MMSZ4688
5% TOLERANCE
Electrical Characteristics TA = 25OC unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
VZZener Voltage 4.47 4.94 VIZT =50.0 uA D.C
IRReverse Leakage 10 uA VR= 3.0 V
VFForward Voltage 900 mV IF= 10 mA
VZDelta Zener Voltage 990 mV IF=100 uA to 10 uA
Absolute Maximum Ratings (note 1) TA = 25OC unless otherwise noted
Parameter Value Units
TSTG - Storage Temperature -55 to +150 OC
TJ- Maximum Junction Temperature -55 to +150 OC
PD - Total Power Dissipation at 25OC 500 mW
Derate above 25OC 6.7 mW/OC
RØJA - Thermal Resistance Junction to Ambient 340 OC/W
RØJL - Thermal Resistance Junction to Lead 150 OC/W
VZ- Maximum Voltage Change (Note 2) 990 mV
Lead Solder Temperature (Max 10 second duration) 260 OC
Nominal Zener Voltage (VZ) at 50 uA 4.7 V
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Note 2: Voltage change is equal to the difference between VZ at 100 uA and VZ at 10 uA.
Top Mark: CT
1: Cathode
2: Anode
2
1
Features:
•Compact surface mount with same footprint as mini-melf
•500 mW rating on FR-4 or FR-5 board.
•Class 3 ESD rating (>16 kV) per Human Body Model
Ordering:
• 7 inch reel (178 mm); 8 mm Tape; 3,000 units per reel.
General Description:
Half watt, General purpose, Medium Current Surface Mount
Zener in the SOD-123 package. The SOD-123 package has
the same footprint as the glass mini-melf (LL-34) package &
provides a convenient alternative to the Leadless package.
© 1997 Fairchild Semiconductor Corporation
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
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not intended to be an exhaustive list of all such trademarks.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
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OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART ST ART™
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MICROWIRE™
OPTOLOGIC™
Rev. H3
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
F ACT Quiet Series™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
VCX™
STAR*POWER is used under license
