
Phycomp Product specification
Surface-mount ceramic
multilayer capacitors C Array: Class 1, NP0 50 V
size 0612 (4 × 0603)
2003 Jul 18 Rev.7 9 www.yageo.com
TESTS AND REQUIREME NTS
Table 3 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be
mounted on printed-circuit
boards or ceramic substrates
by applying wave soldering,
reflow soldering (including
vapour phase soldering) or
conductive adhesive
no visible damage
4.5 visual inspection and
dimension check any applicable method usi ng
×10 magnification in accordance with
specification
4.6.1 capacitance (measured
1000 hours after date of
manufacture)
f = 1 kHz; measuring voltage
1 Vrms at 20 °C within specified tolerance
4.6.2 tan δ f = 1 kHz; measuring voltage
1 Vrms at 20 °C in accordance with
specification
4.6.3 insulation resistance
at UR (DC) for 1 minute in accordance with
specification
4.6.4 voltage proof 2.5 × UR for 1 minute no breakdown or flashover
4.7.1 temperature coefficient between minimum and
maximum temperature in accordance with
specification
4.8 adhesion a force of 5 N applied for
10 s to the line joining the
terminations and in a plane
parallel to the substrate
no visible damage
4.9 bond strength of plating
on end face mounted in accordance with
IEC 60384 10, paragraph 4.4
conditions: bending 1 mm at
a rate of 1 mm/s, radius jig
340 mm
no visible damage
∆C/C: ≤10%
resistance to soldering
heat; jig clamps to the
second component in
the longitudinal line
260 ±5 °C for 10 ±0.5 s
in a static solder bath the terminations shall be
well tinned after recovery
∆C/C: ±10%
4.10 Tb
resistance to leaching;
jig clamps to the second
component in the
longitudinal line
260 ±5 °C for 30 ±1 s
in a static solder bath using visual enlargement
of ×10, dissolution of the
terminations shall not
exceed 10%