General Description
The MAX15023 dual, synchronous step-down controller
operates from a 5.5V to 28V or 5V ±10% input voltage
range and generates two independent output voltages.
Each output is adjustable from 85% of the input voltage
down to 0.6V and supports loads of 12A or higher. Input
voltage ripple and total RMS input ripple current are
reduced by interleaved 180° out-of-phase operation.
The MAX15023 offers the ability to adjust the switching
frequency from 200kHz to 1MHz with an external resistor.
The MAX15023’s adaptive synchronous rectification elimi-
nates the need for external freewheeling Schottky diodes.
The device also utilizes the external low-side MOSFET’s
on-resistance as a current-sense element, eliminating the
need for a current-sense resistor. This protects the DC-
DC components from damage during output overloaded
conditions or output short-circuit faults without requiring a
current-sense resistor. Hiccup-mode current limit reduces
power dissipation during short-circuit conditions. The
MAX15023 includes two independent power-good out-
puts and two independent enable inputs with precise
turn-on/turn-off thresholds, which can be used for supply
monitoring and for power sequencing.
Additional protection features include cycle-by-cycle,
low-side, sink peak current limit, and thermal shutdown.
Cycle-by-cycle, low-side, sink peak current limit prevents
reverse inductor current from reaching dangerous levels
when the device is sinking current from the output. The
MAX15023 also allows prebiased startup without dis-
charging the output and features adaptive internal digital
soft-start. This new proprietary feature enables monoton-
ic charging of externally large output capacitors at start-
up, and achieves good control of the peak inductor
current during hiccup-mode short-circuit protection.
The MAX15023 is available in a space-saving and ther-
mally enhanced 4mm x 4mm, 24-pin TQFN-EP pack-
age. The device operates over the -40°C to +85°C
extended temperature range.
Applications
Point-of-Load Regulators
Set-Top Boxes
LCD TV Secondary Supplies
Switches/Routers
Power Modules
DSP Power Supplies
Features
o5.5V to 28V or 5V ±10% Input Supply Range
o0.6V to (0.85 x VIN) Adjustable Outputs
oAdjustable 200kHz to 1MHz Switching Frequency
oGuaranteed Monotonic Startup into a Prebiased
Load
oLossless, Cycle-by-Cycle, Low-Side, Source Peak
Current Limit with Adjustable, Temperature-
Compensated Threshold
oCycle-by-Cycle, Low-Side, Sink Peak Current-
Limit Protection
oProprietary Adaptive Internal Digital Soft-Start
o±1% Accurate Voltage Reference
oInternal Boost Diodes
oAdaptive Synchronous Rectification Eliminates
External Freewheeling Schottky Diodes
oHiccup-Mode Short-Circuit Protection and
Thermal Shutdown
oPower-Good Outputs and Analog Enable Inputs
for Power Sequencing
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
________________________________________________________________
Maxim Integrated Products
1
23
24
22
21
*EP
*EXPOSED PAD (CONNECT TO GROUND).
8
7
9
EN1
PGOOD1
DL1
PGND1
10
FB1
FB2
PGOOD2
DL2
COMP2
PGND2
12
LIM2
456
1718 16 14 13
LIM1
COMP1
DH2
DH1
BST1
LX1
MAX15023
EN2 VCC
3
15
IN
20
+
11 BST2
SGND
19 12 LX2
RT
TQFN
TOP VIEW
Pin Configuration
Ordering Information
19-4219; Rev 2; 3/11
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
PART TEMP RANGE
PIN-PACKAGE
MAX15023ETG+
-40°C to +85°C
24 TQFN-EP*
MAX15023ETG/V+
-40°C to +85°C
24 TQFN-EP*
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 12V, RT = 33kΩ, CVCC = 4.7µF, CIN = 1µF, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
(Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150°C),
and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection
included in this IC.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
IN to SGND.............................................................-0.3V to +30V
BST_ to VCC............................................................-0.3V to +30V
LX_ to SGND .............................................................-1V to +30V
EN_ to SGND............................................................-0.3V to +6V
PGOOD_ to SGND .................................................-0.3V to +30V
BST_ to LX_ ..............................................................-0.3V to +6V
DH_ to LX_ ..........................................….-0.3V to (VBST_ + 0.3V)
DL_ to PGND_ ............................................-0.3V to (VCC + 0.3V)
SGND to PGND_ .................................................. -0.3V to +0.3V
VCC to SGND................-0.3V to the lower of +6V or (VIN + 0.3V)
All Other Pins to SGND...............................-0.3V to (VCC + 0.3V)
VCC Short Circuit to SGND.........................................Continuous
VCC Input Current (IN = VCC, internal LDO not used) ......600mA
PGOOD_ Sink Current ........................................................20mA
Continuous Power Dissipation (TA= +70°C)(Note 1)
24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)......2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
GENERAL
5.5 28
Input Voltage Range VIN VIN = VCC 4.5 5.5 V
Quiescent Supply Current IIN VFB1 = VFB2 = 0.9V, no switching 4.5 6 mA
Standby Supply Current IIN_SBY VEN1 = VEN2 = VSGND 0.21 0.35 mA
VCC REGULATOR
6V < VIN < 28V, ILOAD = 5mA
Output Voltage VCC VIN = 6V, 1mA < ILOAD < 100mA 5.00 5.2 5.50 V
VCC Regulator Dropout ILOAD = 100mA 0.07 V
VCC Short-Circuit Output Current VIN = 5V 150 250 mA
VCC Undervoltage Lockout VCC_UVLO VCC falling 3.6 3.8 4 V
VCC Undervoltage Lockout
Hysteresis 430 mV
ERROR AMPLIFIER (FB_, COMP_)
FB_ Input Voltage Set-Point VFB_ 594 600 606 mV
FB_ Input Bias Current IFB_ VFB_ = 0.6V -250 +250 nA
PACKAGE THERMAL CHARACTERISTICS (Note 2)
24 TQFN-EP
Junction-to-Ambient Thermal Resistance (θJA)...............+36°C/W
Junction-to-Case Thermal Resistance (θJC)......................+8°C/W
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
_______________________________________________________________________________________ 3
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
FB_ to COMP_
Transconductance gmICOMP = ±40µA 650 1200 1900 µS
Amplifier Open-Loop Gain No load 80 dB
Amplifier Unity-Gain Bandwidth 10 MHz
COMP_ Swing (High) 2.4 V
COMP_ Swing (Low) No load at COMP_ 0.6 V
COMP_ Source/Sink Current ICOMP_ | ICOMP_ |, VCOMP_ = 1.5V 45 80 120 µA
ENABLE (EN_)
EN_ Input High VEN_H EN_ rising 1.15 1.20 1.25 V
EN_ Input Hysteresis VEN_HYS 150 mV
EN_ Input Leakage Current ILEAK_EN_ -250 +250 nA
OSCILLATOR
Switching Frequency fSW Each converter 460 500 540 kHz
Switching Frequency
Adjustment Range (Note 4) 200 1000 kHz
PWM Ramp Peak-to-Peak
Amplitude VRAMP 1.42 V
PWM Ramp Valley VVALLEY 0.72 V
Phase Shift Between
Channels From DH1 to DH2 rising edges 180 Degrees
Minimum Controllable On-Time 60 100 ns
Maximum Duty Cycle 86 87.5 %
OUTPUT DRIVERS
Low, sinking 100mA, VBST_ - VLX_ = 5V 1
DH_ On-Resistance H i g h, sour ci ng 100m A, V
B S T _ - V
L X _ = 5V 1.2 Ω
Low, sinking 100mA, VCC = 5.2V 0.75
DL_ On-Resistance High, sourcing 100mA, VCC = 5.2V 1.4 Ω
Sinking 3
DH_ Peak Current CLOAD = 10nF Sourcing 2 A
Sinking 3
DL_ Peak Current CLOAD = 10nF Sourcing 2 A
DH_, DL_ Break-Before-Make
Time (Dead Time) 15 ns
SOFT-START
Soft-Start Duration 2048 Switching
cycles
Reference Voltage Steps 64 Steps
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, RT = 33kΩ, CVCC = 4.7µF, CIN = 1µF, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
(Note 3)
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, RT = 33kΩ, CVCC = 4.7µF, CIN = 1µF, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
(Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CURRENT LIMIT/HICCUP
Cycle-by-Cycle, Low-Side,
Source Peak Current-Limit
Threshold Adjustment Range
Source peak limit = VLIM_/10 30 300 mV
LIM_ Reference Current ILIM_ VLIM_ = 0.3V to 3V, TA = +25°C 45 50 55 µA
LIM_ Reference Current TC VLIM_ = 0.3V 2400 ppm/°C
Number of Consecutive Current-
Limit Events to Hiccup 7 Events
Hiccup Timeout Out of soft-start 7936 Switching
cycles
Cycle-by-Cycle, Low-Side,
Sink Peak Current-Limit Sense
Voltage
V
L IM _/
20 V
BOOST
Boost Switch Resistance VIN = VCC = 5.2V, IBST_ = 10mA 4.5 8 Ω
POWER-GOOD OUTPUTS
VFB_ rising 88.5 92.5 96.5
PGOOD_ Threshold VFB_ falling 85.5 89.5 93.5
%
V
FB
(
N OM IN A L
)
PGOOD_ Output Leakage ILEAK_PGD VPGOOD_ = 28V, VEN_ = 5V, VFB_ = 0.8V 1 µA
PGOOD_ Output Low Voltage VPGOOD_L IPGOOD_ = 2mA, EN_ = SGND 0.4 V
THERMAL SHUTDOWN
Thermal Shutdown Threshold +150 °C
Thermal Shutdown Hysteresis Temperature falling 20 °C
Note 3: All
Electrical Characteristics
limits over temperature are 100% tested at room temperature and guaranteed by design over
the specified temperature range.
Note 4: Select RTas
Rk
fkHz
has a
T
SW
()
(())
(
.
Ω= 24806 24806
1 0663
11
farad unit).
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
_______________________________________________________________________________________ 5
EFFICIENCY
vs. LOAD CURRENT
MAX15023 toc01
LOAD CURRENT (A)
EFFICIENCY (%)
101
35
40
45
50
55
60
65
70
75
80
85
90
95
30
0.1 100
VIN = 12V
VOUT1 = 1.2V
VOUT1 = 3.3V
EFFICIENCY
vs. LOAD CURRENT
MAX15023 toc02
LOAD CURRENT (A)
EFFICIENCY (%)
101
35
40
45
50
55
60
65
70
75
80
85
90
95
100
30
0.1 100
VOUT1 = 1.2V
VOUT1 = 3.3V
VIN = VCC = 5V
OUTPUT VOLTAGE CHANGE
vs. LOAD CURRENT
MAX15023 toc03
LOAD CURRENT (A)
OUTPUT VOLTAGE CHANGE (%)
108642
99.2
99.4
99.6
99.8
100.0
100.2
100.4
100.6
100.8
101.0
99.0
012
OUT1
VCC VOLTAGE
vs. LOAD CURRENT
MAX15023 toc04
LOAD CURRENT (mA)
SUPPLY VOLTAGE (V)
13512015 30 45 75 9060 105
5.05
5.10
5.15
5.20
5.25
5.30
5.35
5.40
5.00
0150
VCC VOLTAGE
vs. IN VOLTAGE
MAX15023 toc05
IN VOLTAGE (V)
VCC VOLTAGE (V)
242016128
4.15
4.30
4.45
4.60
4.75
4.90
5.05
5.20
5.35
5.50
4.00
428
ILOAD = 5mA
ILOAD = 50mA
VCC VOLTAGE
vs. TEMPERATURE
MAX15023 toc06
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
303510-15
5.05
5.10
5.15
5.20
5.25
5.30
5.35
5.40
5.45
5.50
5.00
-40 85
ILOAD = 5mA
SWITCHING FREQUENCY
vs. RT
MAX15023 toc07
RT (kΩ)
SWITCHING FREQUENCY (kHz)
807050 6030 4020
200
300
400
500
600
700
800
900
1000
1100
1200
1300
100
10 90
SWITCHING FREQUENCY
vs. TEMPERATURE
MAX15023 toc08
TEMPERATURE (°C)
SWITCHING FREQUENCY (kHz)
603510-15
250
300
350
400
450
500
550
600
650
700
750
800
200
-40 85
RT = 22.1kΩ
RT = 33.2kΩ
RT = 66.5kΩ
IIN CURRENT
vs. SWITCHING FREQUENCY
MAX15023 toc09
SWITCHING FREQUENCY (kHz)
IIN CURRENT (mA)
900800700600500400300
30
60
90
120
150
180
210
0
200 1000
VIN = 12V
CDL = CDH = 10nF
CDL = CDH = 4.7nF
CDL = CDH = 1nF
CDL = CDH = 0nF
Typical Operating Characteristics
(Supply = IN = 12V, unless otherwise noted. See
Typical Application Circuit
of Figure 6.)
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Supply = IN = 12V, unless otherwise noted. See
Typical Application Circuit
of Figure 6.)
IIN + IVCC CURRENT
vs. SWITCHING FREQUENCY
MAX15023 toc10
SWITCHING FREQUENCY (kHz)
IIN + IVCC CURRENT (mA)
900800700600500400300
30
60
90
120
150
180
210
0
200 1000
VIN = VCC = 5V
CDL_ = CDH_ = 10nF
CDL_ = CDH_ = 4.7nF
CDL_ = CDH_ = 1nF
CDL = CDH = 0nF
EN_ TURN-ON AND TURN-OFF THRESHOLD
vs. TEMPERATURE
MAX15023 toc11
TEMPERATURE (°C)
EN_ TURN-ON AND TURN-OFF THRESHOLDS
603510-15
1.025
1.050
1.075
1.100
1.125
1.150
1.175
1.200
1.225
1.250
1.000
-40 85
EN_ RISING
EN_ FALLING
LIM_ CURRENT
vs. TEMPERATURE
MAX15023 toc12
TEMPERATURE (°C)
LIM_ CURRENT (µA)
603510-15
40
42
44
46
48
50
52
54
56
58
60
38
-40 85
ILIM2
ILIM1
SHUTDOWN CURRENT
vs. TEMPERATURE
MAX15023 toc13
TEMPERATURE (°C)
SHUTDOWN CURRENT (µA)
603510-15
205
210
215
220
225
230
200
-40 85
CURRENT-LIMIT THRESHOLD
vs. RLIM
MAX15023 toc14
RLIM (kΩ)
CURRENT-LIMIT THRESHOLD (mV)
555040 4515 20 25 30 3510
30
60
90
120
150
180
210
240
270
300
0
560
SOURCE CURRENT LIMIT
SINK CURRENT LIMIT
LOAD TRANSIENT ON OUT1
MAX15023 toc15
10µs/div
VOUT1 (AC-COUPLED)
100mV/div
VOUT2 (AC-COUPLED)
50mV/div
IOUT1
5A/div
LOAD TRANSIENT ON OUT2
MAX15023 toc16
10µs/div
VOUT2 (AC-COUPLED)
200mV/div
VOUT1 (AC-COUPLED)
100mV/div
IOUT2
2A/div
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(Supply = IN = 12V, unless otherwise noted. See
Typical Application Circuit
of Figure 6.)
STARTUP AND DISABLE FROM EN
MAX15023 toc19
2ms/div
VEN2
5V/div
VIN
10V/div
VOUT2
2V/div
VPGOOD2
5V/div
IOUT2 = 500mA
STARTUP AND TURN-OFF FROM IN
MAX15023 toc20
4ms/div
VIN
10V/div
VOUT1
1V/div
VPGOOD1
5V/div
EN1 = EN2 = VCC
IOUT1 = 1.2A
STARTUP AND TURN-OFF FROM IN
MAX15023 toc21
4ms/div
VIN
10V/div
VOUT2
2V/div
VPGOOD2
5V/div
IOUT2 = 500mA
STARTUP INTO PREBIASED OUTPUT
(0.5V PREBIASED)
MAX15023 toc22
2ms/div
VOUT1
500mV/div
0V
LINE-TRANSIENT RESPONSE
MAX15023 toc17
2ms/div
VIN
5V/div
VOUT1 (AC-COUPLED)
50mV/div
VOUT2 (AC-COUPLED)
100mV/div
STARTUP AND DISABLE FROM EN
MAX15023 toc18
2ms/div
VEN1
5V/div
VIN
10V/div
VOUT1
500mV/div
VPGOOD1
5V/div
IOUT1 = 1.2A
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(Supply = IN = 12V, unless otherwise noted. See
Typical Application Circuit
of Figure 6.)
STARTUP INTO PREBIASED OUTPUT
(1V PREBIASED)
MAX15023 toc23
2ms/div
VOUT1
500mV/div
0V
STARTUP INTO PREBIASED OUTPUT
(1.5V PREBIASED)
MAX15023 toc24
2ms/div
VOUT1
500mV/div
0V
DH_ AND DL_ DISOVERLAP
MAX15023 toc25
20ns/div
VDH1
10V/div
VDL1
5V/div
VLX1
10V/div
IOUT1 = 5A
DH_ AND DL_ DISOVERLAP
MAX15023 toc26
20ns/div
VDH1
10V/div
VDL1
5V/div
VLX1
10V/div
IOUT1 = 5A
OUT-OF-PHASE SWITCHING FORMS
MAX15023 toc27
1µs/div
VLX1
10V/div
VLX2
10V/div
ILX1
5A/div
ILX2
2A/div
IOUT1 = 5A
IOUT2 = 2.5A
SINK CURRENT-LIMIT WAVEFORMS
MAX15023 toc28
100µs/div
VOUT1
200mV/div
VLX1
20V/div
ILX1
2A/div
1.5V PREBIASED
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
_______________________________________________________________________________________ 9
Pin Description
PIN NAME FUNCTION
1 FB1 Feedback Input for Regulator 1. Connect FB1 to a resistive divider between Output 1 and SGND to adjust
the output voltage between 0.6V and (0.85 x input voltage (V)). See the Setting the Output Voltage section.
2 EN1
Active-High Enable Input for Regulator 1. When the voltage at EN1 exceeds 1.2V (typ), the controller begins
regulating OUT1. When the voltage falls below 1.05V (typ), the regulator is turned off. The EN1 input can be
used for power sequencing and as a secondary UVLO. Connect EN1 to VCC for always-on applications.
3 EN2
Active-High Enable Input for Regulator 2. When the voltage at EN2 exceeds 1.2V (typ), the controller begins
regulating OUT2. When the voltage falls below 1.05V (typ), the regulator is turned off. The EN2 input can be
used for power sequencing and as a secondary UVLO. Connect EN2 to VCC for always-on applications.
4 PGOOD1 Power-Good Output (Open Drain) for Channel 1. To obtain a logic signal, pull up PGOOD1 with an external
resistor connected to a positive voltage below 28V.
5 DL1 Low-Side Gate-Driver Output for Regulator 1. DL1 swings from VCC to PGND1. DL1 is low before VCC
reaches the UVLO rising threshold voltage.
6 PGND1 Low-Side Gate-Driver Supply Return (Regulator 1). Connect to the source of the low-side MOSFET of
Regulator 1.
7 LX1
External Inductor Connection for Regulator 1. Connect LX1 to the switched side of the inductor. LX1 serves
as the lower supply rail for the DH1 high-side gate driver and as sensing input of the synchronous
MOSFET’s VDS drop (drain terminal).
8 BST1 Boost Flying-Capacitor Connection for Regulator 1. Connect a ceramic capacitor with a minimum value of
100nF between BST1 and LX1.
9 DH1 High-Side Gate-Driver Output for Regulator 1. DH1 swings from LX1 to BST1. DH1 is low before VCC
reaches the UVLO rising threshold voltage.
10 DH2 High-Side Gate-Driver Output for Regulator 2. DH2 swings from LX2 to BST2. DH2 is low before VCC
reaches the UVLO rising threshold voltage.
11 BST2 Boost Flying-Capacitor Connection for Regulator 2. Connect a ceramic capacitor with a minimum value of
100nF between BST2 and LX2.
12 LX2
External Inductor Connection for Regulator 2. Connect LX2 to the switched side of the inductor. LX2 serves
as the lower supply rail for the DH2 high-side gate driver and as sensing input of the synchronous
MOSFET’s VDS drop (drain terminal).
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
10 ______________________________________________________________________________________
Pin Description (continued)
PIN NAME FUNCTION
13 PGND2 Low-Side Gate-Driver Supply Return (Regulator 2). Connect to the source of the low-side MOSFET of
Regulator 2.
14 DL2 Low-Side Gate-Driver Output for Regulator 2. DL2 swings from VCC to PGND2. DL2 is low before VCC
reaches the UVLO rising threshold voltage.
15 PGOOD2 Power-Good Output (Open Drain) for Channel 2. To obtain a logic signal, pull up PGOOD2 with an external
resistor connected to a positive voltage below 28V.
16 VCC
Internal 5.2V Linear Regulator Output and the Device’s Core Supply. When using the internal regulator,
bypass VCC to SGND with a 4.7µF minimum low-ESR ceramic capacitor. If VCC is connected to IN for 5V
operation, then a 2.2µF ceramic capacitor is adequate for decoupling (see the Typical Application Circuits).
17 FB2 Feedback Input for Regulator 2. Connect FB2 to a resistive divider between output 2 and SGND to adjust
the output voltage between 0.6V and (0.85 x input voltage (V)). See the Setting the Output Voltage section.
18 COMP2 Compensation Pin for Regulator 2. See the Compensation section.
19 RT Oscillator-Timing Resistor Input. Connect a resistor from RT to SGND to set the oscillator frequency from
200kHz to 1MHz (see the Setting the Switching Frequency section).
20 SGND Signal Ground. Connect SGND to the SGND plane. SGND also serves as sensing input of the synchronous
MOSFET’s VDS drop (source terminals) for both channels.
21 IN Internal VCC Regulator Input. Bypass IN to SGND with a 1µF minimum ceramic capacitor when the internal
linear regulator (VCC) is used. When operating in the 5V ±10% range, connect IN to VCC.
22 LIM2
Current-Limit Adjustment for Regulator 2. Connect a resistor (RLIM2) from LIM2 to SGND to adjust the
current-limit threshold (VITH2) from 30mV (RLIM2 = 6kΩ) to 300mV (RLIM2 = 60kΩ). See the Setting the
Cycle-by-Cycle Low-Side Source Peak Current Limit section.
23 LIM1
Current-Limit Adjustment for Regulator 1. Connect a resistor (RLIM1) from LIM1 to SGND to adjust the
current-limit threshold (VITH1) from 30mV (RLIM1 = 6kΩ) to 300mV (RLIM1 = 60kΩ). See the Setting the
Cycle-by-Cycle Low-Side Source Peak Current Limit section.
24 COMP1 Compensation Pin for Regulator 1. See the Compensation section.
—EP
Exposed Paddle. Connect EP to a large copper plane at SGND potential to improve thermal dissipation. Do
not use as the main IC’s SGND ground connection.
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 11
Functional Diagram
OSCILLATOR
ENABLE
LOGIC
VREF
RT
EN1
ENABLE1
COMPARATOR
THERMAL
SHUTDOWN
BANDGAP
REFERENCE
STARTUP
BIAS
VREF
VREF = 0.6V
VREF
EN2
SGND
IN
LIM2
LIM1
VCC
ENABLE2
COMPARATOR
IN
UVLO
VCC
UVLO
INTERNAL
VOLTAGE
REGULATOR
LIM
CURRENT
GENERATOR
MAX15023 GEN
VREF
CK2
CK1
ENABLE1 ENABLE2
VREF
CK2
LIM2
SGND LIM1
CK1
ENABLE1
ENABLE1
gM
VREF
ENABLE2
DC-DC CONVERTER 2
DC-DC CONVERTER 1
SOFT-START/
STOP LOGIC
AND
HICCUP LOGIC
COMP2 BST2 DH2 PGND2
PGOOD2 FB2 DL2 LX2
MAX15023
VREF
0.925 x VREF
CK1
FB1
DAC_VREF
PWM
COMPARATOR
RAMP
GENERATOR
BOOST
DRIVER
LOW-SIDE DRIVER
SINK
CURRENT-LIMIT
COMPARATOR
PGOOD
COMPARATOR
SOURCE
CURRENT-LIMIT
COMPARATOR
HIGH-
SIDE
DRIVER
PWM
PWM
CONTROL
LOGIC
RAMP
GATEP
HICCUP TIMEOUT
HICCUP
HICCUP
VCC
LIM1/20
LIM1/10
HICCUP
TIMEOUT
COMP1
BST1
DH1
LX1
DL1
PGND1
FB1
PGOOD1
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
12 ______________________________________________________________________________________
Detailed Description
The MAX15023 dual, synchronous, step-down con-
troller operates from a 5.5V to 28V or 5V ±10% input
voltage range and generates two independent output
voltages. As long as the controller’s input bias voltage
is within the specified range, the input power bus can
also be lower than 4.5V and step-down conversion
from a 3.3V rail is also possible. Both output voltages
can be set from 0.6V to 85% of regulator’s input volt-
age. Each output can support loads of 12A or higher.
The switching sequence of the regulators is interleaved
with 180° out-of-phase operation, so that input voltage
ripple and total RMS input ripple current are reduced.
Enable inputs with precise turn-on/off threshold
(±4.2%) allow accurate external UVLO settings. Power-
good (PGOOD) open-drain outputs can be used for
supply sequencing.
The MAX15023’s capability to provide low output volt-
ages (down to 0.6V) and high output current (in excess
of 12A) makes it ideal for applications where a 5V or
12V bus is postregulated to deliver low voltages and
high currents, such as in set-top boxes.
The switching frequency is adjustable from 200kHz to
1MHz using an external resistor. The MAX15023’s
adaptive synchronous rectification eliminates the need
for external freewheeling Schottky diodes.
The MAX15023 utilizes voltage-mode control and exter-
nal compensation. The device also utilizes cycle-by-
cycle low-side source peak current limit for overcurrent
protection, where the external low-side MOSFET’s on-
resistance is used as a current-sense element during
the inductor freewheeling time, eliminating the need for
a current-sense resistor. The current-limit threshold
voltage is resistor adjustable independently on each
regulator from 30mV to 300mV and is temperature
compensated, so that the effects of the MOSFET’s
RDS(ON) variation over temperature are reduced.
Hiccup-mode current limit reduces average current
and power dissipation during a prolonged short-circuit
condition.
The MAX15023 also features a proprietary adaptive
internal digital soft-start and allows prebias startup
without discharging the output. Adaptive digital soft-
start, by acting on the loop voltage reference, automati-
cally prolongs the soft-start time, if the current-limit
threshold is reached during the soft-start sequence.
This increases the ability to smoothly bring up a large,
unknown amount of output capacitance. Also, since
soft-start is invoked during hiccup-mode short-circuit
protection, the same voltage reference rollback algo-
rithm achieves good control of the peak inductor cur-
rent during steady short-circuit or overload conditions.
An additional protection feature (cycle-by-cycle low-
side sink peak current limit) prevents the regulators from
sinking excessive amount of current if the prebias volt-
age exceeds the programmed steady-state regulation
level, or if another voltage source is trying to force the
output above that. This way, the synchronous rectifier
MOSFET and the body diode of the high-side MOSFET
do not experience dangerous levels of current stress
while the regulator is sinking current from the output.
Thermal shutdown protects the MAX15023 from exces-
sive power dissipation.
DC-DC PWM Controller
The MAX15023 step-down controller uses a PWM volt-
age-mode control scheme (see the
Functional
Diagram
) for each channel. Control loop compensation
is external for providing maximum flexibility in choosing
the operating frequency and output LC filter compo-
nents. An internal transconductance error amplifier pro-
duces an integrated error voltage at COMP_ that helps
provide higher DC accuracy. The voltage at COMP_
sets the duty cycle using a PWM comparator and a
ramp generator. On the rising edge of its internal clock,
the high-side n-channel MOSFET of each regulator
turns on and remains on until either the appropriate
duty cycle or the maximum duty cycle is reached.
During the high-side MOSFET’s on-time, the inductor
current ramps up. During the second-half of the switch-
ing cycle, the high-side MOSFET turns off and the low-
side n-channel MOSFET turns on. Now the inductor
releases the stored energy as its current ramps down,
providing current to the output. Under overload condi-
tions, when the inductor current exceeds the selected
cycle-by-cycle low-side source peak current-limit
threshold (see the
Current-Limit Circuit (LIM_)
section),
the high-side MOSFET does not turn on at the subse-
quent clock rising edge and the low-side MOSFET
remains on to let the inductor current ramp down.
Interleaved Out-of-Phase Operation
The two independent regulators in the MAX15023 oper-
ate 180° out-of-phase to reduce input filtering require-
ments, reduce electromagnetic interference (EMI), and
improve efficiency. This effectively lowers component
cost and saves board space, making the MAX15023
ideal for cost-sensitive applications.
MAX15023
The internal oscillator frequency is divided down to
obtain separated clock signals for each regulator. The
phase difference of the two clock signals is 180°, so that
the high-side MOSFETs turn on out-of-phase. The instan-
taneous input current peaks of both regulators no longer
overlap, resulting in reduced RMS ripple current and
input voltage ripple. As a result, this allows an input
capacitor with a lower ripple-current rating to be used or
allows the use of fewer or less expensive capacitors, as
well as reduces EMI filtering and shielding requirements.
Internal 5.2V Linear Regulator
The MAX15023’s internal functions and MOSFET drivers
are designed to operate from a 5V ±10% supply volt-
age. If the available supply voltage exceeds 5.5V, a
5.2V internal low-dropout linear regulator is used to
power internal functions and the MOSFET drivers at
VCC. If an external 5V ±10% supply voltage is available,
then IN and VCC can be tied to the 5V supply. The maxi-
mum regulator input voltage (VIN) is 28V. The regulator’s
input (IN) must be bypassed to SGND with a 1µF
ceramic capacitor when the regulator is used. Bypass
the regulator’s output (VCC) with a 4.7µF ceramic
capacitor to SGND. The VCC dropout voltage is typically
70mV, so when VIN is greater than 5.5V, VCC is typically
5.2V. The MAX15023 also employs a UVLO circuit that
disables both regulators when VCC falls below 3.8V
(typ). The 430mV UVLO hysteresis prevents chattering
on power-up/power-down.
The internal VCC linear regulator can source up to
100mA to supply the IC, power the low-side gate dri-
vers, recharge the external boost capacitors, and sup-
ply small external loads. The current available for
external loads depends on the current consumed for
the MOSFET gate drive.
For example, when switched at 600kHz, a single
MOSFET with 18nC total gate charge (at VGS = 5V)
requires 18nC x 600kHz ≅11mA. Since four MOSFETs
are driven and 6mA (max) is used by the internal con-
trol functions, the current available for external loads is:
(100 – (4 x 11) – 6)mA ≅50mA
MOSFET Gate Drivers (DH_, DL_)
The DH_ and DL_ drivers are optimized for driving
large size n-channel power MOSFETs. Under normal
operating conditions and after startup, the DL_ low-side
drive waveform is always the complement of the DH_
high-side drive waveform (with controlled dead time to
prevent cross-conduction or shoot-through). On each
channel, an adaptive dead-time circuit monitors the DH
and DL outputs and prevents the opposite-side
MOSFET from turning on until the other MOSFET is fully
off. Thus, the circuit allows the high-side driver to turn
on only when the DL_ gate driver has been turned off.
Similarly, it prevents the low-side (DL_) from turning on
until the DH_ gate driver has been turned off.
The adaptive driver dead time allows operation without
shoot-through with a wide range of MOSFETs, minimizing
delays, and maintaining efficiency. There must be a low-
resistance, low-inductance path from the DL_ and DH_
drivers to the MOSFET gates for the adaptive dead-time
circuits to work properly. Otherwise, because of the stray
impedance in the gate discharge path, the sense circuit-
ry could interpret the MOSFET gates as off while the VGS
of the MOSFET is still high. To minimize stray imped-
ance, use very short, wide traces (50 mils to 100 mils
wide if the MOSFET is 1in from the driver).
Synchronous rectification reduces conduction losses in
the rectifier by replacing the normal low-side Schottky
catch diode with a low-resistance MOSFET switch. The
internal pulldown transistor that drives DL_ low is
robust, with a 0.75Ω(typ) on-resistance. This low on-
resistance helps prevent DL_ from being pulled up dur-
ing the fast rise time of the LX_ node, due to capacitive
coupling from the drain to the gate of the low-side syn-
chronous rectifier MOSFET.
High-Side Gate-Drive Supply (BST_)
and Internal Boost Switches
The high-side MOSFET is turned on by closing an inter-
nal switch between BST_ and DH_. This provides the
necessary gate-to-source voltage to turn on the high-side
MOSFET, an action that boosts the gate drive signal
above VIN. The boost capacitor connected between
BST_ and LX_ holds up the voltage across the gate dri-
ver during the high-side MOSFET on-time.
The charge lost by the boost capacitor for delivering the
gate charge is refreshed when the high-side MOSFET is
turned off and LX_ node swings down to ground. When
the corresponding LX_ node is low, an internal high-volt-
age switch connected between VCC and BST_ recharges
the boost capacitor to the VCC voltage. The need for
external boost diodes is negated. See the
Boost Flying-
Capacitor Selection
section in the
Design Procedure
section to choose the right size of the boost capacitor.
Enable Inputs (EN_),
Adaptive Soft-Start and Soft-Stop
The MAX15023 can be used to regulate two indepen-
dent outputs. Each of the two outputs can be turned on
and off independently of one another by controlling the
enable input of each phase (EN1 and EN2).
A logic-high on each enable pin turns on the corre-
sponding channel. Then, the soft-start sequence is initi-
ated by step-wise increasing the reference voltage of
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 13
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
14 ______________________________________________________________________________________
the error amplifier. The duration of the soft-start ramp is
2048 switching cycles and the resolution is 1/64 of the
steady-state regulation voltage. This allows a smooth
increase of the output voltage. A logic-low on each EN_
initiates a soft-stop sequence by stepping down the ref-
erence voltage of the error amplifier. After the soft-stop
sequence is completed, the MOSFET drivers are both
turned off. See Figure 1 for more detail.
Connect EN1 and EN2 to VCC for always-on operation.
Owing to their accurate turn-on and turn–off thresholds,
EN1 and EN2 can be used as a UVLO adjustment input
and for power sequencing together with the PGOOD_
outputs. (See the
Setting the Enable Input (EN_)
section).
The adaptive action in the soft-start becomes visible if
the cycle-by-cycle, low-side, source peak current limit
is reached during the soft-start ramping sequence. In
this case, the rate-of-rise of the internal reference is
decreased, so that the PWM controller tries to regulate
to the inductor current around its limit value, rather than
the output voltage. The soft-start time can be prolonged
up to 4096 clock cycles (twice the normal soft-start
duration). This implementation allows the soft-start time
to be automatically adapted to the time necessary to
keep the LX current below the limit while charging the
output capacitor.
Since soft-start is invoked by the hiccup-mode short-
circuit protection, also see the
Hiccup Mode
Overcurrent Protection
section for additional details.
Power-Good Outputs (PGOOD_)
The MAX15023 includes two power-good comparators
to monitor the regulators’ output voltages and detect
the power-good threshold, fixed at 92.5% of the nomi-
nal FB voltage. The PGOOD_ outputs are open-drain
and should be pulled up with an external resistor to the
supply voltage of the logic input they drive. This voltage
should not exceed 28V. They can sink up to 2mA of
current while low.
VCC
BCD E
2048 CLK
CYCLES
2048 CLK
CYCLES
FGHIA
UVLO
EN_
VOUT_
DAC_VREF_
DH_
DL_
UVLO Undervoltage threshold value is provided in
the Electrical Characteristics table.
Internal 5.2V linear regulator output.
Active-high enable input.
Regulator output voltage.
Regulator internal soft-start and soft-stop signal.
Regulator high-side gate-driver output.
Regulator low-side gate-driver output.
VCC rising while below the UVLO threshold.
EN_ is low.
VCC
EN_
VOUT_
DAC_VREF_
DH_
DL_
A
SYMBOL DEFINITION
BVCC is higher than the UVLO threshold. EN_ is low.
EN is pulled high. DH_ and DL_ start switching.
Normal operation.
VCC drops below UVLO.
VCC goes above UVLO threshold. DH_ and DL_
start switching. Normal operation.
EN_ is pulled low. VOUT_ enters soft-stop.
EN_ is pulled high. DH_ and DL_ start switching.
Normal operation.
VCC drops below UVLO.
C
D
E
F
G
H
I
SYMBOL DEFINITION
Figure 1. MAX15023 Detailed Power-On/-Off Sequencing
MAX15023
Each PGOOD_ goes high (high impedance) when the
corresponding regulator output increases above 92.5%
of its nominal regulated voltage. Each PGOOD_ goes
low when the corresponding regulator output voltage
drops typically below 89.5% of its nominal regulated
voltage. PGOOD_ can be used as power-on-reset or
power sequencing for the two regulators.
PGOOD_ asserts low during the hiccup timeout period.
Startup into a Prebiased Output
When the controller starts into a prebiased output, the
DH_/DL_ complementary switching sequence is inhibit-
ed until the PWM comparator commands its first PWM
pulse. Until then, DH_ and DL_ are kept off so that the
converter does not sink current from the output. The
first PWM pulse occurs when the ramping reference
voltage increases above the FB_ voltage or the internal
soft-start time is over.
Current-Limit Circuit (LIM_)
The current-limit circuit employs a cycle-by-cycle low-
side source peak and sink current-sensing algorithm
that uses the on-resistance of the low-side MOSFET as
a current-sensing element, so that costly sense resis-
tors are not required. The current-limit circuit is also
temperature compensated to track the MOSFET’s on-
resistance variation over temperature. The current limit
is adjustable on each channel with an external resistor
at LIM_ (see the
Typical Application Circuits
), and
accommodates MOSFETs with a wide range of on-
resistance characteristics (see the
Design Procedure
section). The adjustment range is from 30mV to 300mV
for the cycle-by-cycle, low-side, source peak current
limit, corresponding to resistor values of 6kΩto 60kΩ.
The cycle-by-cycle, low-side, source peak current-limit
threshold across the low-side MOSFET is precisely 1/10
the voltage seen at LIM_, while the cycle-by-cycle, low-
side, sink peak current-limit threshold is 1/20 the volt-
age seen at LIM_.
The MAX15023 uses SGND to sense the voltage of the
source terminals of the low-side MOSFETs for both
channels, and LX_ to sense the drain voltage of each
low-side MOSFET. Carefully observe the
PCB Layout
Guidelines
section to ensure that noise and systematic
errors do not corrupt the current-sense signals seen by
LX_ and SGND on each channel.
Cycle-by-cycle, low-side, source peak current limit acts
when the inductor current flows in the normal direction,
and the drain (LX_) is more negative than source
(sensed by SGND) during the low-side MOSFET on-
time. If the magnitude of current-sense signal exceeds
the cycle-by-cycle, low-side, source peak current-limit
threshold during the low-side MOSFET on-time, the
controller does not initiate a new PWM cycle and lets
the inductor current decay in the next cycle. Since
cycle-by-cycle, low-side, source peak current sensing
is employed, the actual peak current is greater than the
current-limit threshold by an amount equal to the induc-
tor ripple current. Therefore, the exact current-limit
characteristic and maximum load capability are func-
tions of the low-side MOSFET’s on-resistance, current-
limit threshold, inductor value, and input voltage.
Cycle-by-cycle, low-side, sink peak current limit is also
implemented by monitoring the voltage drop across the
low-side MOSFET, but with opposite polarity (drain
more positive than source). If this drop exceeds 1/20
the voltage at the corresponding LIM_ pin at any time
during the low-side MOSFET on-time, the low-side
MOSFET is turned off and the inductor current flows
from the output through the high-side MOSFET back. If
the cycle-by-cycle, low-side, sink peak current limit is
activated, the DH_ and DL_ switching sequence is no
longer complementary.
Hiccup Mode Overcurrent Protection
Hiccup mode overcurrent protection reduces power
dissipation during prolonged short-circuit or deep over-
load conditions.
After the soft-start sequence has been completed, on
each switching cycle where the cycle-by-cycle, low-side,
source peak current-limit threshold is reached, a 3-bit
counter is incremented. The counter is decremented on
each switching cycle where the threshold is not reached,
and stopped at zero (000).
If the cycle-by-cycle, low-side, source peak current-
limit condition persists, the counter fills up reaching 111
(= 7 events). Then, the controller stops both DL_ and
DH_ drivers and waits for 7936 switching cycles (hic-
cup timeout delay). After this delay, the controller initi-
ates a new soft-start sequence.
If cycle-by-cycle, low-side, source peak current-limit
events occur during the soft-start time, turn-on cycles are
still skipped to control the inductor current, but the fill-up
of the 3-bit counter does not terminate the soft-start
sequence. Rather, the soft-start ramp is slowed down or
rolled back based on the cycle-by-cycle, low-side, source
peak current-limit events occurrences, so that the PWM
controller tries to regulate the inductor current around its
limit value, rather than the output voltage.
This proprietary technique prevents the duty cycle from
saturating, and limits the on-time and thus, the peak
inductor current is reached every time the high-side
MOSFET is turned on.
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 15
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
16 ______________________________________________________________________________________
In case of a nonideal short circuit applied at the output,
the output voltage equals the output impedance times the
limited inductor current during this phase. After reaching
the maximum allowable limit of the soft-start duration
(twice the normal soft-start time), the controller remains off
for 7936 clock cycles before trying to soft-start again.
Undervoltage Lockout
The MAX15023 has an internal undervoltage lockout
(UVLO) circuit to monitor the voltage on VCC. The
UVLO circuit prevents the MAX15023 from operating if
the voltages for the MOSFET drivers or for the internal
control functions are too low. The VCC falling threshold
is 3.8V (typ), with 430mV hysteresis to prevent chatter-
ing on the rising/falling edge of the supply voltage.
Before VCC reaches UVLO rising threshold voltage,
DL_ and DH_ stay low to inhibit switching.
Thermal-Overload Protection
Thermal-overload protection limits total power dissipation
in the MAX15023. When the device’s die-junction tem-
perature exceeds TJ= +150°C, an on-chip thermal sen-
sor shuts down the device, forcing DL_ and DH_ low,
allowing the IC to cool. The thermal sensor turns the
device on again after the junction temperature cools by
20°C. During thermal shutdown, the regulators shut
down, and soft-start is reset. Thermal-overload protection
can be triggered by power dissipation in the LDO regula-
tor, by excessive driving losses, or by both. Therefore,
carefully evaluate the total power dissipation (see the
Power Dissipation
section) to avoid unwanted triggering
of the thermal-overload protection in normal operation.
Design Procedure
Effective Input Voltage Range
Although the MAX15023 controllers can operate from
input supplies up to 28V and regulate down to 0.6V, the
minimum voltage conversion ratio (VOUT/VIN) might be
limited by the minimum controllable on-time. For proper
fixed-frequency PWM operation, the voltage conversion
ratio should obey the following condition:
where tON(MIN) is 100ns (max) and fSW is the switching
frequency in Hertz. If the desired voltage conversion
does not meet the above condition, then pulse skipping
occurs to decrease the effective duty cycle. To avoid
this, decrease the switching frequency or lower the
input voltage VIN.
The maximum voltage conversion ratio is limited by the
maximum duty cycle (Dmax):
where VDROP1 is the sum of the parasitic voltage drops
in the inductor discharge path, including synchronous
rectifier, inductor, and PCB resistances. VDROP2 is the
sum of the resistances in the charging path, including
high-side switch, inductor, and PCB resistances. In
practice, the above condition should be met with ade-
quate margin for good load-transient response.
Setting the Enable Input (EN_)
Each controller has an enable input referenced to an
analog voltage (1.2V). When the voltage exceeds 1.2V,
the regulator is enabled. To set a specific turn-on
threshold that can act as a secondary UVLO, a resistive
divider circuit can be used (see Figure 2)
Select R2(EN_ to SGND resistor) to a value lower than
200kΩ. Calculate R1(VMON to EN_ resistor) with the fol-
lowing equation:
where VEN_H_ = 1.2V (typical).
RR V
V
MON
EN H
12 1=⎛
⎝
⎜⎞
⎠
⎟
⎡
⎣
⎢
⎢
⎤
⎦
⎥
⎥
−
__
V
VDD V (1 D ) V
V
OUT
IN max max DROP2 max DROP1
IN
<×+ ×
−−
V
Vtf
OUT
NON(MIN) SW
I
>×
EN_
R1
VMON
R2
MA15023
Figure 2. Adjustable Enable Voltage
MAX15023
Setting the Output Voltage
Set the MAX15023 output voltage on each channel by
connecting a resistive divider from the output to FB_ to
SGND (Figure 3). Select R2(FB_ to SGND resistor) less
than or equal to 16kΩ. Calculate R1(OUT_ to FB_ resis-
tor) with the following equation:
where VFB_ = 0.6V (typ) (see the
Electrical Characteristics
table) and VOUT_ can range from 0.6V to (0.85 x VIN).
Resistor R1also plays a role in the design of the Type
III compensation network. If a Type III compensation
network is used, make sure to review the values of R1
and R2according to the
Type III Compensation
Network (See Figure 5)
section.
Setting the Switching Frequency
The switching frequency, fSW, for each channel is set
by a resistor (RT) connected from RT to SGND. The
relationship between fSW and RTis:
where fSW is in kHz, RT is in kΩ, and 24806 is in
1/farad. For example, a 600kHz switching frequency is
set with RT= 27.05kΩ. Higher frequencies allow
designs with lower inductor values and less output
capacitance. Consequently, peak currents and I2R
losses are lower at higher switching frequencies, but
core losses, gate-charge currents, and switching loss-
es increase.
Inductor Selection
Three key inductor parameters must be specified for
operation with the MAX15023: inductance value (L),
inductor saturation current (ISAT), and DC resistance
(RDC). To select inductance value, the ratio of inductor
peak-to-peak AC current to DC average current (LIR)
must be selected first. A good compromise between
size and loss is a 30% peak-to-peak ripple current to
average-current ratio (LIR = 0.3). The switching fre-
quency, input voltage, output voltage, and selected LIR
then determine the inductor value as follows:
where VIN, VOUT, and IOUT are typical values (so that
efficiency is optimum for typical conditions). The
switching frequency is set by RT(see the
Setting the
Switching Frequency
section). The exact inductor value
is not critical and can be adjusted in order to make
trade-offs among size, cost, efficiency, and transient
response requirements. Lower inductor values minimize
size and cost, but also improve transient response and
reduce efficiency due to higher peak currents. On the
other hand, higher inductance increases efficiency by
reducing the RMS current, but requires more output
capacitance to meet load-transient specifications.
Find a low-loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. The
inductor’s saturation rating (ISAT) must be high enough
to ensure that saturation can occur only above the max-
imum current-limit value, given the tolerance of the low-
side MOSFET’s on-resistance and of the LIM_ reference
current (ILIM). On the other hand, these tolerances
should not prevent the converter from delivering the
rated load current (ILOAD(MAX)). Combining these con-
ditions, the inductor saturation current (ISAT) should be
such that:
where RDS(ON,MAX) and RDS(ON,TYP) are the maximum
and typical on-resistance of the low-side MOSFET. For
a given inductor type and value, choose the LIR corre-
sponding to the worst-case inductor tolerance.
For LIR = 0.4, and a +25% on the low-side MOSFET’s
RDS(ON,MAX), the inductor saturation current should be
about 50% greater than the converter’s maximum load
current. A variety of inductors from different manufac-
turers can be chosen to meet this requirement (for
example, Coilcraft MSS1278 series).
I1I
SAT
RDS(ON,MAX)
RDS(ON,TYP) LOAD(MAX)
>×+
⎛
⎝
⎜⎞
⎠
⎟×
LIR
2
LVVV
V f I LIR
OUT IN OUT
IN SW OUT
=−()
R
f
T
SW
=24806
1 0663
()
.
RR V
V
OUT
FB
12 1=⎛
⎝
⎜⎞
⎠
⎟
⎡
⎣
⎢
⎢
⎤
⎦
⎥
⎥
−
_
_
FB_
R1
OUT_
R2
MA15023
Figure 3. Adjustable Output Voltage
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 17
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
18 ______________________________________________________________________________________
Setting the Cycle-by-Cycle, Low-Side,
Source Peak Current Limit
The minimum current-limit threshold must be high
enough to support the maximum expected load current
with the worst-case low-side MOSFET on-resistance
value since the low-side MOSFET’s on-resistance is
used as the current-sense element. The inductor’s
cycle-by-cycle, low-side, source peak current occurs at
ILOAD(MAX) minus half the ripple current. The ripple cur-
rent is maximum when the inductor value is at the lower
limit of its specified tolerance. The minimum value of
the current-limit threshold voltage (VITH) should be
greater than the voltage on the low-side MOSFET dur-
ing the ripple-current valley:
where RDS(ON) is the on-resistance of the low-side
MOSFET in ohms. Use the maximum value for RDS(ON)
from the low-side MOSFET’s data sheet.
To adjust the current-limit threshold, connect a resistor
(RLIM_) from LIM_ to SGND. The relationship between
the current-limit threshold (VITH_) and RLIM_ is:
where RLIM_ is in kΩand VITH_ is in mV.
An RLIM_ resistance range of 6kΩto 60kΩcorresponds
to a current-limit threshold of 30mV to 300mV. When
adjusting the current limit, use 1% tolerance resistors to
minimize errors in the current-limit threshold setting.
Input Capacitor
The input filter capacitor reduces peak currents drawn
from the power source and reduces noise and voltage
ripple on the input caused by the circuit’s switching.
The two converters of the MAX15023 run 180° out-of-
phase, thereby, effectively doubling the switching fre-
quency at the input and lowering the input RMS current.
The input ripple waveform would be unsymmetrical due
to the difference in load current and duty cycle between
converter 1 and converter 2. In fact, the worst-case input
RMS current occurs when only one controller is operat-
ing. The converter delivering the highest output power
(VOUT x IOUT) must be used in the formulas below:
The input capacitor RMS current requirement (IRMS) is
defined by the following equation:
IRMS has a maximum value when the input voltage
equals twice the output voltage (VIN = 2VOUT), so
IRMS(MAX) = ILOAD(MAX)/2.
Choose an input capacitor that exhibits less than +10°C
temperature rise at the RMS input current for optimal
long-term reliability.
The input voltage ripple is composed of ∆VQ(caused
by the capacitor discharge) and ∆VESR (caused by the
ESR of the capacitor). Use low-ESR ceramic capacitors
with high ripple current capability at the input. Assume
the contribution from the ESR and capacitor discharge
are equal to 50%. Calculate the input capacitance and
ESR required for a specified input voltage ripple using
the following equations:
where:
and:
where:
All equations listed above are valid under the assump-
tion that the input ports of both converters can be
merged in the physical layout, so that only one input
capacitor truly serves both converters. If this is not the
case, additional low-ESR, low-ESL ceramic capacitors
should be locally placed on each converter’s input port,
connected between the drain of the high-side MOSFET
and the source of the low-side MOSFET.
Output Capacitor
The key selection parameters for the output capacitor
are capacitance value, ESR, and voltage rating. These
parameters affect the overall stability, output ripple volt-
age, and transient response. The output ripple has two
components: variations in the charge stored in the out-
put capacitor, and the voltage drop across the capaci-
tor’s ESR caused by the current flowing into and out of
the capacitor:
∆∆∆VVV
RIPPLE ESR Q
≅+
DV
V
OUT
IN
=
CIDD
Vf
IN OUT
QSW
=×
×
−()1
∆
∆IVV V
Vf L
LIN OUT OUT
IN SW
=×
××
−()
ESR V
II
IN ESR
OUT L
=
+
∆
∆
2
II VVV
V
RMS LOAD MAX OUT IN OUT
IN
=−
()
()
RV
A
LIM ITH
__
=×10
50µ
VR I LIR
ITH DS ON MAX LOAD MAX
>××
⎛
⎝
⎜⎞
⎠
⎟
−
(, ) ( ) 12
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 19
The output voltage ripple as a consequence of the ESR
and the output capacitance is:
where ∆IL is the peak-to-peak inductor current ripple
(see the
Inductor Selection
section). These equations
are suitable for initial capacitor selection, but final val-
ues should be verified by testing in a prototype or eval-
uation circuit.
As a general rule, a smaller inductor ripple current
results in less output ripple voltage. The output capaci-
tor must be also checked against load-transient
response requirements. The allowable deviation of the
output voltage during fast load transients also deter-
mines the output capacitance, its ESR, and its equiva-
lent series inductance (ESL). The output capacitor
supplies the load current during a load step until the
controller responds with a greater duty cycle. The
response time (tRESPONSE) depends on the closed-
loop bandwidth of the converter (see the
Compensation
section). The resistive drop across the output capaci-
tor’s ESR, the drop across the capacitor’s ESL (∆VESL),
and the capacitor discharge causes a voltage droop
during the load step.
Use a combination of low-ESR tantalum/aluminum elec-
trolytic or polymer and ceramic capacitors for better
transient load and voltage ripple performance. Non-
leaded capacitors and capacitors in parallel help
reduce the ESL. Keep the maximum output voltage
deviation below the tolerable limits of the load. Use the
following equations to calculate the required ESR, ESL,
and capacitance value during a load step:
where ISTEP is the load step, tSTEP is the rise time of the
load step, tRESPONSE is the response time of the con-
troller, and fOis the closed-loop crossover frequency.
Compensation
Each channel of the MAX15023 provides an internal
transconductance amplifier with its inverting input and
its output available to the user for external frequency
compensation. The flexibility of external compensation
for each converter offers wide selection of output filter-
ing components, especially the output capacitor. For
cost-sensitive applications, use low-ESR aluminum
electrolytic capacitors; for component-size sensitive
applications, use low-ESR tantalum, polymer, or ceram-
ic capacitors at the output. The high switching frequen-
cy of the MAX15023 allows use of ceramic capacitors
at the output. Choose the small-signal components for
the error amplifier to achieve the desired closed-loop
bandwidth and phase margin.
To choose the appropriate compensation network type,
the power-supply poles and zeros, the zero crossover
frequency, and the type of the output capacitor must be
determined.
In a buck converter, the LC filter in the output stage
introduces a pair of complex poles at the following fre-
quency:
The output capacitor and its ESR also introduce a zero
at:
The loop-gain crossover frequency (fO, where the loop
gain equals 1 (0dB)) should be set below 1/10 the
switching frequency:
Choosing a lower crossover frequency might also help
in reducing the effects of noise pickup into the feed-
back loop, such as jittery duty cycle.
In order to maintain a stable system, two stability crite-
ria must be met:
1) The phase shift at the crossover frequency fO, must
be less than 180°. In other words, the phase margin
of the loop must be greater than zero.
2) The gain at the frequency where the phase shift is
-180° (gain margin) must be less than 1.
ff
OSW
≤10
fESR C
ZO OUT
=××
1
2π
f
LC
PO
OUT OUT
=××
1
2π
ESR V
I
CIt
V
ESL Vt
I
tf
ESR
STEP
OUT STEP RESPONSE
Q
ESL STEP
STEP
RESPONSE O
=
=×
=×
≅×
∆
∆
∆
1
3
∆∆
∆∆
∆
V I ESR
VI
Cf
IVV V
Vf L
ESR L
QL
OUT SW
LIN OUT OUT
IN SW
=×
=××
=×
××
−
8
()
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
20 ______________________________________________________________________________________
It is recommended to have a phase margin around
+50° to +60° to maintain a robust loop stability and
well-behaved transient response.
If an electrolytic or large-ESR tantalum output capacitor
is used, the capacitor ESR zero fZO typically occurs
between the LC poles and the crossover frequency fO
(fPO < fZO < fO). In this case, use a Type II (PI or pro-
portional-integral) compensation network.
If a ceramic or low-ESR tantalum output capacitor is
used, the capacitor ESR zero typically occurs above
the desired crossover frequency fO, that is fPO < fO <
fZO. In this situation, choose a Type III (PID or propor-
tional-integral-derivative) compensation network.
Type II Compensation Network
(See Figure 4)
If fZO is lower than fOand close to fPO, the phase lead
of the capacitor ESR zero almost cancels the phase
loss of one of the complex poles of the LC filter around
the crossover frequency. Therefore, a Type II compen-
sation network with a midband zero and a high-fre-
quency pole can be used to stabilize the loop. In Figure
4, RFand CFintroduce a midband zero (fZ1). RFand
CCF in the Type II compensation network also provide a
high-frequency pole (fP1), which mitigates the effects of
the output high-frequency ripple.
To calculate the component values for Type II compen-
sation network in Figure 4, follow the instruction below:
1) Calculate the gain of the modulator (GainMOD)—
composed of the regulator’s pulse-width modulator,
LC filter, feedback divider, and associated circuitry
at crossover frequency:
where VIN is the regulator’s input voltage, VOSC is the
amplitude of the ramp in the pulse-width modulator,
VFB is the FB_ input voltage set-point (0.6V typically,
see
Electrical Characteristics
table), and VOUT is the
desired output voltage.
The gain of the error amplifier (GainEA) in midband fre-
quencies is:
where gmis the transconductance of the error amplifier.
The total loop gain as the product of the modulator gain
and the error amplifier gain at fOshould equal 1. So:
Therefore:
Solving for RF:
2) Set a midband zero (fZ1) at 0.75 x fPO (to cancel
one of the LC poles):
Solving for CF:
3) Place a high-frequency pole at fP1 = 0.5 x fSW (to
attenuate the ripple at the switching frequency, fSW)
and calculate CCF using the following equation:
C
Rf C
CF
FSW F
=
×× −
1
1
π
CRf
FFPO
=×× ×
1
2075π.
fRC f
ZFF PO1
1
2075=×× =×
π.
RVfLV
V V g ESR
FOSC O OUT OUT
FB IN m
=×××
()
×
×××
2π
V
V
ESR
fL
V
VgR
IN
OSC O OUT
FB
OUT mF
××× ×××=
()21
π
Gain Gain
MOD EA
×=1
Gain g R
EA m F
=×
Gain V
V
ESR
fL
V
V
MOD IN
OSC O OUT
FB
OUT
=×
××
()
×
2π
VREF
R1
VOUT
R2gm
RF
COMP
CFCCF
Figure 4. Type II Compensation Network
MAX15023
Type III Compensation Network
(See Figure 5)
If the output capacitor used is a low-ESR tantalum or
ceramic type, the ESR-induced zero frequency is usual-
ly above the targeted zero crossover frequency (fO). In
this case, Type III compensation is recommended.
Type III compensation provides three poles and two
zeros at the following frequencies:
Two midband zeros (fZ1 and fZ2) cancel the pair of
complex poles introduced by the LC filter:
fP1 = 0
fP1 introduces a pole at zero frequency (integrator) for
nulling DC output voltage errors:
Depending on the location of the ESR zero (fZO), fP2
can be used to cancel it, or to provide additional atten-
uation of the high-frequency output ripple:
fP3 attenuates the high-frequency output ripple.
The locations of the zeros and poles should be such
that the phase margin peaks around fO.
Ensure that RF>>2/gm(1/gm(MIN) = 1/600µS = 1.67kΩ)
and the parallel resistance of R1, R2, and RIis greater
than 1/gm. Otherwise, a 180° phase shift is introduced
to the response and will make it unstable.
The following procedure is recommended:
1) With RF≥10kΩ, place the first zero (fZ1) at 0.5 x
fPO:
so:
2) The gain of the modulator (GainMOD)—composed of
the regulator’s pulse-width modulator, LC filter,
feedback divider, and associated circuitry at
crossover frequency is:
The gain of the error amplifier (GainEA) in midband fre-
quencies is:
The total loop gain as the product of the modulator gain
and the error amplifier gain at fOshould be equal to 1.
So:
Therefore:
Solving for CI:
3) If fPO < fO < fZO < fSW/2, the second pole (fP2)
should be used to cancel fZO. This way, the Bode
plot of the loop gain plot does not flatten out soon
after the 0dB crossover, and maintains its
-20dB/decade slope up to 1/2 the switching frequen-
cy. This is likely to occur if the output capacitor is a
low-ESR tantalum or polymer. Then set:
fP2 = fZO
If a ceramic capacitor is used, then the capacitor ESR
zero, fZO, is likely to be located even above 1/2 the
switching frequency, that is, fPO < fO< fSW/2 < fZO. In
this case, the frequency of the second pole (fP2) should
be placed high enough in order not to significantly
erode the phase margin at the crossover frequency. For
example, it can be set at 5 x fO, so that its contribution
to phase loss at the crossover frequency, fO, is only
about 11°:
fP2 = 5 x fO
Once fP2 is known, calculate RI:
RfC
IPI
=××
1
22
π
CVfLC
VR
IOSC O OUT OUT
IN F
=××× ×
()
×
2π
V
VfC L
fCR
IN
OSC O OUT OUT
OIF
××× × × ××× =
1
2
21
2
()
ππ
Gain Gain
MOD EA
×=1
Gain f C R
EA O I F
= ×××2π
Gain V
VfL C
MOD IN
OSC O OUT OUT
=×
×× ×
1
22
()π
CRf
FFPO
=×× ×
1
205π.
fRC f
ZFF PO1
1
205=×× =×
π.
f
RCC
CC
P
FFCF
FCF
3
1
2
=
×× ×
+
π
fRC
PII
2
1
2
=××π
fRC
fCRR
ZFF
ZII
1
21
1
2
1
2
=××
=×× +
π
π()
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 21
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
22 ______________________________________________________________________________________
4) Place the second zero (fZ2) at 0.2 x fOor at fPO,
whichever is lower and calculate R1using the fol-
lowing equation:
5) Place the third pole (fP3) at half the switching fre-
quency and calculate CCF:
6) Calculate R2as:
MOSFET Selection
The MAX15023’s step-down controller drives two exter-
nal logic-level n-channel MOSFETs as the circuit switch
elements. The key selection parameters to choose
these MOSFETs include:
• On-resistance (RDS(ON) )
• Maximum drain-to-source voltage (VDS(MAX) )
• Minimum threshold voltage (VTH(MIN) )
• Total gate charge (Qg)
• Reverse transfer capacitance (CRSS)
• Power dissipation
All four n-channel MOSFETs must be a logic-level type
with guaranteed on-resistance specifications at VGS =
4.5V. For maximum efficiency, choose a high-side
MOSFET (NH_) that has conduction losses equal to the
switching losses at the typical input voltage. Ensure
that the conduction losses at minimum input voltage do
not exceed MOSFET package thermal limits, or violate
the overall thermal budget. Also, ensure that the con-
duction losses plus switching losses at the maximum
input voltage do not exceed package ratings or violate
the overall thermal budget. Ensure that the MAX15023
DL_ gate drivers can drive a low-side MOSFET (NL_).
In particular, check that the dV/dt caused by NH_ turn-
ing on does not pull up the NL_ gate through NL_’s
drain-to-gate capacitance. This is the most frequent
cause of cross-conduction problems.
Gate-charge losses are dissipated by the driver and do
not heat the MOSFET. Therefore, if the drive current is
taken from the internal LDO regulator, the power dissi-
pation due to drive losses must be checked. All
MOSFETs must be selected so that their total gate
charge is low enough; therefore, VCC can power all four
drivers without overheating the IC:
where QG_TOTAL is the sum of the gate charges of all
four MOSFETs.
Power Dissipation
Device’s maximum power dissipation depends on the
thermal resistance from the die to the ambient environ-
ment and the ambient temperature. The thermal resis-
tance depends on the device package, PCB copper
area, other thermal mass, and airflow.
The power dissipated into the package (PT) depends on
the supply configuration (see the
Typical Application
Circuits
). It can be calculated using the following equation:
PT= VIN x IIN
For the circuits of Figures 7 and 8:
PT = VCC x (IIN + IVCC)
where VIN and VCC are the voltages at the respective
pins, IIN is the current at the input of the internal LDO
(IIN is practically zero for the circuits of Figures 7 and
8), IVCC is the current consumed by the internal core
and drivers when the internal regulator is unused for 5V
supply operation (IN = VCC). See the corresponding
Typical Operating Characteristics
for the typical curves
of IIN and IVCC current consumption vs. operating fre-
quency at various load capacitance values.
PVQ f
DRIVE IN G TOTAL SW
=× ×
_
RV
VV
R
FB
OUT FB
21
=×
−
CC
fRC
CF F
SW F F
=×× ××
()
−205 1π.
RfC
R
ZI
I1 2
1
2
=××
−
π
VREF
gm
R1
R2
VOUT
RI
COMP
CI
CCF
RFCF
Figure 5. Type III Compensation Network
MAX15023
To estimate the temperature rise of the die, use the fol-
lowing equation:
TJ= TA+ (PTx θJA)
where θJA is the junction-to-ambient thermal resistance
of the package, PTis power dissipated in the device,
and TAis the ambient temperature. The θJA is 36°C/W
for the 24-pin TQFN package on multilayer boards, with
the conditions specified by the respective JEDEC stan-
dards (JESD51-5, JESD51-7). If actual operating condi-
tions significantly deviate from those described in the
JEDEC standards, then an accurate estimation of the
junction temperature requires a direct measurement of
the case temperature (TC). Then, the junction tempera-
ture can be calculated using the following equation:
TJ= TC+ (PTx θJC)
Use 3°C/W as θJC thermal resistance for the 24-pin
TQFN package. The case-to-ambient thermal resis-
tance (θCA) is dependent on how well the heat is trans-
ferred from the PCB to the ambient. Therefore, solder
the exposed pad of the TQFN package to a large cop-
per area to spread heat through the board surface,
minimizing the case-to-ambient thermal resistance. Use
large copper areas to keep the PCB temperature low.
Boost Flying-Capacitor Selection
The MAX15023 uses a bootstrap circuit to generate the
necessary gate-to-source voltage to turn on the high-
side MOSFET. The selected n-channel high-side MOS-
FET determines the appropriate boost capacitance
values (CBST_in
Typical Application Circuits
) according
to the following equation:
where Qg is the total gate charge of the high-side
MOSFET and ∆VBST_ is the voltage variation allowed on
the high-side MOSFET driver after turn-on. Choose
∆VBST_ such that the available gate drive voltage is not
significantly degraded (e.g., ∆VBST_ = 100mV to
300mV) when determining CBST_. The boost flying-
capacitor should be a low-ESR ceramic capacitor. A
minimum value of 100nF is recommended.
Applications Information
PCB Layout Guidelines
Make the controller ground connections as follows: cre-
ate a small analog ground plane near the IC or use a
dedicated internal plane. Connect this plane to SGND
and use this plane for the ground connection for the IN
bypass capacitor, compensation components, feed-
back dividers, RT resistor, and LIM_ resistors.
If possible, place all power components on the top side
of the board, and run the power stage currents (espe-
cially the one having large high-frequency components)
using traces or copper fills on the top side only, without
adding vias.
On the top side, lay out a large PGND copper area for
the output of channels 1 and 2, and connect the bottom
terminals of the high-frequency input capacitors, output
capacitors, and the source terminals of the low-side
MOSFETs to that area.
Then, make a star connection of the SGND plane to the
top copper PGND area with few vias in the vicinity of
the source terminal sensing. Do not connect PGND and
SGND anywhere else. Refer to the MAX15023
Evaluation Kit data sheet for guidance.
Keep the power traces and load connections short,
especially at the ground terminals. This practice is
essential for high efficiency and jitter-free operation. Use
thick copper PCBs (2oz vs. 1oz) to enhance efficiency.
Place the controller IC adjacent to the synchronous rec-
tifier MOSFETs (NL_) and keep the connections for LX_,
PGND_, DH_, and DL_ short and wide. Use multiple
small vias to route these signals from the top to the bot-
tom side. The gate current traces must be short and
wide, measuring 50 mils to 100 mils wide if the low-side
MOSFET is 1in from the controller IC. Connect each
PGND trace from the IC close to the source terminal of
the respective low-side MOSFET.
Route high-speed switching nodes (BST_, LX_, DH_,
and DL_) away from the sensitive analog areas (RT,
COMP_, LIM_, and FB_). Group all SGND-referred and
feedback components close to the IC. Keep the FB_
and compensation network nets as small as possible to
prevent noise pickup.
CQg
V
BST BST
__
=∆
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 23
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
24 ______________________________________________________________________________________
Typical Application Circuits
3300pF
390pF
33pF
MAX15023
Q3
FDS8880
Q2
FDS8880
Q5
FDS6982AS-Q2
Q4
FDS6982AS-Q1
Q1
FDS8880
2EN1
8BST1
9DH1
15 PGOOD2
19
RT
18
COMP2
16
VCC
11
BST2
10
DH2
17
FB2
7
LX1
12
LX2
5
DL1
6
PGND1
14
DL2
13
PGND2
24
COMP1
23
LIM1
21
IN
1
FB1
1µF
16.2kΩ
47kΩ
200kΩ
30.1kΩ
20kΩ
2200pF
1.5Ω
RT
33kΩ
10µF
25V
2200pF
3300pF
22pF
CBST1
0.22µF
CBST2
0.22µF
4.7µF
10µF
25V
20
SGND
22
LIM2
12.1kΩ
12.1kΩ
EN1
VOUT1
VOUT2
VCC
PGOOD2
VCC
VIN
VIN
9V TO 16V
3EN2
4PGOOD1
47kΩ
200kΩ
22.1kΩ
10kΩ
45.3kΩ
1.62kΩ
EN2
DL1
PGOOD1
VOUT1
VCC
0.8µH 3.3µH
VIN
22µF
6.3V
1500µF
2.5V
22µF
6.3V
22µF
6.3V
22µF
6.3V
10µF
25V
1.5Ω
VOUT2
Figure 6. Application Diagram (Operation from a Single-Supply Rail, VIN = 9V to 16V)
MAX15023
Typical Application Circuits (continued)
MAX15023
22
DH1 LIM2
9
BST2 SGND
11
20
DH2 IN
10
21
LX2 RT
12
19
BST1 LIM1
8
23
LX1 COMP1
7
24
514DL1 DL2
415PGOOD1 PGOOD2
613PGND1 PGND2
316VCC
EN2
217FB2
EN1
118COMP2
VIN
4.5V TO 5.5V
PGOOD2
VOUT2
L2
VIN
FB1
C8
R6
C6
Q1
Q2
C2
CIN2
C3
C5
C5
R2
R4
RPU1
R8
R7
R1
R10 R9 RT
R5
EN1
PGOOD1
VOUT1
L1
EN2
CIN1
CBST1 CBST2
COUT1
C4 R3
RPU2
Q3
VIN
Q4 COUT2
Figure 7. Application Diagram (Operation with VIN = VCC = 5V ±10%)
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 25
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
26 ______________________________________________________________________________________
Typical Application Circuits (continued)
MAX15023
22
DH1 LIM2
9
BST2 SGND
11
20
DH2 IN
10
21
LX2 RT
12
19
BST1 LIM1
8
23
LX1 COMP1
7
24
514DL1 DL2
415PGOOD1 PGOOD2
613PGND1 PGND2
316VCC
EN2
217FB2
EN1
118COMP2
VAUX
4.5V TO 5.5V
PGOOD2
VOUT2
L2
VIN
3.3V
FB1
C8
R6
C6
Q1
Q2
C2
CIN2
C3
C5
C5
R2
R4
RPU1
R8
VIN
3.3V
R7
R1
R10 R9 RT
R5
EN1
PGOOD1
VOUT1
L1
EN2
CIN1
CBST1 CBST2
COUT1
C4 R3
RPU2
Q3
Q4 COUT2
Figure 8. Application Diagram (Operation with Auxiliary 5V Supply and 3.3V Bus)
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
______________________________________________________________________________________ 27
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE OUTLINE NO. LAND
PATTERN NO.
24 TQFN-EP T2444+4 21-0139 90-0022
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
28
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 7/08 Initial release —
1 2/09 Updated Electrical Characteristics, Current-Limit Circuit (LIM_), and
Setting the Enable Input (EN_) sections.4, 15, 16
2 3/11 Added automatic part MAX5023ETG/V+ 1, 2, 13, 27
