XC2100A-05ST - Anaren, Inc. - Datasheet.Directory

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Model XC2100A

Rev B

5 dB Directional Coupler

Description

The XC2100A-05 is a low profile, high performance 5dB directional coupler

in a new easy to use, manufacturing friendly surface mount package. It is

designed for UMTS and other 3G band applications. The XC2100A-05 is

designed particularly for non-binary split and combine in high power

amplifiers, e.g. used along with a 3dB to get a 3-way, plus other signal

distribution applications where low insertion loss is required. It can be used

in high power applications up to 175 Watts.

Parts have been subjected to rigorous qualification testing and they are

manufactured using materials with coefficients of thermal expansion (CTE)

compatible with common substrates such as FR4, G-10, RF-35, RO4350,

and polyimide.

Electrical Specifications **

Frequency Mean

Coupling Insertion

Loss VSWR Phase

Balance

MHz dB dB Max Max : 1 Degrees

2000-2300 5.0 ± 0.22 0.15 1.15 90±2.0

2110-2170 5.0 ± 0.19 0.12 1.12 90±2.0

Directivity Frequency

Sensitivity Power ΘJC Operating

Temp.

dB Min dB Max Avg. CW Watts ºC/Watt ºC

23 ± 0.05 125 19 -55 to +95

25 ± 0.03 175 19 -55 to +95

Features:

• 2000 – 2300 MHz

• UMTS and other 3G

• High Power

• Very Low Loss

• Tight Coupling

• High Directivity

• Production Friendly

• Tape and Reel

• Available in Lead-Free (as

illustrated) or Tin-Lead

• Reliable, FIT=0.53

**Specification based on performance of unit properly installed on Anaren Test Board 58481-0001 with small

signal applied. Specifications subject to change without notice. Refer to parameter definitions for details.

XC2100A-05* Mechanical Outline

Dimensions are in Inches [Millimeters]

Side View

.064±.006

[1.62±0.15]

Bottom View (Far-Side)

Top View (Near-Side)

Denotes

Array Number

4X .040±.004

[1.02±0.10]

4X .059±.004 SQ

[1.50±0.10]

.430±.004

[10.92±0.10]

.220±.004

[5.59±0.10]

GND

Pin 1 Pin 2

Pin 3

Pin 4

Pin 1

Pin 2

Pin 4

Pin 3

.560±.010

[14.22±0.25]

.350±.010

[8.89±0.25]

Orientation

Marker Denotes

Pin 1

* = Plating Finish

Tolerances are Non-Cumulative

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Model XC2100A

Rev A

Directional Coupler Pin Configuration

The XC2100A-05 has an orientation marker to denote Pin 1. Once port one has been identified the other ports are

known automatically. Please see the chart below for clarification:

Pin 1 Pin 2 Pin 3 Pin 4

Input Isolated Direct Coupled

Isolated Input Coupled Direct

Direct Coupled Input Isolated

Coupled Direct Isolated Input

Note: The direct port has a DC connection to the input port and the coupled port has a DC connection to the

isolated port.

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Insertion Loss and Power Derating Curves

Insertion Loss Derating:

The insertion loss, at a given frequency, of a group of

couplers is measured at 25°C and then averaged. The

measurements are performed under small signal

conditions (i.e. using a Vector Network Analyzer). The

process is repeated at 95°C, 150°C, and 200°C. A best-

fit line for the measured data is computed and then

plotted from -55°C to 300°C.

Power Derating:

The power handling and corresponding power derating

plots are a function of the thermal resistance, mounting

surface temperature (base plate temperature),

maximum continuous operating temperature of the

coupler, and the thermal insertion loss. The thermal

insertion loss is defined in the Power Handling section of

the data sheet.

As the mounting interface temperature approaches the

maximum continuous operating temperature, the power

handling decreases to zero.

025 50 75 100 125 150 175 200 225 250 275 300

100

125

150

175

200

225

250

Base Plate Temperature (ºC)

Power (Watts)

Power Derating Curve for XC2100A-05

power handling at 2170MHz

power handling at 2300MHz

-100 -50 050 100 150 200 250 300 350

-0.2

-0.18

-0.16

-0.14

-0.12

-0.1

-0.08

-0.06

-0.04

-0.02

Temperature of the Part (ºC)

Insertion Loss (dB)

Typical Insertion Loss Derating Curve for XC2100A-05

typical insertion loss (f=2170MHz)

typical insertion loss (f=2300MHz)

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Typical Performance (-55°C, 25°C and 95°C): 2000-2300 MHz

2000 2050 2100 2150 2200 2250 2300

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

Frequency (MHz)

Return Loss (dB)

Return Loss for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

Frequency (MHz)

Return Loss (dB)

Return Loss for XC2100A-05 (Feeding Port 2)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

Frequency (MHz)

Return Loss (dB)

Return Loss for XC2100A-05 (Feeding Port 3)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

Frequency (MHz)

Return Loss (dB)

Return Loss for XC2100A-05 (Feeding Port 4)

- 55ºC

25ºC

95ºC

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Rev B

Typical Performance (-55°C, 25°C and 95°C): 2000-2300 MHz

2000 2050 2100 2150 2200 2250 2300

-5.5

-5.4

-5.3

-5.2

-5.1

-5

-4.9

-4.8

-4.7

-4.6

-4.5

Frequency (MHz)

Coupling (dB)

Coupling for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

Frequency (MHz)

Directivity (dB)

Directivity for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

Frequency (MHz)

Phase Balance (Degrees)

Phase Balance for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

2000 2050 2100 2150 2200 2250 2300

-2

-1.95

-1.9

-1.85

-1.8

-1.75

-1.7

-1.65

-1.6

-1.55

-1.5

Frequency (MHz)

Transmission Loss (dB)

Transmission Loss for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

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Model XC2100A

Rev A

Typical Performance (-55°C, 25°C and 95°C): 2000-2300 MHz

2000 2050 2100 2150 2200 2250 2300

-0.16

-0.14

-0.12

-0.1

-0.08

-0.06

-0.04

-0.02

Frequency (MHz)

Insertion Loss (dB)

Insertion Loss for XC2100A-05 (Feeding Port 1)

- 55ºC

25ºC

95ºC

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Rev B

Definition of Measured Specifications

Parameter Definition Mathematical Representation

VSWR

(Voltage Standing Wave Ratio)

The impedance match of

the coupler to a 50Ω

system. A VSWR of 1:1 is

optimal.

VSWR = min

max

Vmax = voltage maxima of a standing wave

Vmin = voltage minima of a standing wave

Return Loss

The impedance match of

the coupler to a 50Ω

system. Return Loss is

an alternate means to

express VSWR.

Return Loss (dB)= 20log

VSWR

1VSWR

Mean Coupling

At a given frequency (ωn),

coupling is the input

power divided by the

power at the coupled

port. Mean coupling is

the average value of the

coupling values in the

band. N is the number of

frequencies in the band.

Coupling (dB) = 













=)(P

)(P

log10)( cpl

Cω

Mean Coupling (dB) =

∑

=1)(ω

Insertion Loss The input power divided

by the sum of the power

at the two output ports. 10log direct cpl

PP P

Directivity

The power at the

coupled port divided by

the power at the isolated

port.

10log iso

cpl

Phase Balance The difference in phase

angle between the two

output ports. Phase at coupled port – Phase at direct port

Frequency Sensitivity

The decibel difference

between the maximum in

band coupling value and

the mean coupling, and

the decibel difference

between the minimum in

band coupling value and

the mean coupling.

Max Coupling (dB) – Mean Coupling (dB)

and

Min Coupling (dB) – Mean Coupling (dB)

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Notes on RF Testing and Circuit Layout

The XC2100A-05 Surface Mount Couplers require the use of a test fixture for verification of RF performance. This test

fixture is designed to evaluate the coupler in the same environment that is recommended for installation. Enclosed

inside the test fixture, is a circuit board that is fabricated using the recommended footprint. The part being tested is

placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. A four port Vector

Network Analyzer is connected to the fixture and is used to measure the S-parameters of the part. Worst case values

for each parameter are found and compared to the specification. These worst case values are reported to the test

equipment operator along with a Pass or Fail flag. See the illustrations below.

3 & 5 dB

Test Board

10 & 20 dB

Test Board

In Fixture

Test Station

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The effects of the test fixture on the measured data must be minimized in order to

accurately determine the performance of the device under test. If the line impedance is anything other than 50Ω

and/or there is a discontinuity at the microstrip to SMA interface, there will be errors in the data for the device under

test. The test environment can never be “perfect”, but the procedure used to build and evaluate the test boards

(outlined below) demonstrates an attempt to minimize the errors associated with testing these devices. The lower the

signal level that is being measured, the more impact the fixture errors will have on the data. Parameters such as

Return Loss and Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels,

will present the greatest measurement challenge.

The test fixture errors introduce an uncertainty to the measured data. Fixture errors can make the performance of the

device under test look better or worse than it actually is. For example, if a device has a known return loss of 30dB and

a discontinuity with a magnitude of –35dB is introduced into the measurement path, the new measured Return Loss

data could read anywhere between –26dB and –37dB. This same discontinuity could introduce an insertion phase

error of up to 1°.

There are different techniques used throughout the industry to minimize the affects of the test fixture on the

measurement data. Anaren uses the following design and de-embedding criteria:

• Test boards have been designed and parameters specified to provide trace impedances of 50

±1Ω. Furthermore, discontinuities at the SMA to microstrip interface are required to be less than

–35dB and insertion phase errors (due to differences in the connector interface discontinuities

and the electrical line length) should be less than ±0.25° from the median value of the four

paths.

• A “Thru” circuit board is built. This is a two port, microstrip board that uses the same SMA to

microstrip interface and has the same total length (insertion phase) as the actual test board. The

“Thru” board must meet the same stringent requirements as the test board. The insertion loss

and insertion phase of the “Thru” board are measured and stored. This data is used to

completely de-embed the device under test from the test fixture. The de-embedded data is

available in S-parameter form on the Anaren website (www.anaren.com).

Note: The S-parameter files that are available on the anaren.com website include data for frequencies that are

outside of the specified band. It is important to note that the test fixture is designed for optimum performance through

2.3GHz. Some degradation in the test fixture performance will occur above this frequency and connector interface

discontinuities of –25dB or more can be expected. This larger discontinuity will affect the data at frequencies above

2.3GHz.

Circuit Board Layout

The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4350 material

that is 0.030” thick. Consider the case when a different material is used. First, the pad size must remain the same to

accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the

interface to the coupler will also change. Second, the linewidth required for 50Ω will be different and this will introduce

a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will

affect the performance of the part. To achieve the specified performance, serious attention must be given to the

design and layout of the circuit environment in which this component will be used.

If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance

that is present on the Anaren RO4350 test board. When thinner circuit board material is used, the ground plane will

be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric

constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases,

narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will

compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used,

the interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line

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Rev A

before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will

match the performance of the Anaren test board.

Notice that the board layout for the 3dB and 5dB couplers is different from that of the 10dB and 20dB couplers. The

test board for the 3dB and 5dB couplers has all four traces interfacing with the coupler at the same angle. The test

board for the 10dB and 20dB couplers has two traces approaching at one angle and the other two traces at a different

angle. The entry angle of the traces has a significant impact on the RF performance and these parts have

been optimized for the layout used on the test boards shown below.

10 & 20dB Test Board 3 & 5dB Test Board

Testing Sample Parts Supplied on Anaren Test Boards

If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the

loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and

Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss

of the coupler. An S-parameter file for a “Thru” board (see description of “Thru” board above) will be supplied upon

request. As a first order approximation, one should consider the following loss estimates:

Frequency Band Avg. Ins. Loss of Test Board @ 25°C

800 – 1000 MHz ~ 0.07dB

1700 – 2300 MHz ~ 0.12dB

For example, a 1900MHz, 10dB coupler on a test board may measure –10.30dB from input to the coupled port at

some frequency, F1. When the loss of the test board is removed, the coupling at F1 becomes -10.18dB (-10.30dB +

0.12dB). This compensation must be made to both the coupled and direct path measurements when calculating

insertion loss.

The loss estimates in the table above come from room temperature measurements. It is important to note that the

loss of the test board will change with temperature. This fact must be considered if the coupler is to be evaluated at

other temperatures.

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Model XC2100A

Rev B

Peak Power Handling

High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown voltage of

1.7KV (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of handling at

least 12dB peaks over average power levels, for very short durations. The breakdown location consistently occurred

across the air interface at the coupler contact pads (see illustration below). The breakdown levels at these points will

be affected by any contamination in the gap area around these pads. These areas must be kept clean for optimum

performance. It is recommended that the user test for voltage breakdown under the maximum operating conditions

and over worst case modulation induced power peaking. This evaluation should also include extreme environmental

conditions (such as high humidity).

Orientation Marker

A printed circular feature appears on the top surface of the coupler to designate Pin 1. This orientation marker is not

intended to limit the use of the symmetry that these couplers exhibit but rather to facilitate consistent placement of

these parts into the tape and reel package. This ensures that the components are always delivered with the same

orientation. Refer to the table on page 2 of the data sheet for allowable pin configurations.

Test Plan

Xinger II couplers are manufactured in large panels and then separated. A sample population of parts is RF small

signal tested at room temperature in the fixture described above. All parts are DC tested for shorts/opens. (See

“Qualification Flow Chart” section for details on the accelerated life test procedures.)

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Power Handling

The average power handling (total input power) of a Xinger coupler is a function of:

• Internal circuit temperature.

• Unit mounting interface temperature.

• Unit thermal resistance

• Power dissipated within the unit.

All thermal calculations are based on the following assumptions:

• The unit has reached a steady state operating condition.

• Maximum mounting interface temperature is 95oC.

• Conduction Heat Transfer through the mounting interface.

• No Convection Heat Transfer.

• No Radiation Heat Transfer.

• The material properties are constant over the operating temperature range.

Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal

resistance. The finite element simulation requires the following inputs:

• Unit material stack-up.

• Material properties.

• Circuit geometry.

• Mounting interface temperature.

• Thermal load (dissipated power).

The classical definition for dissipated power is temperature delta (∆T) divided by thermal resistance (R). The

dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss

(ILtherm):

)(10110 WP

Ptherm

indis 











−⋅=

∆

=−

(1)

Power flow and nomenclature for an “X” style coupler is shown in Figure 1.

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Rev B

Pin 1

Pin 4

Input Port

Coupled Port Direct Port

Isolated Port

PIn POut(RL) POut(ISO)

POut(CPL) POut(DC)

Figure 1

The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are

no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is

returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the

power at the coupled port, and Pout(DC) is the power at the direct port.

At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and

direct ports:

Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a

negative number. Obviously, a mere sign change equates the two quantities.

)dB(

PP P

log10IL

)DC(out)CPL(out

10 











+

⋅= (2)

In terms of S-parameters, IL can be computed as follows:

)dB(SSlog10IL 2

3110 









+⋅−= (3)

We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the

isolated port.

For thermal calculations, we are only interested in the power lost “inside” the coupler. Since Pout(RL) is lost in the

source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for

thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:

)(log10

)()()()(

10 dB

PPPP P

RLoutISOoutDCoutCPLout

therm 











+++

⋅= (4)

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In terms of S-parameters, ILtherm can be computed as follows:

)(log10 2

1110 dBSSSSILtherm 









+++⋅−= (5)

The thermal resistance and power dissipated within the unit are then used to calculate the average total input power

of the unit. The average total steady state input power (Pin) therefore is:

)(

101101 1010

Pthermtherm ILIL

dis











−

∆











−

=−− (6)

Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):

)( CTTT o

mntcirc −=∆ (7)

The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.

Multiple material combinations and bonding techniques are used within the Xinger II product family to optimize RF

performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit

temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot

be used as a boundary condition for power handling calculations.

Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the

end users responsibility to ensure that the Xinger II coupler mounting interface temperature is maintained within the

limits defined on the power derating plots for the required average power handling. Additionally appropriate solder

composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the

mounting interface and RF port temperatures are kept to a minimum.

The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes

of the power handling of the coupler.

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Mounting

In order for Xinger surface mount couplers to work

optimally, there must be 50? transmission lines leading

to and from all of the RF ports. Also, there must be a

very good ground plane underneath the part to ensure

proper electrical performance. If either of these two

conditions is not satisfied, insertion loss, coupling, VSWR

and isolation may not meet published specifications.

Overall ground is improved if a dense population of

plated through holes connect the top and bottom ground

layers of the PCB. This minimizes ground inductance

and improves ground continuity. All of the Xinger hybrid

and directional couplers are constructed from ceramic

filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal

coefficient of expansion (CTE) of 17-25 ppm/oC.

When a surface mount hybrid coupler is mounted to a

printed circuit board, the primary concerns are; ensuring

the RF pads of the device are in contact with the circuit

trace of the PCB and insuring the ground plane of neither

the component nor the PCB is in contact with the RF

signal.

Mounting Footprint

To ensure proper electrical and thermal performance

there must be a ground plane with 100%

solder connection underneath the part

Dimensions are in Inches [Millimeters]

XC2100A-05 Mounting Footprint

4X .066 SQ

[1.68] 4X 50 V

Transmission

Line

Multiple

plated thru holes

to ground

.430

[10.92]

.220

[5.59]

4X .040

[1.02]

* = Plating Finish

Coupler Mounting Process

The process for assembling this component is a

conventional surface mount process as shown in Figure

1. This process is conducive to both low and high volume

usage.

Figure 1: Surface Mounting Process Steps

Storage of Components: The Xinger II products are

available in either an immersion tin or tin-lead finish.

Commonly used storage procedures used to control

oxidation should be followed for these surface mount

components. The storage temperatures should be held

between 15OC and 60OC.

Substrate: Depending upon the particular component,

the circuit material has an x and y coefficient of thermal

expansion of between 17 and 25 ppm/°C. This coefficient

minimizes solder joint stresses due to similar expansion

rates of most commonly used board substrates such as

RF35, RO4350, FR4, polyimide and G-10 materials.

Mounting to “hard” substrates (alumina etc.) is possible

depending upon operational temperature requirements.

The solder surfaces of the coupler are all copper plated

with either an immersion tin or tin-lead exterior finish.

Solder Paste: All conventional solder paste formulations

will work well with Anaren’s Xinger II surface mount

components. Solder paste can be applied with stencils or

syringe dispensers. An example of a stenciled solder

paste deposit is shown in Figure 2. As shown in the

figure solder paste is applied to the four RF pads and the

entire ground plane underneath the body of the part.

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Available on Tape and

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Manufacturing.

Model XC2100A

Rev A

Figure 2: Solder Paste Application

Coupler Positioning: The surface mount coupler can

be placed manually or with automatic pick and place

mechanisms. Couplers should be placed (see Figure 3

and 4) onto wet paste with common surface mount

techniques and parameters. Pick and place systems

must supply adequate vacuum to hold a 0.50-0.55

gram coupler.

Figure 3: Component Placement

Figure 4: Mounting Features Example

Reflow: The surface mount coupler is conducive to most of

today’s conventional reflow methods. A low and high

temperature thermal reflow profile are shown in Figures 5

and 6, respectively. Manual soldering of these components

can be done with conventional surface mount non-contact

hot air soldering tools. Board pre-heating is highly

recommended for these selective hot air soldering

methods. Manual soldering with conventional irons should

be avoided.

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Model XC2100A

Rev B

Figure 5 – Low Temperature Solder Reflow Thermal Profile

Figure 6 – High Temperature Solder Reflow Thermal Profile

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Model XC2100A

Rev A

Qualification Flow Chart

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Place Manufacturing.

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Model XC2100A

Rev B

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Reel for Pick and Place

Manufacturing.

Model XC2100A

Rev A

Material Declaration XC2100A-05S

Immersion Tin Finish

Material Weight

(lbs) (g) (PPM)

CAS Number

2-thiourea 3.1136E-07 1.4123E-04

2.7737E+02

62-56-6

Acetone

67-64-1

Aluminum

7429-90-5

Arsenic 3.4444E-07 1.5624E-04

3.0684E+02

7440-38-2

Brominated Epoxy Resin

68928-70-1

BT Resin

-------------

Chromium 6.8888E-08 3.1248E-05

6.1369E+01

7440-47-3

Copper 3.5261E-04 1.5994E-01

3.1412E+05

7440-50-8

EDTA Disodium Salt 3.1136E-08 1.4123E-05

2.7737E+01

139-33-3

Fiberglass 4.4280E-05 2.0086E-02

3.9447E+04

65997-17-3

Fused Silica 4.8180E-04 2.1855E-01

4.2921E+05

60676-86-0

Lead

7439-92-1

Polyimide

60842-76-4

Polyphenylene Ether Resin

-------------

PTFE 1.7391E-04 7.8887E-02

1.5493E+05

9002-84-0

Proprietary / Unknown 9.3407E-08 4.2369E-05

8.3211E+01

-------------

Sodium Hypophosphite 9.3407E-08 4.2369E-05

8.3211E+01

7681-53-0

Stannous Chloride 3.7363E-08 1.6948E-05

3.3284E+01

-------------

Steel

7439-89-6

25067-11-2

Tetrafluoroethylene

Hexaflouoropropylene

copolymer

Tin 5.6044E-08 2.5422E-05

4.9927E+01

7440-31-5

Titanium Dioxide 6.8888E-05 3.1248E-02

6.1369E+04

13463-67-7

Xylene

1330-20-7

Total Weight Calculated 1.1225E-03 5.0918E-01

Total Weight Measured 1.1500E-03 5.2164E-01

The values presented above are estimates at the current revision, and it is derived from vendor

supplied data. Whil

e Anaren strives for accurate reporting, due to product and process variations at

both Anaren and our suppliers, the quoted values are our best estimates only, and not measured

absolute values. Product specifications are subject to change without notice.

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Model XC2100A

Rev B

Application Information

The XC2100A-05 is an “X” style 5dB coupler. Port configurations are defined in the table on page 2 of this data sheet

and an example driving port 1 is shown below. Note that this is not an “H” style coupler like the older 5dB Xinger

couplers (such as the 1D1304-5 and 1A1305-5). The change was made to allow better placement of the termination

resistors when the coupler is used in a serial splitter/combiner network.

Ideal Coupler Operation

0.562V

∠

(

5dB)

0.827V

∠

90 (

1.65dB)

Isolated Port

The primary application for 5dB couplers is in serial splitting and combining networks. These networks are often

employed when the combining of 3 amplifiers is required. Unlike corporate networks, serial networks are not limited to

binary divisions (corporate networks are limited to 2n number of splits, where n is an integer). Serial networks can be

designed with [3, 4, 5, ….., n] splits, but have a practical limitation of about 8 splits.

A 5dB coupler is used in conjunction with a 3dB coupler to build 3-way splitter/combiner networks. An ideal version of

this network is illustrated below. Note what is required; a 50% split (i.e. 3dB coupler) and a 66% and 33% split (which is

actually a 4.77dB coupler, but due to losses in the system higher coupler values, such as 5dB, are actually better suited

for this function). The design of this type of circuit requires special attention to the losses and phase lengths of the

components and the interconnecting lines. A more in depth look at serial networks can be found in the article “Designing

In-Line Divider/Combiner Networks” by Samir Tozin, which describes the circuit design in detail and can be found in the

White Papers Section of the Anaren website, www.anaren.com.

3-Way Ideal Serial Splitter/Combiner Network

1/3 Pin

2/3 Pin

1/3 Pin

G=1

Pout

2/3 Pin

1/3 Pin

5 dB (4.77)

coupler

3 dB coupler

5 dB (4.77)

coupler

* 50Ω

Termination

* 50Ω

Termination

* 50Ω

Termination

* 50Ω

Termination

*Recommended Terminations

Power (Watts) Model

8 RFP-060120A15Z50

15 RFP-250375A4Z50

50 RFP-375375A6Z50

100 RFP-500500A6Z50

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Model XC2100A

Rev A

Packaging and Ordering Information

Parts are available in both reel and tube. Packaging follows EIA 481-2. Parts are oriented in tape and reel as

shown below. Minimum order quantities are 2000 per reel and 30 per tube. See Model Numbers below for

further ordering information.

ØAØC

REEL DIMENSIONS (inches [mm])

ØA

ØC 0.630 [16.0]

4.017 [102.03]

13.0 [330.0]

2000

QUANTITY/REEL TABLE 1

ØD

0.512 [13.0]

ØD

Xinger

Coupler Frequency Size Coupling

Value Plating Finish Packaging

XC 0450= 410-480MHz

0900= 800-1000MHz

1900=1700-2000MHz

2100=2000-2300MHz

A=0.56”x0.35”

B=1.0”x0.5”

E=0.56”x0.2”

L=0.65”x0.48”

T=0.65”x0.48”

03=3dB

05=5dB

10=10dB

20=20dB

P=Tin Lead

S=Immersion Tin

T=Tube

R=Tape & Reel

XX XXXX X-XX X X