1
FEATURES
DESCRIPTION
APPLICATIONS
RELATED DEVICES
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
PowerLAN™ Dual-Cell Li-Ion Battery Monitor With PowerPump™ Cell Balancing
2
•Monitors up to Two Individual Cell Voltagesand Temperatures
The bq76PL102 PowerLAN dual-cell battery monitoris part of a complete scalable battery management•Part of a Complete Low-Cost Solution for
system for use with arrays of up to 12 Li-IonBattery Packs of up to 12 Series and One or
rechargeable cells. The bq76PL102 connects to oneMore Parallel Cells (When Used With
or two cells in a series string, performs voltage andbq78PL114).
temperature monitoring of each individual cell, and•Advanced PowerPump™ Balancing
reports these parameters over the PowerLANTechnology Equalizes Cells in Li-Ion Battery
communication network. Together with a bq78PL114Packs, Resulting in Longer Run Time and Cell
master-gateway battery controller, the bq76PL102Life.
forms a complete battery monitoring andmanagement system for higher cell-count•PowerPump™ Cell Balancing Transfers
applications.Charge From Cell to Cell During all OperatingConditions – No Wasteful Current Bleeding or
Partitioning of the battery monitor function on a perAssociated Heat Buildup.
cell basis permits connection and measurement closeto the cell. This results in superior accuracy and•Unique PowerLAN™ Isolated Communications
management over competing solutions. This schemeTechnology Permits Simultaneous
also facilitates the PowerPump cell balancing system,Measurement of All Individual Cell Voltages in
a technique which actively balances capacities ofa Series String.
Li-Ion batteries without the excessive heat or•Low Current Consumption:
limitations of bleed-balancing techniques.– < 250 µA Active
The bq76PL102 PowerPump cell balancing– < 35 µA Standby
technology uses a charge-transfer methodologywhich does not bleed off excess energy as heat, but– < 1 µA Undervoltage Shutdown
instead moves energy dynamically from cell to cell as•Connects Directly to Cells, No Resistive
needed. Balancing is performed during all batteryDividers
operational modes – charge, discharge, and rest.•Internal LDO Regulator for Support Circuitry
Balancing is automatically coordinated between allcells on a PowerLAN system. PowerPump balancing•Ultrasmall Footprint, 3-mm × 3-mm
technology results in longer run time and longer cell•Millivolt Measurement Resolution Using
life.Delta-Sigma A/D Converter
The PowerLAN communications architecture has•Self-Calibrating Time Base – No Crystal
been engineered to provide robust communications inRequired When Used With bq78PL114
tough EMI/RFI environments while avoiding theexcessive power draw, high parts count, and elevatedcost of other solutions. PowerLAN permits easy•Uninterruptible Power Supplies (UPS)
scalability using series connections of bq76PL102dual-cell battery monitors. High-cell-count battery•Portable Medical and Test Equipment
systems of up to 12 series cells are easily•Electric Bikes and Mild-EV Battery Packs
constructed without complicated high-voltage cell•Multicell Series Strings ≥5S
measurement restrictions.
The bq76PL102 works with the bq78PL114master-gateway battery controller.•bq78PL114 Master Gateway Battery Controller
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPump, PowerLAN are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
Vref
XT1
XT2
PUMP2S
PUMP2N
PUMP1S
PUMP1N
V2
Oscillator
PowerLAN™ Communications
Control Logic
VLDO
+
+
SDI
SDO
V1
VSS
Internal
Temperature
PowerPump™
BalancingLogic
D S-
A/D
D S-
A/D
2.5V
LDO
Typical
Temp
Sensor
Typical
Temp
Sensor
Cell Balancing Circuits
B0345-01
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 1. bq76PL102 Simplified Internal Block Diagram
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Product Folder Link(s) :bq76PL102
bq76PL102 Cell
MonitorWith
PowerPump
Balancing
PowerLAN
Communication
Link
PowerLAN
MasterGateway
BatteryController
bq78PL114
Pack
Positive
Pack
Negative
Example8-cellconfigurationshown
–+
SMBus
RSENSE
PackProtection
CircuitsandFuse
B0332-01
bq76PL102 Cell
MonitorWith
PowerPump
Balancing
AVAILABLE OPTIONS
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
Figure 2. Example Multicell PowerLAN System Implementation
The bq76PL102 is currently available in a 3-mm square QFN-16 package, bq76PL102RGT, with a ratedoperational temperature range of – 40 ° C to 85 ° C. (See Figure 5 for specific package information, dimensions, andtolerances.)
•Order bq76PL102RGTT for 250 quantity, tape and reel•Order bq76PL102RGTR for 3000 quantity, tape and reel
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s) :bq76PL102
1
2
3
4
VSS
PUMP1S
VLDO
PUMP1N
TDI
PUMP2S
SDI
PUMP2N
12
11
10
9
16
V2
VPP
TMD
V1
TCK
XT1
SDO
XT2
15 14 13
5678
P0019-06
Thermal
Pad
RGTPackage
(TopView)
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
Figure 3. bq76PL102 Pinout (Top View)
CAUTION:
This device is subject to damage from Electrostatic Discharge (ESD). Thedevice should be stored and handled using appropriate ESD precautions toprevent damage to the internal circuitry.
PIN FUNCTIONS
PIN
I/O
(1)
DESCRIPTION
(2)NAME NO.
PUMP1N 6 O Charge-balance gate drive for cell 1 northPUMP1S 5 O Charge-balance gate drive for cell 1 southPUMP2N 8 O Charge-balance gate drive cell 2 northPUMP2S 7 O Charge-balance gate drive cell 2 southSDI 4 I PowerLAN serial data input from lower south, downstream partSDO 9 O PowerLAN serial data output to north, upstream partXT1 14 IA External temperature sensor 1 input (calibrated 50 µA)XT2 13 IA External temperature sensor 2 input (calibrated 50 µA)TCK 10 NC Do not connectTDI 3 NC Do not connectTMD 11 NC Do not connectV1 15 IA Midpoint cell connection (cell 1 positive and cell 2 negative)V2 12 P, IA Connect to most-positive cell voltage (cell 2 positive)
(3)
VLDO 2 P Low-dropout regulator output – connect to VPP (bypass with 4.7 µF capacitor)VPP 16 P Connect to VLDOVSS 1 P Connect to most-negative cell voltage (cell 1 negative)— P Thermal pad – connect to VSS
(1) I - input, IA - analog input, O - output, P - power, NC - no connect(2) Cell numbering convention is from more-negative (cell 1) to more-positive (cell 2) and is locally referenced.(3) When there is an odd number of series cells in a battery pack, connect pin V2 of the topmost bq76PL102 to pin V1 of the samebq76PL102.
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
T
A
Operating free-air temperature (ambient) – 40 to 85 ° CT
stg
Storage temperature – 65 to 150 ° CVoltage on SDO Note: not VSS-referenced (V1 – 0.5) to (V2 + 0.5)
(2)
VVoltage on SDI Limited by lower cell voltage (VSS – 0.5) to (V1 + 0.5)
(2)
VVoltage on V1 (V1 – VSS)
(2)
Maximum cell voltage – 0.5 to 5 VVoltage on V2 (V2 – V1)
(2)
Maximum cell voltage (not VSS-referenced) – 0.5 to 5 VVoltage on XT1 or XT2 With respect to VSS (VSS – 0.5) to (V1 + 0.5) VJEDEC, JESD22-A114 human-body model, R = 1500 Ω,ESD tolerance 2 kVC = 100 pF
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is note implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) Cell numbering convention is from most negative (Cell 1) to most positive (Cell 2) and is locally referenced.
T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC CHARACTERISTICS
Two-cell configuration 2.5 3.6 4.5V
CELL
(1) (
Cell voltage input V2)
One-cell configuration
(2)
2.8 3.6 4.5I
DD
Operating current (cell 2) Measuring, reporting, or balancing 250 350 µAI
STBY
Standby-mode current (cell 2) Idle 32 50 µAI
SHIP
Ship-mode current (cell 2) 10 30 µAI
UVM
(3)
Cell extreme undervoltage-mode current V1 < 2.8 V 0.5 1 µA(cell 2)V
Startup
Minimum startup voltage, V1 and V2 2.9 V
CELL VOLTAGE MEASUREMENT CHARACTERISTICS
V1 measurement range 2.75 4.5 VV2 measurement range 2.75 4.5 VAnalog resolution < 1 mV25 ° C ± 3 ± 7Accuracy (after calibration) mV0 ° C to 85 ° C ± 10
(4)
Measurement temperature coefficient +150 µV/ ° CConversion time
(5)
80 ms
INTERNAL TEMPERATURE MEASUREMENT CHARACTERISTICS
Measurement range – 30 85 ° CResolution 0.1 ° CAccuracy (after calibration)
(4)
0 ° C to 85 ° C ± 2 ° CTemperature coefficient +1.28 mV/ ° C
(1) For single-cell operation, V1 must be connected to V2.(2) During operation after power up(3) Condition forced by bq78PL114(4) With respect to voltage shift induced by temperature coefficient at 85C.(5) Does not include delay due to internode timing delays.
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s) :bq76PL102
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EXTERNAL TEMPERATURE SENSOR(S) TYPICAL CHARACTERISTICS
(6)
Measurement range
(7)
– 40 90 ° CResolution 0.2 ° C25 ° C ± 2 ° CAccuracy
(8)
0 ° C to 85 ° C ± 2 ° C
PowerPump ELECTRICAL CHARACTERISTICS (FOR bq76PL102)
(9)
V
OH
High drive, PUMP1S, PUMP2S I
OUT
= 10 µA 0.9 V1 VV
OL
Low drive, PUMP1S, PUMP2S I
OUT
= – 200 µA 0.1 V1 VV
OH
High drive, PUMP1N, PUMP2N I
OUT
= 200 µA 0.9 V1 VV
OL
Low drive, PUMP1N, PUMP2N I
OUT
= – 10 µA 0.1 V1 VI
OH
Source current, PUMP1S, PUMP2S V
OH
= V1 – 0.8 V 250 µAI
OL
Sink current, PUMP1N, PUMP2N V
OH
= V1 + 0.2 V – 250 µAt
r
Signal rise time C
Load
= 300 pF 100 nst
f
Signal FET fall time C
Load
= 300 pF 100 nsf
P
Frequency 204.8 kHzPUMP1S, PUMP2S 67%PWM duty cycle
(10)
PUMP1N, PUMP2N 33%
LDO VOLTAGE CHARACTERISTICS
(11)
V
LDO
Single-cell operation, referenced to VSS Load = 200 µA at 25 ° C, V1 = 2.8 V 2.425 2.5 2.575 VV
LDO
Dual-cell operation, V1 = V2 = cell voltage Load = 2 mA at 25 ° C 2.425 2.5 2.575 V
V
LAN
SIGNALS
(12) (13) (14)
SDI, C coupling = 1000 pf 100C
L
Load capacitance pFSDO 100V
IH
Input logic high SDI 0.8 V
LDO
VV
OH
Output logic high SDO 0.9 V
LDO
VV
IL
Input logic low SDI 0.2 V
LDO
VV
OL
Output logic low SDO 0.1 V
LDO
Vt
r
Input rise time SDI 500 nst
f
Input fall time SDI 500 nst
or
Output rise time SDO 30 50 nst
of
Output fall time SDO 30 50 ns
(6) Typical for dual-diode (MMBD4148 or equivalent) external sensor using recommended circuit(7) Range of diode sensors may exceed operation limits of IC and battery cells.(8) Typical behavior after calibration; final result depends on specific component characteristics(9) All parameters tested at typical cell voltages = 3.6 V.(10) The frequency and duty cycle of each pump gate drive signal is set by the bq78PL114. The PUMPxN signals have a positive duty cycleand switch on the N-Channel MOSFETs. The duty cycle of the PUMPxS signals is (100 – the duty cycle of the PUMPxN signals).(11) After calibration(12) Values specified by design(13) The SDI and SDO pins on the bq76PL102 are ac-coupled from the cell circuits downstream and upstream, respectively. The limitsspecified here are the voltage transitions which must occur within the SDI and SDO rise- and fall-time specifications.(14) The value specified is over the full input voltage range and the maximum load capacitance.
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Product Folder Link(s) :bq76PL102
FEATURE SET
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
The bq76PL102 dual-cell li-ion battery monitor with PowerPump balancing implements battery voltagemeasurement, temperature measurement, and balancing for one or two Li-Ion cells in series, and any number inparallel (limited by other design considerations).
Functions include:•Two external temperature sensors are supported•Simultaneous, synchronous measurement of all cell voltages in a series string•Asynchronous reporting of most-recent measurements for each cell•Fully independent measurements on a cell-by-cell basis•PowerPump cell balancing using charge transfer from cell to cell•PowerLAN isolated communications to other bq76PL102 devices or bq78PL114 master-gatewaybattery-management controller•Low-power operation
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s) :bq76PL102
OPERATION
Cell-Voltage Measurement
Cell-Temperature Measurement
Cell Balancing
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
Voltage measurements are made using one-per-cell precision delta-sigma analog-to-digital converters (ADC). Aninternal calibrated band-gap voltage reference is provided with each part. Measurements are performed whencommanded by the bq78PL114 master-gateway battery-management controller via the one-wire PowerLANserial communications bus. This allows all cells to be measured at exactly the same time under the same loadconditions.
Temperature measurements can be obtained using one internal and up to two external sensors. Each externalsensor consists of one (or two for increased accuracy) series-connected diodes and a capacitor for filtering. Theuse of dual diodes in a single SMT package is recommended (MMBD4148SE or equivalent). The diode can belocated up to 6 inches (15 cm) from the circuit board. The RF filter capacitor should be co-located very close tothe diode to minimize unwanted noise coupling.
The temperature measurement subsystem uses the same dual ADCs that are used for measuring voltages.Temperature measurements are fully independent of voltage readings, and are ordinarily interleaved at afractional rate of the voltage readings by commands from the bq78PL114 master-gateway battery-managementcontroller.
Balancing is provided among any number of supported cells. The bq76PL102 and PowerLAN family ofmaster-gateway battery controllers is optimized for designs using more than four cells in series.
The patented PowerPump reactive cell balancing dramatically increases the useful life of battery systems byeliminating the cycle life fade of multicell batteries due to cell imbalance. PowerPump efficiently transfers chargefrom cell to cell, rather than simply bleeding off charging energy as heat. Charge is moved from higher-capacitycells to lower-capacity ones, and can be moved as needed between any number of series cell elements.Balancing is performed during all battery operational modes – charge, discharge, and rest. Compared to resistivebleed balancing, virtually no energy is lost as heat. The actual balance current is externally scalable withcomponent selection and can range from 10 mA to 1 A (100 mA typical) depending on application or cellrequirements. (See the reference schematic, Figure 7 .)
Algorithms for cell balancing are centrally coordinated by the bq78PL114 PowerLAN master-gatewaybattery-management controller and directed across the array of bq76PL102 dual-cell Li-Ion battery monitors.Balancing is done in both directions by the bq76PL102s within the cell stack array: north or up the cell stack andsouth or down the cell stack. Each bq76PL102 node provides the circuitry to transfer (pump) the charge from cellto cell to provide balancing. The balancing algorithm is implemented in the bq78PL114 master-gateway batterycontroller, and commands are communicated to the bq76PL102s via the PowerLAN communications link. Bytracking the balancing required by individual cells, overall battery safety is enhanced – often allowing earlydetection of internal micro-shorts or other cell failures.
Cell balancing pumping, or charge transfer from one cell to another, is accomplished using a circuit that forms asimple flyback converter under control of the bq76PL102, which is in turn controlled by the master gateway. Theoutputs of PUMP nd (cell number, direction) control MOSFET transistors which charge an inductor from one celland then discharge the inductor into an adjacent cell through the intrinsic body diode of the other MOSFET.•PUMP1S: Pumps charge from cell 1 to the next lower cell (closer to battery negative). This signal is unusedby the first or lowest cell in the string.•PUMP1N: Pumps charge from cell 1 to cell 2.•PUMP2S: Pumps charge from cell 2 to cell 1•PUMP2N: Pumps charge from cell 2 to the next higher cell in a pack (closer to battery positive). This signal isunused by the highest cell in the string.
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Product Folder Link(s) :bq76PL102
PowerLAN Communications
Operation Modes
COMPLEMENTARY PRODUCTS
PowerLAN Master Gateway Battery Controller
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
PowerLAN communications technology is a patented serial network and protocol designed specifically for batterymanagement in a multicell environment. PowerLAN is used to initiate and report measurements of cell voltageand temperature, as well as control cell balancing. Using only a capacitor, PowerLAN isolates voltages fromadjacent bq76PL102 parts to permit high-voltage stack assemblies without compromising precision andaccuracy. PowerLAN is expandable to support up to 12 cells in series, with each bq76PL102 handling two seriescells. PowerLAN provides high ESD standoff and high immunity to noise generated by nearby digital circuitry orswitching currents. Each bq76PL102 has both a PowerLAN serial input and serial output pin. Received data isbuffered and retransmitted, permitting high numbers of nodes without loss of signal fidelity. Signals arecapacitor-coupled between nodes to provide high dc isolation.
The bq76PL102 normally operates in one of two modes: active or standby. The bq76PL102 is normally instandby mode and consumes typically less than 50 µA. The low-dropout regulator output is still functional in thismode, as are internal system protection functions (undervoltage, communications timeout, etc.)
When a PowerLAN communications event occurs, then the bq76PL102 transitions to active mode and currentdrain increases to 250 µA typically. The bq76PL102 stays in this mode to complete any measurements orcell-balancing pumping operations. Once activity in this mode ceases, the return to standby is automatic, thusreducing overall power consumption.
An undervoltage ultralow-current mode is also available when initiated by the bq78PL114 master-gateway batterycontroller and when the cell voltages drop below a preset threshold. This mode is used to preserve batterycapacity during long periods of non-use and therefore has a current drain of approximately 1 µA.
Note that cell balancing currents are external to the bq76PL102 and may be sized according to the needs of theapplication (typically 10 mA to 1 A). These currents are fixed by the cell-balancing circuitry and only enabled ordisabled by the bq76PL102 (under control of the bq78PL114) to achieve the necessary cell-balance operations.
The bq78PL114 master-gateway battery-management controller with PowerPump cell balancing from TexasInstruments is the central controller for a complete multicell battery system.
This advanced master-gateway battery controller works with up to 12 series cells monitored by bq76PL102 cellmonitors to provide battery voltage, temperature, current and safety monitoring; state-of-charge andstate-of-health information; system-wide internal PowerLAN communications; as well as external communicationsof battery parameters via the industry-standard SMBus interface.
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s) :bq76PL102
PowerLAN Six-Cell Battery Monitor
bq78PL114
PowerLAN
Gateway Battery
Management
Controller
RPRE
+PACK+
–
RSENSE
PACK–
XT1, XT2
XT3, XT4
Temperature
Sensor (typ.)
Temperature
Sensor (typ.)
SPROT
LED1–LED5
Typical six-cell configuration shown.
Additional cells added via PowerLAN connection.
Some components omitted for clarity.
V2
V3
V4
V1
VLDO2
CRFI
CRFI
VLDO1
RSTN
SDO2
SDI3
One of 2 external
sensors shown
One of 2 external
sensors shown
P-LAN
5
CELL 6
CELL 5
V2
V1
SDI1
SDO0
Level-Shift Circuits
CHG
DSG
PRE
ESD
Protection
SMBCLK
SMBDAT
SMBus
Thermal Pad
VSS
CSBAT
CCBAT
CCPACK
CSPACK
Cell Balancing
Circuits
Cell Balancing Circuits
bq76PL102
CELL 4
CELL 3
CELL 2
CELL 1
S0342-03
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
Figure 4. bq78PL114 Simplified 6-Cell Gateway Controller Circuit With bq76PL102
10 Submit Documentation Feedback Copyright © 2008 – 2009, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL102
VSS
V1
V2
PUMP2S
PUMP2N
PUMP1N
1
+
+
bq76PL102
SDI
SDO
0.001
3300pF
3300pF
20k
20k
15µH
2k
3300pF
3300pF
20k
20k
15µH
2k
1
1
1
1
PowerPad
VLDO
VPP
PUMP1S
XT1,XT2
PowerLAN™
1
0.001
To Node n + 1
To Node n – 1
PowerPump™ Circuit
V1 n+1
+
V2 n
+
V1 n+1
–
V1 n
+
V2 n
–
V1 n
–
V2 n – 1
+
Typical
Temperature
Sensor
MMBD4148SE
Typical 2cell circuit shown,
somecomponents omitted
forclarity.
PUMP1S (Next part below)
ToNode n – 1
PUMP1S (Next part above)
ToNode n+1
S0388-01
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
Figure 5. bq76PL102 Simplified Example Operating-Circuit Diagram
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s) :bq76PL102
S001
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
Figure 6. Higher-Balancing-Current bq76PL102 Operating-Circuit Diagram
12 Submit Documentation Feedback Copyright © 2008 – 2009, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL102
bq78PL114S12
1
CHG
2
DSG
3
PRE
4
EFCIC
5
EFCID
6
CCBAT
7CCPACK
8
VLDO1
9
CSBAT
10 CSPACK
11
OSCI
12
OSCO
13 SDO0
14 SDI1
15 P1N
16 P2S
17 P2N
18 SDO2
19 SDI3
20 P3S
21 P3N
22 P4S
23 P4N
24
P-LAN
25 RSTN
26
N/C
27
N/C
28
N/C
29
FIELD
30
SPROT
31
LEDEN/PSH/BP/TP
32
LED1/SEG1
33
LED2/SEG2
34
LED3/SEG3
35
LED4/SEG4
36
LED5/SEG5
37
SMBCLK
38
SMBDAT
39 V4
40
XT4 41
XT3
42 V3
43 VLDO2
44 V2
45
XT2 46
XT1
47 V1
48 VSS
49 TAB
U4
C5
10uF
R44
10K
C27 0.01uF
C28
10uF
C43
0.1uF
C7
1.0uF
R5
100K
C11
0.01uF
R28
4.7K
R27
4.7K
R49
100R R50
100R
C9
10uF
C10
0.01uF
R54
100R
R55
100R
R43
1.0M
R51
1.0M
15 V1
12 V2 14
T1
13
T2
11
N/C
10
N/C
3
N/C
8P2N
7P2S
6P1N
5P1S
2
VLDO
16
VPP
9
SDO
4SDI
17 TAB
1VSS
U3
BQ76PL102
C40
1.0uF
C44
1.0uF
C39
1.0uF
C41
1.0uF
1
2
3
4
SMBUS-PORT
R3
Various
R6
1.0M
Z1
5.6VDC
T3
C6 0.01uF
T4
C37 0.01uF
C29
10uF
C51
10uF
T6
C52 0.01uF
C48
0.01uF
PACK+
PACK-
Q11
Q12
R53
560K
R56
200K
ZR2
12.0 VDC
R58
30K
R59
1.0M
Q13
Q8
Q9
R40
560K
R41
200K
ZR1
12.0 VDC
R45
100K R46
1.0M
Q10
C60
0.1uF
C61
0.1uF
Q15
BC846ALT1G
R17
1.0M
R52
100K
Q16 R18
R19
1.0M
R25
1.0M
D23
D24
D25
D26
D27
S1
T1
C8 0.01uF
T2
C16 0.01uF
C42
0.1uF
C50
0.1uF
-
+CELL1
-
+CELL2
-
+CELL3
-
+CELL4
-
+CELL5
-
+CELL6
-
+CELL8
-
+CELL9
-
+CELL10
T5
C45 0.01uF
C46
10uF
C49
0.01uF
15 V1
12 V2 14
T1
13
T2
11
N/C
10
N/C
3
N/C
8P2N
7P2S
6P1N
5P1S
2
VLDO
16
VPP
9
SDO
4SDI
17 TAB
1VSS
U2
BQ76PL102
C53
10uF
C54
10uF
T7
C55 0.01uF
T8
C57 0.01uF
C92
10uF
15 V1
12 V2 14
T1
13
T2
11
N/C
10
N/C
3
N/C
8P2N
7P2S
6P1N
5P1S
2
VLDO
16
VPP
9
SDO
4SDI
17 TAB
1VSS
U6
BQ76PL102
C94
10uF
C95
10uF
T11
C96 0.01uF
T12
C98 0.01uF
-
+CELL7
R15
100R
C3
0.01uF
R16
200K
ZR3
12.0 VDC
VSS
VLDO1
VSS
VSS
VSS
VSS
P1N
P2S
P2N
P3S
P3N
P4S
P4N
P5S
P5N
P6S
P6N
P7S
P7N
P8S
P8N
P9S
P9N
P10S
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
CELL7
CELL8
CELL9
CELL10
VSS
VSS
S001
bq76PL102
www.ti.com
.......................................................................................................................................... SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009
Figure 7. Reference Schematic (Sheet 1 of 2)
Copyright © 2008 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s) :bq76PL102
R2
2.0K
R4 20K
R7 20K
C58
3300pF
C59
3300pF
Q18-A
Q18-B
L8
4.7uH
C62
22uF D1
D2
R8
2.0K
R21 20K
R22 20K C63
3300pF
C64
3300pF
Q19-A
Q19-B
L9
4.7uH
D3
D4
R23
2.0K
R26 20K
R42 20K
C65
3300pF
C66
3300pF
Q20-A
Q20-B
L10
4.7uH
C67
22uF
D19
D20
R47
2.0K
R48 20K
R57 20K C68
3300pF
C69
3300pF
Q21-A
Q21-B
L11
4.7uH
C70
22uF
D21
D22
R61
2.0K
R62 20K
R63 20K
C71
3300pF
C72
3300pF
Q22-A
Q22-B
L12
4.7uH
C73
22uF
D28
D29
R64
2.0K
R65 20K
R66 20K C74
3300pF
C75
3300pF
Q23-A
Q23-B
L13
4.7uH
C76
22uF
D30
D31
R67
2.0K
R68 20K
R69 20K
C77
3300pF
C78
3300pF
Q24-A
Q24-B
L14
4.7uH
D32
D33
C90
22uF
C91
22uF
C1
22uF
R9
2.0K
R10 20K
R11 20K
C2
3300pF
C12
3300pF
Q1-A
Q1-B
L1
4.7uH
C13
22uF
D5
D6
R12
2.0K
R13 20K
R14 20K C14
3300pF
C15
3300pF
Q2-A
Q2-B
L2
4.7uH
C17
22uF
D7
D8
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
CELL7
VSS
P1N
P2S
P3N
P4S
P2N
P3S
P5S
P5N
P4N
P6N
P7S
P6S
P8S
P7N
CELL8
CELL9
CELL10
P8N
P9N
P10S
P9S
S002
bq76PL102
SLUS887A – DECEMBER 2008 – REVISED OCTOBER 2009 ..........................................................................................................................................
www.ti.com
Figure 8. Reference Schematic (Sheet 2 of 2)
14 Submit Documentation Feedback Copyright © 2008 – 2009, Texas Instruments Incorporated
Product Folder Link(s) :bq76PL102
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
BQ76PL102RGTR ACTIVE QFN RGT 16 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
BQ76PL102RGTT ACTIVE QFN RGT 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ76PL102RGTR QFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
BQ76PL102RGTT QFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ76PL102RGTR QFN RGT 16 3000 367.0 367.0 35.0
BQ76PL102RGTT QFN RGT 16 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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