER -97 -85 -103.0 -85 dBm

Saturation (maximum input level) 5 -11 dBm

Tx Output Power (VCC = 3.0V) 4.5 6.0 20 dBm

TX Output Power (VCC = 2.1V) 4.5 6.0 19.6 dBm

Error Vector Magnitude 17 35 15 35 %

Adjacent Channel Rejection

+/- 5 MHz

+/- 10 MHz

Frequency Error Tolerance -96.2 96.2 -96.2 96.2 kHz

Output Power Control Range 55 55 dB

Over the Air Data Rate 250 1000 250 1000 kbps

Harmonics (2nd & 3rd) -41.2 -41.2 dBm/MHz

MeshConnect™ Module Series

Page 9

PIN SIGNALS I/O PORT CONFIGURATION

MeshConnect I/O PIN ASSIGNMENTS

MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module

Dimensions shows the layout of the 56 edge castellations.

MeshConnect™

Module

MeshConnect™

Extended Range

Module

Type Description Functionality

1GND GND GND-RF Ground Ground N/A

2GND GND GND-RF Ground Ground N/A

3MS1 NC static control

line

Mode Select, Bit #1. Active Low Internal

Voltage Regulator Enable:

0: Internal Voltage Regulator Enabled

1: Internal Voltage Regulator Disabled, Supply

Analog and Digital Supply Voltages Externally

No connect 14

4 GND GND GND-RF Ground Ground N/A

5 GND NC GND GND Ground 13

6 NC NC NC no connect No connect N/A

7 GND GND GND-Logic Ground Ground 49

8 GND GND GND-Logic Ground Ground 49

9 GND GND GND-Logic Ground Ground 49

10 GND GND GND-Logic Ground Ground 49

11 GND GND GND-Logic Ground Ground 49

12 ACH0 ACH0 Analog Input 1.5V Level Analog ADC0 Input ADC input 8

13 ACH1 ACH1 Analog Input 1.5V Level Analog ADC1 Input ADC input 9

14 ACH2 ACH2 Analog Input 1.5V Level Analog ADC2 Input ADC input 10

15 ACH3 ACH3 Analog Input 1.5V Level Analog ADC3 Input ADC input 11

16 P1_7 NC digital I/O Port P1.7 Digital I/O 20

17 P1_6 NC digital I/O Port P1.6 Digital I/O 21

18 P1_4 P1_4 digital I/O Port P1.4 / QUADZB / Sleep Timer OSC

Buffer Input

digital I/O or

dedicated function

port

19 P1_3 P1_3 digital I/O Port P1.3 / QUADZA / Sleep Timer OSC

Buffer Output / RTCLKOUT

digital I/O or dedicated

function port 23

20 GND GND GND-Logic Ground Ground 49

21 GND GND GND-Logic Ground Ground 49

22 GND GND GND-Logic Ground Ground 49

23 P1_1 P1_1 digital I/O Port P1.1 / TXD1

digital I/O or

dedicated function

port

24 VCC_3V VCC_3V Power 3.0V Power supply for Analog Internal

Voltage Regulator Power Input 7

25 P1_0 P1_0 digital I/O Port P1.0 / RXD1 digital I/O or dedicated

function port 26

26 P3_7 P3_7 digital I/O Port P3.7 / 12mA Drive capability / PWM3 /

CTS1 / SPICSN

digital I/O with high

current capability 27

27 P3_6 P3_6 digital I/O Port P3.6 / 12mA Drive capability /PWM2 /

RTS1 / SPICLK

digital I/O with high

current capability 28

Note:

1. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.

MeshConnect™ Module Series

Page 10

MeshConnect I/O PIN ASSIGNMENTS (Continued)

28 P3_5 P3_5 digital I/O Port P3.5 / T1 / CTS0 / QUADYB / SPIDO digital I/O or dedicated

function port 29

29 P3_4 P3_4 digital I/O Port P3.4 / T0 / RTS0 / QUADYA / SPIDI digital I/O or dedicated

function port 30

30 GND GND GND-Logic Ground Ground 49

31 P3_3 P3_3 digital I/O Port P3.3 / INT1 (active low) digital I/O or dedicated

function port 31

32 P3_2 P3_2 digital I/O Port P3.2 / INT0 (active low) digital I/O or dedicated

function port 32

33 GND GND GND-Logic Ground Ground 49

34 P3_1 P3_1 digital I/O Port P3.1 / TXD0 / QUADXB digital I/O or dedicated

function port 33

35 P3_0 P3_0 digital I/O Port P3.0 / RXD0 / QUADXA digital I/O or dedicated

function port 35

36 GND GND GND-Logic Ground Ground 49

37 P0_7 P0_7 digital I/O GPIO 8051 Port P0.7 / I2STX_MCLK digital I/O 36

38 P0_6 P0_6 digital I/O GPIO 8051 Port P0.6 / I2STX_BCLK digital I/O 37

39 P0_5 P0_5 digital I/O GPIO 8051 Port P0.5 / I2STX_LRCLK digital I/O 38

40 P0_4 P0_4 digital I/O GPIO 8051 Port P0.4 / I2STX_DO digital I/O 39

41 P0_3 P0_3 digital I/O GPIO 8051 Port P0.3 / I2SRX_MCLK digital I/O 40

42 P0_2 P0_2 digital I/O GPIO 8051 Port P0.2 / I2SRX_BCLK digital I/O 41

43 P0_1 P0_1 digital I/O GPIO 8051 Port P0.1 / I2SRX_LRCK digital I/O 42

44 P0_0 P0_0 digital I/O GPIO 8051 Port P0.0 / I2SRX_DI digital I/O 43

45 DVDD_1_5(1) NC Power

Output of Digital Internal Voltage Regulator

(1.5V) / 1.5V Power supply for Digital

Core(input mode @ No REG)

Selected as Internal

Regulator output or

Regulated Voltage

supply Input

46 ISP ISP Digital Input

Mode Select, Bit #2. Active High In-System

Programming (ISP) Input:

0: Normal Mode

1: ISP Mode

Programming 15

47 RESET RESET Control Reset (Active Low) Hardware Reset 17

48 AVDD_1_5(1) NC Power

Output of Analog Internal Voltage Regulator

(1.5V) / 1.5V Power supply for Mixer, VGA,

and LPF (input mode @ No REG)

Selected as Internal

Regulator output or

Regulated Voltage

supply Input

49 GND GND GND-Logic Ground Ground 49

50 GND GND GND-Logic Ground Ground 49

51 GND GND GND-Logic Ground Ground 49

52 GND GND GND-Logic Ground Ground 49

53 GND GND GND-Logic Ground Ground 49

54 NC NC NC No Connect No connect N/A

55 GND GND GND-RF Ground Ground N/A

56 GND GND GND-RF Ground Ground N/A

MeshConnect™

Module

MeshConnect™

Extended Range

Module

Type Description Functionality

Note:

1. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.

MeshConnect™ Module Series

Page 11

MODULE DIMENSIONS

1.000”0.195”

0.903”

1.413”

0.062”

0.120”

RF Shield

C7 C7B

C11 R10

C21

C20

R11 C23

C22

C5B

C24

C13

C6A C1

C6B

C14

C10

C9 R2

C15

C16

C17

C4A

XTAL1

Pin 1

Pin 19 Pin 38

Pin 56

EM357

Series

ARM

0000000000000

Module

ZICM2410P0

1.000”0.195”

0.903”

1.413”

0.062”

RF Shield

C7 C7B

C11 R10

C21

C20

R11 C23

C22

C5B

C24

C13

C6A C1

C6B

C14

C10

C9 R2

C15

C16

C17

C4A

XTAL1

Pin 1

Pin 19 Pin 38

Pin 56

EM357

Series

ARM

C7 C7B

C11 R10

C21

C20

R11 C23

C22

C5B

C24

C13

C6A C1

C6B

C14

C10

C9 R2

C15

C16

C17

C4A

XTAL1

EM357

Series

ARM

0000-00-00-00-000

Module

ZICM2410P0

For layout recommendation for optimum antenna performance, refer to Antenna section in this document.

MeshConnect™ Module / MeshConnect™ Extended Range Module

w/PCB Trace Antenna

MeshConnect™ Module / MeshConnect™ Extended Range Module

w/U.FL Connector for external antenna

MeshConnect™ Module Series

Page 12

MODULE LAND FOOTPRINT

Note: Unless otherwise specied. Dimensions are in Inches [mm].

0.9277”

1.005”

1.138”

1.413”

0.147” DIA KEEPOUT

56 X 0.040” X 0.100” PA D

1.050”

1.000”

0.944”

0.7489”

0.055”

-0.050”

0.065”

0.050” PITCH TYP.

MeshConnect™ Module Series

Page 13

PROCESSING

Recommended Reow Prole

Parameters Values

Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max

Minimum Soak Temperature 150ºC

Maximum Soak Temperature 200ºC

Soak Time 60-120 sec

TLiquidus 217ºC

Time above TL 60-150 sec

Tpeak 250ºC

Time within 5º of Tpeak 20-30 sec

Time from 25º to Tpeak 8 min max

Ramp down rate 6ºC/sec max

Achieve the brightest possible solder llets with a good shape and low contact angle.

Pb-Free Soldering Paste

Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.

Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-

cation. See IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed

with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and

the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between

neighboring pads. Water could also damage any stickers or labels.

• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which

is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

• Ultrasonic cleaning could damage the module permanently.

The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.

Optical Inspection

After soldering the Module to the host board, consider optical inspection to check the following:

• Proper alignment and centering of the module over the pads.

• Proper solder joints on all pads.

• Excessive solder or contacts to neighboring pads, or vias.

Repeating Reow Soldering

Only a single reow soldering process is encouraged for host boards.

Wave Soldering

If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave

soldering process is encouraged.

MeshConnect™ Module Series

Page 14

PROCESSING (Continued)

AGENCY CERTIFICATIONS

Hand Soldering

Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/

reference document IPC-7711.

Rework

The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating

from underneath is recommended. Avoid overheating.

Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will

terminate warranty coverage.

Additional Grounding

Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is

done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum

immunity to external RF interference.

FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference.

2. This device must accept any interference received, including interference that may cause undesired operation.

Warning (Part 15.21)

Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.

20 cm Separation Distance

To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this

transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located

or operating in conjunction with any other antenna or transmitter.

OEM Responsibility to the FCC Rules and Regulations

The MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or

certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the

information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is

labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then

the outside of the device into which the module is installed must also display a label referring to the enclosed module. This

exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC

ID: W7Z-ICP0”

The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied

with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-

tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.

MeshConnect™ Module Series

Page 15

AGENCY CERTIFICATIONS (Continued)

SHIPMENT, HANDLING, AND STORAGE

Shipment

The MeshConnect Modules are delivered in trays of 28.

Handling

The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.

Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD

protection may destroy or damage the module permanently.

Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instruc-

tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.

Moisture Sensitivity Level (MSL)

MSL 3, per J-STD-033

Storage

Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.

IC Certication — Industry Canada Statement

The term "IC" before the certication / registration number only signies that the Industry Canada technical specications

were met.

Section 14 of RSS-210

The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in

excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's

website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php

CE Certication — Europe

The MeshConnect RF module has been tested and certied for use in the European Union.

OEM Responsibility to the European Union Compliance Rules

If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the

European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of

these standards and kept on le as described in Annex II of the R&TTE Directive.

The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining

European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to

make a submission to the notied body for compliance testing.

OEM Labeling Requirements

The `CE' mark must be placed on the OEM product in a visible location.

The CE mark shall consist of the initials “CE” with the following form:

· If the CE marking is reduced or enlarged, the proportions given in the above graduated

drawing must be adhered to.

· The CE mark must be a minimum of 5mm in height

· The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz

band is not harmonized by a few countries throughout Europe, the Restriction sign must be

placed to the right of the “CE” marking as shown in the picture

MeshConnect™ Module Series

Page 16

REFERENCES & REVISION HISTORY

Previous Versions Changes to Current Version Page(s)

0007-00-07-00-000

(Issue A) February 05, 2009 Initial preliminary datasheet. N/A

0007-00-07-00-000

(Issue B) June 11, 2009 Updated Development Kit and Agency Certication 2, 14, 15

0007-00-07-00-000

(Issue C) October 6, 2009 Added New MeshConnect Extended Range Module All

0007-00-07-00-000

(Issue C) January 29, 2010 Removed "Prelimary" from datasheet and "Pending" from Agency Certication All

0007-00-07-00-000

(Issue C) April 7, 2010

Added SNAP enabled modules to Ordering Information , updated module land

footprint 1

0007-00-07-00-000

(Issue D) December 22, 2010 MeshConnect Extend Range Module part number change to -2 All

0007-00-07-00-000

(Issue D) February 8, 2011MeshConnect Extend Range Module W/connector part number change to -1 1

0007-00-07-00-000

(Issue E) June 14, 2012Changed ZICM2410P2-1C part number to -2C, updated Coaxial Keepout diagram 1, 12

Disclaimer

• The information in this document is current as of the published date. The information is subject to change without

notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most

up-to-date specications of CEL products. Not all products and/or types are available in every country. Please

check with an CEL sales representative for availability and additional information.

• No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.

• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of CEL products listed in this document or any other liability arising from the

use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other

intellectual property rights of CEL or others.

• Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these circuits,

software and information in the design of a customer’s equipment shall be done under the full responsibility of the

customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use

of these circuits, software and information.

• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and

acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to

property or injury (including death) to persons arising from defects in CEL products, customers must incorporate

sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.