AD5262BRUZ200RL7 - ANALOG DEVICES

November 2016

DocID027586 Rev 3

1/21

This is information on a product in full production.

www.st.com

MP34DT04

MEMS audio sensor omnidirectional digital microphone

Datasheet - product ion data

Features

• Single supply voltage

• Low power consumption

• 120 dBSPL acoustic overload point

• 64 dB signal-to-noise ratio

• Omnidirectional sensitivity

• –26 dBFS sensitivity

• PDM output

• HCLGA package

− Top-port design

− SMD-compliant

− EMI-shielded

− ECOPACK®, RoHS, and “Green”

compliant

Applications

• Mobile terminals

• Laptop and notebook computers

• Portable media players

• VoIP

• Speech recognition

• A/V eLearning de vices

• Gaming and virtual reality input devices

• Digital still and video cameras

• Antitheft systems

Description

The MP34DT04 is an ultra-compact, low-power,

omnidirectional, digital MEMS microphone built

with a capacitive sensing element and an IC

interface.

The sensing element, capable of detecting

acoustic waves , is manufactured us ing a

specialized silicon micromachining process

dedicated to produce audio sensors.

The IC interface is manufactured using a CMOS

process that allows designing a dedicated circuit

able to provide a digit al sig nal ex terna lly in PDM

format.

The MP34DT04 has an acoustic overload point of

120 dBSPL with a 64 dB signal-to-noise ratio and

–26 dBFS sensitivity.

The MP34DT04 is available in a top-port, SMD-

complia nt, EMI-shielded package and is

guaranteed to operate over an extended

temperature range from -40 °C to +85 °C.

Table 1: Device summary

Order codes

Temp.

range [°C]

Package

Packing

MP34DT04

-40 to +85

HCLGA

(3x4 x1. 095 mm)

4LD

Tray

MP34DT04TR

-40 to +85

HCLGA

(3x4 x1.095 mm)

4LD

Tape an d

reel

Contents

MP34DT04

2/21

DocID027586 Rev 3

Contents

1 Pin des cription ................................................................................ 5

2 Acoustic and electrical specifications ........................................... 6

2.1 Acousti c and electri cal char ac ter i sti c s ............................................... 6

2.2 Timing characteristics ....................................................................... 7

2.3 Frequency response ......................................................................... 8

3 Application recommendations ....................................................... 9

4 Carrier tape mechanical specifications ....................................... 11

5 Proce s s re c ommendat ions ........................................................... 12

6 Sensi ng e lem e nt ............................................................................ 14

7 Absolute maximum ratings ........................................................... 15

8 Functionality .................................................................................. 16

8.1 L/R channel selection ...................................................................... 16

9 Package information ..................................................................... 17

9.1 Soldering information ...................................................................... 17

9.2 HCLGA package information........................................................... 18

10 Revisi on history ............................................................................ 20

MP34DT04

List of tables

DocID027586 Rev 3

3/21

List of tables

Table 1: Device summary ........................................................................................................................... 1

Table 2: Pin description .............................................................................................................................. 5

Table 3: Acoustic and electrical characteristics .......................................................................................... 6

Table 4: Distortion specifications ................................................................................................................ 6

Table 5: Timing characteristics ................................................................................................................... 7

Table 6: Frequency response mask for digital microphones ...................................................................... 8

Table 7: Absolute maximum ratings ......................................................................................................... 15

Table 8: L/R channel selection ................................................................................................................. 16

Table 9: Recommended soldering profile limits ........................................................................................ 17

Table 10: Document revision history ........................................................................................................ 20

List of figur es

MP34DT04

4/21

DocID027586 Rev 3

List of figures

Figure 1: Pin connec tio ns ........................................................................................................................... 5

Figure 2: Timing waveforms ....................................................................................................................... 7

Figure 3: Frequency response and mask ................................................................................................... 8

Figure 4: MP34DT04 electrical connections for stereo configuration ......................................................... 9

Figure 5: MP34DT04 electrical connections for stereo configuration (top view ....................................... 10

Figure 6: Carrier tape without microphone (top view) ............................................................................... 11

Figure 7: Carr ier tape with microphone (top v iew) .................................................................................... 11

Figure 8: Recommended picking area ...................................................................................................... 12

Figure 9: Recommended picker design .................................................................................................... 13

Figure 10: Recom mended solder ing pr of ile limits .................................................................................... 17

Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data ........................................ 18

Figure 12: Land patter n ............................................................................................................................. 19

MP34DT04

Pin description

DocID027586 Rev 3

5/21

1 Pin description

Figure 1: Pin connections

Table 2: Pin description

Pin # Pin name Function

1 Vdd Power supply

2 LR Left/Ri ght chan nel selection

3 CLK Synchronizat ion inp ut clo ck

4 DOUT Left/Right PDM data output

5 (ground ring) GND 0 V supply

Acoustic and electrical specifications

MP34DT04

6/21

DocID027586 Rev 3

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,

T = 25 °C, unless otherwise noted.

Table 3: Acoustic and electrical characteristics

Symbol

Parameter

Test condition

Min.

Typ.

(1)

Max.

Unit

Vdd

Suppl y voltage

1.6

1.8

3.6

Idd

Cur rent consum ption i n n o rm al

mode

Mean v al ue

600

700

μA

IddPdn

Cur rent consum ption i n p ow er-

down m ode

(2)

µA

Scc

Short-circuit current

AOP

Acoustic overload point

120

dBSPL

Sensitivity

-29

-26

-23

dBFS

SNR

Signal-to-noise ratio

A-weig hted at 1 k Hz ,

94 dB SP L

dB (A)

PSR

Power supply rejection

100 mVpp sine 1 kHz

-70

dBFS

CLK

Inp ut clock frequ ency

(3)

2.4

3.25

MHz

Ton

Turn-on time

(4)

Gu ar anteed by design

Top

Operating temperature range

-40

+85

°C

IOL

Low-level logic input/output

voltage

out

= 1 mA

-0.3

0.35xVdd

IOH

High-level logic input/output

voltage

out

= 1 mA

0.65xVdd

Vdd+0.3

LOAD

Cap acitive loa d

100

Notes:

(1)

Typical specifications are not guaranteed.

(2)

Input clock in static mode.

(3)

Duty cycle: min = 40% max = 60%.

(4)

Ti m e fr o m the first clock edge t o v a li d output dat a.

Table 4: Distortion specifications

Parameter Test condition Value

Distortion 100 dBSPL (50 Hz - 4 kHz) < 1 % THD + N

Distortion 115 dBSPL (1 kHz) < 5% THD + N

MP34DT04

Acoustic and electrical specifications

DocID027586 Rev 3

7/21

2.2 Timi ng char a c t er is t ics

Table 5: Timing characteristics

Parameter Description Min. Max. Unit

fCLK Clock frequency for normal mode 1 3.25 MHz

fPD Clock frequency for power-down mode

0.23 MHz

TCLK Clock period for normal mode 308 1000 ns

TR,EN Data enabled on DATA line, L/R pin = 1 18 (1)

TR,DIS Data disabled on DATA line, L/R pin = 1

16(1) ns

TL,EN Data enabled on DATA line, L/R pin = 0 18(1)

TL,DIS Data disabled on DATA line, L/R pin = 0

16(1) ns

Notes:

(1)From design simulations

Figure 2: Timin g wav efor ms

High Z High Z

L,EN

R,DIS

R,EN

L,DIS

CLK

PDM R

PDM L

Acoustic and electrical specifications

MP34DT04

8/21

DocID027586 Rev 3

2.3 Frequency respon s e

Figure 3: Frequency response and mask

Table 6: Frequenc y response mask for digital microphones

Frequency / Hz (1) Lowe r limit Upper limit Unit

100...4000 -2 +2 dBr 1 kHz

4000...10000 -2 +4 dBr 1 kHz

Notes:

(1)At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)

MP34DT04

Application recommendations

DocID027586 Rev 3

9/21

3 Application recommendations

Figure 4: MP34D T04 electr i cal connections for stereo configuration

Application recommendations

MP34DT04

10/21

DocID027586 Rev 3

Figure 5: MP34DT04 electrical connections for stereo configuration (top view

Power supply decoupling capacitors (100 nF ceramic, 1 µF ceramic) should be placed as

near as possible to pin 1 of the device (common design practice).

The L/R pin must be connected to Vdd or GND (refer to Table 8: "L/R channel selection").

MP34DT04

Carrier tape mechanical specifications

DocID027586 Rev 3

11/21

4 Carrier tape mechanical specifications

Figure 6: Carrier tape without microphone (top view)

Figure 7: Carrier tape with microphone (top view)

Process recommendations

MP34DT04

12/21

DocID027586 Rev 3

5 Process recommendations

To ensure a consistent manufacturing process it is strongly advised to comply with the

following recommendations:

• The recommended pick-up area for the MP34DT04 package must be defined using

the worst case (ie. no device alignment during the picking process). This area has

been defined considering all the tolerances of the components involved (reel,

package, sound inlet). The picker tolerance shall be considered as well.

• To prevent damage to the MEMS membrane or incorrect pick-up and placement, do

not pick up the component on the inlet area.

• For the package outline please refer to Figure 7: "Carrier tape with microphone (top

view)". Nozzle shape, size, and placement accuracy are the other key factors to

consider when deciding on the coordinates for picking.

• Device alignment before picking is highly recommended.

• A vacuum force greater than 7 psi must be avoided

• 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.00 98 at m

• MSL (moisture sensitivity level) Class 3

• Maximum of 3 reflow cycles is recommended.

• All recommended dimensions (device safe-picking area) do not include the pick-and-

place equipment tolerances

Figure 8: Recommended picking area

To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.

The following picker ensures that the holes for the vacuum and the air stream are ALWAYS

away from the porthole of the device (4 vacuum ports located at each corner of the device).

The recommended nozzle also has a recess, in the form of a cross, which guarantees that

the porthole is always left at atmospheric pressure. By using the recommended nozzle, the

membrane will not suffer any sudden air disturbances during the picking or placing of the

devices in the tape and reel.

MP34DT04

Process reco mm end atio ns

DocID027586 Rev 3

13/21

Figure 9: Recommended picker design

Sensing element

MP34DT04

14/21

DocID027586 Rev 3

6 Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable

plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound

pressure into the changes of coupled capacity between those two plates.

Omron Corporation supplies this element for STMicroelectronics.

MP34DT04

Absolute maximum ratings

DocID027586 Rev 3

15/21

7 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage

to the device. This is a stress rating only and functional operation of the device under these

conditions is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

Table 7: A bsolut e maximum rat ings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.3 to 5 V

Vin Input voltage on any c ontrol pin -0.3 to Vdd +0.3 V

TSTG Storage temperature r ange -40 to +125 °C

ESD Electrostatic discharge protection

±2000 (HBM)

V ±200 (MM)

±750 (CBM)

ESD Product standard EN 55024:2010 - 3 air

discharge ±15000 V

Functionality

MP34DT04

16/21

DocID027586 Rev 3

8 Functionality

8.1 L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R

channel selection". The L/R pin must be connected to Vdd or GND.

Table 8: L/R channel selection

L/R CLK low CLK high

GND Data valid High impedance

Vdd High impedance Data valid

MP34DT04

Package information

DocID027586 Rev 3

17/21

9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

9.1 Solderi ng information

The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards

and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

Figure 10: Recommended soldering profile limits

Table 9: Recommended soldering profile limits

Description Parameter Pb free

Average ramp rate TL to TP 3 °C/sec max

Preheat Minimum temperature

Maximum temperature

Time (TSMIN to TSMAX)

TSMIN

TSMAX

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate TSMAX to TL

Time maintained above liquids temperature

Liquids temperature tL

TL 60 sec to 150 sec

217 °C

Peak temperature TP 260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 s ec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

RAMP-DOWN

RAMP-UP

PREHEAT

to T

SMAX

SMIN

30 60 90 120 150 180 210 240 270 300 330 360 390

T25° t o P E A K

TEMPERATURE

CRITICAL ZONE

TIME

Package information

MP34DT04

18/21

DocID027586 Rev 3

9.2 HCLG A package inf ormati on

Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data

1. The MEMS microphone plastic cap can exhibit some level of variation in color whe n

the device is subjected to thermal processes. This variation does not affect acoustic or

electrical performance.

2. Ring plating can be subject to change not affecting acoustic and electrical

performance.

Dimensions are in millimeter unless otherwise specified

General Tolerance is +/-0.15mmunless otherwise specified

OUTER DIMENSIONS

ITEM DIMENSION [mm] TOLERANCE[mm]

1.0±3]L[htgneL 1.0±4]W[htdiW 1.0±590.1]H[thgieH AP ɸ1.0±4.0

8579626_B

MP34DT04

Package information

DocID027586 Rev 3

19/21

Figure 12: Land pattern

GND

DOUT

Vdd

CLK

1.30

2.30

0.35

0.40

0.95

0.35

Pad + s older pas te

0.85

Revision history

MP34DT04

20/21

DocID027586 Rev 3

10 Revision history

Table 10: Document revision history

Date Revision Changes

10-Mar-2015 1 Initial release

07-May-2015 2 Updated Secti on 9.2: "HCLGA package information"

04-Nov-2016 3 Added CLOAD to Table 3: "Acoustic and electrical characteristics"

Updated Secti on 3: "Application recommendations"

Updated Secti on 5: "Process recommendations"

MP34DT04

DocID027586 Rev 3

21/21

IMPORTANT NOTICE – PLEAS E READ CAREFULLY

STMicroe l ec t r on ic s NV a nd its s ubsidiari es ( “S T”) reser ve t h e r i gh t to m ake c ha nges, co r rec t i on s , enhancements, modifications, and

improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant in formation on ST

produc ts before placin g or ders. ST product s are sold pur suant to ST’s term s and condi ti ons of sale in plac e at the time of or der

acknowledgement.

Purchasers are s olely responsibl e for the choice, sel ection, and use of S T produc ts and ST assumes no liability for application assistance or the

design of Purchasers’ products.

No license, express or implied, t o any intellectual proper ty right is granted by ST herein.

Resale of ST products with provi sions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the S T logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.