AMP J 822 (Rev, MAR 91) 108-5290 Product Specification 108-5290 CHAMP .050 (1) Board-to-Board Connector 1. Scope : = 1.1 Contents e This specification covers the requirements for product performance, test methods and quality od ve assurance provisions of CHAMP .050 (I) Board-to-Board Connector. o ce The applicable product descriptions and part numbers are as shown in Fig. 1: 2. Applicable Documents : The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. . 2.1 AMP Specifications: A. 109-5000 Test Specification, General Requirements for Test Methods B. 501-5066 Test Report (Dip Type) 501-5160 Test Report (SMT Type) 2.2 Military Standard and Specifications : MIL-STD-202 Test Methods for Electronic and Electrical Component Parts J | Revised FJ00-0660-00 {> Hiern H._ | Revised FJ00-0579-98 LTA epat OR. 19 Nov. "92 G_| Revised FJ00-1468-97 8H] HK |7.1097 SHEET AMP F | Revised FJ00-5380-96 51 | Hx |s1096| 5. Ishikawa { AMP (Japan), Ltd. E_| Revised F100~4384-96 S.T]Y.F loses ere 49 Nova OF Kawasakl, Japan D | Revised FJ00-3075-95 SHY. F |2e.695 - - 8 toc | Loc | NO. REV. C j Revised FJ00-2813-95 S HEY. F |28.8'95 Y. Fujiura cl J A 408-5290 J i B | Revised RFA-1871 T.N [ .F }2.1091 5 A_| Revised RFA-1644 s.1[v.F[esc0|APP- 19 Nov. "92, | NAME 5 0 | Released RFA-1371 SAJY Epos oa ura CHAMP .050 (1D E futa REVISION RECORD pR | CHK| DATE Board-to-Board ConnectorAMP J - 523 (Rev. MAR 91) 108-5290 SECURITY Customer Release CLASSINCATION : 3.1 3.2 3.3 3.4 Requirements : Design and Construction : Product shall be of the design, construction and physical dimensions specified in the applicable product drawing. Materials : A. Contact: Phosphor Bronze 1,3 2m minimum thick nickel underplate 0.2 zm, 0.5 ym and 0.76 4m minimum thick gold-plated on contact area only. 1,0 zm minimum thick solder-plated on tine area only. B. Housing and Tine Plate Malded Thermoplastic C. Accessories and Hardware: Retention Leg : Materials : Brass 1 pm minimum thick nickel underplate 2 zm minimum thick solder-plated Ratings : A. Voltage Rating: 250 VAC B. Current Rating: 1A C. Temperature Rating: 55C ~85C Performance and Test Descriptions : The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig. 1. All tests shall be performed in the room temperature unless otherwise specified. SHEET AMP AMP (Japan), Ltd. Kawasaki, Japan 2 OF 8 TA | 108-5290 NAME CHAMP .080 (I) Board-to-Board ConnectorAMP J - 523 (Rev, MAA 91) 108-5290 Customer Release SEOLRITY CLASSIFICATION : 3.5 Test Requirements and Procedures Summary Para. Test Items Requirements Procedures 8.5.1 | Confirmation of Product shall be conforming to Visually, dimensionally and Product the requirements ofa applicable | functionally inspected per applicable product drawing. inspections plan. Electrical Requirements 3.5.2 | Termination Resistance | 35m max. (Initial) Subject mated contacts assembled in (Low Level) AR=20 mf max. (Final) housing to closed circuit of 50 mA max. at open circuit voltage of 50 mV max. Fig. 3, AMP Spee. 109-5306 3.5.3 | Insulation Resistance 1,000 MQ min. (Initial) Measure by applying test potential 100 MQ min. (Final) between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B 3.6.4 | Dielectric Strength Connector must withstand test | Measure by applying test potential potential of 0.5 kVAC for 1 between the adjacent contacts, and minute, Currentleakage must | between the contacts and ground in be 0.5 mA max. the mated connectors, MIL-STD-202, Method 301 3.5.5 | Temperature Rising vs. | 30C max. under loaded Measure temperature rising by Curent specified current, energized current, Fig, 3. AMP Spec. 109-5310 AMP (Japan}, Ltd. SHEET AMP Kawasaki, Japan SOFB | tec J ise fs og 5200 | NAME CHAMP .050(D Board-to-Board ConnectorAMP J-523 (Rev. MAR 91) 108-5290 Customer Release Para. Test Items Requirements Procedures Physical Requirements 3.5.6 | Vibration Sinusoidal No electrical discontinuity Subject mated connectors to 10-55-10 Low Frequency greater than 1 microsecond (s) Hz traversed in 1 minute at 1.52 mm shall cecur, amplitude 2 hours each of 3 mutually perpendicular planes. MIL-STD-202, Method 201 3.5.7 | Physical Shock No electrical discontinuity Subject mated connectors to 50 Gs greater than 1 microsecond (s) halfsine shock pulses of 11 millisecond shall oceur, duration : 3 shocks in each direction applied along the 3 mutually perpendicular planes totally 18 shocks | ; MIL-STD-202, Method 213, Condition A 3.5.8 | Connector Mating Force | 90 g max. per contact Using autograph, measure the force required to mate connector using locking latch by operating at 100 mma minute. Calculate the value for a contact. AMP Spec. 109-5206 3.5.9 | Connector Unmating 15 g min, per contact Using autograph, measure the force Force required to unmate connector without locking latch set in effect, by operating at 100 mma minute. Calculate value for acontact. AMP Spec. 109-5206 3.5.10 | Durability (Repeated The requirements per Para. Mate and unmate connectors for 500 Mate/ Unmating) 3.5.2 shall be met. cycles at a maximum rate of 40 cycles Tainute. AMP Spec. 109-27 3.5.11 | Solderability Solderable area shall have a With the connector mounted on PCB. solder coverage of 95 % immerse in melted soldering tub so minimum. that the lower surface of PCB get wetted in the temperature of 230C =5C PCB for 5 seconds. Soldering area must appear with | Test in the following test condition : normally working filler of Preheat 100~150C 60 sec. min. solder, Heating 210 C min. 30 sec. max. Peek Temperature : 240C max. (Measured at housing surface) Fig. 1 (To be continued) AMP (Japan), Ltd. SHEET AM Romaseka haan 4 OF 8 7. A NO. 1 08- 5290 ") NAME CHAMP .050(1) Board-to-Board ConnectorAMP J + 523 (Rey. MAR 91} 108-5290 Customer Release SECLBITY CLASSIACATION : Para. Test Items Requirements Procedures 3.5.12 | Resistance to Soldering | No physical damage shall oceur. | Subject connector mounted on printed Heat circuit boards to solder bath at 260 (Dip Type) +5 C for seconds. MIL-STD-202, Method 210 except as indicated above Resistance to Reflow After testing, no physical Test by mounting on PCB. Soldering Heat damage shall be nor evident. Preheat 100~150 C 60 sec. min. (SMT Type) Heating 210C min, 30 sec. max. Peek Temperature : 240C max. (Measured at housing surface) 3.5.13 | Thermal Shock The requirements per Para, Subject mated connectors to 5 cycles 3.5.2 shall be met. between 55 * Cand +85 *8 c, MIL-STD-202, Method 107, Condition A 3.5.14 | Humidity-Temperature | The requirements per Paras. Subject mated connectors to 10 cycles Cycling 3.5.2, 3.5.3, and 3.5.4 shall be of humidity-temperature changes met. between 25 C and 65C at 96 % R.H. 3.5.15 | Salt Spay The requirements per Para. Subject mated connectors to 5 % salt 3.5.2 shall be met. concentration for 48 hours ; MIL-STD-202, Method 101 Condition B. 3.5.16 | Temperature Life The requirements per Para, Subject mated connectors to 3.5.2 shall be met. temperature life ;85 C +2C, 250 hours MIL-STD-202, Method 108 Condition B. 3.5.17 | Sulfurous acid gas The requirements per Para. Subject mated connectors to sulfurous 3.6.2 shall be met. acid gas of 10+ 3 ppm concentration in the room temperature with 90% min. R.H., for 48 hours. Fig.1 (End) AMP (Japan), Ltd. SHEET | AMINE Kawasaki, Japan 50OF8 We tec NO. 108-5290 NAME CHAMP .060 (1) Board-to-Board ConnectorAMP J- 523 (Rav. MAR 91) 108-5290 3.6 Product Qualification and Requalification Tests. Test of Examination Test Groups (a) 5 6 7 8 9 10 | 11 | 12 Test Sequence (b) Examination of Product 1,7 1,5 1,5 1,5 1,5] 1,5 1,6 1 Termination Resistance, Dry Circuit 2,6 2,4 2,4 2,4 2,4|2,4 2,5 Dielectric Withstanding Voltage zZ, 5 Customer Release | Setar: Insulation Resistance 3,6 Temperature Rise vs Current Vibration Physical Shock Mating Force Unmating Force Durability Solderability Resistance to Soldering Heat Reflow Solderability (SMT Type) Resistance to Reflow Soldering Heat (SMT Type) Thermal Shock Humidity-Temperature Cycling Corrosin, Salt Spray Temperature Life Sulfurous acid gas Number of Samples 5 3 3 3 (a) Numbers indicate sequence in which tests are performed. Fig. 2 SHEET 60F8 AMP AMP (Japan), Ltd. Kawasaki, Japan LOC J Loc A NO, REV. 108-5290 i NAME CHAMP .050 (I) Board-to-Board ConnectorAMP J- 523 (Rev. MAR 61} 108-5290 Customer Release S0nny CLASSINCATION - emperature Rise Probing Points RZ <= AMP AMP (Japan), Ltd. SHEET Kawasaki, Japan 7OF8 | |" 408-5290 "J NAME CHAMP .050(1D) Board-to-Board ConnectorAMP 1-523 (Rav. MAR 91} 108-5290 Customer Release CLASSHAICATION : SECURITY Product Part No. Description (-175610-O =| PlugConnector, Horizontal Type, W/O Retention Leg. D-175472-L1) | PlugConnector, Horizontal Type, with Retention Leg. O-175611-0 +|PlugConnector, VerticalType, W/O Retention Leg. 0-176473-E) +|PlugConnector, VerticalType, with Retention Leg. ()-176612-L] | Receptacle Connector, Horizontal Type, W/O Retention Leg. 01-175474-E) ~=+| Receptacle Connector, Horizontal Type, with Retention Leg. 1-176613-O) =| Receptacle Connector, Vertical Type. W/O Retention Leg. ()-175475-L || Receptacle Connector, Vertical Type, with Retention Leg. (1-176850-O | Receptacle Connector, Horizontal Type (High Profile) With R/L. O1-176953-C | Receptacle Connector, Horizontal Type, with Retention Leg. 0-176852-1~=| Plug Connector, Horizontal Type, with Retention Leg. C-917085-Q) {SMT PlugConneector, Horizontal Type with Retention Leg. O1-917593-L) |SMT Plug Connector, Horizontal Type with Retention Leg with GND Cont. , (-316241-) |SMTPlugConnector, Horizontal Type with Retention Leg with GND Cont. CJ-316790-L] |SMTPlugConnector, Horizontal Type with Retention Leg with GND Cont, CJ-353057-L5 =| Receptacle Connector Vertical Type, with Retention Leg. (1-1123283-O | SMT Plug Connector,Horizontal Type with Retention Leg with GND Cont. [1-1123575-O | Plug Connector,Horizontal Type with Retention Leg, Tine=2.0 (-1876054-0 | Plug Connector, Horizontal Type with GND cont. with reinforcement pin NOTE: Prefix and suffix numbers vary depending on the variations of the number of contacts and plating designation. Appendix 1 SHEET 8B OFS | coc | toc | no. AMP (Japan), Ltd. Kawasaki, Japan JIA REV. 108-5290 J NAME CHAMP .650 (I) Board-to-Board Connector