NTC Thermistor:
::
:TCF Series
Lead Frame Type for Temperature Sensing/Compensation
THINKING ELECTRONIC INDUSTRIAL Co., LTD.
4
www.thinking.com.tw
2011.10
All specifications are subject to change without notice.
Reliability
Item Standard Test conditions / Methods Specifications
Tensile Strength
of Terminals IEC60068-2-21
Gradually apply the specified force and keep the unit fixed for 10±1 sec
Terminal cross-sectional area
Force
(mm
2
)
(Kg)
0.1<S≦0.2
0.5
No visible damage
Bending Strength
of Terminals IEC60068-2-21
Hold specimen and apply the force specified below to each lead. Bend the
specimen to 90°, and then return to the orig
inal position. Repeat the
procedure in the opposite direction.
Terminal cross-sectional area
Force
(mm
2
)
(Kg)
0.1<S≦
0.25
No visible damage
Solderability IEC60068-2-20
245 ± 3℃ , 3 ± 0.3 sec At least 95% of terminal
electrode is covered by
new solder
Resistance to
Soldering Heat IEC60068-2-20
260 ± 3℃ , 10 ± 1 sec No visible damage
∣△R
25
/R
25
∣≦ 3 %
High Temperature
Storage IEC60068-2-2
100 ± 5℃ , 1000 ± 24 hrs No visible damage
∣△R
25
/R
25
∣≦ 5 %
Damp Heat,
Steady State IEC60068-2-3
40 ± 2 ℃, 90~95% RH, 1000 ± 24 hrs No visible damage
∣△R
25
/R
25
∣≦ 3 %
Rapid Change
of Temperature IEC60068-2-14
The conditions shown below shall be repeated 5 cycles
Step Temperature (℃) Period (minutes)
1 -40 ± 5 30 ± 3
2 Room temperature 5 ± 3
3 100 ± 5 30 ± 3
4 Room temperature 5 ± 3
No visible damage
∣△R
25
/R
25
∣≦ 3 %
Power Dissipation
IEC60539-1 25 ± 5℃, Pmax. , 1000 ± 24 hrs No visible damage
∣△R
25
/R
25
∣≦ 5 %
Hi-pot Test MIL-STD-202F
-Method 301 1000 V
AC
1 min No visible damage