Additional Resources: Product Page | 3D Model date 02/10/2020 page 1 of 5 SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK FEATURES * * * * TO-220 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths MODEL thermal resistance1 length power dissipation1 (mm) @ 75C T, nat conv (C/W) @ 1 W, nat conv (C/W) @ 1 W, 200 LFM (C/W) @ 1 W, 400 LFM (C/W) @ 75C T, nat conv (W) HSE-B20254-035H 25.4 12.93 14.40 3.28 2.49 5.80 HSE-B20381-035H 38.1 11.54 13.64 3.66 2.76 6.50 HSE-B20508-035H 50.8 9.62 12.98 5.17 3.28 7.80 HSE-B20508-035H-W2 50.8 9.62 12.98 5.17 3.28 7.80 HSE-B20635-035H 63.5 8.15 10.92 4.35 2.86 9.20 HSE-B20635-035H-W2 63.5 8.15 10.92 4.35 2.86 9.20 Note: 1. See performance curves for full thermal resistance details. 2. Placement pins with standoffs. 3. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-035H Power (W) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 14.40 3.28 2.49 2 28.52 6.90 5.02 3 43.03 10.51 7.48 4 56.78 13.98 9.87 5 67.70 17.81 12.71 6 77.09 21.84 14.82 7 86.63 25.55 17.33 8 95.53 29.43 19.68 9 103.32 33.25 22.19 10 112.39 37.35 24.51 100 Without Airflow 90 Mounting Surface Temperature Rise Above Ambient (C) Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 200 LFM 400 LFM 80 70 60 50 40 30 20 10 0 0 1 Ths: "hot spot" temperature measured on the heatsink Ta: ambient temperature cuidevices.com 2 3 4 5 6 Dissipated Power (W) 7 8 9 10 Additional Resources: Product Page | 3D Model CUI Devices SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK date 02/10/2020 page 2 of 5 PERFORMANCE CURVES (CONTINUED) HSE-B20381-035H 100 Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 13.64 3.66 2.76 2 25.38 6.96 5.06 3 40.52 10.35 7.51 4 51.51 13.65 9.97 5 61.79 17.05 12.65 6 71.27 20.69 15.04 7 80.06 24.37 17.45 8 89.74 27.82 19.84 9 97.27 30.95 22.10 10 105.15 34.45 24.85 Mounting Surface Temperature Rise Above Ambient (C) Power (W) Without Airflow 90 200 LFM 400 LFM 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 4 5 6 7 8 9 10 Dissipated Power (W) Ths: "hot spot" temperature measured on the heatsink Ta: ambient temperature HSE-B20508-035H(-W) 100 Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 12.98 5.17 3.28 2 23.69 10.43 7.01 3 33.43 16.23 9.87 4 43.43 22.15 14.05 5 52.51 27.62 18.06 6 61.06 33.03 22.24 7 69.25 38.72 26.25 8 77.11 43.92 30.07 9 84.38 49.28 33.81 10 92.34 54.09 36.92 Mounting Surface Temperature Rise Above Ambient (C) Power (W) Without Airflow 90 200 LFM 400 LFM 80 70 60 50 40 30 20 10 0 0 1 Ths: "hot spot" temperature measured on the heatsink Ta: ambient temperature cuidevices.com 2 3 Dissipated Power (W) Additional Resources: Product Page | 3D Model CUI Devices SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK date 02/10/2020 page 3 of 5 PERFORMANCE CURVES (CONTINUED) HSE-20635-035H(-W) Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 Without Airflow 90 Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 10.92 4.35 2.86 2 20.75 9.46 5.94 3 29.43 14.60 9.20 4 37.74 19.72 12.44 5 45.32 24.84 15.80 6 53.03 29.05 19.04 7 59.98 33.85 22.26 8 66.72 38.44 25.51 10 9 73.88 43.38 28.69 0 10 80.40 47.80 32.10 Mounting Surface Temperature Rise Above Ambient (C) Power (W) 200 LFM 400 LFM 80 70 60 50 40 30 20 0 1 Ths: "hot spot" temperature measured on the heatsink Ta: ambient temperature cuidevices.com 2 3 4 5 6 Dissipated Power (W) 7 8 9 10 Additional Resources: Product Page | 3D Model CUI Devices SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK date 02/10/2020 page 4 of 5 MECHANICAL DRAWING units: mm tolerance: 0.5 mm MATERIAL AL 6063-T5 FINISH black anodized PIN MATERIAL steel PIN PLATING tin -W Models * * Note: MODEL NO. LENGTH, L (mm) WEIGHT (g) HSE-B20254-035H* 25.4 11.33 HSE-B20381-035H 38.1 16.67 HSE-B20508-035H 50.8 22.22 HSE-B20508-035H-W 50.8 22.22 HSE-B20635-035H 63.5 27.5 HSE-B20635-035H-W 63.5 27.5 * Mounting hole not present on 25.4 mm length model. cuidevices.com Additional Resources: Product Page CUI Devices SERIES: HSE-BX-02 DESCRIPTION: HEAT SINK | 3D Model date 02/10/2020 page 5 of 5 REVISION HISTORY rev. description date 1.0 initial release 05/09/2017 1.01 updated datasheet 09/11/2017 1.02 brand update 02/10/2020 The revision history provided is for informational purposes only and is believed to be accurate. CUI Devices offers a one (1) year limited warranty. Complete warranty information is listed on our website. CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. cuidevices.com