WT12-A-AI - SILICON LABS - Datasheet.Directory

WT12

Data Sheet

Version 2.8

Friday, May 22, 2009

Bluegiga Technologies assumes no responsibility for any errors, which may appear in this manual.

Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or

specifications detailed herein at any time without notice, and does not make any commitment to

update the information contained herein. Bl uegiga Technologies’ products are not authoriz ed for use

as critical components in life support devices or systems.

The WRAP is a registered trademark of Bl uegiga Technologies

The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA, and is licensed to Bluegiga

Technologies.

All other trademarks listed herein are owned by their respective owners.

Contents:

1. ...................................................................6 Block Diagram and Descriptions

2. ..............................................................................8 Electrical Characteristics

2.1 ........................................................11 Radio Characteristics – Basic Data Rate

2.2 ..................................................14 Radio Characteristics – Enhanced Data Rate

3. .................................................................................16 WT12 Pin Description

4. .....................................................................................19 Physical Interfaces

4.1 ..........................................................................................19 UART Interface

4.1.1 ...............................................20 UART Configuration While RESET is Active

4.1.2 ...............................................................................20 UART Bypass Mode

4.2 ...........................................................................................22 USB Interface

4.2.1 ............................................................................22 USB Pull-Up Resistor

4.2.2 ...............................................................................22 Self Powered Mode

4.2.3 ...............................................................................23 Bus Powered Mode

4.2.4 ..................................................................................24 Suspend Current

4.2.5 ..............................................................24 Detach and Wake-Up Signaling

4.2.6 ..........................................................................................25 USB Driver

4.2.7 .............................................................................25 USB 1.1 Compliance

4.2.8 ...........................................................................25 USB 2.0 Compatibility

4.3 ............................................................................................26 SPI Interface

4.4 ...........................................................................................27 PCM Interface

4.4.1 ...................................................................27 PCM Interface Master/Slave

4.4.2 .................................................................................28 Long Frame Sync

4.4.3 ................................................................................28 Short Frame Sync

4.4.4 ..............................................................................29 Multi Slot Operation

4.4.5 ......................................................................................29 GCI Interface

4.4.6 .....................................................................30 Slots and Sample Formats

4.4.7 ..............................................................................31 Additional Features

4.4.8 ................................................................................31 PCM Configuration

5. .......................................................................................33 I/O Parallel Ports

6. .........................................................................................34 Software St acks

6.1 .............................................................................................34 iWRAP Stack

6.2 .................................................................................................35 HCI Stack

6.3 ..........................................................................................38 RFCOMM Stack

6.4 ..................................................................................................39 VM Stack

6.5 ................................................................................................40 HID Stack

7. ...................................................................................42 Enhanced Data Rate

7.1 ....................................................................42 Enhanced Data Rate Baseband

7.2 ..................................................................42 Enhanced Data Rate /4 DQPSK

7.3 ...................................................................................................42 8DQPSK

8. .........................................................44 Layout and Soldering Considerations

8.1 ........................................................................44 Soldering recommendations

8.2 ......................................................................................44 Layout guidelin es

9. .........................................................................47 WT12 physical dimensions

10. ......................................................................................................49 Package

11. ..............................................................................................51 Certifications

11.1 ............................................................................................51 Bluetooth

11.2 ....................................................................................................52 FCC

11.3 .....................................................................................................52 CE

11.4 ............................................................................53 Industry Canada (IC)

12. ........................................54 RoHS Statement with a List of Banned Materials

13. ...................................................................................55 Contact Information

TERMS & ABBREVIATIONS

Term or Abbreviation: Explanation:

Bluetooth Set of technologies providing audio and data transfer over short-range

radio connections

CE Conformité Européene

DFU Device Firmware Upgrade

EDR Enhanced Data Rate

FCC Federal Communications Commission

HCI Host Controller Interface

HID Human Interface Device

iWRAP Interface for WRAP

PCB Printed Circuit Board

PCM Pulse Code Modulation

RoHS The Restriction of Hazardous Substances in Electrical and Electronic

Equipment Directive (2002/95/EC)

SPI Serial Peripheral Interface

UART Universal Asynchronous Transmitter Receiver

USB Universal Serial Bus

VM Virtual Machine

WRAP Wireless Remote Access Platform

WT12 Bluetooth  module

DESCRIPTION

WT12 is a next-generation, class 2,

Bluetooth® 2.0+EDR (Enhanced Data Rates)

module. It introduces three times faster data

rates compared to existing Bluetooth® 1.2

modules even with lower power consumption!

WT12 is a highly integrated and sophisticated

Bluetooth® module, containing all the

necessary elements from Bluetooth® radio to

antenna and a fully implemented protocol

stack. Therefore WT12 provides an ideal

solution for developers who want to integrate

Bluetooth® wireless technology into their

design with limited knowledge of Bluetooth®

and RF technologies.

By default WT12 module is equipped with

powerful and easy-to-use iWRAP firmware.

iWRAP enables users to access Bluetooth®

functionality with simple ASCII commands

delivered to the module over serial interface -

it's just like a Bluetooth® modem.

FEATURES:

 Fully Qualified Bluetooth system v2.0 +

EDR, CE and FCC

 Integrated chip antenna

 Industrial temperature range from -40oC

to +85oC

 Enhanced Data Rate (EDR) compliant with

v2.0.E.2 of specification for both 2Mbps

and 3Mbps modulati on modes

 RoHS Compliant

 Full Speed Bluetooth Operation with Full

Piconet

 Scatternet Support

 USB version 2.0 compatible

 UART with bypass mode

 Support for 802.11 Coexistence

 8Mbits of Flash Memory

APPLICATIONS:

 Hand held terminals

 Industrial devices

 Point-of-Sale systems

 PCs

 Personal Digital Assistants (PDAs)

 Computer Accessories

 Access Points

 Automotive Diagnostics Units

Figure 1: Physical outlook of WT12

ORDERING INFORMATION:

In te rnal chip anten na

iWRAP 3.0 firmware WT12-A-AI3

iWRAP 2.2.0 firmware WT12-A-AI

HCI firm ware, BT2.1 + EDR WT12-A-HCI21

HCI firm ware, BT2.0 + EDR W T12-A-HCI

C ustom firm w are WT 12 -A-C (*

Table 1: Ordering information

*) Custom firmware means any standard firmware with custom parameters (like UART baud rate), custom

firmware developer by customer or custom firmware developed by Bluegiga for the customer.

To order custom firmware you must have a properly filled Custom Firmware Order From and unique ordering

code issued by Bluegiga.

Contact support@bluegiga.com for more information.

1. BLOCK DIAGRAM AND DESCRIPTIONS

Figure 2: Block Diagram of WT12

BlueCore04

BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio

transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth®

2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps.

The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run

the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced

instruction set computer (RISC) microcontroller is used for low power consumption and

efficient use of memory.

BlueCore04 has 48Kbytes of on-chip RAM is provided to support the RISC MCU and is

shared between the ring buffers used to hold voice/data for each active connection and

the general purpose memory required by the Bluetooth stack.

Crystal

The crystal oscillates at 26MHz.

Flash

Flash memory is used for storing the Bluetooth protocol stack and Virtual Machine

applications. It can also be used as an optional external RAM for memory intensive

applications.

Balun / filter

Combined balun and filter changes the balanced input/output signal of the module to

unbalanced signal of the monopole antenna. The filter is a band pass filter (ISM band).

Matching

Antenna matching components match the antenna to 50 Ohms.

Antenna

The antenna is ACX AT3216 chip antenna.

USB

This is a full speed Universal Serial Bus (USB) interface for communicating with other

compatible digital devices. WT12 acts as a USB peripheral, responding to requests from a

Master host controller such as a PC.

Synchronous Serial Interface

This is a synchronous serial port interface (SPI) for interfacing with other digital devices.

The SPI port can be used for system debugging. It can also be used for programming the

Flash memory.

UART

This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for

communicating with other serial devices.

Audio PCM Interface

The audio pulse code modulation (PCM) Interface supports continuous transmission and

reception of PCM encoded audio data over Bluetooth.

Programmable I/O

WT12 has a total of 6 digital programmable I/O terminals. These are controlled by

firmware running on the device.

Reset

This can be used to reset WT12.

802.11 Coexistence Interface

Dedicated hardware is provided to implement a variety of coexistence schemes. Channel

skipping AFH (Adaptive Frequency Hopping), priority signaling, channel signaling and host

passing of channel instructions are all supported. The features are configured in firmware.

Since the details of some methods are proprietary (e.g. Intel WCS) please contact

Bluegiga Technologies for details.

2. ELECTRICAL CHARACTERISTICS

Absolute maximum ratings

Min Max Unit

Sto rage temperatu re -40 85 °C

O perating tem perature -40 85 °C

Supply voltage -0,3 3,6 V

Terminal v oltages -0,4 Vdd + 0,4 V

O utput current from PIO S 35 mA

The module should not continuously run under these conditions. Exposure to absolute maximum rating conditions for

extended periods of time may affect reliability and cause permanent damage to the device.

Table 2: Absolute maximum ratings

Recommended operating conditions

Min Max Unit

Operating temperature -40 85 °C

Supply voltage 3,1 (1) 3,6 V

Terminal voltages 0 Vdd V

Table 3: Recommended operating conditions

1) WT 12 operates as low as 2,7 V supply voltage. However, to sa fely mee t th e USB spe cif icat io n fo r min imu m vo ltag e fo r

USB data lines, minimum of 3,1 V supply is required.

Terminal characteristics

Min Typ Max Unit

I/O vo lta ge le ve ls

VIL in p ut lo gic le v e l low -0,4 - 0,8 V

VIH input logic level high 0,7Vdd - Vdd + 0,4 V

VOL output logic level low --0,2V

VOH output logic level high Vdd - 0,2 - - V

Reset term inal

VTH,res threshold voltage 0,64 0,85 1,5 V

RIR ES input resistance 220 k



CIR ES input capacitance 220 nF

Inpu t and tri-state current w ith

Strong pull-up -100 -40 -10





Strong pull-down 10 40 100





We ak pu ll-up -5 -1 -0,2





Weak pull-dow n 0,2 1 5





I/O pad leakage current -1 0 1





dd sup ply current

TX m ode - - 70 mA

RX m ode - - 70 mA

Table 4: Terminal characteristics

Current consump tion

Test conditions: Room temperature, Vdd = 3,3 V, iWRAP firmware

OPERATION MODE Peak

supply

current

AVG

supply

current Unit Notes

Peak c urrent at T X mode 70 - m A -

Peak c urrent at R X mode 70 - m A -

IDLE - 3 m A Module is idle D efault settings

IDLE, Deep Sleep ON - 1,2 m A Module is idle

IDLE, Deep Sleep ON

NO T visible, NO T

connectable -0,4mA

M odule is idle (Minimum consumption),

SET BT PAGEM O DE 0 2000 1

INQUIRY - 4 4 ,7 mA D ev ic e d is cov e r y w ith I NQUIRY c o mma nd

NAM E - 44,7 m A Name resolution

CALL - 44,7 mA CALL [ADD R ] 1101 RFCOM M

CONNECT

Master - 6,2 mA No data was transm itted, Default settings

CONNECT

Slave - 22,4 mA No data was transmitted, Default settings

CO N N EC T + Sniff, Master - 4,7 mA Connected (SET BT S NIFF 40 20 1 8)

CO N N EC T + Sniff, Slave - 4,6 m A C onnected (SET BT S NIFF 40 20 1 8)

CONNECT + sniff, M aster - 2,3 mA N o data transmitted

(SET BT SN IFF 1000 20 1 8)

CONNECT + sniff, Slave - 2,3 m A N o data transmitted

(SET BT SN IFF 1000 20 1 8)

CO N N EC T + park, Master - 3,1 mA N o data transm ittedPark param eter 1000

CO N N EC T + park, Slave - 2,3 mA N o data transm ittedPark param eter 1000

DAT A , Master - 31,5 mA Data transm itted @ 115200bps

DAT A , Slave - 29,2 mA Data transm itted @ 115200bps

DA T A + Sniff, Ma ster - 19,6 mA D ata transmitted @ 115200bps

(SET BT SN IFF 40 20 1 8)

DATA + Sniff, Slave - 22,6 m A Data transmitted @ 115200bps

(SET BT SN IFF 40 20 1 8)

D ATA + S n if f , Maste r - 3 ,9 mA Data transmitted

(SET BT SN IFF 1000 20 1 8)

Table 5: Current consumption

Radio characteristics and general specifications

Note

Operatin

fre

uenc

ran

eIS M B a nd

Lower quard

band

Upper quard

band

Carrier frequency f = 2402 + k,

k = 0 ...7 8

Modulation

method

GFSK: Asynchronous, 723.2 kbps / 57.6 kbps

Synchronous: 433.9 kbps / 433.9 kbps

P/4

DQPSK: Asynch ronous, 1448.5 kbps / 115.2 kbps

Synchronous: 869.7 kbps / 869.7 kbps

8DQPSK: Asynchronous, 2178.1 kbps / 177.2 kbps

Synchronous: 1306.9 kbps / 1306.9 kbps

Receivin

nal

ran

eTypical

condition

Receiver IF

fre

uenc

Center

fre

uenc

M i n -1 1 ... - 9 d B m

M a x +1 ... + 3 d B m

RF input

edance

Com

liance

USB s

ecification

Transmission

power

50 

Maximum data

rate

Specification

(2 4 0 0 ... 24 8 3 ,5 ) MH z

2 MHz

3,5 MH z

2402 M Hz ... 2480 M Hz

GFSK (1 Mbps)

P/4 D Q PS K (2Mbps)

1600 hops/s, 1 MHz channel space

Blu e tooth sp eci fication , v ersion 2 .0 + E D R

USB specification, version 1.1 (USB 2.0 compliant)

-82 to -20 dBm

1.5 MHz

Table 6: Radio characteristics and general specifi cations

2.1 Radio Characteristics – Basic Data Rate

Transmitter radio characteristics

WT12 meets the Bluetooth v2.0+EDR specification between -40°C and +85°C. TX output is guaranteed to be

unconditionally stable over the guarante ed temperature range.

Measurement conditions: T = 20C, Vdd = 3,3V

Item Typical value Bluetooth specification Unit

Maximum out

owe

1,2 +2.5 -6 to 4 3dBm

Variation in RF power over

temperature range with

com

ensation enabled41.5 - dB

Variation in RF power over

temperature range with

com

ensation disabled42.0 - dB

RF power control range 35 16 dB

RF power range control

resolution50.5 - dB

20dB bandwidth for modulated

carrie

780  1000 kHz

Adjacent channel transmit power

F = F0 ± 2MHz6,7 -40  20 dBm

Adjacent channel transmit power

F = F0 ± 3MHz6,7 -45  -40 dBm

Adjacent channel transmit power

F = F0 ± > 3MHz6,7 -50  -40 dBm

f1avg Maximum Modulation 165 140<f1avg<175 kHz

f2max Maximum Modulation 150 115 kHz

f1avg / f2avg 0.97 0.80 -

Initial carrier frequency tolerance 6  75 kHz

Drift Rate 8



20 kHz/50



Drift (single slot packet) 7



25 kHz

Drift (five slot packet) 9



40 kHz

2nd Harmonic content -65  -30 dBm

3rd Harmonic content -45  -30 dBm

Table 7: Transmitter radio characteristics at basic data rate and temperature 20C

Notes:

1. WT12 firmware maintains the transmit power to be within the Bluetooth v2.0+EDR specification limits.

2. Measurement made using a PSKEY_LC_MAX_TX_POWER setting corresponds to a

PSKEY_LC_POWER_TABLE power table entry of 63.

3. Class 2 RF-transmit power range, Bluetooth v2.0+EDR specification.

4. To some extent these parameters are dependent on the matching circuit used, and its behavior over

temperature. Therefore these parameter s may be beyond CSR’s direct control.

5. Resolution guaranteed over the range -5dB to -25dB relative to maximum power for TX Level >20.

6. Measured at F0= 2441MHz.

7. Up to three exceptions are allowed i n the Bluetooth v2.0+ED R specification. WT 12s guaranteed to me et

the ACP performance as specifie d by the Bluetoot h v2.0+EDR specification.

Frequency (GHz) Typ Unit Cellular band

0.869 – 0.8941-145 GSM 850

0.869 – 0.8942-145 CDMA 850

0.925 – 0.9601 -145 GSM 900

1.570 – 1.5803-145 GPS

1.805 – 1.8801-145 GSM 1800 / DCS

1800

1.930 – 1.9904 -145 PSC 1900

1.930 – 1.9901 -145 GSM 1900

1.930 – 1.9902 -145 CDMA 1900

2.110 – 2.1702 -142 W-CDMA 2000

2.110 – 2.1702-144 W-CDMA 2000

Emitted power in

cellular ban ds

measured at the

unbalanced port of

the balun.

Output power 4dBm

dBm/kHz

Table 8: Transmitter radio characteristics at basic data rate and temperature 20C

Notes:

1. Integrated in 200kHz bandwidth and then normalized to a 1Hz bandwidth.

2. Integrated in 1.2MHz bandwidth and th en normalized to a 1Hz bandwidth.

3. Integrated in 1MHz bandwidth. and then normalized to a 1Hz bandwidth.

4. Integrated in 30kHz bandwidth and then normalized to a 1Hz bandwidth.

5. Integrated in 5MHz bandwidth and then normalized to a 1Hz bandwidth.

Receiver radio characteristics

Measurement conditions: T = 20C, Vdd = 3,3V

Frequency

(GHz) Typ Bluetooth

specification Unit

2.402 -84

2.441 -84

2.480 -84

10 -20 dBm

Sensitivity at 0.1% BER

for all packet types

Maximum received si

nal at 0.1% BE

dBm

 75

Table 9: Receiver radio characteristics at basic data rate and temperature 20C

Frequency

(GHz) Typ Bluetooth

specification Unit

30-2000

BD -10

2000-2400

BD -27

2500-3000

BD -27

3000-3300

BD -27

6 11 dB

-5  0 dB

-4  0 dB

-38  -30 dB

-23  -20 dB

-45  -40 dB

-44  -40 dB

-22  9 dB

-30 -39 dBm

BD - dBm

acent channel selectivity C/I F=FIma

e1,2

Ma ximum level of in termodula tion interferers3

urious out

ut level

dBm

acent channel selectivity C/I F=F0

+ 2 MHz1,2

acent channel selectivity C/I F=F0

- 2 MHz1,2

acent channel selectivity C/I F=F0

+ 3 MHz1,2

acent channel selectivity C/I F=F0

- 5 MHz1,2

Continuous power re quired to block

Bluetooth reception (for sensitivity of -

67dBm with 0.1% BER) measured at

the unbalanced

ort o f the balun.

C/I co-channel

acent channel selectivity C/I F=F0

+ 1MHz1,2

acent channel selectivity C/I F=F0

- 1MHz1,2

Table 10: Receiver radio characteristics at basic data rate and temperature 20C

Notes:

1 Up to five exception s are allowed in the Blu etooth v2.0 + EDR specification. BlueCore4 is guaranteed to

meet the C/I performan ce as specified by the Blue tooth v2.0 + EDR speci fication.

2 Measured at F = 2441MHz

3 Measured at f1-f2 = 5MHz. Measurement is performed in accordance with Bluetooth RF test

RCV/CA/05/c. i.e. wanted signal at -64dBm

4 Measured at the unbalanced port of the balun. Integrated in 100kHz bandwidth and then normalized to

1Hz. Actual figure is typically below TBD dBm/Hz except for peaks of -52dBm in band at 2.4GHz and

d80dBm at 3.2GHz

Frequency

(

GHz

)

Typ Unit Cellular band

0.824 – 0.849 2.0 GSM 850

0.824 – 0.849

BD CDMA

0.880 – 0.915 5.0 GSM 900

1.710 – 1.785 4.0 GSM 1800 / DCS 1800

1.710 – 1.785 3.0 GSM 1900 / PCS 1900

1.850 – 1.910

BD CDMA 1900

1.920 – 1.980

BD W-CDMA 2000

0.824 – 0.849 -10 GSM 850

0.824 – 0.849

BD CDMA

0.880 – 0.915 -10 GSM 900

1.710 – 1.785 -9 GSM 1800 / DCS 1800

1.850 – 1.910 -9 GSM 1900 / PCS 1900

1.850 – 1.910

BD CDMA 1900

1.920 – 1.980 TBD W-CDMA 2000

Emitted power in cellular

bands require d to block

Bluetooth reception (for

sensitivity of -67d Bm with

0.1% BER) me asured at the

unbalanced port of the

balun.

Cont inuous power in c ellular

bands require d to block

Bluetooth reception (for

sensitivity of-72d Bm with

0.1% BER) me asured at the

unbalanced port of the

balun.

dBm

Table 11: Receiver radio characteristics at basic data rate and temperature 20C

2.2 Radio Characteristics – Enhanced Data Rate

Transmitter radio characteristics

Measurement conditions: T = 20C, Vdd = 3,3V

Typ Bluetooth specification Unit

+1 -6 to 42dBm

-1 -4 to 1 dB



10 kHz

RMS DEV -



135%

99% DEV -



205%

Peak DEVM -



255%

Modulation

accuracy3,4

Ca rrier frequency stability

Relative transmit power

Maximum output power1

Table 12: Transmitter radio characteristics at enhanced data rate and temperature 20C

Notes:

Results shown are referenced to input of the RF balun.

1 WT12 firmwar e maintains th e transmit power to be within the Bluetooth v2.0 +EDR specification limits

2 Class 2 RF transmit power range, Bluetooth v2.0 + EDR specification

3 Measurements methods are in accordance with the EDR RF Test Specification v2.0.E.2

4 Modulation accuracy utilizes differential error vector magnitude (DEVM) with tracking of the carrier

frequency drift.

5 The Bluetooth spec ification values are for 8DPS K modulation (values for the S /4 DQPSK modulation are

less stringent)

Receiver radio characteristics

Measurement conditions: T = 20C, Vdd = 3,3V

Modulation Typ Bluetooth

ecification Unit



4 D

PSK -87



-70

PSK -79



-70



4 D

PSK -7 -20



4 D

PSK +11



PSK +19





4 D

PSK -8



PSK -2





4 D

PSK -8



PSK -2





4 D

PSK -35



-30

PSK -35



-25



4 D

PSK -23



-20

PSK -19



-13



4 D

PSK -43



-40

PSK -40



-33



4 D

PSK -43



-40

PSK -38



-33



4 D

PSK -17



-7

8DQPSK -11



C/I co-channel at 0.1% BER1

acent channel selectivity

C/I F = F0 + 1MHz1,2,3

acent channel selectivity

C/I F = F0 - 5MHz1,2,3

acent channel selectivity

C/I F = FIma

e1,2,3

dBm

acent channel selectivity

C/I F = F0 - 1MHz1,2,3

acent channel selectivity

C/I F=F0 + 2MHz1,2,3

acent channel selectivity

C/I F = F0 - 2MHz1,2,3

acent channel selectivity

C/I F = F0 + 3MHz1,2,3

Sensitivity at 0.1% BER for

all

acket t

es1

Maximum received si

nal at

0.1% BE

Table 13: Receiver radio characteristics at enhanced data rate and temperature 20C

Notes:

Results shown are referenced to input of the RF balun

1 Measurements methods are in accordance with the EDR RF Test Specification v2.0.E.2

2 Up to five exceptio ns are al lowed in E DR RF Test Specif ication v 2.0. E.2. W T12 is guar anteed to me et the

C/I performance as specif ied by the EDR RF Test Specification v 2.0.E.2.

3 Measured at F0 = 2405MHz, 2441MHz, 2477MHz

3. WT12 PIN DESCRIPTION

WT12

293031

GND

VDD

PIO2

PIO3

NRTS

RXD

PCMO

USB_D+

USB_D-

NCTS

PCMI

PCMC

PCMS

GND

TXD

PIO5

MOSI

MISO

SCLK

NCSB

PIO4

PIO7

PIO6

RES

VDD

GND

GND GNDRF

Figure 3: WT12 connection diagram

GND (pins 1, 14, 15, 28, 29 and 31)

Connect GND pins to the ground plane of PCB.

VDD (pins 2 and 16)

3.3 V supply voltage connection. WT12 has an internal decoupling capacitor and LC filter

to block high frequency disturbances. Thus external filtering is usually not needed. It is

however recommended to leave an option for an external high Q 10pF decoupling

capacitor in case EMC problems arise.

RES (pin 17)

The RESET pin is an active high reset and is internally filtered using the internal low

frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following

RESET being active. It is recommended that RESET be applied for a period greater than

5ms.

WT12 has an internal reset circuitry, which keeps reset pin active until supply voltage has

reached stability in the start up. This ensures that supply for the flash memory inside the

WT12 will reach stability before BC4 chip fetches instructions from it. Schematic of the

reset circuitry is shown in figure 4. Rising supply voltage charges the capacitor, which will

activate the reset of WT12. The capacitor discharges through 220 k resistor, which

eventually deactivates the reset. Time constant of the RC circuitry is set such that the

supply voltage is safely stabilized before reset deactivates. Pull-up or pull-down resistor

should not be connected to the reset pin to ensure proper star up of WT12.

Figure 4: WT12 internal reset circuitry

PIO2 – PIO7 (pins 3, 4, 18, 19, 20 and 25)

Programmable digital I/O lines. All PIO lines can be configured through software to have

either weak or strong pull-ups or pull-downs. Configuration for each PIO line depends on

the application. See section 10 “I/O parallel ports” for detailed descriptions for each

terminal. Defa ult configuration for all of the PIO lines is input with weak internal pull-up.

NC (pin 27)

This pin is internally connected to PIO1.

NRTS (pin 5)

CMOS output with weak internal pull-up. Can be used to implement RS232 hardware flow

control where RTS (request to send) is active low indicator. UART interface requires

external RS232 transceiver chip.

NCTS (pin 10)

CMOS input with weak internal pull-down. Can be used to implement RS232 hardware flow

control where CTS (clear to send) is active low indicator. UART interface requires external

RS232 transceiver chip.

RXD (pin 6)

CMOS input with weak internal pull-down. RXD is used to implement UART data transfer

from another device to WT12. UART interface requires external RS232 transceiver chip.

TXD (pin 26)

CMOS output with weak internal pull-up. TXD is used to implement UART data transfer

from WT12 to another device. UART interface requires external RS232 transceiver chip.

PCMO (pin 7)

CMOS output with weak intern al pull-down . Used in PCM (pulse code modulation) interface

to transmit digitized audio.

PCMI (pin 11)

CMOS input w it h weak internal pull-dow n. Used in PCM interface to receive digitized audio.

PCMC (pin 12)

Bi-directional synchronous data clock signal pin with weak internal pull-down. PCMC is

used in PCM interface to transmit or receive CLK signal. When configured as a master,

WT12 generates clock signal for the PCM interface. When configured as a slave PCMC is an

input and receives the clock signal from another device.

PCMS (pin 13)

Bi-directional synchronous data strobe with weak internal pull-down. When configured as

a master, WT12 generates SYNC signal for the PCM interface. When configured as a slave

PCMS is an input an d receives the SYNC signal from another device.

USB_D+ (pin 8)

Bi-directional USB data line with a selectable internal 1.5 k pull-up implemented as a

current source (compliant with USB specification v1.2) External series resistor is required

to match the connection to the characteristic impedance of the USB cable.

USB_D- (pin 9)

Bi-directional USB data line. External series resistor is required to match the connection to

the characteristic impedance of the USB cable.

NCSB (pin 21)

CMOS input with weak internal pull-up. Active low chip select for SPI (serial peripheral

interface).

SCLK (pin 22)

CMOS input for the SPI clock signal with weak internal pull-down. WT12 is the slave and

receives the clock signal from the device operating as a master.

MISO (pin 23)

SPI data output with weak internal pull-down.

MOSI (pin 24)

SPI data input with weak internal pull-down.

RF (pin 30)

Connect external RF-transceiver antenna to this pin when chip ant enna is not in use.

4. PHYSICAL INTERFACES

4.1 UART Interface

WT12 Universal Asynchronous Receiver Transmitter (UART) interface provides a simple

mechanism for communicating with other serial devices using the RS232 standard. The

UART interface of WT12 uses volt age levels of 0 to Vdd and thus external transceiver IC is

required to meet the voltage level specifications of UART.

UART_TX

UART_RX

UART_RTS

UART_CTS

WT12

Figure 5: WT12 UART interface

Four signals are used to implement the UART function, as shown in Figure 6. When WT12

is connected to another digital device, UART_RX and UART_TX transfer data between the

two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to

implement RS232 hardware flow control where both are active low indicators. DTR, DSR

and DCD signals can be implemented using PIO terminals of WT12. All UART connections

are implemented using CMOS technology and have signaling levels of 0V and VDD.

In order to communicate with the UART at its maximum data rate using a standard PC, an

accelerated serial port adapter card is required for the PC.

Possible values

1200 baud (d2%Error)

9600 baud (d1%Error)

Maximum 3.0Mbaud (d1%Error)

RTS/CTS, none

None, Odd, Even

1 or 2

Parity

Number of stop bits

Bits per channel

Parameter

Baud rate Minimum

Flow control

Table 14: Possible UART settings

The UART interface is capable of resetting WT12 upon reception of a break signal. A Break

is identified by a continuous logic low (0V) on the UART_RX terminal, as shown in Figure

7. If tBRK is longer than the value, defined by the PS Key

PSKEY_HOST_IO_UART_RESET_TIMEOUT, (0x1a4), a reset will occur. This feature allows

a host to initialize the system to a known state. Also, WT12 can emit a Break character

that may be used to wake the Host.

Since UART_RX terminal includes weak internal pull-down, it can’t be left open unless

disabling UART interface using PS_KEY settings. If UART is not disabled, a pull-up resistor

has to be connected to UART_RX. UART interface requires external RS232 transceiver,

which usually includes the required pull-up.

BRK

UART_RX

Figure 6: Break signal

Note

Table 15 shows a list of commonly used Baud rates and their associated values for the

Persistent Store Key PSKEY_UART_BAUD_RATE (0x204). There is no requirement to use

these standard values. Any Baud rate within the supported range can be set in the

Persistent Store Key according to the formula in Equation below.

Baud Rate = PSKEY_UART_BAUD_RATE

0.004096

Figure 7: Baud rate calculation formula

Hex Dec

1200 0x0005 51.73%

2400 0x000a 10 1.73%

4800 0x0014 20 1.73%

9600 0x0027 39 -0.82%

19200 0x004f 79 0.45%

38400 0x009d 157 -0.18%

57600 0x00ec 263 0.03%

76800 0x013b 315 0.14%

115200 0x01d8 472 0.03%

230400 0x03b0 944 0.03%

460800 0x075f 1887 -0.02%

921600 0x0ebf 3775 0.00%

1382400 0x161e 5662 -0.01%

1843200 0x1d7e 7550 0.00%

2765800 0x2c3d 11325 0.00%

Baud rate Error

Persistent store values

Table 15: UART baud rates and error values

4.1.1 UART Configuration While RESET is Active

The UART interface for WT12 while the chip is being held in reset is tri-state. This will

allow the user to daisy chain devices onto the physical UART bus. The constraint on this

method is that any devices connected to this bus must tri-state when WT12reset is de-

asserted and the firmware begins to run.

4.1.2 UART Bypass Mode

Alternatively, for devices that do not tri-state the UART bus, the UART bypass mode on

WT12 can be used. The default state of WT12 after reset is de-asserted, this is for the host

UART bus to be connected to the WT12 UART, thereby allowing communication to WT12

via the UART.

In order to apply the UART bypass mode, a BCCMD command will be issued to WT12 upon

this, it will s witch the bypass to P IO[7:4] as shown in Figure 9. Once the by pass mode has

been invoked, WT12 will enter the deep sleep state indefinitely.

In order to re-establish communication with WT12, the chip must be reset so that the

default configuration takes affect.

It is important for the host to ensure a clean Bluetooth disconnection of any active links

before the bypass mode is invoked. Therefore it is not possible to have active Bluetooth

links while operat ing the bypass mode.

The current consumption for a device in UART Bypass Mode is equal to the values quoted

for a device in standby mode.

WT12

Host

processor

Test

interface

RXD

CTS

RTS

TXD

Another

device

RTS

CTS

UART_TX

UART_RTS

UART_CTS

UART_RX

RESET

PIO5

PIO6

PIO7

PIO4

UART

Figure 8: UART bypass mode

4.2 USB Interface

WT12 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving

a USB cable directly. No external USB transceiver is required. To match the connection to

the characteristic impedance of the USB cable, series resistors must be included to both of

the signal lines. These should be of 1% tolerance and the value required may vary

between 0 and 20 ohm with 10 ohm being nominal. The resistors should be placed close to

the USB pins of the module in order to avoid reflections. The module has internally 22 ohm

resistors in series. The total input impedance seen by the cable is affected by the IC

characteristics, track layout and the connector. The cable impedance is approximately 40

ohm.

The device operates as a USB peripheral, responding to requests from a master host

controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of

USB endpoints implemented can behave as specified in the USB section of the Bluetooth

v2.0 + EDR specification or alternatively can appear as a set of endpoint appropriate to

USB audio devices such as speakers.

As USB is a Master/Slave oriented system (in common with other USB peripherals), WT12

only supports USB Slave operation.

4.2.1 USB Pull-Up Resistor

WT12 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high

when WT12 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s)

USB device.

The USB internal pull-up is implem en ted as a current source, and is compliant w ith Section

7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_D+ high to at least

2.8V when loaded with a 15k +/-5% pull-down resist or (in the hub/host ). This presents a

Therein resistance to the host of at least 900. Alternatively, an external 1.5k pull-up

resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be

alerted to which mode is used by setting PS Key PSKEY_USB_PIO_PULLUP appropriately.

The default setting uses the internal pull-up resistor.

4.2.2 Self Powered Mode

In self powered mode, the circuit is powered from its own power supply and not from the

VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA)

from VBUS on the USB cable. This is the easier mode for which to design for, as the design

is not limited by the power that can be drawn from the USB hub or root port. However, it

requires that VBUS be connected to WT12 via a voltage devider (Rvb1 and Rvb2), so

WT12 can detect when VBUS is powered up. Voltage divider is essential to drop the 5V

voltage at the VBUS to 3,3V expected at the USB interface of WT12. WT12 will not pull

USB_DP high when VBUS is off.

Self powered USB designs (powered from a battery or PSU) must ensure that a PIO line is

allocated for USB pull-up purposes. A 1.5K 5% pull-up resistor between USB_DP and the

selected PIO line should be fitted to the design. Failure to fit th is resistor may result in t he

design failing to be USB compliant in self powered mode. The internal pull-up in WT12 is

only suitable for bus powered USB devices i.e. dongles.

PIO

USB_D+

USB_D-

USB_ON

R =1.5k

Rvb1

WT12

Rvb2

Figure 9: USB in self powered mode

The terminal marked USB_ON can be any free PIO pin. The PIO pin selected must be

registered by setting PSKEY_USB_PIO_VBUS to the corresponding pin number. In self

powered mode PSKEY_USB_PIO_PULLUP must be set to match with the PIO selected.

Note:

USB_ON is shared with WT12 PIO terminals (PIO2-PIO7).

4.2.3 Bus Powered Mode

In bus powered mode the application circuit draws its current from the 5V VBUS supply on

the USB cable. WT12 negotiates with the PC during the USB enumeration stage about how

much current it is allow ed to consume.

For WT12 Bluetooth applicat ions, it is recommended th at the regulator u sed to derive 3. 3V

from VBUS is rated at 100mA average current and should be able to handle peaks of

120mA without fold back or limiting. In bus powered mode, WT12 requests 100mA during

enumeration.

When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush

current (when charging reservoir and supply decoupling capacitors) is limited by the USB

specification (see USB specification v1.1, Section 7.2.4.1). Some applications may require

soft start circuitry to limit inrush current if more than 10pF is present between VBUS and

GND.

The 5V VBUS line emerging from a PC is often electrically noisy. As well as regulation

down to 3.3V, applicat ions should include careful f iltering of the 5V li ne to attenuate noise

that is above the voltage regulator bandwidth.

In bus powered mode PSKEY_USB_PIO_PULLUP must be set to 16 for internal pull-up

(default conf iguration in WT12).

USB_D+

USB_D-

USB_ON

Voltage

regulator

WT12

VBUS

GND

Figure 10: USB in bus powered mode

4.2.4 Suspend Current

All USB devices must permit the USB controller to place them in a USB Suspend mode.

While in USB Suspend, bus powered devices must not draw more than 0.5mA from USB

VBUS (self powered devices may draw more than 0.5mA from their own supply). This

current draw requirement prevents operation of the radio by bus powered devices during

USB Suspend.

The voltage regulator circuit itself should draw only a small quiescent current (typically

less than 100uA) to ensure adherence to the suspend current requirement of the USB

specification. This is not normally a problem with modern regulators. Ensure that external

LEDs and/or amplifiers can be turned off by WT12. The entire circuit must be able to enter

the suspend mode. (For more details on USB Suspend, see separate CSR documentation).

4.2.5 Detach and Wake-Up Signaling

WT12 can provide out-of-band signaling to a host controller by using the control lines

called ‘USB_DETACH’ and ‘USB_WAKE_UP’. These are outside the USB specification (no

wires exist for them inside the USB cable), but can be useful when embedding WT12 into a

circuit where no external USB is visible to the user. Both control lines are shared with PIO

pins and can be assigned to any PIO pin by setting the PS Keys PSKEY_USB_PIO_DETACH

and PSKEY_USB_PIO_WAKEUP to the selected PIO number.

USB_DETACH is an input which, when asserted high, causes WT12 to put USB_D- and

USB_D+ in high impedance state and turned off the pull-up resistor on D+. This detaches

the device from the bus and is logically equivalent to unplugging the device. When

USB_DETACH is taken low, WT12 will connect back to USB and await enumeration by the

USB host.

USB_WAKE_UP is an active high output (used only when USB_DETACH is active) to wake

up the host and allow USB communication to recommence. It replaces the function of the

software USB WAKE_UP message (which runs over the USB cable), and cannot be sent

while WT12 is effectively disconnected from the bus.

USB_WAKE_UP

USB_DETACH

Port_Imbedance

USB_DPUSB_DN

USB_PULL_UP

10ms m ax

10ms max 10ms max

No max

Disconnected

Figure 11: USB_DETACH and USB_WAKE_UP Signal

4.2.6 USB Driver

A USB Bluetooth device driver is required to provide a software interface between WT12

and Bluetooth software running on the host computer. Suitable drivers are available from

www.bluegiga.com/techforum/.

4.2.7 USB 1.1 Compliance

WT12 is qualified to the USB specification v1.1, details of which are available from

http://www.usb.org. The specificatio n contains valuable information o n aspects such as PCB

track impedance, supply inrush current and product labeling.

Although WT12 meets the USB specification, Bluegiga Technologies cannot guarantee that

an application circuit designed around the module is USB compliant. The choice of

application circuit, component choice and PCB layout all affect USB signal quality and

electrical characteristics. The information in this document is intended as a guide and

should be read in association with the USB specification, with particular attention being

given to Chapter 7. Independent USB qualification must be sought before an application is

deemed USB compliant and can bear the USB logo. Such qualification can be obtained

from a USB plug fest or from an independent USB test house.

Terminals USB_D+ and USB_D- adhere to the USB specification 2.0 (Chapter 7) electrical

requirements.

4.2.8 USB 2.0 Compatibility

WT12 is compatible with USB v2.0 host controllers; under these circumstances the two

ends agree the mutually acceptable rate of 12Mbits/s according to the USB v2.0

specification.

4.3 SPI Interface

The synchronous serial port interface (SPI) is for interfacing with other digital devices. The

SPI port can be used for system debugging. It can also be used for programming the Flash

memory. SPI interface is connected using the MOSI, MISO, CSB and CLK pins.

The module operates as a slave and thus MISO is an output of the module. MISO is not in

high-impedance state when CSB is pulled high. Instead, the module outputs 0 if the

processor is running and 1 if it is stopped. Thus WT11 should not be connected in a multi-

slave arrangement by simple parallel connection of slave MISO lines.

4.4 PCM Interface

Pulse Code Modulation (PCM) is a standard method used to digitize audio (particularly

voice) patterns for transmission over digital communication channels. Through its PCM

interface, WT12 has hardware support for continual transmission and reception of PCM

data, thus reducing processor overhead for wireless headset applications. WT12 offers a bi

directional digita l audio in terf ace that routes directly int o th e baseband lay er of th e on chip

firmware. It does not pass through the HCI protocol layer.

Hardware on WT12 allows the data to be sent to and received from a SCO connection. Up

to three SCO connections can be supported by the PCM interface at any one time.

WT12 can operate as the PCM interface Master generating an output clock of 128, 256 or

512kHz. When configured as PCM interface slave it can operate with an input clock up to

2048kHz. WT12 is compatible with a variety of clock formats, including Long Frame Sync,

Short Frame Sync and GCI timing environments.

It supports 13 or 16-bit linear, 8-bit -law or A-law companded sample formats at

8ksamples/s and can receive and transmit on any selection of three of the first four slots

following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PS

KEY_PCM_CONFIG32 (0x1b3). WT12 interfaces directly to PCM audio devices including the

following:

 Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices

 OKI MSM7705 four channel A-law and -law CODEC

 Motorola MC145481 8-bi t A-law and -law CODEC

 Motorola MC145483 13-bit linear CODEC

 STW 5093 and 5094 14-bit linear CODECs

 BlueCore4-External is also compatible with the Motorola SSI™ interface



4.4.1 PCM Interface Master/Slave

When configured as the Master of the PCM interface, WT12 generates PCM_CLK and

PCM_SYNC.

PCM_OUT

PCM_IN

PCM_CLK

PCM_SYNC 8kHz

128/256/512 kHz

WT12

Figure 12: WT12 as PCM master

When configured as the Slave of the PCM interface, WT12 accepts PCM_CLK and

PCM_SYNC. PCM_CLK rates up to 2048kHz are accepted.

PCM_OUT

PCM_IN

PCM_CLK

PCM_SYNC 8kHz

Up to 2048kHz

WT12

Figure 13: WT12 as PCM slave

4.4.2 Long Frame Sync

Long Frame Sync is the name given to a clocking format that controls the transfer of PCM

data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the

start of the PCM word. When WT12 is configured as PCM Master, generating PCM_SYNC

and PCM_CLK, then PCM_SYNC is 8-bits long. When BlueCore4-External is configured as

PCM Slave, PCM_SYNC may be from two consecutive falling edges of PCM_CLK to half the

PCM_SYNC rate, i.e. 62.5s long.

WT12 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the

rising edge. PCM_OUT may be configured to be high impedance on the falling edge of

PCM_CLK in the LSB position or on the rising edge.

12345678PCM_OUT

PCM_CLK

PCM_SYNC

12345678

undefined undefined

PCM_IN

Figure 14: Long frame sync (shown with 8-bit Companded Sample)

4.4.3 Short Frame Sync

In Short Frame Sync the falling edge of PCM_SYNC indicates the start of the PCM word.

PCM_SYNC is always one clock cycle long.

12345678PCM_OUT

PCM_CLK

PCM_SYNC

12345678

undefined

PCM_IN

9 10111213 14 15 16

9 10111213 14 15 16 undefined

Figure 15: Short frame sync (shown with 16-bit Companded Sample)

As with Long Frame Sync, WT12 samples PCM_IN on the falling edge of PCM_CLK and

transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high

impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.

4.4.4 Multi Slot Operation

More than one SCO connection over the PCM interface is supported using multiple slots.

Up to three SCO connections can be carried over any of the first four slots.

12345678PCM_OUT

PCM_CLK

LONG_PCM_SYNC

12345678

undefined undefined

PCM_IN

SHORT_PCM_SYNC

Figure 16: Multi Slot Operation with Two Slots and 8-bit Companded Samples

4.4.5 GCI Interface

WT12 is compatible with the General Circuit Interface, a standard synchronous 2B+D ISDN

timing interface. The two 64Kbps B channels can be accessed when this mode is

configured.

12345678PCM_OUT

PCM_CLK

PCM_SYNC

12345678

undefined

PCM_IN

12345678

undefined

Figure 17: GCI Interface

The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz. With

WT12 in Slave mode, the frequency of PCM_CLK can be up to 4.096MHz.

4.4.6 Slots and Sample Fo rmat s

WT12 can receive and transmit on any selection of the first four slots following each sync

pulse. Slot durations can be either 8 or 16 clock cycles. Duration’s of 8 clock cycles may

only be used with 8-bit sample formats. Durations of 16 clocks may be used with 8, 13 or

16-bit sample formats.

WT12 supports 13-bit linear, 16-bit linear and 8-bit -law or A-law sample formats. The

sample rate is 8ksamples/s. The bit order may be little or big Endian. When 16-bit slots

are used, the 3 or 8 unused bits in each slot may be filled with sign extension, padded

with zeros or a programmable 3-bit audio attenuation compatible with some Motorola

CODECs.

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Sign extension

8-bit sample

Figure 18: 16-bit slot with 8-bit companded sample and sign extension selected

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

8-bit sample

Zeros padding

Figure 19: 16-bit slot with 8-bit companded sample and zeros padding selected

PCM_OUT

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

3-bit sign

extension

13-bit samp le

Figure 20: 16-bit slot with 13-bit linear sample and sign extension selected

PCM_OUT

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Audio gain

13-bit sample

Figure 21: 16-bit slot with 13-bit linear sample and audio gain selected

4.4.7 Additional Features

WT12 has a mute facility that forces PCM_OUT to be 0. In Master mode, PCM_SYNC may

also be forced to 0 while keeping PCM_CLK running which some CODECS use to control

power down.

4.4.8 PCM Configuration

The PCM configuration is set using two PS Keys, PSKEY_PCM_CONFIG32 and

PSKEY_PCM_LOW_JITTER_CONFIG. The following tables detail these PS Keys. The default

for PSKEY_PCM_CONFIG32 key is 0x00800000 i.e. first slot following sync is active, 13-bit

linear voice format, long frame sync and interface master generating 256kHz PCM_CLK

from 4MHz internal clock with no tri-stating of PCM_OUT.

PSKEY_PCM_LOW_JIT TE R _CONFIG is described in Table 17.

Name Bit position Description

-0 Set to 0

SLAVE MODE EN 1

0 selects Master mode wi th internal generation of PCM_CLK and

PCM_SYNC. 1 selects Slave mod e requ iring e xternally generated

PCM_CLK and PCM_SYNC. This should be set to 1 if

48M_PCM_CLK_GEN _EN (bit 11) is set.

SHORT SYNC EN 2 0 selects long fram e sync (rising edge indicates start of frame), 1

selects shor t fram e sync (falling edge indicates start of frame).

- 3 Set to 0

SIGN EXTENDED

EN 4

0 selects pad ding of 8 or 13-bit voice sample into a 16- bit slot by

inserting extra LSBs, 1 selects sig n extension . When padding is

selected with 3-bit voice sample, the 3 padding bits are the aud io gain

setting; with 8-bit samples the 8 padding bits are zeroes.

LSB FIRST EN 5 0 transmits and r eceives voice samples MSB fir st, 1 uses LSB first.

TX TRISTATE EN 6 0 drives PCM_ OUT contin uously, 1 tri-states P CM_ OUT immediately

after the fa lling e dge of PCM_CLK in the last bit of an active slot,

assuming the next slot is not active.

TX TRI STA TE

RISING EDGE EN 70 tristates PCM_OUT im mediately after the falling edge of PCM_CLK

in th e last bit of an active slot, assum ing th e next slot is also not active.

1 tristates PCM_OUT after t he rising edge of PCM_CLK.

SYNC SUPPRESS

EN 80 enables PCM_SYNC ou tput when mast er, 1 suppresses PCM _SYNC

whilst keeping PCM_CLK running. Some CODECS utilize this to enter

a low power state.

GCI MODE EN 9 1 ena bles GCI mode.

MUTE EN 10 1 forces PCM_OUT to 0.

48M PCM CLK GEN

EN 11 0 sets PCM_CLK a nd PCM_SYNC genera tion via DDS from internal 4

MHz clock, as for BlueCor e4-External. 1 sets PCM_CLK and

PCM_SYNC generation via DDS fr om internal 48 MHz clock.

LONG LENGTH

SYNC EN 12 0 sets PCM_SYNC length to 8 PCM_CLK cycles an d 1 sets length to

16 PCM_CLK cycles. Only applies for long frame sync and with

48M_PCM_CLK_GEN_EN set to 1.

[

20:16

]

Set to 0b00000.

MASTER CLK R ATE [22:21] Selects 128 (0b01), 256 (0b00) , 512 (0b10) kHz PCM_CLK frequency

when master and 48M _PCM_CLK_GEN_EN (bit 11) is low.

ACTIVE SLOT

[

26:23

]

Default is 0001. I

nored b

firmaware

SAMPLE_FORMAT [28:27] Selects between 13 (0b00), 16 (0b01), 8 (0b 10) bit samp le with 16

cycle slot duration 8 ( 0b 11) bit samp le 8 cycle slot duration.

Table 16: PSKEY_PCM_CONFIG32 description

Name Bit position Description

CNT LIMIT [12:0] Sets PCM_CLK counter limit

CNT RATE [23:16] Sets PCM_CLK count rate.

SYNC LIMIT [31:24] Sets PCM_SYNC division relative to PCM_CLK.

Table 17: PSKEY_PCM_LOW_JITTER_CONFIG Desc ription

5. I/O PARALLEL PORTS

The Parallel Input Output (PIO) Port is a general-purpose I/O interface to WT12. The port

consists of six programmable, bi-directional I/O lines, PIO[2:7]. Programmable I/O lines

can be accessed either via an embedded application running on WT12 or via private

channel or manufacturer-specific HCI commands.

All PIO lines are configured as inpu ts with weak pull downs at reset.

PIO[2] / USB_PULL_UP (1)

The function depends on whether WT12 is a USB or UART capable version. On UART

versions, this terminal is a programmable I/O. On USB versions, it can drive a pull-up

resistor on USB_D+. For application using external RAM this terminal may be programmed

for chip select.

PIO[3] / USB_WAKE_UP (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, its

function is selected by setting the Persistent Store Key PSKEY_USB_PIO_WAKEUP (0x2cf)

either as a programmable I/O or as a USB_WAKE_UP function.

PIO[4] / USB_ON (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, the

USB_ON function is also selectable.

PIO[5] / USB_DETACH (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, the

USB_DETACH function is also selectable.

PIO[6] / CLK_REQ

Function is determined by Persistent Store Keys. Using PSKEY_CLOCK _REQUEST_ENABLE,

(0x246) this terminal can be configured to be low when WT12 is in deep sleep and high

when a clock is required. The clock must be supplied within 4ms of the rising edge of

PIO[6] to avoid losing timing accuracy in certain Bluetooth operating modes.

PIO[7]

Programmable I/O terminal.

6. SOFTWARE STACKS

WT12 is supplied with Bluetooth v2.0 + EDR compliant stack firmware, which runs on the

internal RISC microcontroller.

The WT12 software architecture allows Bluetooth processing and the application program

to be shared in different ways between the internal RISC microcontroller and an external

host processor (if any). The upper layers of the Bluetooth stack (above HCI) can be run

either on-chip or on the host processor.

6.1 iWRAP Stack

PCM I/O

Host I/O

Radio

48kB RAM Baseband MCU

HCI

L2CAP

RFCOMM SDP

iWRAP

UART

Host I/O

PCM

Figure 22: WRAP THOR VM Stack

In figure 23 above, the iWRAP software solution is described. In this version of the stack

firmware shown no host processor is required to run the Bluetooth protocol stack. All

software layers, including application software, run on the internal RISC processor in a

protected user software execution environment known as a Virtual Machine (VM).

The host processor interfaces to iWRAP software via one or more of the physical

interfaces, which are also shown in the figure 23. The most common interfacing is don e via

UART interface using the ASCII commands supported by the iWRAP software. With these

ASCII commands the user can access Bluetooth functionality without paying any attention

to the complexity, which lies in the Bluetooth protocol stack.

The user may write applications code to run on the host processor to control iWRAP

software with ASCII commands and to develop Bluetooth powered applications.

Notes:

More details of iWRAP software and it’s features can be found from iWRAP User Guide

which can be downloaded from www.bluegiga.com.

6.2 HCI Stack

PCM I/O

Host I/O

Radio

48kB RAM Baseband MCU

HCI

UART

USB

Host

I/O

PCM

Figure 23: WRAP THOR HCI Stack

In the implementation shown in figure 24 the internal processor runs the Bluetooth stack

up to the Host Controller Interface (HCI). The Host processor must provide all upper layers

including the application.

Features of HCI Stack

1. New Bluetooth v2.0 + EDR Mandatory Functionality:

 (AFH), including classifier

 Faster connection – enhanced inquiry scan (immediate FHS response)

 LMP improvements

 Parameter ranges

2. Optional v2.0 functionality supported:

 Adaptive Frequency Hopping (AFH) as Master and Automatic Channel Classification

 Fast Connect – Interlaced Inquiry and Page Scan plus RSSI during Inquiry

 Extended SCO (eSCO), eV3 +CRC, eV4, eV5

 SCO handle

 Synchronization

The firmware has been written against the Bluetooth v2.0 + EDR Specification.

 Bluetooth components:

o Baseband (including LC)

o LM

o HCI

 Standard USB v2.0 (full speed) and UART HCI Transport Layers

 All standard radio packet types

 Full Bluetooth data rate, enhanced data rates of 2 and 3Mbps(1)

 Operation with up to seven active slaves(1)

 Scatternet v2.5 operation

 Maximum number of simultaneous active ACL connections: 7(2)

 Maximum number of simultaneous active SCO connections: 3(2)

 Operation with up to three SCO links, routed to one or more slaves

 All standard SCO voice coding, plus “transparent SCO”

 Standard operating modes: page, inquiry, page-scan and inquiry-scan

 All standard pairing, authentication, link key and encryption operations

 Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including

Forced Hold”

 Dynamic control of peers’ transmit power via LMP

 Master/Slave switch

 Broadcast

 Channel qual ity driven data rate

 All standard Bluetooth Test Modes

The firmware’s supported Bluetooth features are detailed in the standard Protocol

Implementation Conformance (PICS) documents. They can be asked separately form

support@bluegiga.com.

Extra functionality:

 Supports BlueCore Serial Protocol (BCSP) – a proprietary, reliable alternative to the

standard Bluetooth UART Host Transport

 Provides a set of approximately 50 manufacturer-specific HCI extension commands.

This command set (called BCCMD – “BlueCore Command”), provides:

 Access to the chip’s general-purpose PIO port

 The negotiated effect ive encryption key length on established Bluetooth links

 Access to the firmware’s random number generator

 Controls to set the default and maximum transmit powers – these can help minimize

interference between overlapping, fixed-location piconets

 Dynamic UART configuration

 Radio transmitter enable/disable – a simple command connects to a dedicated

hardware switch that determines whether the radio can transmit

 The firmware can read th e v oltage on a pair of the chip’s external pins. This is normally

used to build a battery monitor, using either VM or host code

 A block of BCCMD commands provides access to the chip’s “persistent store”

configuration database (PS). The database sets the device’s Bluetooth address, Class

of Device, radio (transmit class) configuration, SCO routing, LM, USB and DFU

constants, etc.

 A UART “break” condition can be used in three ways:

 Presenting a UART break condition to the chip can force the chip to perform a hardware

reboot

 Presenting a break condition at boot time can hold the chip in a low power state,

preventing normal initialization while the condition exists

 With BCSP, the firmware can be configured to send a break to the host before sending

data – normally used to wake the host from a deep sleep state

 The DFU standard has been extended with public/private key authentication, allowing

manufacturers to control the firmware that can be loaded onto their Bluetooth modules

 A modified version of the DFU protocol allows firmware upgrade via the chip’s UART

 A block of “radio test” or BIST commands allows direct control of the chip’s rad io. This

aids the development of modules’ radio designs, and can be used to support Bluetooth

qualification.

 Virtual Machine (VM). The firmware provides the VM environment in which to run

application-specific code. Although the VM is mainly used with BlueLab and “RFCOMM

builds” (alternative firmware builds providing L2CAP, SDP and RFCOMM), the VM can

be used with this build to perform simple tasks such as flashing LED’s via the chip’s

PIO port.

 Hardware low power modes: shallow sleep and deep sleep. The chip drops into modes

that significantly reduce power consumption when the software goes idle.

 SCO channels are normally routed via HCI (over BCSP). However, up to three SCO

channels can be routed over the chip’s single PCM port (at the same time as routing

any remaining SC O channels over HCI).

 Co-operative existence with 802.11b/g chipsets. The device can be optionally

configured to support a number of different co-existence schemes including:

o TDMA - Bluetooth and WLAN avoid transmitting at the same time.

o FDMA - Bluetooth avoids transmitting within the WLAN channel

o Combination TDMA & FDMA - Bluetooth avoids transmitting in the WLAN

channel only when WLAN is active.

 Please refer to separate documentation f or f ull det ails of the co-existence schemes that

CSR supports.

Notes:

1. Supports basic data rate up to 723.2kbps asymmetric, maximum allowed by

Bluetooth v2.0 + EDR specification

2. WT12 supports all combinations of active ACL and SCO channels for both Master

and

3. Always refer to the Firmware Release Note for the specific functionality of a

particular build.

6.3 RFCOMM Stack

PCM I/O

Host I/O

Radio

48kB RAM Baseband MCU

HCI

L2CAP

RFCOMM SDP

UART

USB

Host

I/O

PCM

Figure 24: WRAP THOR RFCOMM stack

In the version of the firmware, shown in Figure 25, the upper layers of the Bluetooth stack

up to RFCOMM are run on-chip. This reduces host-side software and hardware

requirements at the expense of some of the power and flexibility of the HCI only stack.

Features of RFCOMM Stack

Interfaces to Host:

 RFCOMM, an RS-232 serial cabl e emulation protocol

 SDP, a service database look-up protocol

Connectivity:

 Maximum number of active slaves: 3

 Maximum number of simultaneous active ACL connections: 3

 Maximum number of simultaneous active SCO connections: 3

 Data Rate: up to 350kbps1

Security:

 Full support for all Bluetooth security features up to and includi n g strong (128-bit)

 encryption.

Power Saving:

 Full support for all Bluetooth power saving modes (Park, Sniff and Hold).

Data Integrity:

 CQDDR increases the effective data rate in noisy environments.

 RSSI used to minimi ze in terference to other radio devices using the ISM band.

Notes:

1. The data rate is with respect to WT12 with basic data rate packets.

6.4 VM Stack

PCM I/O

Host I/O

Radio

48kB RAM Baseband MCU

HCI

L2CAP

RFCOMM SDP

VM Application Software

UART

USB

Host

I/O

PCM

Figure 25: WRAP THOR VM Stack

In figure 26, this version of the stack firmware shown requires no host processor (but can

use a host processor for debugging etc.). All software layers, including application

software, run on the internal RISC processor in a protected user software execution

environment known as a Virtual Machine (VM).

The user may write custom application code to run on the BlueCore VM using BlueLab™

software development kit (SDK) supplied with the Casira development kit, available

separately from Bluegiga or directly form CSR. This code will then execute alongside the

main WRAP THOR firmware. The user is able to make calls to the WRAP THOR firmware for

various operations. WRAP THOR firmware is not equal to iWRAP firmware, which on the

contrary does not allow user to run own firmware in the module.

The execution environment is structured so the user application does not adversely affect

the main software routines, thus ensuring that the Bluetooth stack software component

does not need re-qualification when the application is changed.

Using the VM and the BlueLab SDK the user is able to develop applications such as a

cordless headset or other profiles without the requirement of a host controller. BlueLab is

supplied with example code including a full implementation of the headset profile.

Notes:

Sample applications t o control PIO lines can al so be written with BlueLab SDK and the VM

for the HCI stack.

6.5 HID Stack

PCM I/O

Host I/O

Radio

48kB RAM Baseband MCU

HCI

L2CAP

HID SDP

VM Application Software

UART

Sensing

Hardware I/O

Figure 26: WRAP THOR HID stack

This version of the stack firmware requires no host processor. All software layers,

including application software, run on t he internal RISC microcon troller in a protec ted user

software execution environment known as a virtual machine (VM).

The user may write custom application code to run on the BlueCore VM using BlueLab

Professional software development kit (SDK) supplied with the BlueLab Professional and

Casira development kits, available separately from CSR. This code will then execute

alongside the main BlueCore firmware. The user is able to make calls to the BlueCore

firmware for various operations.

The execution environment is structured so the user application does not adversely affect

the main software routines, thus ensuring that the Bluetooth stack software component

does not need re-qualificat ion when the application is changed.

Using the VM and the BlueLab Professional SDK the user is able to develop Bluetooth HID

devices such as an optical mouse or keyboard. The user is able to customize features

such as power management and connect /reconnect behavior.

The HID I/O component in the HID stack controls low latency data acquisition from

external sensor hardware. With this component running in native code, it does not incur

the overhead of the VM code interpreter. Supported external sensors include 5 mouse

buttons, the Agilent ADNS-2030 optical sensor, quadrature scroll wheel, direct coupling to

a keyboard matrix and a UART interface to custom hardware.

A reference schematic for implementing a three button, optical mouse with scroll wheel is

available separately.

Software Development

WT12 Evaluation Kits are available to allow the evaluation of the WT12 hardware and

software as well CSR BlueLab toolkit for developing on-chip and host software.

7. ENHANCED DATA RATE

EDR has been introduced to provide 2x and optionally 3x data rates with minimal

disruption to higher layers of the Bluetooth stack. CSR supports both of the new data

rates, with WT12. WT 12 is complia nt with revision v2.0.E.2 of the specification.

7.1 Enhanced Data Rate Baseband

At the baseband level EDR uses the same 1.6kHz slot rate as basic data rate and therefore

the packets can be 1, 3, or 5 slots long as per the basic data rate. Where EDR differs from

the basic data rate is that in the same 1MHz symbol rate 2 or 3bits are used per symbol,

compared to 1bit per symbol used by the basic data rate. To achieve the increase in

number of bits symbol, two new modulation schemes have been introduced as

summarized in Table 18 presented below and the modulation schemes are explained in the

further sections.

Scheme Bits per symbol Modulation

Basic data rate 1 GFSK

Enhanced data rate 2 P/4 DQPSK

Enhanced data rate 3 8DPSK (optional)

Table 18: Data rate schemes

Although the EDR uses new packets Link establishment and management are unchanged

and still use Basic Rate packets.

7.2 Enhanced Data Rate /4 DQPSK

4-state Differential Phase Shift Keying

2 bits determine phase shift between consecutive symbols

/4 rotation avoids phase shift of

, which would cause large amplitude variation

Raised Cosine pulse shaping filt er to further reduce side band emissions

Bit pattern Phase shift

















Table 19: 2 bits determine phase shift between consecutive symbols

7.3 8DQPSK

8-state Differential Phase-Shift Keyin g

Three bits determine phase shift between consecutive symbols.

Bit pattern Phase shift



























































Table 20: 3 bits determine phase shift between consecutive symbols

Figure 27: 8DQPSK

8. LAYOUT AND SOLDERING CONSIDERATIONS

8.1 Soldering recommendations

WT12 is compatible with industrial standard reflow profile for Pb-free solders. The reflow

profile used is dependent on the thermal mass of the entire populated PCB, heat transfer

efficiency of the oven and particular type of solder paste used. Consult the datasheet of

particular solder paste for profile configurations.

Bluegiga Technologies will give following recommendations for soldering the module to

ensure reliable solder joint and operation of the module after soldering. Since the profile

used is process and layout dependent, the optimum profile should be studied case by case.

Thus following recommendation should be taken as a starting point guide.

 Refer to technical documentations of particular solder paste for profile configurations

 Avoid using more than one flow.

 Reliability of the solder joint and self-alignment of the component are dependent on

the solder volume. Min imu m of 150m stencil thickness is recommend ed.

 Aperture size of the stencil should be 1:1 with the pad size.

 A low residue, “no clean” solder paste should be used due to low mounted height of

the component.

8.2 Layout guidelines

It is strongly recommended to use good layout practices to ensure proper operation of the

module. Placing copper or any metal near antenna deteriorates its operation by having

effect on the matching properties. Metal shield around the antenna will prevent the

radiation and thus metal case should not be used with the module. Use grounding vias

separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating

inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB

edges. Figure 5 illustrates recommended PCB design around the antenna of WT12 when

the module is placed at the edge of a PCB.

Do not place copper on the top layer under the module, as shown in figure 5. The module

has vias on the area shown, which can cause short circuit if there is copper underneath.

Any metal placed closer than 20 mm in any direction from the antenna changes the

matching properties and thus will considerably deteriorate the RF performance of the

module.

Figure 28: Suggested PCB design around ACX antenna with the module at the edge of PCB

Following recommendations helps to avoid EMC problems arising in the design. Note that

each design is unique and the following list do not consider all basic design rules such as

avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC

problems caused by RF part of the module. Use good consideration to avoid problems

arising from digital signals in the design.

 Do not remove copper from the PCB more than needed. Use ground filling as much

as possible. However remove small floating islands after copper pour.

 Do not place a ground plane underneath the antenna. The grounding areas under

the module should be designed as shown in Figure 5.

 Use conductive vias separated max. 3 mm apart at the edge of the ground areas.

This prevents RF to penetrate inside the PCB. Use ground vias extensively all over

the PCB. If you allow RF freely inside the PCB, you have a potential resonator in

your hand. All the traces in (and on) the PCB are potential antennas.

 Avoid loops.

 Ensure that signal lines have return paths as short as possible. For example if a

signal goes to an inner layer through a via, always use ground vias around it. Locate

them tightly and symmetrically around the signal vias.

 Routing of any sensitive signals should be done in the inner layers of th e PCB.

 Sensitive traces should have a ground area above and under the line. If this is not

possible make sure that the return path is short by other means (for example using

a ground line next to the signal line).

9. WT12 PHYSICAL DIMENSIONS

WT12-A Dimensions

Tol. +/- 0.2mm

ant 1.6 +/- 0.2 mm

3.2 +/- 0.2mm

14 mm

25.0 mm

0.5mm

10.0 mm

20.0 mm

5.0 mm

BLUEGIGA

PCB thickness 0.8mm

ant 2.0 mm

2.4 mm

ant

Figure 29: WT12 dimensions

Figure 30: WT12 foot print and dimension (top view)

Figure 31: WT12 pad dimensions

10. PACKAGE

Figure 32: Reel information

Figure 33: Tape information

11. CERTIFICATIONS

WT12 is compliant to the fo llowing specifications

11.1 Bluetooth

WT12 module is Bluetooth qualified and listed as an end product. If not modified in any

way, it is a complete Bluetooth entity, containing software and hardware functionality as

well as the whole RF-part including the antenna. This practically translates to that if the

module is used without modification of any kind, it does not need any Bluetooth approval

work. If changes are made in the parameter set, added profiles or in the antenna design,

it is required to be submitted to a BQB (Bluetooth Qualification Body) for evaluation on

what needs to be tested.

With HCI firmware WT12 w ill not meet the requirements of end product qualification.

WT12 is Bluetooth complian t to the following specifications

1. RF as defined in Part A of t he Bluetooth specification v2 .0+EDR, Vol.2 Core System

Package [Controller volume] (Class 1 operation) with all optional and mandatory

features supported.

2. BB as defined in Part B of the Bluetooth specification v2.0+EDR, Vol. 2 Core System

Package [Controller volume], and specified in the covered functionality of the

Software Integrated Component (Bluetooth ID: B01294)

3. LM as defined in Part C of the Bluetoot h specification v2. 0+EDR, Vol.2 C ore System

Package [Controller volume], and specified in the covered functionality of the

Software Integrated Component (Bluetooth ID: B01294)

4. L2CAP as defined in Part A of the Bluetooth specification v2.0+EDR, Vol.3 Core

System Package [Controller volume], and specified in the covered functionality of

the Software Integrated Component (Bluetooth ID: B00477)

5. SDP as defined in Part B of the Bluetooth specification v2.0+EDR, Vol.3 Core

System Package [Controller volume], and specified in the covered functionality of

the Software Integrated Component (Bluetooth ID: B00477)

6. RFCOMM as defined in PART F:1 of the Bluetooth Core Specification v1.1 and

specified in the covered functionality of the Software Integrated Component

(Bluetooth ID: B00047).

7. Generic Access GAP as defined in PART C of the Bluetooth Core Specification

v2.0+EDR, Vol.3 Core Systems Package [Host Volume], and specified in the

covered functionality of the Software Integrated Component (Bluetooth ID:

B00047).

8. Serial Port Profile (SPP) as defined in PART K:5 of the Bluetooth Profile Specification

v1.1, and specified in the covered functionality of the Software Integrated

Component (Bluetooth ID: B00047).

Bluetooth identifier: B03005

11.2 FCC

Federal Communications Commission (FCC) Statement

15.21

You are cautioned that changes or modifications not expressly approved by the part

responsible for compliance could void the user’s authority to operate the equipment.

15.105(b)

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the

user is encouraged to try to correct the interference by one or more of the following

measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

Operation is subject to the following two conditions:

 This device may not cause interference and

 This device must accept any interference, including interference that may cause

undesired operation of the device.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. End users must follow the specific operating instructions for satisfying RF

exposure compliance. This transmitter must not be co-located or operating in conjunction

with any other antenna or transmitter.

Note: The end product shall has the words “Contains Transmitter Module FCC ID:

QOQWT12”

WT12-A FCC ID: QOQWT12

11.3 CE

WT12 meets the requirements of the standards below and hence fulfills the requirements

of EMC Directive 89/336/EEC as amended by Directives 92/31/EEC and 93/68/EEC within

CE marking requirement.

 Electromagnetic emission EN 301 489-17 V.1.2.1

o EN 55022:1998+A

o EN 55022:2000+A3

o EN 55022:2003 Class B

o EN 61000-3-2:2001

o EN 61000-3-3:1995 A1:2001

o EN 61000-4-3:2002

o EN 61000-4-4:1995 A1:2000

o EN 61000-4-5:1995 A1:2000

o EN 61000-4-6:1996 A1:2000

o EN 61000-4-11:1994 A1:2000

 ETSI EN 300.328 V1.6.1:2004

11.4 Industry Canada (IC)

WT12 meets Industry Canada’s procedural an d specification requirements for certif ication.

Industry Canada ID: 5123A-BGTWT12A

12. ROHS STATEMENT WITH A LIST OF BANNED MATERIALS

WT12 meets the requirements of Directive 2002/95/EC of the European Parliament and of

the Council on the Restriction of Hazardous Substance (RoHS)

The following banned substances are not present in WT11, which is compliant with RoHS:

 Cadmium

 Lead

 Mercury

 Hexavalent chromium

 PBB (Polybrominated Bi-Phenyl)

 PBDE (Polybrominated Diphenyl Ether)

13. CONTACT INFORMATION

Sales: sales@bluegiga.com

Technical support: support@bluegiga.com

http://www.bluegiga.com/techforum/

Orders: orders@bluegiga.com

Head Office / Finland

Phone: +358-9-4355 060

Fax: +358-9-4355 0660

Street Address:

Sinikalliontie 11

02630 ESPOO

FINLAND

Postal address:

P.O. BOX 120

02631 ESPOO, FINLAND

Sales Office / USA

Phone: (781) 556-1039

Bluegiga Technologi es, Inc.

99 Derby Street, Suit e 200

Hingham, MA 02043