27.94mm [1.100"] 0.64mm typ. [0.025"] 27.94mm [1.100"] 0.41mm typ. [0.016"] 18.03mm [0.710"] 2.54mm typ. [0.100"] 25.65mm [1.010"] Top View Bottom View 1 4.08mm [0.161"] 7.33mm [0.289"] 2 3 0.46mm dia. typ. [0.018"] Side View 1 Substrate: 2.51mm 0.18mm [0.099" 0.007"] FR4/G10 or equivalent high temp material. 17m [1/2 oz.] Cu clad. SnPb plating. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25m [10"] Au over 1.27m [50"] Ni (min.). 3 Stand-off: material- Teflon; 2.29mm[0.090"] dia., 1.52mm[0.060"] thick. Description: PACKAGE CONVERTER 100 position QFP surface mount land pattern to 69 position PGA base pins. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.13mm [0.005"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. PC-QFP/PGA-CX3002-01 Drawing (c) 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale 2.5:1 Rev: A Drawing: H. Hansen Date: 6/20/01 File: PC-QFP/PGA-CX3002-01 Dwg Modified: