date 02/10/2020
page 1 of 5
SERIES: HSE-BX-02 │ DESCRIPTION: HEAT SINK
cuidevices.com
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL thermal resistance1power
dissipation1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B20254-035H 25.4 12.93 14.40 3.28 2.49 5.80
HSE-B20381-035H 38.1 11.54 13.64 3.66 2.76 6.50
HSE-B20508-035H 50.8 9.62 12.98 5.17 3.28 7.80
HSE-B20508-035H-W250.8 9.62 12.98 5.17 3.28 7.80
HSE-B20635-035H 63.5 8.15 10.92 4.35 2.86 9.20
HSE-B20635-035H-W263.5 8.15 10.92 4.35 2.86 9.20
Note: 1. See performance curves for full thermal resistance details.
2. Placement pins with standos.
3. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 2345
6789
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 14.40 3.28 2.49
2 28.52 6.90 5.02
3 43.03 10.51 7.48
4 56.78 13.98 9.87
5 67.70 17.81 12.71
6 77.09 21.84 14.82
7 86.63 25.55 17.33
8 95.53 29.43 19.68
9 103.32 33.25 22.19
10 112.39 37.35 24.51
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20254-035H
Additional Resources: Product Page | 3D Model