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PD55035 - PD55035S
500 MHz TEST CIRCUIT SCHEMATIC (ENGINEERING)
500 MHz TEST CIRCUIT COMPONENT PART LIST
COMPONENT DESCRIPTION
B1,B2 FERRITE BEAD
C1,C13 300 pF, 100 mil CHIP CAPACITOR
C2,C3,C4,C12,C13,C14 1 to 20 pF TRIMMER CAPACITOR
C6 39 pF ATC 100B SURFACE MOUNT CERAMIC CHIP CAPACITOR
C7, C19 120 pF 100 mil CHIP CAPACITOR
C10, C16 10 µF, 50 V ELECTROLYTIC CAPACITOR
C9, C17 0.1 mF, 100 mil CHIP CAP
C8, C18 1.000 pF 100 mil CHIP CAP
C5, C11 33 pF, 100 mil CHIP CAP
L1 56 nH, 7 TURN, COILCRAFT
N1, N2 TYPE N FLANGE MOUNT
R1 15 Ω, 1 W CHIP RESISTOR
R2 1 kΩ, 1 W CHIP RESISTOR
R3 33 kΩ, 1 W CHIP RESISTOR
Z1 0.471” x 0.080” MICROSTRIP
Z2 1.082” x 0.080” MICROSTRIP
Z3 0.372” x 0.080” MICROSTRIP
Z4,Z5 0.260” x 0.223” MICROSTRIP
Z6 0.050” x 0.080” MICROSTRIP
Z7 0.551” x 0.080” MICROSTRIP
Z8 0.825” x 0.080” MICROSTRIP
Z9 0.489” x 0.080” MICROSTRIP
BOARD ROGER , ULTRA LAM 2000 THK 0.030 ”, εr = 2.55 2oz. ED Cu 2 SIDES.
RF
INPUT
Z1 Z3
R3
C3
Z2
C2
C10 C9
VGG
+
B1
C19 C18 C17 C16
VDD
Z5
B2
L1
C8
+
R2
C7
C1
Z4
R1
C11
Z6
C13
Z7
C14
Z8 Z9 N2
OUTPUT
RF
C15
DUT
C4 C12
C5 C6
RF
INPUT
Z1 Z3
R3
C3
Z2
C2
C10 C9
VGG
+
B1
RF
INPUT
Z1 Z3
R3
C3
Z2
C2
C10 C9
VGG
+
B1
C19 C18 C17 C16
VDD
Z5
B2
L1
C8
+
R2
C7
C1
Z4
R1
C11
Z6
C13
Z7
C14
Z8 Z9 N2
OUTPUT
RF
C15
DUT
C4 C12
C5 C6 C13
Z7
C14
Z8 Z9 N2
OUTPUT
RF
C15
DUT
C4 C12
C5 C6