November 2016
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This is information on a product in full production.
www.st.com
ESDV5-1BF4
Low clamping, very low capacitance bidirectional single line ESD
protection
Datasheet - production data
Features
Low clamping voltage
Bidirectional device
Low leakage current
0201 package
Ultralow PCB area: 0.18 mm2
ECOPACK®2 compliant component
Exceeds the IEC 61000-4-2 level 4
standard:
±30 kV (air discharge)
±12 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Smartphones, mobile phones and
accessories
Tablets and notebooks
Portable multimedia devices and
accessories
Wearable, home automation, healthcare
Highly integrated systems
Description
The ESDV5-1BF4 is a bidirectional single line
TVS diode designed to protect the data line or
other I/O ports against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
Figure 1: Functional diagram
Characteristics
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1 Characteristics
Table 1: Absolute ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
VPP
Peak pulse voltage
IEC 61000-4-2
Contact discharge
Air discharge
12
30
kV
PPP
Peak pulse power dissipation (8/20 μs)
20
W
IPP
Peak pulse current (8/20 μs)
1.7
A
Tj
Operating junction temperature range
-55 to +150
°C
Tstg
Storage temperature range
-65 to +150
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Figure 2: Electrical characteristics (definitions)
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
Test condition
Min.
Typ.
Max.
Unit
VBR
IR = 1 mA
5.8
8.5
V
IRM
VRM = 5.5 V
1
100
nA
VCL
8 kV contact discharge after 30 ns, IEC 61000-4-2
16.3
V
CLINE
F = 1 MHz, VLINE = 0 V, VOSC = 30 mV
5
7
pF
RD
Pulse duration 100 ns
0.67
Ω
ESDV5-1BF4
Characteristics
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1.1 Characteristics (curves)
Figure 3: Leakage current versus junction
temperature (typical values)
Figure 4: Junction capacitance versus reverse
voltage applied (typical values)
Figure 5: ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 6: ESD response to IEC 61000-4-2
(-8 kV contact discharge)
Figure 7: TLP characteristic
Figure 8: S21 attenuation measurement result
0
5
10
15
20
25
30
35
40
0 25 50 75 100 125 150
VR= VRM = 5 V
Forward and Reverse
Tj(°C)
IR(nA)
0
1
2
3
4
5
6
0 1 2 3 4 5
C(pF)
VR(V)
Peak clamping voltage
Clamping voltage at 30 ns
Clamping voltage at 60 ns
Clamping voltage at 100 ns
1
2
3
4
20 ns/div
5 V/div
1
30 V
2
16 V
3
15 V
4
11 V
20 ns/div
5 V/div
1
23
4
Peak clamping voltage
Clamping voltage at 30 ns
Clamping voltage at 60 ns
Clamping voltage at 100 ns
1
2
3
4
-30 V
-16 V -15 V
-11 V
0
2
4
6
8
10
12
14
16
18
20
22
24
0 10 20 30
IPP(A)
VCL(V)
S21 (dB)
Package information
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2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 0201 package information
Figure 9: ST0201 package outline
ESDV5-1BF4
Package information
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M
Table 3: ST0201 package mechanical data
Ref.
Dimensions
Millimeters
Min.
Typ.
Max.
A
0.270
0.300
0.330
b
0.1675
0.1875
0.2075
D
0.56
0.58
0.60
D1
0.3375
E
0.260
0.280
0.300
E1
0.205
0.225
0.245
fD
0.0175
0.0275
0.0375
fE
0.0175
0.0275
0.0375
2.2 ESDV5-1BF4 marking and tape and reel
Figure 10: Marking
Product marking may be rotated by multiples of 90° for assembly plant
differentiation. In no case should this product marking be used to orient the
component for its placement on a PCB. Only pin 1 mark is to be used for this
purpose.
Package information
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Bar indicates Pin 1
User direction of unreeling
All dimensions in mm
4.0 ± 0.1
2.0 ± 0.05
8.0+0.03-0.
01
2.0 ± 0.05
1.75±0.1
3.5 ± 0.05
Ø 1.5 ± 0.1
0.36 ± 0.03 0.38 ± 0.03
0.22
0.68 ± 0.03
Figure 11: Tape and reel specification (in mm)
ESDV5-1BF4
Recommendation on PCB assembly
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3 Recommendation on PCB assembly
3.1 Footprint
1. Footprint in mm
a. SMD footprint design is recommended.
Figure 12: Footprint in mm
3.2 Stencil opening design
1. Reference design
a. Stencil opening thickness: 75 μm / 3 mils
Figure 13: Recommended stencil window position in mm (inches)
3.3 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-38 μm.
Recommendation on PCB assembly
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3.4 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
3.5 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
3.6 Reflow profile
Figure 14: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-
STD-020.
ESDV5-1BF4
Ordering information
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4 Ordering information
Figure 15: Ordering information scheme
Table 4: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
ESDV5-1BF4
M(1)
ST0201
0.116 mg
15000
Tape and reel
Notes:
(1)The marking can be rotated by multiples of 90° to differentiate assembly location
5 Revision history
Table 5: Document revision history
Date
Revision
Changes
30-Nov-2016
1
First issue.
ESD - 1 BV 5 F4
ESD protection
Very low capacitance
Stand-off voltage at 5.5 V max.
Number of lines
Directional
B = Bi-directional
Package
=F4 ST0201
ESDV5-1BF4
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