Agilent HSME-C110/C120/C150/
C170/C177/C190/C191/C197/C265
AlInGaP Green ChipLED
Data Sheet
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of
the product(s) at anytime.
Features
• Small size
• Industry standard footprint
• Operating temperature range of
–30˚C to +85˚C
• Compatible with IR soldering
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip-locked
moisture barrier bags
Applications
• Membrane switch indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
• Symbol backlighting
• Keypad backlighting
Description
This chip-type LED utilizes Alumi-
num Indium Gallium Phosphide
(AlInGaP) material technology. The
AlInGaP material has a very high
luminous efficiency, capable of
producing high light output.
These chipLEDs come in top
mounting, top emitting packages
(HSMx-C150/170/177/190/191/197),
top mounting, side emitting pack-
ages (HSMx-C110/120) or reverse
mounting, top emitting package
(HSMx-C265).
All packages are binned by both
color and intensity.
In order to facilitate pick and
place operation, these chipLEDs
are shipped in Tape & Reel, with
4000 units per reel for HSMx-
C120/170/ 177/190/191/197 and
3000 units per reel for HSMx-
C110/C150/265.
These packages are compatible
with reflow soldering process.
2
Package Dimensions
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
HSMx-C190
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2.00 (0.079 )
0.30 (0.012)
0.40 ± 0.15
(0.016 ± 0.006)
0.30 (0.012)
POLARITY
0.80 (0.031)
0.40 ± 0.15
(0.016 ± 0.006)
1.40
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
CATHODE LINE
HSMx-C170
CATHODE
MARK
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
POLARITY
CATHODE
LINE
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
HSMx-C110
3.2 (0.126 )
3
3.2 (0.126 )
0.5 (0.020)
0.5 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.5 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
HSMx-C150
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3.40 (0.134)
0.30 (0.012)
2– 1.10 (0.043)
POLARITY
CATHODE
MARK (ETCHED)
1.10 (0.043)
2– 0.50 ± 0.15
(0.020 ± 0.006)
1.20
(0.047)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
1.25 (0.049)
CATHODE LINE
HSMx-C265
0.80 (0.031)
1.60
(0.063)
DIFFUSED
EPOXY
PC BOARD 0.40 (0.016)
0.16 (0.006)
0.70
(0.028) MIN.
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.40
(0.016)
CATHODE MARK
LED DIE
HSMx-C197
POLARITY
SOLDERING
TERMINAL
HSMx-C120
1.6
(0.063)
0.5 (0.020)
POLARITY
CATHODE MARK
1.0 (0.039)
3 – 0.3 (0.012)
1.2
(0.047)
0.3
(0.012)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6
(0.024)
CATHODE LINE
4
Package Dimensions, continued
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00
(0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16
(0.006)
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
HSMx-C177
1.10 (0.043)
POLARITY
CATHODE LINE
5
Device Selection Guide
Package Dimension (mm)[1,2] AlInGaP Green Package Description
1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused
1.6 (L) x 0.6 (W) x 1.0 (H) HSME-C120 Untinted, Non-diffused
3.2 (L) x 1.0 (W) x 1.5 (H) HSME-C110 Untinted, Non-diffused
3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused
3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at TA = 25°C
HSME-C110/120/170/177/
Parameter 190/191/197/150/265 Units
DC Forward Current[1,2] 20 mA
Power Dissipation 52 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 °C
Operating Temperature Range –30 to +85 °C
Storage Temperature Range –40 to +85 °C
Soldering Temperature See reflow soldering profile (Figures 6 & 7)
Electrical Characteristics at TA = 25°C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (°C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSME-C110/120 2.1 2.6 5 18 550
HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450
HSME-C265 2.1 2.6 5 16 450
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive current above 5 mA is recommended for best long term performance.
6
Optical Characteristics at TA = 25°C
Color, Dominant
Luminous Intensity Peak Wavelength Wavelength Viewing Angle Luminous Efficacy
IV (mcd) @ 20 mA[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηV (lm/w)
Part Number Min. Typ. Typ. Typ. Typ. Typ.
HSME-C110 18 52 570 572 130 570
HSME-C120 18 52 570 572 155 570
HSME-150/170/ 18 50 570 572 170 570
190/191
HSME-C177/197 18 50 570 572 130 570
HSME-C265 18 50 570 572 170 570
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Light Intensity (IV) Bin Limits[1]
Intensity (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
Green Color Bin Limits[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ± 0.5 nm
Tolerance: ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in
all categories. Please contact your Agilent representative for information on currently
available bins.
7
Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150.Figure 4. Maximum forward current vs.
ambient temperature.
Figure 3. Luminous intensity vs. forward
current.
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197.
100
50
0
400 450 550 600 650 700
RELATIVE INTENSITY – %
WAVELENGTH - nm
90
80
70
60
40
30
20
10
500
100
10
1
0.11.5 1.9 2.2
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
1.7 2.01.6 1.8 2.1
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
1.2
LUMINOUS INTENSITY
(NORMALIZED @ 20 mA)
30
0.6
0.2
0.8
10 20 25
0
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
20
15
25
10
10 30 50 70 90
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
8
Figure 5c. Relative intensity vs. angle for HSMx-C110.
Figure 5d. Relative intensity vs. angle for HSMx-C120.
RELATIVE INTENSITY – %
100
0
ANGLE
40
20
60
80
0 20 100-100 -20-80 -60 -40 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
40
20
60
80
0 20 100-100 -20-80 -60 -40 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
9
Figure 6. Recommended reflow soldering profile.Figure 5e. Relative intensity vs. angle for HSMx-C265.
Figure 8. Recommended soldering pattern for HSMx-C265.
Figure 9. Recommended soldering pattern for HSMx-C120. Figure 10. Recommended soldering pattern for HSMx-C110.
Figure 11. Recommended soldering pattern
for HSMx-C170 and HSMx-C177.
Figure 12. Recommended soldering pattern
for HSMx-C190, HSMx-C191 and HSMx-C197.
Figure 13. Recommended soldering pattern
for HSMx-C150.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
1.25 (0.049)
1.4
(0.055) 1.4
(0.055)
2.3
(0.091)
2.2 (0.087) DIA. PCB HOLE
0.7 (0.028)
0.8
(0.031) 0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
5.0 (0.200)
1.0 (0.039)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 7. Recommended Pb-free reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
10
Figure 15. Reel dimensions.
Figure 14. Reeling orientation.
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
x
x
x
x
x
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS






178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
11
Figure 16. Tape dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.






8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.30 (0.091)  1.45 (0.057) 0.95 (0.037)
HSMx-C190 SERIES 1.80 (0.071)  0.95 (0.037) 0.87 (0.034)
HSMx-C110 SERIES 3.35 (0.132) 1.85 (0.073) 1.20 (0.047)
HSMx-C191 SERIES 1.86 (0.073)  0.89 (0.035) 0.87 (0.034)
HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)


HSMx-C110/C120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
HSMx-C110
R 1.0 ± 0.05
(0.039 ± 0.002)
HSMx-C120
R 0.5 ± 0.05
(0.020 ± 0.002)
HSMx-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.80 (0.031)
HSMx-C197 SERIES 1.75 (0.069) 0.95 (0.037) 0.60 (0.024)
HSMx-C177 SERIES 2.30 (0.091) 1.40 (0.055) 0.60 (0.024)






8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
HSMx-C265 SERIES  3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
Convective IR Reflow Soldering
For more information on solder-
ing, refer to Application Note
1060, Surface Mounting SMT
LED Indicator Components.
Storage Condition: 5 to 30˚ C @ 60%
RH max.
Baking is required under the con-
dition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
Figure 17. Tape leader and trailer dimensions.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR 
COVER TAPE.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
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Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-7659EN
April 28, 2004
5989-0520EN