1
2
notice_e-01
Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s ofcial sales channel.
Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
140
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mlci08_e-01
FEATURES
ORDERING CODE
EXTERNAL DIMENSIONS/STANDARD QUANTITY
AVAILABLE MATERIALS
APPLICATIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Internal code
Standard Products
△=Blank Space
External Dimensions
L×Wmm
060302010.6×0.3
100504021.0×0.5
160806031.6×0.8
212508052.0×1.25
Impedance 〔Ω〕
example
330 33
101 100
391 390
Characteristics
Standard Products
Type
BKP
MULTILAYER CHIP BEAD
INDUCTORS FOR POWER
LINES
B K P 1 6 0 8 H S 1 8 1 T
Packaging
T Tape & Reel
Material
HS Refer to impedance
Curves for material
differrences
HM
Type L W T e Standard Quantity pcs
Paper Tape Embossed Tape
BKP0603
0201
0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 15000
0.024±0.001 0.012±0.001 0.012±0.0010.006±0.002
BKP1005
0402
1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 10000
0.039±0.002 0.020±0.002 0.020±0.002 0.010±0.004
BKP1608
0603
1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 4000
0.063±0.006 0.031±0.006 0.031±0.006 0.012±0.008
BKP2125
0805
2.00.3
0.1 1.25±0.2 0.85±0.2 0.5±0.3 4000
0.0790.012
0.004 0.049±0.008 0.033±0.008 0.020±0.012
Unitmminch
Low Rdc value can lower the power consumption and extend the life
of batteries. That stands on the high advanced green sheet and print-
ing technologies.
No need for grounding provides greater flexibility in circuit design.
HS With low R-XL cross point frequency characteristics and large
resistance part working as damping function, suppresses un-
necessary resonance and keeps signal integrity.
HM Resistance part rising exceeding from 20MHz. For general usage.
TS : Low DC resistance HS version. For power supply lines.
TM Low DC resistance HM version.
◦High frequency noise debug on the DC power supply line in personal
computers and other information system products.
Noise suppression in USB and IEEE1394 interface.
Prevents interference between circuits in mobile systems
(PDC, PHS, PDA)
MULTILAYER CHIP BEAD INDUCTORS FOR
POWER LINES (BK SERIES P TYPE)
REFLOWWAVE*
I max=1.0A
I max=1.54A
I max=13A
100
80
60
40
20
2
1 HS330
2 HS220
500
250
1
2
4
5
3
1 HS331
2 HS221
3 HS101
4 HS600
5 HS330
100
0
200
300
400
500
600
700
110 100 1000
11
2
2
4
4
3
3
5
5
6
6
7
7
7
8
2 HS391
1 HS471
3 HS271
4 HS181
6 HS101
5 HS121
7 HS600
8 HS330
500
400
300
200
100
1 HM221
2 HM121
1
2
500
250
1 TM121
1
1
2
3
1121
2680
3330
500
400
300
200
100
I max=0.82.0A
BKP0603
BKP2125
BKP1608
BKP1005
HS type
HS type
HS type
HS type HM type TM type
TS type
I max=0.91.1A I max=1.3A
I max=1.31.7A
OPERATING TEMP.
5585
Except for BKP0603, BKP1005
500
400
300
200
100
2
3
5
1 HS221
2 HS121
3 HS680
4 HS330
5 HS100
4
141
1
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mlci08_e-01
NOISE SUPPRESSION COMPONENTS
FERRITE BEAD INDUCTORS
PART NUMBERS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Ordering code
EHS
Environmental
Hazardous
Substances
Impedance
〔Ω
Measuring
frequency
MHz
DC resistance
mΩ max.
Rated current
A max.
Thickness
mm inch
BKP0603 HS 220 RoHS 22±25100 65 1.0 0.30±0.03
0.012±0.001
BKP0603 HS 330 RoHS 33±2570 1.0
BKP0603
BKP1005
BKP1608
BKP2125
Ordering code
EHS
Environmental
Hazardous
Substances
Impedance
〔Ω
Measuring
frequency
MHz
DC resistance
mΩ max.
Rated current
A max.
Thickness
mm inch
BKP10 05 HS 100 RoHS 10±25
100
30 2.0
0.50±0.05
0.02±0.002
BKP10 05 HS 330 RoHS 33±2550 1.7
BKP10 05 HS 680 RoHS 68±2575 1.5
BKP10 05 HS 121 RoHS 120±25140 1.0
BKP10 05 HS 221 RoHS 220±25200 0.8
BKP10 05 HM 121 RoHS 120±25120 1.1
BKP10 05 HM 221 RoHS 220±25180 0.9
BKP10 05 TS 330 RoHS 33±2539±30% 1.7
BKP10 05 TS 680 RoHS 68±2555±30% 1.5
BKP10 05 TS 121 RoHS 120±2570±30% 1.3
BKP10 05 TM 121 RoHS 120±25100 1.3
Ordering code
EHS
Environmental
Hazardous
Substances
Impedance
〔Ω
Measuring
frequency
MHz
DC resistance
mΩ max.
Rated current
A max.
Thickness
mm inch
BKP1608 HS 330 RoHS 33±25
100
25 3.0
0.80±0.15
0.031±0.006
BKP1608 HS 600 RoHS 60±2540 2.5
BKP1608 HS 101 RoHS 100±2550 1.7
BKP1608 HS 121 RoHS 120±2535 2.7
BKP1608 HS 181 RoHS 180±2575 1.5
BKP1608 HS 271 RoHS 270±25110 1.2
BKP1608 HS 391 RoHS 390±25140 1.0
BKP1608 HS 471 RoHS 470±25180 1.0
Ordering code
EHS
Environmental
Hazardous
Substances
Impedance
〔Ω
Measuring
frequency
MHz
DC resistance
mΩ max.
Rated current
A max.
Thickness
mm inch
BKP2125 HS 330 RoHS 33±25
100
20 4.0
0.85±0.2
0.033±0.008
BKP2125 HS 600 RoHS 60±2525 3.0
BKP2125 HS 101 RoHS 100±2540 2.5
BKP2125 HS 221 RoHS 220±2550 2.0
BKP2125 HS 331 RoHS 330±2575 1.5
142
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mlci08_e-01
ELECTRICAL CHARACTERISTICS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
100
80
60
40
20
0
110 100 1000
BKP0603 HS220
100
80
60
40
20
0
110 100 100001000
BKP0603 HS330
100
80
60
40
20
0
110 100 100001000
BKP1005 HS330
250
200
150
100
50
0
110 100 100001000
BKP1005 HS680
250
200
150
100
50
0
110 100 100001000
BKP1005 HM121
250
200
150
100
50
0
110 100 100001000
BKP1005 TS121
500
400
300
200
100
0
110 100 100001000
BKP1005 HS221
250
200
150
100
50
0
110 100 100001000
BKP1005 TS680
250
200
150
100
50
0
110 100 100001000
BKP1608 HS101
BKP1608 HS121
250
200
150
100
50
0
110 100 100001000
100
80
60
40
20
0
110 100 1000 10000
BKP1608 HS600
500
400
300
200
100
0
110 100 100001000
BKP1005 HM221
500
400
300
200
100
0
110 100 100001000
BKP1005 TM121
700
400
500
600
300
200
100
0
110 100 1000 10000
BKP1608 HS471
100
80
60
40
20
0
110 100 100001000
BKP1005 TS330
BKP1005 HS121
250
200
150
100
50
0
110 100 100001000
100
80
60
40
20
0
110 100 10000
1000
BKP1608 HS330
BKP0603
BKP1005
500
250
0
110 100 1000
BKP1608 HS391
100
50
0
110 100 1000
BKP2125 HS330
BKP2125
100
50
0
110 100 1000
BKP2125 HS600
500
250
0
110 100 1000
BKP2125 HS101
BKP1608
500
400
300
200
100
0
110 100 1000 10000
BKP1608 HS181
500
400
300
200
100
0
110 100 1000 10000
BKP1608 HS271
100
80
60
40
20
0
110 100 1000 10000
BKP1005 HS100
143
1
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mlci08_e-01
NOISE SUPPRESSION COMPONENTS
FERRITE BEAD INDUCTORS
ELECTRICAL CHARACTERISTICS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
500
250
0
110 100 1000
BKP2125 HS221
500
250
0
110 100 1000
BKP2125 HS331
1
2
mlci0109_reli-PRP1 mlci0109_reli_e-01
PACKAGING
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Tape & Reel Packaging
Minimum Quantity Taping material
Paper tape (0.315 inches wide)
Taping Dimensions
Unit : mm inch
To next page
C K 2125
C K S 2125
C K P 2012
C K P 2016
C K P 25 2 0
N M 2012
N M 25 20
L K 2 125
H K 2125
B K 2125
B K 3 216
Type
Thickness
mm
inch
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
CK160806030.8
0.031
1.0±0.2
0.039±0.008
1.8±0.2
0.071±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
CK212508050.85
0.033
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
CKS21250805
0.85
0.033
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
LK100504020.5
0.020
0.65±0.1
0.026±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
LK160806030.8
0.031
1.0±0.2
0.039±0.008
1.8±0.2
0.071±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
LK212508050.85
0.033
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
HK0402010050.2
0.008
0.25±0.04
0.010±0.002
0.45±0.04
0.018±0.002
2.0±0.05
0.079±0.002
0.36
0.014max
HK060302010.3
0.012
0.40±0.06
0.016±0.002
0.70±0.06
0.028±0.002
2.0±0.05
0.079±0.002
0.45
0.018max
HK100504020.5
0.020
0.65±0.1
0.026±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
HK160806030.8
0.031
1.0±0.2
0.039±0.008
1.8±0.2
0.071±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
HKQ0603S0201
0.3
0.012
0.40±0.06
0.016±0.002
0.70±0.06
0.028±0.002
2.0±0.05
0.079±0.002
0.45
0.018max
HKQ0603U0201
0.3
0.012
0.40±0.06
0.016±0.002
0.70±0.06
0.028±0.002
2.0±0.05
0.079±0.002
0.45
0.018max
AQ10504020.5
0.020
0.75±0.1
0.030±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
Type Thickness
mm inch
Standard Quantity pcs
Paper Tape Embossed Tape
CK160806030.8 4000
0.031
CK21250805
0.85 4000
0.033
1.25 2000
0.049
CKS21250805
0.85 4000
0.033
1.25 2000
0.049
CKP201208050.9 3000
0.035
CKP201608060.9 3000
0.035
CKP25201008
0.7 3000
0.028
0.9 3000
0.035
1.1 2000
0.043
NM201208050.9 3000
0.035
NM252010081.1 2000
0.043
LK100504020.5 10000
0.020
LK160806030.8 4000
0.031
LK21250805
0.85 4000
0.033
1.25 2000
0.049
HK0402010050.2 20000
0.008
HK060302010.3 15000
0.012
HK100504020.5 10000
0.020
HK160806030.8 4000
0.031
HK21250805
0.85 4000
0.033
1.0 3000
0.039
HKQ0603S02010.3 15000
0.012
HKQ0603U02010.3 15000
0.012
AQ10504020.5 10000
0.020
BK0402010050.2 20000
0.008
BK060302010.3 15000
0.012
BK100504020.5 10000
0.020
BKH100504020.5 10000
0.020
BK160806030.8 4000
0.031
BK21250805
0.85 4000
0.033
1.25 2000
0.049
BK201008040.45 4000
0.018
BK321612060.8 4000
0.031
BKP060302010.3 15000
0.012
BKP100504020.5 10000
0.020
BKP160806030.8 4000
0.031
BKP212508050.85 4000
0.033
C K 16 0 8
C K 2 125
C K S 2125
L K 10 0 5
L K 16 0 8
L K 2 125
H K 04 0 2
H K 06 0 3
H K 10 0 5
H K 16 0 8
H K Q 0 6 0 3
A Q 10 5
B K 04 0 2
B K 06 0 3
B K 10 0 5
B K 16 0 8
B K 2 125
B K 2 010
B K P 0 6 0 3
B K P 10 0 5
B K P 16 0 8
B K P 2125
B K H 10 0 5
1
2
mlci0109_reli-PRP2
mlci0109_reli_e-01
PACKAGING
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Unit : mm inch
Embossed Tape (0.315 inches wide)
LEADER AND BLANK PORTION
160mm or more
6.3inches or more
Direction of tape feed
100mm or more
3.94inches or more
400mm ore more
15.7inches or more
Reel Size
Top tape strength
The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as
illustrated below.
Type
Thickness
mm
inch
Chip cavity Insertion
Pitch
Tape
Thickness
A B F T
BK0402010050.2
0.008
0.25±0.04
0.010±0.002
0.45±0.04
0.018±0.002
2.0±0.05
0.079±0.002
0.36
0.014max
BK060302010.3
0.012
0.40±0.06
0.016±0.002
0.70±0.06
0.028±0.002
2.0±0.05
0.079±0.002
0.45
0.018max
BK100504020.5
0.020
0.65±0.1
0.026±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
BK160806030.8
0.031
1.0±0.2
0.039±0.008
1.8±0.2
0.071±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
BK212508050.85
0.033
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
BK201008040.45
0.018
1.2±0.1
0.047±0.004
2.17±0.1
0.085±0.004
4.0±0.1
0.157±0.004
0.8
0.031max
BKP060302010.3
0.012
0.40±0.06
0.016±0.002
0.70±0.06
0.028±0.002
2.0±0.05
0.079±0.002
0.45
0.018max
BKP100504020.5
0.020
0.65±0.1
0.026±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
BKP160806030.8
0.031
1.0±0.2
0.039±0.008
1.8±0.2
0.071±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
BKP212508050.85
0.033
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.1
0.043max
BKH100508050.5
0.020
0.65±0.1
0.026±0.004
1.15±0.1
0.045±0.004
2.0±0.05
0.079±0.002
0.8
0.031max
Unit : mm inch
Type
Thickness
mm
inch
Chip cavity Insertion
Pitch
Tape
Thickness
A B F K T
CK21250805
1.25
0.049
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
2.0
0.079
0.3
0.012
CKS21250805
1.25
0.049
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
2.0
0.079
0.3
0.012
CKP20120805
0.9
0.035
1.55±0.2
0.061±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.3
0.051
0.3
0.012
CKP20160806
0.9
0.035
1.8±0.1
0.071±0.004
2.2±0.1
0.087±0.004
4.0±0.1
0.157±0.004
1.3
0.051
0.25
0.01
CKP25201008
0.7
0.028
2.3±0.1
0.091±0.004
2.8±0.1
0.110±0.004
4.0±0.1
0.157±0.004
1.4
0.055
0.3
0.012
0.9
0.035
1.4
0.055
1.1
0.043
1.7
0.067
NM20120805
0.9
0.035
1.55±0.2
0.061±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.3
0.051
0.3
0.012
NM25201008
1.1
0.043
2.3±0.1
0.091±0.004
2.8±0.1
0.110±0.004
4.0±0.1
0.157±0.004
1.7
0.067
0.3
0.012
LK21250805
1.25
0.049
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
2.0
0.079
0.3
0.012
HK21250805
0.85
0.0331.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
1.5
0.0590.3
0.012
1.0
0.039
2.0
0.079
BK21250805
1.25
0.049
1.5±0.2
0.059±0.008
2.3±0.2
0.091±0.008
4.0±0.1
0.157±0.004
2.0
0.079
0.3
0.012
BK32161206
0.8
0.031
1.9±0.1
0.075±0.004
3.5±0.1
0.138±0.004
4.0±0.1
0.157±0.004
1.4
0.055
0.3
0.012
1
2
mlci0109_reli-PRP3 mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
1. Operating Temperature Range
BK0402
55125
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
5585
BKP1005
BKP1608
BKP2125
CK1608
40~+85
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
55125HK0603
HK1005
HK1608 40~+85
HK2125
HKQ0603S
55125HKQ0603U
AQ105
2. Storage Temperature Range
BK0402
55125
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
5585
BKP1005
BKP1608
BKP2125
CK1608
40~+85
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
55125HK0603
HK1005
HK1608 40~+85
HK2125
HKQ0603S
55125HKQ0603U
AQ105
1
2
mlci0109_reli-PRP4
mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
3. Rated Current
BK0402 240540mA DC
BK0603 100500mA
BK1005 1201000mA
BKH1005 200mA
BK1608 1501500mA
BK2125 2001200mA
ARRAY BK2010 100mA
BK3216 100200mA
BKP0603 1.0A
BKP1005 8002000mA DC
BKP1608 1.03.0A
BKP2125 1.54.0A
CK1608 5060mA DC
CK2125 60500mA DC
CKS2125 110280mA DC
CKP2012 0.71.2A DC
CKP2016 0.91.6A DC
CKP2520 1.11.8A DC
NM2012 0.81.5A DC
NM2520 0.91.1A DC
LK1005 2025mA DC
LK1608 1150mA DC
LK2125 5300mA DC
HK0402 160380mA DC
HK0603 60470mA DC
HK1005 110300mA DC
HK1608 150300mA DC
HK2125 300mA DC
HKQ0603S 130600mA DC
HKQ0603U 130600mA DC
AQ105 280710mA DC
Definition of rated current
In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20.
In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40.
In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current
at which the temperature of the element is increased within 20.
4. Impedance
BK0402 10120Ω ±25%
BK0603 10600Ω ±25%
BK1005 101800Ω ±25%
BKH1005 15001800Ω ±25%
BK1608 222500Ω ±25%
BK2125 152500Ω ±25%
ARRAY BK2010 51000Ω ±25%
BK3216 681000Ω ±25%
BKP0603 2233Ω ±25%
BKP1005 10220Ω ±25%
BKP1608 33470Ω ±25%
BKP2125 33330Ω ±25%
CK1608
——
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
BK0402 Series
Measuring frequency100±1MHz
Measuring equipmentE4991Aor its equivalent
Measuring jig16196Dor its equivalent
BK0603 Series, BKP0603 Series
Measuring frequency100±1MHz
Measuring equipment4291Aor its equivalent
Measuring jig16193Aor its equivalent
BK1005 Series, BKP1005 Series, BKH1005 Series
Measuring frequency100±1MHz
Measuring equipment4291Aor its equivalent
Measuring jig16192Aor its equivalent, 16193Aor its equivalent
BK16082125 Series, BKP16082125 Series
Measuring frequency100±1MHz
Measuring equipment4291Aor its equivalent, 4195Aor its equivalent
Measuring jig16092Aor its equivalent or 16192Aor its equivalent/HW
BK20103216 Series
Measuring frequency100±1MHz
Measuring equipment4291Aor its equivalent , 4195Aor its equivalent
Measuring jig16192Aor its equivalent
1
2
mlci0109_reli-PRP5 mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
5. Inductance
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 4.710.0μH±20%
CK2125 0.110.0μH±20%
CKS2125 1.010.0μH±20%
CKP2012 0.474.7μH±20%
CKP2016 0.474.7μH±20%
CKP2520 0.474.7μH±20%
NM2012 0.821.0μH±20%
NM2520 1.02.2μH±20%
LK1005 0.122.2μH±10% Q 0.122.2μH±30%
LK1608 0.04733.0μH±20% 0.1012.0μH±10% Q 0.122.2μH±30%
LK2125 0.04733.0μH±20% 0.1012.0μH±10% Q 0.122.2μH±30%
HK0402 1.06.2nH±0.3nH 6.812nH±5%
HK0603 1.06.2nH±0.3nH 6.8100nH±5%
HK1005 1.06.2nH±0.3nH 6.8270nH±5%
HK1608 1.05.6nH±0.3nH 6.8470nH±5%
HK2125 1.55.6nH±0.3nH 6.8470nH±5%
HKQ0603S 0.66.2nH±0.3nH 6.822nH±5%
HKQ0603U 0.66.2nH±0.3nH 6.822nH±5%
AQ105 1.06.2nH±0.3nH 6.815nH±5%
Test Methods and Remarks
CK Series
Measuring frequency2 to 4MHz CK1608
Measuring frequency2 to 25MHz CK2125
Measuring frequency2 to 10MHz CKS2125
LK Series
Measuring frequency10 to 25MHz LK1005
Measuring frequency1 to 50MHz LK1608
Measuring frequency0.4 to 50MHz LK2125
CKP Series, NM Series
Measuring frequency1MHzCKP2012, CKP2016, CKP2520, NM2012NM2520
Measuring equipment, jig4194A16085B16092Aor its equivalent
4195A4195116092Aor its equivalent
4294A16192Aor its equivalent
4291A16193Aor its equivalent/LK1005
4285A42841A42842C4285161100CKP2012CKP2016CKP2520NM2012NM2520
Measuring current1mA rms0.047 to 4.7μH 0.1mA rms5.6 to 33μH
HKHKQAQ Series
Measuring frequency100MHzHK0402HK0603HK1005AQ105
Measuring frequency50/100MHzHK1608HK2125
Measuring frequency500MHzHKQ0603SHKQ0603U
Measuring equipment, jig4291A16197Aor its equivalent/HK0603AQ105
4291A16193Aor its equivalent/HK1005
E4991A16197Aor its equivalent/HKQ0603SHKQ0603U
4291A16092in-house made jigor its equivalent/HK1608HK2125
E4991A16196Dor its equivalent/HK0402
1
2
mlci0109_reli-PRP6
mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
6. Q
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 20 min.
CK2125 1520 min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 1020 min.
LK1608 1035 min.
LK2125 1550 min.
HK0402 3 min.
HK0603 45 min.
HK1005 8 min.
HK1608 812 min.
HK2125 1018 min.
HKQ0603S 1013 min.
HKQ0603U 1013 min.
AQ105 8 min.
7. DC Resistance
BK0402 0.100.53Ω max.
BK0603 0.0651.50Ω max.
BK1005 0.030.80Ω max.
BKH1005 1.502.00Ω max.
BK1608 0.051.10Ω max.
BK2125 0.050.75Ω max.
ARRAY BK2010 0.100.90Ω max.
BK3216 0.150.80Ω max.
BKP0603 0.0650.070Ω max.
BKP1005 0.0300.20Ω max.
BKP1608 0.0250.18Ω max.
BKP2125 0.0200.075Ω max.
CK1608 0.450.85Ω (±30%
CK2125 0.160.65Ω max.
CKS2125 0.090.40Ω typ.
0.120.52Ω max.
CKP2012 0.100.28Ω max.
CKP2016 0.080.20Ω max.
CKP2520 0.050.16Ω max.
NM2012 0.100.19Ω max.
NM2520 0.130.22Ω max.
LK1005 0.411.16Ω max.
LK1608 0.22.2Ω max.
LK2125 0.11.1Ω max.
HK0402 0.180.99Ω max.
HK0603 0.113.74Ω max.
HK1005 0.084.8Ω max.
HK1608 0.052.6Ω max.
HK2125 0.101.5Ω max.
HKQ0603S 0.061.29Ω max.
HKQ0603U 0.061.29Ω max.
AQ105 0.070.45Ω max.
Test Methods and Remarks
Measuring equipmentVOAC-7412made by Iwasaki Tsushinki VOAC-7512made by Iwasaki Tsushinki
Test Methods and Remarks
CK Series
Measuring frequency2 to 4MHzCK1608
Measuring frequency2 to 25MHzCK2125
LK Series
Measuring frequency10 to 25MHzLK1005
Measuring frequency1 to 50MHzLK1608
Measuring frequency0.4 to 50MHzLK2125
Measuring equipment, jig4194A16085B16092Aor its equivalent
4195A4195116092Aor its equivalent
4294A16192Aor its equivalent
4291A16193Aor its equivalent/LK1005
Measuring current1mA rms0.047 to 4.7μH 0.1mA rms5.6 to 33μH
HKHKQAQ Series
Measuring frequency100MHzHK0603HK1005AQ105
Measuring frequency50/100MHzHK1608HK2125
Measuring frequency500MHzHKQ0603S
HKQ0603U
Measuring equipment, jig
4291A16197Aor its equivalent/HK0603AQ105
4291A16193Aor its equivalent/HK1005
E4991A16197Aor its equivalent/HKQ0603S
HKQ0603U
4291A16092A in-house made jigor its
equivalent/HK1608HK2125
E4991A16196Dor its equivalentHK0402
1
2
mlci0109_reli-PRP7 mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
8. Self Resonance FrequencySRF
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 1725MHz min.
CK2125 24235MHz min.
CKS2125
——
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 40180MHz min.
LK1608 9260MHz min.
LK2125 13320MHz min.
HK0402 2900010000MHz min.
HK0603 90010000MHz min.
HK1005 40010000MHz min.
HK1608 30010000MHz min.
HK2125 2004000MHz min.
HKQ0603S 190010000MH min.
HKQ0603U 190010000MH min.
AQ105 230010000MHz min.
Test Methods and Remarks
LK Series
Measuring equipment4195Aor its equivalent
Measuring jig4195116092Aor its equivalent
HKHKQAQ Series
Measuring equipment8719Cor its equivalent8753Dor its equivalent/HK2125
9. Temperature Characteristic
BK0402
——
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
Inductance changeWithin ±10
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
HKHKQAQ SeriesTemperature range30 to 85
Reference temperature20
1
2
mlci0109_reli-PRP8
mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
10. Resistance to Flexure of Substrate
BK0402
No mechanical damage.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
Warp2mmBK Series without 0402size, BKP
, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series
1mmBK0402, HK0402 Series
Testing boardglass epoxy-resin substrate
Thickness0.8mm
11. Solderability
BK0402
At least 75 of terminal electrode is covered by new solder.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
At least 75 of terminal electrode is covered by new solder.
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
Solder temperature230±5
Duration4±1 sec.
1
2
mlci0109_reli-PRP9 mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
12. Resistance to Soldering
BK0402
AppearanceNo significant abnormality.
Impedance changeWithin ±30
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
No mechanical damage.
Remaining terminal electrode70 min.
Inductance change
R104R7 Within ±10
6R8100 Within ±15
CKS2125 Within ±20
CKP2012CKP2016CKP2520NM2012NM2520Within ±30
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Remaining terminal electrode70 min. Inductance changeWithin ±15
LK1608 No mechanical damage.
Remaining terminal electrode70 min. Inductance change 47N4R7Within ±10% 5R6330Within ±15
LK2125
HK0402
No mechanical damage.
Remaining terminal electrode70 min. Inductance changeWithin ±5
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
Solder temperature260±5
Duration10±0.5 sec.
Preheating temperature150 to 180
Preheating time3 min.
FluxImmersion into methanol solution with colophony for 3 to 5 sec.
Recovery2 to 3 hrs of recovery under the standard condition after the test.See Note 1
13. Thermal Shock
BK0402
AppearanceNo significant abnormality.
Impedance changeWithin ±30
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance changeWithin ±20% Q changeWithin ±30
Inductance changeWithin ±20CKS2125
CK2125
CKS2125
CKP2012
No mechanical damage. Inductance changeWithin ±30
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±30
LK1608
LK2125
HK0402
No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±20
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
Conditions for 1 cycle
Step 1Minimum operating temperature
0
3 30±3 min.
Step 2Room temperature 2 to 3 min.
Step 3Maximum operating temperature
3
0 30±3 min.
Step 4Room temperature 2 to 3 min.
Number of cycles5
Recovery2 to 3 hrs of recovery under the standard condition after the test.See Note 1
(Note 1) When there are questions concerning mesurement resultmeasurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP10
mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
14. Damp Heat Steady state
BK0402
AppearanceNo significant abnormality.
Impedance changeWithin ±30
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance changeWithin ±20% Q changeWithin ±30
CK2125
CKS2125 Inductance changeWithin ±20
CKP2012
No mechanical damage. Inductance changeWithin ±30
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±30
LK1608
LK2125 No mechanical damage. Inductance changeWithin ±20% Q changeWithin ±30
HK0402
No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±20
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
BK, BKP, BKH Series
Temperature40±2
Humidity90 to 95RH
Duration50024
0hrs
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1
LKCKCKSCKPNMHKHKQAQ Series
Temperature40±2LKCKCKSCKPNM Series
60±2HKHKQAQ Series
Humidity90 to 95RH
Duration500±12 hrs
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1
1
2
mlci0109_reli-PRP11 mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
15. Loading under Damp Heat
BK0402
AppearanceNo significant abnormality.
Impedance changeWithin ±30
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance changeWithin ±20% Q changeWithin ±30
CK2125
CKS2125 No mechanical damage. Inductance changeWithin ±20
CKP2012
No mechanical damage. Inductance changeWithin ±30
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Inductance changeWithin ±10% Q changeWithin ±30
LK1608 No mechanical damage.
Inductance change0.047 to 12.0μHWithin ±10% 15.0 to 33.0μHWithin ±15% Q changeWithin ±30
LK2125 No mechanical damage. Inductance changeWithin ±20% Q changeWithin ±30
HK0402
No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±20
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
BK, BKP, BKH Series
Temperature40±2
Humidity90 to 95RH
Applied currentRated current
Duration50024
0hrs
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1
LKCKCKSCKPNMHKHKQAQ Series
Temperature40±2LKCKCKSCKPNM Series
60±2HKHKQAQ Series
Humidity90 to 95RH
Applied currentRated current
Duration500±12 hrs
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP12
mlci0109_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Multilayer chip inductors and beads
16. Loading at High Temperature
BK0402
AppearanceNo significant abnormality
Impedance changeWithin ±30
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance changeWithin ±20% Q changeWithin ±30
CK2125
CKS2125 No mechanical damage. Inductance changeWithin ±20
CKP2012
No mechanical damage. Inductance changeWithin ±30
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage. Inductance changeWithin ±10% Q changeWithin ±30
LK1608 No mechanical damage.
Inductance change0.047 to 12.0μHWithin ±10% 15.0 to 33.0μHWithin ±15% Q changeWithin ±30
LK2125 No mechanical damage. Inductance changeWithin ±20% Q changeWithin ±30
HK0402
No mechanical damage.
Inductance changeWithin ±10% Q changeWithin ±20
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
Test Methods and Remarks
BK, BKH Series
Temperature125±3
Applied currentRated current
Duration50024
0hrs
Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1
LKCKCKSCKPNMHKHKQAQBKP Series
Temperature85±2LKCKCKSCKPNMBKP Series
85±2HK16082125
85±2HK1005, AQ105 operating temperature range 55 to 85
125±2HK0402, HK0603, HK1005, HKQ0603S, HKQ0603U, AQ105 operating temperature range 55 to 125
Applied currentRated current
Duration500±12 hrs
Recovery2 to 3 hrs of recovery under the standard condition after the test.See Note 1
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other-
wise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
1
2
mlci0109_reli-PRP13 mlci0109_reli_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
1. Circuit Design
Precautions
Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
components used in general purpose applications.
Operating Current Verification of Rated current
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
Pattern configurationsDesign of Land-patterns
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder usedsize of lletcan directly affect inductor performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
1 The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of
solder necessary to form the fillets.
2 When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated
by solder-resist.
3 The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
Pattern configurationsInductor layout on panelized breakaway PC boards
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting,
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern
configurations and the position of SMD inductors should be carefully performed to minimize stress.
Technical
consider-
ations
Pattern configurationsDesign of Land-patterns
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amountslarger fillets which extend above
the component end terminations. Examples of improper pattern designs are also shown.
1 Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering
Recommended land dimensions for reflow-soldering
Type 1608 2125 3216
Size
L 1.6 2.0 3.2
W 0.8 1.25 1.6
A 0.81.0 1.01.4 1.82.5
B 0.50.8 0.81.5 0.81.7
C 0.60.8 0.91.2 1.21.6
Unitmm
Type 0402 0603 1005 105 1608 2012 2125 2016 3216 2520
Size
L 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5
W 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0
A
0.150.25 0.200.30 0.450.55 0.500.55
0.81.0 0.81.2 0.81.2 0.81.2 1.82.5 1.01.4
B
0.100.20 0.200.30 0.400.50 0.300.40
0.60.8 0.81.2 0.81.2 0.81.2 0.61.5 0.61.0
C
0.150.30 0.250.40 0.450.55 0.600.70
0.60.8 0.91.6 0.91.6 1.22.0 1.22.0 1.82.2
Unitmm
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Recommended land dimension for Reflow-soldering
Type 3216 2010
Size
L 3.2 2.0
W 1.6 1.0
a 0.70.9 0.50.6
b 0.81.0 0.50.6
c 0.40.5 0.20.3
d 0.8 0.5
Unitmm
2 Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD
and leaded components
Component placement
close to the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
To next page
1
2
mlci0109_reli-PRP14
mlci0109_reli_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
3. Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
Technical
consider-
ations
Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be
considered before lowering the pick-up nozzle:
1 The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.
2 The pick-up pressure should be adjusted between 1 and 3N static loads.
3 To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item Improper method Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component
placement, so the following precautions should be noted in the application of adhesives.
1 Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufcient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
2 When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive
flow of adhesive on to the land or solder pad.
Recommended conditions
Figure 0805 case sizes as examples
a 0.3mm min
b 100120μm
c Area with no adhesive
2. PCB Design
Technical
consider-
ations
Pattern configurationsInductor layout on panelized breakaway PC boards
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board
warp or deflection.
Item Not recommended Recommended
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.
An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must
also consider the PCB splitting procedure.
1
2
mlci0109_reli-PRP15 mlci0109_reli_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
4. Soldering
Precautions
Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
1 Flux used should be with less than or equal to 0.1 wt% Chlorine conversion method of halogenated content. Flux having a strong acidity content should
not be applied.
2 When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
3 When using water-soluble flux, special care should be taken to properly clean the boards.
Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-and please contact us about peak tem-
perature when you use lead-free paste.
Technical
consider-
ations
Selection of Flux
1-1. When too much halogenated substanceChlorine, etc.content is used to activate the ux, or highly acidic flux is used, an excessive amount of residue
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines
used should also be considered carefully when selecting water-soluble flux.
Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130 of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
Reflow soldering
Temperature profile
Peak 260 max
10 sec max
Pb free soldering
Pb free soldering
Pb free soldering
Peak 260 max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
(※T190 3216Type max, 130 3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1φ or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature(℃)
300
200
100
0
Temperature(℃
300
200
100
0
Temperature(℃
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350 max
3 sec max
60 sec min
Caution
1. The ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
Wave soldering
Temperature profile
Peak 260 max
10 sec max
Pb free soldering
Pb free soldering
Pb free soldering
Peak 260 max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
(※T190 3216Type max, 130 3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1φ or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature(℃
300
200
100
0
Temperature(℃)
300
200
100
0
Temperature(℃
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350 max
3 sec max
60 sec min
Caution
1. Make sure the inductors are preheated sufciently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
Hand soldering
Temperature profile
Peak 260 max
10 sec max
Pb free soldering
Pb free soldering
Pb free soldering
Peak 260 max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130 of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
(※⊿T190 3216Type max, T≦ 130 3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1φ or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature(℃
300
200
100
0
Temperature(℃
300
200
100
0
Temperature(℃)
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350 max
3 sec max
60 sec min
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
1
2
mlci0109_reli-PRP16
mlci0109_reli_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
5. Cleaning
Precautions
Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of
the cleaninge.g. to remove soldering flux or other materials from the production process.
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
Technical
consider-
ations
Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's
electrical propertiesespecially insulation resistance.
2. Inappropriate cleaning conditionsinsufficient or excessive cleaningmay detrimentally affect the performance of the inductors.
1 Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output Below 20W/
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
Precautions
Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors
7. Handling
Precautions
Breakaway PC boardssplitting along perforations
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors soldering irons, measuring instruments should be properly grounded.
5. Keep bare hands and metal productsi.e., metal deskaway from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
1 If inductors are dropped on the floor or a hard surface they should not be used.
2 When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40
Humidity Below 70% RH
The ambient temperature must be kept below 30. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
consider-
ations
Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.