REV. C
a
AD7476A/AD7477A/AD7478A
*
2.35 V to 5.25 V, 1 MSPS,
12-/10-/8-Bit ADCs in 6-Lead SC70
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
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may result from its use. No license is granted by implication or otherwise
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Tel: 781/329-4700 www.analog.com
Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
FEATURES
Fast Throughput Rate: 1 MSPS
Specified for VDD of 2.35 V to 5.25 V
Low Power:
3.6 mW Typ at 1 MSPS with 3 V Supplies
12.5 mW Typ at 1 MSPS with 5 V Supplies
Wide Input Bandwidth:
71 dB SNR at 100 kHz Input Frequency
Flexible Power/Serial Clock Speed Management
No Pipeline Delays
High Speed Serial Interface
SPI®/QSPI™/MICROWIRE™/DSP Compatible
Standby Mode: 1 ␮A Max
6-Lead SC70 Package
8-Lead MSOP Package
APPLICATIONS
Battery-Powered Systems
Personal Digital Assistants
Medical Instruments
Mobile Communications
Instrumentation and Control Systems
Data Acquisition Systems
High Speed Modems
Optical Sensors
FUNCTIONAL BLOCK DIAGRAM
12-/10-/8-BIT
SUCCESSIVE-
APPROXIMATION
ADC
CONTROL
LOGIC
AD7476A/AD7477A/AD7478A
GND
V
DD
V
IN
SCLK
SDATA
CS
T/H
GENERAL DESCRIPTION
The AD7476A/AD7477A/AD7478A are 12-bit, 10-bit, and 8-bit
high speed, low power, successive-approximation ADCs, respec-
tively. The parts operate from a single 2.35 V to 5.25 V power
supply and feature throughput rates up to 1 MSPS. The parts
contain a low noise, wide bandwidth track-and-hold amplifier
that can handle input frequencies in excess of 13 MHz.
The conversion process and data acquisition are controlled using
CS and the serial clock, allowing the devices to interface with
microprocessors or DSPs. The input signal is sampled on the
falling edge of CS, and the conversion is also initiated at this point.
There are no pipeline delays associated with the parts.
The AD7476A/AD7477A/AD7478A use advanced design tech-
niques to achieve low power dissipation at high throughput rates.
The reference for the part is taken internally from V
DD
,
which
allows the widest dynamic input range to the ADC. Thus, the
analog input range for the part is 0 to V
DD
. The conversion rate is
determined by the SCLK.
PRODUCT HIGHLIGHTS
1. First 8-/10-/12-bit ADCs in an SC70 package.
2. High throughput with low power consumption.
3. Flexible power/serial clock speed management. The conversion
rate is determined by the serial clock, allowing the conver-
sion time to be reduced through the serial clock speed increase.
This allows the average power consumption to be reduced
when a power-down mode is used while not converting. The
parts also feature a power-down mode to maximize power
efficiency at lower throughput rates. Current consumption is
1µA max and 50 nA typically when in power-down mode.
4. Reference derived from the power supply.
5. No pipeline delay. The parts feature a standard successive-
approximation ADC with accurate control of the sampling
instant via a CS input and once-off conversion control.
*Protected by U.S.Patent No. 6,681,332.
REV. C–2–
AD7476A/AD7477A/AD7478A
(VDD = 2.35 V to 5.25 V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS, unless otherwise noted;
TA = TMIN to TMAX, unless otherwise noted.)
AD7476A–SPECIFICATIONS
1
Parameter
A Grade
2
B Grade
2
Y Grade
2
Unit Test Conditions/Comments
DYNAMIC PERFORMANCE f
IN
= 100 kHz Sine Wave
Signal-to-Noise + Distortion (SINAD)
3
70 70 70 dB min V
DD
= 2.35 V to 3.6 V, T
A
= 25ⴗC
69 69 69 dB min V
DD
= 2.4 V to 3.6 V
71.5 71.5 71.5 dB typ V
DD
= 2.35 V to 3.6 V
69 69 69 dB min V
DD
= 4.75 V to 5.25 V, T
A
= 25ⴗC
68 68 68 dB min V
DD
= 4.75 V to 5.25 V
Signal-to-Noise Ratio (SNR)
3
71 71 71 dB min V
DD
= 2.35 V to 3.6 V, T
A
= 25ⴗC
70 70 70 dB min V
DD
= 2.4 V to 3.6 V
70 70 70 dB min V
DD
= 4.75 V to 5.25 V, T
A
= 25ⴗC
69 69 69 dB min V
DD
= 4.75 V to 5.25 V
Total Harmonic Distortion (THD)
3
–80 –80 –80 dB typ
Peak Harmonic or Spurious Noise (SFDR)
3
–82 –82 –82 dB typ
Intermodulation Distortion (IMD)
3
Second-Order Terms –84 –84 –84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Third-Order Terms –84 –84 –84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Aperture Delay 10 10 10 ns typ
Aperture Jitter 30 30 30 ps typ
Full Power Bandwidth 13.5 13.5 13.5 MHz typ @ 3 dB
222 MHz typ @ 0.1 dB
DC ACCURACY B and Y Grades
4
Resolution 12 12 12 Bits
Integral Nonlinearity
3
±1.5 ±1.5 LSB max
±0.75 LSB typ
Differential Nonlinearity
–0.9/+1.5 –0.9/+1.5
LSB max
Guaranteed No Missed Codes to 12 Bits
±0.75 LSB typ
Offset Error
3, 5
±1.5 ±1.5 LSB max
±1.5 ±0.2 ±0.2 LSB typ
Gain Error
3, 5
±1.5 ±1.5 LSB max
±1.5 ±0.5 ±0.5 LSB typ
Total Unadjusted Error (TUE)
3, 5
±2±2LSB max
ANALOG INPUT
Input Voltage Range 0 to V
DD
0 to V
DD
0 to V
DD
V
DC Leakage Current ±0.5 ±0.5 ±0.5 µA max
Input Capacitance 20 20 20 pF typ
Track-and-Hold in Track; 6 pF typ when
in Hold
LOGIC INPUTS
Input High Voltage, V
INH
2.4 2.4 2.4 V min
1.8 1.8 1.8 V min V
DD
= 2.35 V
Input Low Voltage, V
INL
0.8 0.8 0.8 V max V
DD
= 5 V
0.4 0.4 0.4 V max V
DD
= 3 V
Input Current, I
IN
, SCLK Pin ±0.5 ±0.5 ±0.5 µA max Typically 10 nA, V
IN
= 0 V or V
DD
Input Current, I
IN
, CS Pin ±10 ±10 ±10 nA typ
Input Capacitance, C
IN6
555 pF max
LOGIC OUTPUTS
Output High Voltage, V
OH
V
DD
– 0.2 V
DD
– 0.2 V
DD
– 0.2 V min
I
SOURCE
= 200 µA; V
DD
= 2.35 V to 5.25 V
Output Low Voltage, V
OL
0.4 0.4 0.4 V max I
SINK
= 200 µA
Floating-State Leakage Current ±1±1±1µA max
Floating-State Output Capacitance
6
555 pF max
Output Coding
Straight (Natural) Binary
CONVERSION RATE
Conversion Time 800 800 800 ns max 16 SCLK Cycles
Track-and-Hold Acquisition Time
3
250 250 250 ns max
Throughput Rate 1 1 1 MSPS max See Serial Interface Section
REV. C
AD7476A/AD7477A/AD7478A
–3–
AD7477A–SPECIFICATIONS
1
(VDD = 2.35 V to 5.25 V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS, unless otherwise noted;
TA = TMIN to TMAX, unless otherwise noted.)
Parameter
A Grade
2
B Grade
2
Y Grade
2
Unit Test Conditions/Comments
POWER REQUIREMENTS
V
DD
2.35/5.25 2.35/5.25 2.35/5.25 V min/max
I
DD
Digital I/Ps = 0 V or V
DD
Normal Mode (Static) 2.5 2.5 2.5 mA typ V
DD
= 4.75 V to 5.25 V, SCLK ON or OFF
1.2 1.2 1.2 mA typ V
DD
= 2.35 V to 3.6 V, SCLK ON or OFF
Normal Mode (Operational) 3.5 3.5 3.5 mA max V
DD
= 4.75 V to 5.25 V, f
SAMPLE
= 1 MSPS
1.7 1.7 1.7 mA max V
DD
= 2.35 V to 3.6 V, f
SAMPLE
= 1 MSPS
Full Power-Down Mode (Static) 1 1 1 µA max Typically 50 nA
Full Power-Down Mode (Dynamic)
0.6 0.6 0.6 mA typ V
DD
= 5 V, f
SAMPLE
= 100 kSPS
0.3 0.3 0.3 mA typ V
DD
= 3 V, f
SAMPLE
= 100 kSPS
Power Dissipation
7
Normal Mode (Operational) 17.5 17.5 17.5 mW max V
DD
= 5 V, f
SAMPLE
= 1 MSPS
5.1 5.1 5.1 mW max V
DD
= 3 V, f
SAMPLE
= 1 MSPS
Full Power-Down Mode 5 5 5 µW max V
DD
= 5 V
333µW max V
DD
= 3 V
NOTES
1
Temperature ranges as follows: A, B Grades: –40°C to +85°C, Y Grade: –40°C to +125°C.
2
Operational from V
DD
= 2.0 V, with input low voltage (V
INL
) 0.35 V max.
3
See Terminology section.
4
B and Y Grades, maximum specifications apply as typical figures when V
DD
= 4.75 V to 5.25 V.
5
SC70 values guaranteed by characterization.
6
Guaranteed by characterization.
7
See Power vs. Throughput Rate section.
Specifications subject to change without notice.
Parameter A Grade
2
Unit Test Conditions/Comments
DYNAMIC PERFORMANCE f
IN
= 100 kHz Sine Wave
Signal-to-Noise + Distortion (SINAD)
3
61 dB min
Total Harmonic Distortion (THD)
3
–72 dB max
Peak Harmonic or Spurious Noise (SFDR)
3
–73 dB max
Intermodulation Distortion (IMD)
3
Second-Order Terms –82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Third-Order Terms –82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Aperture Delay 10 ns typ
Aperture Jitter 30 ps typ
Full Power Bandwidth 13.5 MHz typ @ 3 dB
2MHz typ @ 0.1 dB
DC ACCURACY
Resolution 10 Bits
Integral Nonlinearity ±0.5 LSB max
Differential Nonlinearity ±0.5 LSB max Guaranteed No Missed Codes to 10 Bits
Offset Error
3, 4
±1LSB max
Gain Error
3, 4
±1LSB max
Total Unadjusted Error (TUE)
3, 4
±1.2 LSB max
ANALOG INPUT
Input Voltage Range 0 to V
DD
V
DC Leakage Current ±0.5 µA max
Input Capacitance 20 pF typ Track-and-Hold in Track; 6 pF typ when
in Hold
REV. C–4–
AD7476A/AD7477A/AD7478A
AD7478A–SPECIFICATIONS
1
(VDD = 2.35 V to 5.25 V, fSCLK = 20 MHz, fSAMPLE = 1 MSPS, unless otherwise noted;
TA = TMIN to TMAX, unless otherwise noted.)
Parameter A Grade
2
Unit Test Conditions/Comments
DYNAMIC PERFORMANCE f
IN
= 100 kHz Sine Wave
Signal-to-Noise + Distortion (SINAD)
3
49 dB min
Total Harmonic Distortion (THD)
3
–65 dB max
Peak Harmonic or Spurious Noise (SFDR)
3
–65 dB max
Intermodulation Distortion (IMD)
3
Second-Order Terms –76 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Third-Order Terms –76 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Aperture Delay 10 ns typ
Aperture Jitter 30 ps typ
Full Power Bandwidth 13.5 MHz typ @ 3 dB
2MHz typ @ 0.1 dB
Parameter A Grade
2
Unit Test Conditions/Comments
LOGIC INPUTS
Input High Voltage, V
INH
2.4 V min
1.8 V min V
DD
= 2.35 V
Input Low Voltage, V
INL
0.8 V max V
DD
= 5 V
0.4 V max V
DD
= 3 V
Input Current, I
IN
, SCLK Pin ±0.5 µA max Typically 10 nA, V
IN
= 0 V or V
DD
Input Current, I
IN
, CS Pin ±10 nA typ
Input Capacitance, C
IN5
5pF max
LOGIC OUTPUTS
Output High Voltage, V
OH
V
DD
– 0.2 V min I
SOURCE
= 200 µA, V
DD
= 2.35 V to 5.25 V
Output Low Voltage, V
OL
0.4 V max I
SINK
= 200 µA
Floating-State Leakage Current ±1µA max
Floating-State Output Capacitance
5
5pF max
Output Coding Straight (Natural) Binary
CONVERSION RATE
Conversion Time 700 ns max 14 SCLK Cycles with SCLK at 20 MHz
Track-and-Hold Acquisition Time
3
250 ns max
Throughput Rate 1 MSPS max
POWER REQUIREMENTS
V
DD
2.35/5.25 V min/max
I
DD
Digital I/Ps = 0 V or V
DD
Normal Mode (Static) 2.5 mA typ V
DD
= 4.75 V to 5.25 V, SCLK ON or OFF
1.2 mA typ V
DD
= 2.35 V to 3.6 V, SCLK ON or OFF
Normal Mode (Operational) 3.5 mA max V
DD
= 4.75 V to 5.25 V, f
SAMPLE
= 1 MSPS
1.7 mA max V
DD
= 2.35 V to 3.6 V, f
SAMPLE
= 1 MSPS
Full Power-Down Mode (Static) 1 µA max Typically 50 nA
Full Power-Down Mode (Dynamic) 0.6 mA typ V
DD
= 5 V, f
SAMPLE
= 100 kSPS
0.3 mA typ V
DD
= 3 V, f
SAMPLE
= 100 kSPS
Power Dissipation
6
Normal Mode (Operational) 17.5 mW max V
DD
= 5 V, f
SAMPLE
= 1 MSPS
5.1 mW max V
DD
= 3 V, f
SAMPLE
= 1 MSPS
Full Power-Down Mode 5 µW max V
DD
= 5 V
NOTES
1
Temperature range from –40°C to +85°C.
2
Operational from V
DD
= 2.0 V, with input high voltage (V
INH
) 1.8 V min.
3
See Terminology section.
4
SC70 values guaranteed by characterization.
5
Guaranteed by characterization.
6
See Power vs. Throughput Rate section.
Specifications subject to change without notice.
REV. C
AD7476A/AD7477A/AD7478A
–5–
Parameter A Grade
2
Unit Test Conditions/Comments
DC ACCURACY
Resolution 8 Bits
Integral Nonlinearity
3
±0.3 LSB max
Differential Nonlinearity
3
±0.3 LSB max Guaranteed No Missed Codes to Eight Bits
Offset Error
3, 4
±0.3 LSB max
Gain Error
3, 4
±0.3 LSB max
Total Unadjusted Error (TUE)
3, 4
±0.5 LSB max
ANALOG INPUT
Input Voltage Range 0 to V
DD
V
DC Leakage Current ±0.5 µA max
Input Capacitance 20 pF typ Track-and-Hold in Track; 6 pF typ when
in Hold
LOGIC INPUTS
Input High Voltage, V
INH
2.4 V min
1.8 V min V
DD
= 2.35 V
Input Low Voltage, V
INL
0.8 V max V
DD
= 5 V
0.4 V max V
DD
= 3 V
Input Current, I
IN
, SCLK Pin ±0.5 µA max Typically 10 nA, V
IN
= 0 V or V
DD
Input Current, I
IN
, CS Pin ±10 nA typ
Input Capacitance, C
IN5
5pF max
LOGIC OUTPUTS
Output High Voltage, V
OH
V
DD
– 0.2 V min I
SOURCE
= 200 µA, V
DD
= 2.35 V to 5.25 V
Output Low Voltage, V
OL
0.4 V max I
SINK
= 200 µA
Floating-State Leakage Current ±1µA max
Floating-State Output Capacitance
5
5pF max
Output Coding Straight (Natural) Binary
CONVERSION RATE
Conversion Time 600 ns max 12 SCLK Cycles with SCLK at 20 MHz
Track-and-Hold Acquisition Time
3
225 ns max
Throughput Rate 1.2 MSPS max
POWER REQUIREMENTS
V
DD
2.35/5.25 V min/max
I
DD
Digital I/Ps = 0 V or V
DD
Normal Mode (Static) 2.5 mA typ V
DD
= 4.75 V to 5.25 V, SCLK ON or OFF
1.2 mA typ V
DD
= 2.35 V to 3.6 V, SCLK ON or OFF
Normal Mode (Operational) 3.5 mA max V
DD
= 4.75 V to 5.25 V
1.7 mA max V
DD
= 2.35 V to 3.6 V
Full Power-Down Mode (Static) 1 µA max Typically 50 nA
Full Power-Down Mode (Dynamic) 0.6 mA typ V
DD
= 5 V, f
SAMPLE
= 100 kSPS
0.3 mA typ V
DD
= 3 V, f
SAMPLE
= 100 kSPS
Power Dissipation
6
Normal Mode (Operational) 17.5 mW max V
DD
= 5 V
5.1 mW max V
DD
= 3 V
Full Power-Down Mode 5 µW max V
DD
= 5 V
NOTES
1
Temperature range from –40°C to +85°C.
2
Operational from V
DD
= 2.0 V, with input high voltage (V
INH
) 1.8 V min.
3
See Terminology section.
4
SC70 values guaranteed by characterization.
5
Guaranteed by characterization.
6
See Power vs. Throughput Rate section.
Specifications subject to change without notice.
REV. C–6–
AD7476A/AD7477A/AD7478A
TIMING SPECIFICATIONS
1
(VDD = 2.35 V to 5.25 V; TA = TMIN to TMAX, unless otherwise noted.)
Limit at T
MIN
, T
MAX
Parameter AD7476A/AD7477A/AD7478A Unit Description
f
SCLK 2
10 kHz min
3
A, B Grades
20 kHz min
3
Y Grade
20 MHz max
t
CONVERT
16 ⫻ t
SCLK
AD7476A
14 ⫻ t
SCLK
AD7477A
12 ⫻ t
SCLK
AD7478A
t
QUIET
50 ns min Minimum Quiet Time Required between Bus Relinquish
and Start of Next Conversion
t
1
10 ns min Minimum CS Pulse Width
t
2
10 ns min CS to SCLK Setup Time
t
34
22 ns max Delay from CS until SDATA Three-State Disabled
t
44
40 ns max Data Access Time after SCLK Falling Edge
t
5
0.4 t
SCLK
ns min SCLK Low Pulse Width
t
6
0.4 t
SCLK
ns min SCLK High Pulse Width
t
75
SCLK to Data Valid Hold Time
10 ns min V
DD
≤ 3.3 V
9.5 ns min 3.3 V < V
DD
≤ 3.6 V
7ns min V
DD
> 3.6 V
t
86
36 ns max SCLK Falling Edge to SDATA High Impedance
See Note 7 ns min SCLK Falling Edge to SDATA High Impedance
t
POWER-UP8
1µs max Power-Up Time from Full Power-Down
NOTES
1
Guaranteed by characterization. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of 1.6 V.
2
Mark/space ratio for the SCLK input is 40/60 to 60/40.
3
Minimum f
SCLK
at which specifications are guaranteed.
4
Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 1.8 V when V
DD
= 2.35 V and 0.8 V or 2.0 V for V
DD
> 2.35 V.
5
Measured with 50 pF load capacitor.
6
t
8
is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t
8
, quoted in the timing characteristics is the true bus relinquish
time of the part and is independent of the bus loading.
7
t
7
values also apply to t
8
minimum values.
8
See Power-Up Time section.
Specifications subject to change without notice.
TO OUTPUT
PIN C
L
50pF
200␮AI
OH
200␮AI
OL
1.6V
Figure 1. Load Circuit for Digital Output Timing Specifications
REV. C
AD7476A/AD7477A/AD7478A
–7–
Timing Example 1
Having f
SCLK
= 20 MHz and a throughput of 1 MSPS gives a
cycle time of t
2
+ 12.5 (1/f
SCLK
) + t
ACQ
= 1 µs. With t
2
= 10 ns min,
this leaves t
ACQ
to be 365 ns. This 365 ns satisfies the requirement
of 250 ns for t
ACQ
. From Figure 3, t
ACQ
is comprised of 2.5 (1/f
SCLK
)
+ t
8
+ t
QUIET
, where t
8
= 36 ns max. This allows a value of 204 ns
for t
QUIET
,
satisfying the minimum requirement of 50 ns.
CS
SCLK
SDATA
t
2
t
6
t
3
t
4
t
7
t
5
t
8
t
CONVERT
t
QUIET
ZERO ZERO ZERO DB11 DB10 DB2 DB1 DB0
B
THREE-STATETHREE-
STATE
Z
4 LEADING ZEROS
12 345 1314 15 16
t
1
Figure 2. AD7476A Serial Interface Timing Diagram
CS
SCLK
t
2
t
CONVERT
B
12345 13141516
C
t
8
t
QUIET
t
ACQ
12.5(1/fSCLK)
1/THROUGHPUT
Figure 3. Serial Interface Timing Example
Timing Example 2
Having f
SCLK
= 5 MHz and a throughput of 315 kSPS gives a
cycle time of t
2
+ 12.5 (1/f
SCLK
) + t
ACQ
= 3.174 µs. With t
2
=
10 ns min, this leaves t
ACQ
to be 664 ns. This 664 ns satisfies
the requirement of 250 ns for t
ACQ
. From Figure 3, t
ACQ
is
comprised of 2.5 (1/f
SCLK
) + t
8
+ t
QUIET
, t
8
= 36 ns max. This
allows a value of 128 ns for t
QUIET
,
satisfying the minimum
requirement of 50 ns. As in this example and with other slower
clock values, the signal may already be acquired before the
conversion is complete, but it is still necessary to leave 50 ns
minimum t
QUIET
between conversions. In Example 2, the
signal should be fully acquired at approximately Point C in
Figure 3.
REV. C–8–
AD7476A/AD7477A/AD7478A
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C, unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND . . . . . . . . . . . . –0.3 V to +7 V
Digital Output Voltage to GND . . . . . –0.3 V to V
DD
+ 0.3 V
Input Current to Any Pin except Supplies
2
. . . . . . . . ±10 mA
Operating Temperature Range
Commercial (A and B Grades) . . . . . . . . . –40°C to +85°C
Industrial (Y Grade) . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
MSOP Package
␪
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . 205.9°C/W
␪
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . 43.74°C/W
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment, and can discharge without detection. Although
the AD7476A/AD7477A/AD7478A feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
SC70 Package
␪
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . 340.2°C/W
␪
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . 228.9°C/W
Lead Temperature, Soldering
Reflow (10 sec to 30 sec) . . . . . . . . . . . . . . . . 235 (0/+5)°C
Pb-free Temperature Soldering
Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 (0/+5)°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
REV. C
AD7476A/AD7477A/AD7478A
–9–
ORDERING GUIDE
Temperature Linearity Package
Model Range Error (LSB)
1
Option
2
Branding
AD7476AAKS-500RL7 –40°C to +85°C±0.75 typ KS-6 CEZ
AD7476AAKS-REEL –40°C to +85°C±0.75 typ KS-6 CEZ
AD7476AAKS-REEL7 –40°C to +85°C±0.75 typ KS-6 CEZ
AD7476ABKS-500RL7 –40°C to +85°C±1.5 max KS-6 CEY
AD7476ABKS-REEL –40°C to +85°C±1.5 max KS-6 CEY
AD7476ABKS-REEL7 –40°C to +85°C±1.5 max KS-6 CEY
AD7476ABKSZ-REEL
3
–40°C to +85°C±1.5 max KS-6 CEY
AD7476ABKSZ-REEL7
3
–40°C to +85°C±1.5 max KS-6 CEY
AD7476ABRM –40°C to +85°C±1.5 max RM-8 CEY
AD7476ABRM-REEL –40°C to +85°C±1.5 max RM-8 CEY
AD7476ABRM-REEL7 –40°C to +85°C±1.5 max RM-8 CEY
AD7476AYKS-500RL7 –40°C to +125°C±1.5 max KS-6 CEW
AD7476AYKS-REEL7 –40°C to +125°C±1.5 max KS-6 CEW
AD7476AYKSZ-500RL7
3
–40°C to +125°C±1.5 max KS-6 CEW
AD7476AYKSZ-REEL7
3
–40°C to +125°C±1.5 max KS-6 CEW
AD7476AYRM –40°C to +125°C±1.5 max RM-8 CEW
AD7476AYRM-REEL7 –40°C to +125°C±1.5 max RM-8 CEW
EVAL-AD7476ACB
4
Evaluation Board
AD7477AAKS-500RL7 –40°C to +85°C±0.5 max KS-6 CFZ
AD7477AAKS-REEL –40°C to +85°C±0.5 max KS-6 CFZ
AD7477AAKS-REEL7 –40°C to +85°C±0.5 max KS-6 CFZ
AD7477AAKSZ-REEL
3
–40°C to +85°C±0.5 max KS-6 CFZ
AD7477AAKSZ-REEL7
3
–40°C to +85°C±0.5 max KS-6 CFZ
AD7477AARM –40°C to +85°C±0.5 max RM-8 CFZ
AD7477AARM-REEL –40°C to +85°C±0.5 max RM-8 CFZ
AD7477AARM-REEL7 –40°C to +85°C±0.5 max RM-8 CFZ
EVAL-AD7477ACB
4
Evaluation Board
AD7478AAKS-500RL7 –40°C to +85°C±0.3 max KS-6 CJZ
AD7478AAKS-REEL –40°C to +85°C±0.3 max KS-6 CJZ
AD7478AAKS-REEL7 –40°C to +85°C±0.3 max KS-6 CJZ
AD7478AAKSZ-500RL7
3
–40°C to +85°C±0.3 max KS-6 CJZ
AD7478AAKSZ-REEL
3
–40°C to +85°C±0.3 max KS-6 CJZ
AD7478AAKSZ-REEL7
3
–40°C to +85°C±0.3 max KS-6 CJZ
AD7478AARM –40°C to +85°C±0.3 max RM-8 CJZ
AD7478AARM-REEL –40°C to +85°C±0.3 max RM-8 CJZ
AD7478AARM-REEL7 –40°C to +85°C±0.3 max RM-8 CJZ
EVAL-CONTROL BRD2
5
Evaluation Control
Board
NOTES
1
Linearity error here refers to integral nonlinearity.
2
KS = SC70; RM = MSOP.
3
Z = Pb-free part.
4
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes.
5
This board is a complete unit, allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designator. To order
a complete evaluation kit, you will need to order the particular ADC evaluation board, e.g., EVAL-AD7476ACB, the EVAL-CONTROLBRD2, and a
12 V ac transformer. See relevant evaluation board application note for more information.
REV. C–10–
AD7476A/AD7477A/AD7478A
PIN CONFIGURATIONS
PIN FUNCTION DESCRIPTIONS
Mnemonic Function
CS Chip Select. Active low logic input. This input provides the dual function of initiating conversions on the
AD7476A/AD7477A/AD7478A and also frames the serial data transfer.
V
DD
Power Supply Input. The V
DD
range for the AD7476A/AD7477A/AD7478A is from 2.35 V to 5.25 V.
GND Analog Ground. Ground reference point for all circuitry on the AD7476A/AD7477A/AD7478A. All analog input
signals should be referred to this GND voltage.
V
IN
Analog Input. Single-ended analog input channel. The input range is 0 V to V
DD
.
SDATA Data Out. Logic output. The conversion result from the AD7476A/AD7477A/AD7478A is provided on this output as a
serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from the AD7476A
consists of four leading zeros followed by the 12 bits of conversion data, which are provided MSB first. The data stream
from the AD7477A consists of four leading zeros followed by the 10 bits of conversion data followed by two trailing
zeros, provided MSB first. The data stream from the AD7478A consists of four leading zeros followed by the 8 bits
of conversion data followed by four trailing zeros, which are provided MSB first.
SCLK Serial Clock. Logic input. SCLK provides the serial clock for accessing data from the part. This clock input is also
used as the clock source for the AD7476A/AD7477A/AD7478A’s conversion process.
NC No Connect.
8-Lead MSOP
8
7
6
5
1
2
3
4
NC = NO CONNECT
VDD
SDATA
CS
VIN
GND
SCLK
NCNC
TOP VIEW
(Not to Scale)
AD7476A/
AD7477A/
AD7478A
6-Lead SC70
TOP VIEW
(Not to Scale)
6
5
4
1
2
3
VDD
GND
VIN
CS
SDATA
SCLK
AD7476A/
AD7477A/
AD7478A
REV. C
AD7476A/AD7477A/AD7478A
–11–
TERMINOLOGY
Integral Nonlinearity
This is the maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. For the AD7476A/
AD7477A/AD7478A, the endpoints of the transfer function are
zero scale, a point 1 LSB below the first code transition, and full
scale, a point 1 LSB above the last code transition.
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
This is the deviation of the first code transition (00 . . . 000) to
(00 . . . 001) from the ideal, i.e., AGND + 1 LSB.
Gain Error
This is the deviation of the last code transition (111 . . . 110)
to (111 . . . 111) from the ideal, i.e., V
REF
– 1 LSB after the
offset error has been adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns to track mode at the end
of conversion. The track-and-hold acquisition time is the time
required for the output of the track-and-hold amplifier to reach its
final value, within ±0.5 LSB, after the end of conversion. See
the Serial Interface section for more details.
Signal-to-(Noise + Distortion) Ratio (SINAD)
This is the measured ratio of signal-to-(noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the sum of all nonfundamental signals
up to half the sampling frequency (f
S
/2), excluding dc. The ratio
is dependent on the number of quantization levels in the digiti-
zation process; the more levels, the smaller the quantization
noise. The theoretical signal-to-(noise + distortion) ratio for an
ideal N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Thus, it is 74 dB for a 12-bit converter, 62 dB for a 10-bit con-
verter, and 50 dB for an 8-bit converter.
Total Unadjusted Error (TUE)
This is a comprehensive specification that includes the gain,
linearity, and offset errors.
Total Harmonic Distortion (THD)
Total harmonic distortion is the ratio of the rms sum of har-
monics to the fundamental. It is defined as
THD VVVVV
V
2
2
3
2
4
2
5
2
6
2
1
dB
()
=++++
20 log
where V
1
is the rms amplitude of the fundamental, and V
2
, V
3
,
V
4
, V
5
, and V
6
are the rms amplitudes of the second through the
sixth harmonics.
Peak Harmonic or Spurious Noise (SFDR)
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to f
S
/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is deter-
mined by the largest harmonic in the spectrum. But for ADCs
where the harmonics are buried in the noise floor, it will be a
noise peak.
Intermodulation Distortion (IMD)
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities will create distortion products
at sum and difference frequencies of mfa ± nfb, where m and
n= 0, 1, 2, 3, and so on. Intermodulation distortion terms are
those for which neither m nor n are equal to zero. For example,
the second-order terms include (fa + fb) and (fa – fb), while the
third-order terms include (2fa + fb), (2fa – fb), (fa + 2fb), and
(fa – 2fb).
The AD7476A/AD7477A/AD7478A are tested using the CCIF
standard where two input frequencies are used (see fa and fb on
the specification pages). In this case, the second-order terms are
usually distanced in frequency from the original sine waves, while
the third-order terms are usually at a frequency close to the input
frequencies. As a result, the second- and third-order terms are
specified separately. The calculation of the intermodulation dis-
tortion is per the THD specification, where it is the ratio of the
rms sum of the individual distortion products to the rms amplitude
of the sum of the fundamentals expressed in dBs.
REV. C–12–
AD7476A/AD7477A/AD7478A
FREQUENCY – kHz
5
–55
–115
0 50050
SNR – dB
100 150 200 250 300 350 400 450
–15
–35
–75
–95
8192 POINT FFT
VDD = 2.7V
f
SAMPLE = 1MSPS
f
IN = 100kHz
SINAD = 72.05dB
THD = –82.87dB
SFDR = –87.24dB
TPC 1. AD7476A Dynamic Performance at 1 MSPS
FREQUENCY – kHz
–45
–105
SNR – dB
–5
–25
–65
–85
8192 POINT FFT
VDD = 2.35V
fSAMPLE = 1MSPS
fIN = 100kHz
SINAD = 61.67dB
THD = –79.59dB
SFDR = –82.93dB
0 50050 100 150 200 250 300 350 400 450
TPC 2. AD7477A Dynamic Performance at 1 MSPS
FREQUENCY – kHz
5
–25
–55
SNR – dB
–5
–15
–35
–45
8192 POINT FFT
VDD = 2.35V
f
SAMPLE = 1MSPS
f
IN = 100kHz
SINAD = 49.77dB
THD = –75.51dB
SFDR = –70.71dB
0 50050 100 150 200 250 300 350 400 450
–75
–65
–85
–95
TPC 3. AD7478A Dynamic Performance at 1 MSPS
FREQUENCY – kHz
–66
–69
–72
10 1000
SINAD – dB
100
–67
–68
–70
–71
–73
–74
VDD = 5.25V
VDD = 2.35V
VDD = 2.7V
VDD = 4.75V
VDD = 3.6V
TPC 4. AD7476A SINAD vs. Input Frequency at 1 MSPS
TPC 1, TPC 2, and TPC 3 each show a typical FFT plot for the
AD7476A, AD7477A, and AD7478A, respectively, at a 1 MSPS
sample rate and 100 kHz input frequency.
TPC 4 shows the signal-to-(noise + distortion) ratio performance
versus the input frequency for various supply voltages while sampling
at 1 MSPS with an SCLK frequency of 20 MHz for the AD7476A.
TPC 5 and TPC 6 show INL and DNL performance for the
AD7476A.
TPC 7 shows a graph of the total harmonic distortion versus the
analog input frequency for different source impedances when
using a supply voltage of 3.6 V and sampling at a rate of 1 MSPS
(see Analog Input section).
TPC 8 shows a graph of the total harmonic distortion versus the
analog input signal frequency for various supply voltages while
sampling at 1 MSPS with an SCLK frequency of 20 MHz.
–Typical Performance Characteristics
REV. C
AD7476A/AD7477A/AD7478A
–13–
CODE
1.0
0.4
–0.2
0 1024
INL ERROR – LSB
512
0.8
0.6
0.2
0
–0.4
–0.6
–0.8
–1.0
1536 2048 2560 3072 3584 4096
V
DD
= 2.35V
TEMP = 25ⴗC
f
SAMPLE
= 1MSPS
TPC 5. AD7476A INL Performance
CODE
1.0
0.4
–0.2
0 1024
DNL ERROR – LSB
512
0.8
0.6
0.2
0
–0.4
–0.6
–0.8
–1.0
1536 2048 2560 3072 3584 4096
V
DD
= 2.35V
TEMP = 25ⴗC
f
SAMPLE
= 1MSPS
TPC 6. AD7476A DNL Performance
INPUT FREQUENCY – kHz
0
–30
–60
10 1000
THD – dB
100
–10
–20
–40
–50
–70
–80
–90
VDD = 3.6V
RIN = 10k⍀
RIN = 1k⍀
RIN = 130⍀
RIN = 13⍀
RIN = 0⍀
TPC 7. THD vs. Analog Input Frequency for Various
Source Impedances
INPUT FREQUENCY – kHz
–60
–75
–90
10 1000
THD – dB
100
–65
–70
–80
–85 V
DD
= 5.25V
V
DD
= 2.35V
V
DD
= 2.7V
V
DD
= 4.75V
V
DD
= 3.6V
TPC 8. THD vs. Analog Input Frequency for Various
Supply Voltages
REV. C–14–
AD7476A/AD7477A/AD7478A
CIRCUIT INFORMATION
The AD7476A/AD7477A/AD7478A are fast, micropower,
12-/10-/8-bit, single-supply A/D converters, respectively. The
parts can be operated from a 2.35 V to 5.25 V supply. When
operated from either a 5 V supply or a 3 V supply, the AD7476A/
AD7477A/AD7478A are capable of throughput rates of 1 MSPS
when provided with a 20 MHz clock.
The AD7476A/AD7477A/AD7478A provide the user with an
on-chip, track-and-hold A/D converter and a serial interface
housed in a tiny 6-lead SC70 or 8-lead MSOP package, which
offer the user considerable space-saving advantages over alterna-
tive solutions. The serial clock input accesses data from the part
but also provides the clock source for the successive-approximation
A/D converter. The analog input range is 0 V to V
DD
. The ADC
does not require an external reference or an on-chip reference.
The reference for the AD7476A/AD7477A/AD7478A is derived
from the power supply and thus gives the widest dynamic input
range.
The AD7476A/AD7477A/AD7478A also feature a power-down
option to allow power saving between conversions. The power-
down feature is implemented across the standard serial interface,
as described in the Modes of Operation section.
CONVERTER OPERATION
The AD7476A/AD7477A/AD7478A is a successive-approximation,
analog-to-digital converter based around a charge redistribution
DAC. Figures 4 and 5 show simplified schematics of the ADC.
Figure 4 shows the ADC during its acquisition phase. SW2 is
closed and SW1 is in Position A, the comparator is held in a
balanced condition, and the sampling capacitor acquires the
signal on V
IN
.
CHARGE
REDISTRIBUTION
DAC
CONTROL
LOGIC
COMPARATOR
SW2
SAMPLING
CAPACITOR
ACQUISITION
PHASE
SW1
A
B
AGND
VDD/2
VIN
Figure 4. ADC Acquisition Phase
When the ADC starts a conversion, see Figure 5, SW2 will open and
SW1 will move to Position B, causing the comparator to become
unbalanced. The control logic and the charge redistribution
DAC are used to add and subtract fixed amounts of charge from
the sampling capacitor to bring the comparator back into a
balanced condition. When the comparator is rebalanced, the
conversion is complete. The control logic generates the ADC
output code. Figure 6 shows the ADC transfer function.
CHARGE
REDISTRIBUTION
DAC
CONTROL
LOGIC
COMPARATOR
SW2
SAMPLING
CAPACITOR
CONVERSION
PHASE
SW1
A
B
AGND
VDD/2
VIN
Figure 5. ADC Conversion Phase
ADC TRANSFER FUNCTION
The output coding of the AD7476A/AD7477A/AD7478A is
straight binary.
The designed code transitions occur at the successive integer
LSB values, i.e., 1 LSB, 2 LSB, and so on. The LSB size is
V
DD
/4096 for the AD7476A, V
DD
/1024 for the AD7477A, and
V
DD
/256 for the AD7478A. The ideal transfer characteristic for
the AD7476A/AD7477A/AD7478A is shown in Figure 6.
000...000
0V
ADC CODE
ANALOG INPUT
111...111
000...001
000...010
111...110
111...000
011...111 1LSB = VDD/256 (AD7478A)
1LSB +VDD – 1LSB
1LSB = VDD/1024 (AD7477A)
1LSB = VDD/4096 (AD7476A)
Figure 6. AD7476A/AD7477A/AD7478A
Transfer Characteristic
REV. C
AD7476A/AD7477A/AD7478A
–15–
TYPICAL CONNECTION DIAGRAM
Figure 7 shows a typical connection diagram for the AD7476A/
AD7477A/AD7478A. V
REF
is taken internally from V
DD
and, as
such, V
DD
should be well decoupled. This provides an analog
input range of 0 V to V
DD
. The conversion result is output in a
16-bit word with four leading zeros followed by the MSB of the
12-bit, 10-bit, or 8-bit result. The 10-bit result from the AD7477A
will be followed by two trailing zeros, and the 8-bit result from
the AD7478A will be followed by four trailing zeros.
Alternatively, because the supply current required by the AD7476A/
AD7477A/AD7478A is so low, a precision reference can be used
as the supply source to the AD7476A/AD7477A/AD7478A. A
REF19x voltage reference (REF195 for 5 V or REF193 for 3 V)
can be used to supply the required voltage to the ADC (see Figure 7).
This configuration is especially useful if the power supply is
quite noisy or if the system supply voltages are at some value
other than 5 V or 3 V (e.g., 15 V). The REF19x will output a
steady voltage to the AD7476A/AD7477A/AD7478A. If the low
dropout REF193 is used, the current it needs to supply to the
AD7476A/AD7477A/AD7478A is typically 1.2 mA. When
the ADC is converting at a rate of 1 MSPS, the REF193 will
need to supply a maximum of 1.7 mA to the AD7476A/
AD7477A/AD7478A. The load regulation of the REF193 is typi-
cally 10 ppm/mA (V
S
= 5 V), which results in an error of 17 ppm
(51 µV) for the 1.7 mA drawn from it. This corresponds to a
0.069 LSB error for the AD7476A with V
DD
= 3 V from the
REF193, a 0.017 LSB error for the AD7477A, and a 0.0043 LSB
error for the AD7478A. For applications where power consumption
is of concern, the power-down mode of the ADC and
the sleep
mode of the REF19x reference should be used to
improve
power performance. See the Modes of Operation section.
AD7476A/
AD7477A/
AD7478A
SCLK
SDATA
CS
V
IN
GND
0V TO V
DD
INPUT
V
DD
␮C/␮P
SERIAL
INTERFACE
0.1␮F1␮F
TANT
REF193
1.2mA
680nF
10␮F 0.1␮F
3V 5V
SUPPLY
Figure 7. REF193 as Power Supply to AD7476A/
AD7477A/AD7478A
Table I provides some typical performance data with various
references used as a V
DD
source for a 100 kHz input tone at
room temperature under the same setup conditions.
Table I. AD7476A Typical Performance for Various
Voltage References IC
Reference Tied AD7476A SNR Performance
to V
DD
(dB)
AD780 @ 3 V 72.65
REF193 72.35
AD780 @ 2.5 V 72.5
REF192 72.2
REF43 72.6
Analog Input
Figure 8 shows an equivalent circuit of the analog input structure
of the AD7476A/AD7477A/AD7478A. The two diodes, D1 and
D2, provide ESD protection for the analog input. Care must be
taken to ensure that the analog input signal never exceeds the
supply rails by more than 300 mV. This will cause these diodes
to become forward-biased and start conducting current into the
substrate. The maximum current these diodes can conduct
without causing irreversible damage to the part is 10 mA. The
capacitor C1 in Figure 8 is typically about 6 pF and can primarily
be attributed to pin capacitance. The resistor R1 is a lumped
component made up of the on resistance of a switch. This resistor
is typically about 100 Ω. The capacitor C2 is the ADC sampling
capacitor and has a capacitance of 20 pF typically. For ac applica-
tions, removing high frequency components from the analog input
signal is recommended by use of a band-pass filter on the relevant
analog input pin. In applications where harmonic distortion and
signal-to-noise ratio are critical, the analog input should be driven
from a low impedance source. Large source impedances will
significantly affect the ac performance of the ADC. This may
necessitate the use of an input buffer amplifier. The choice of
the op amp will be a function of the particular application.
D1
D2
R1
C2
20pF
V
DD
V
IN
C1
6pF
CONVERSION PHASE – SWITCH OPEN
TRACK PHASE – SWITCH CLOSED
Figure 8. Equivalent Analog Input Circuit
REV. C–16–
AD7476A/AD7477A/AD7478A
Table II provides some typical performance data with various
op amps used as the input buffer for a 100 kHz input tone at
room temperature under the same setup conditions.
Table II. AD7476A Typical Performance with Various
Input Buffers, V
DD
= 3 V
Op Amp in the AD7476A SNR Performance
Input Buffer (dB)
AD711 72.3
AD797 72.5
AD845 71.4
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance will depend on the amount of total harmonic
distortion (THD) that can be tolerated. The THD will increase
as the source impedance increases and the performance will
degrade. See TPC 7.
Digital Inputs
The digital inputs applied to the AD7476A/AD7477A/AD7478A
are not limited by the maximum ratings that limit the analog
input. Instead, the digital inputs applied can go to 7 V and are
not restricted by the V
DD
+ 0.3 V limit as on the analog input.
For example, if the AD7476A/AD7477A/AD7478A were oper-
ated with a V
DD
of 3 V, then 5 V logic levels could be used on
the digital inputs. However, it is important to note that the data
output on SDATA will still have 3 V logic levels when V
DD
= 3 V.
Another advantage of SCLK and CS not being restricted by the
V
DD
+ 0.3 V limit is the fact that power supply sequencing
issues are avoided. If CS or SCLK is applied before V
DD
, there
is no risk of latch-up as there would be on the analog input if a
signal greater than 0.3 V was applied prior to V
DD
.
MODES OF OPERATION
The mode of operation of the AD7476A/AD7477A/AD7478A is
selected by controlling the (logic) state of the CS signal during a
conversion. There are two possible modes of operation: normal
and power-down. The point at which CS is pulled high after the
conversion has been initiated will determine whether the
AD7476A/AD7477A/AD7478A will enter power-down mode or
not. Similarly, if already in power-down, CS can control
whether the device will return to normal operation or remain in
power-down. These modes of operation are designed to provide
flexible power management options. These options can be
chosen to optimize the power dissipation/throughput rate ratio for
different application requirements.
Normal Mode
This mode is intended for the fastest throughput rate perfor-
mance; the user does not have to worry about any power-up
times with the AD7476A/AD7477A/AD7478A remaining fully
powered all the time. Figure 9 shows the general diagram of the
operation of the AD7476A/AD7477A/AD7478A in this mode.
The conversion is initiated on the falling edge of CS as described
in the Serial Interface section. To ensure that the part remains
fully powered up at all times, CS must remain low until at least
10 SCLK falling edges have elapsed after the falling edge of CS.
If CS is brought high any time after the 10th SCLK falling edge
but before the end of the t
CONVERT
, the part will remain pow-
ered up, but the conversion will be terminated and SDATA will
go back into three-state.
For the AD7476A, 16 serial clock cycles are required to com-
plete the conversion and access the complete conversion results.
For the AD7477A and AD7478A, a minimum of 14 and 12
serial clock cycles are required to complete the conversion and
access the complete conversion results, respectively.
CS may idle high until the next conversion or may idle low until
CS returns high sometime prior to the next conversion (effec-
tively idling CS low).
Once a data transfer is complete (SDATA has returned to
three-state), another conversion can be initiated after the quiet
time, t
QUIET
, has elapsed by bringing CS low again.
Power-Down Mode
This mode is intended for use in applications where slower
throughput rates are required; either the ADC is powered down
between each conversion, or a series of conversions is performed
at a high throughput rate and the ADC is then powered down
for a relatively long duration between these bursts of several
conversions. When the AD7476A/AD7477A/AD7478A is in
power-down, all analog circuitry is powered down.
To enter power-down, the conversion process must be inter-
rupted by bringing CS high anywhere after the second falling
edge of SCLK and before the 10th falling edge of SCLK, as
shown in Figure 10. Once CS has been brought high in this
window of SCLKs, the part will enter power-down, the con-
version that was initiated by the falling edge of CS will be
terminated, and SDATA will go back into three-state. If CS is
brought high before the second SCLK falling edge, the part will
remain in normal mode and will not power down. This will
avoid accidental power-down due to glitches on the CS line.
In order to exit this mode of operation and power up the
AD7476A/AD7477A/AD7478A again, a dummy conversion is
performed. On the falling edge of CS, the device will begin to
power up and will continue to power up as long as CS is held low
until after the falling edge of the 10th SCLK. The device will be
fully powered up once 16 SCLKs have elapsed, and valid data
will result from the next conversion as shown in Figure 11. If CS
is brought high before the 10th falling edge of SCLK, then the
AD7476A/AD7477A/AD7478A will go back into power-down.
This avoids accidental power-up due to glitches on the CS line or
an inadvertent burst of eight SCLK cycles while CS is low. So
although the device may begin to power up on the falling edge of
CS, it will power down again on the rising edge of CS as long as it
occurs before the 10th SCLK falling edge.
Power-Up Time
The power-up time of the AD7476A/AD7477A/AD7478A is
1µs, which means that with any frequency of SCLK up to 20 MHz,
one dummy cycle will always be sufficient to allow the device to
power up. Once the dummy cycle is complete, the ADC will be
fully powered up and the input signal will be acquired properly.
The quiet time, t
QUIET
, must still be allowed from the point
where the bus goes back into three-state after the dummy con-
version to the next falling edge of CS. When running at a 1 MSPS
throughput rate, the AD7476A/AD7477A/AD7478A will power
up and acquire a signal within ±0.5 LSB in one dummy
cycle, i.e., 1 µs.
When powering up from the power-down mode with a dummy
cycle, as in Figure 11, the track-and-hold that was in hold mode
while the part was powered down returns to track mode after
the first SCLK edge the part receives after the falling edge of
CS. This is shown as Point A in Figure 11. Although at any
REV. C
AD7476A/AD7477A/AD7478A
–17–
SCLK frequency one dummy cycle is sufficient to power up the
device and acquire V
IN
, it does not necessarily mean that a full
dummy cycle of 16 SCLKs must always elapse to power up the
device and acquire V
IN
fully; 1 µs will be sufficient to power up
the device and acquire the input signal. If, for example, a
5MHz SCLK frequency was applied to the ADC, the cycle
time would be 3.2 µs. In one dummy cycle, 3.2 µs, the part
would be powered up and V
IN
acquired fully. However, after 1 µs
with a 5 MHz SCLK, only five SCLK cycles would have elapsed.
At this stage, the ADC would be fully powered up and the sig-
nal acquired. In this case, the CS can be brought high after the
10th SCLK falling edge and brought low again after a time,
t
QUIET
, to initiate the conversion.
When power supplies are first applied to the AD7476A/AD7477A/
AD7478A, the ADC may power up in either the power-down or
normal mode. Because of this, it is best to allow a dummy cycle
to elapse to ensure that the part is fully powered up before attempt-
ing a valid conversion. Likewise, if it is intended to keep the part
in the power-down mode while not in use and the user wishes
the part to power up in power-down mode, the dummy cycle
may be used to ensure that the device is in power-down by
executing a cycle such as that shown in Figure 10. Once supplies
are applied to the AD7476A/AD7477A/AD7478A, the power-up
time is the same as that when powering up from the power-
down mode. It takes approximately 1 µs to power up fully if the
part powers up in normal mode. It is not necessary to wait 1 µs
before executing a dummy cycle to ensure the desired mode of
operation. Instead, the dummy cycle can occur directly after
power is supplied to the ADC. If the first valid conversion is
performed directly after the dummy conversion, care must be
taken to ensure that an adequate acquisition time has been
allowed. As mentioned earlier, when powering up from the
power-down mode, the part will return to track upon the first
SCLK edge applied after the falling edge of CS. However,
when the ADC powers up initially after supplies are applied,
the track-and-hold will already be in track. This means, assum-
ing one has the facility to monitor the ADC supply current, if
the ADC powers up in the desired mode of operation and thus
a dummy cycle is not required to change the mode, a dummy
cycle is not required to place the track-and-hold into track.
POWER VS. THROUGHPUT RATE
By using the power-down mode on the AD7476A/AD7477A/
AD7478A when not converting, the average power consumption
of the ADC decreases at lower throughput rates. Figure 12 shows
how as the throughput rate is reduced, the device remains in its
power-down state longer and the average power consumption over
time drops accordingly.
For example, if the AD7476A/AD7477A/AD7478A are oper-
ated in a continuous sampling mode with a throughput rate of
100 kSPS and an SCLK of 20 MHz (V
DD
= 5 V) and the devices
are placed in the power-down mode between conversions, the
power consumption is calculated as follows. The power dissipation
during normal operation is 17.5 mW (V
DD
= 5 V). If the power-up
time is one dummy cycle, i.e., 1 µs, and the remaining conversion
VA L ID DATA
SDATA
SCLK
CS
110121416
AD7476A/AD7477A/AD7478A
Figure 9. Normal Mode Operation
THREE-STATE
SDATA
SCLK
CS
110121416
2
Figure 10. Entering Power-Down Mode
INVALID DATA
SDATA
SCLK
CS
110121416
A116
VA L ID DATA
THE PART IS FULLY
POWERED UP WITH
VIN FULLY ACQUIRED
THE PART
BEGINS TO
POWER UP
Figure 11. Exiting Power-Down Mode
REV. C–18–
AD7476A/AD7477A/AD7478A
time is another cycle, i.e., 1 µs, the AD7476A/AD7477A/
AD7478A can be said to dissipate 17.5 mW for 2 µs during each
conversion cycle. If the throughput rate is 100 kSPS, the cycle time is
10 µs and the average power dissipated during each cycle is
(2/10) ⫻ (17.5 mW) = 3.5 mW. If V
DD
= 3 V, SCLK = 20 MHz,
and the devices are again in power-down mode between conver-
sions, then the power dissipation during normal operation is
5.1 mW. The AD7476A/AD7477A/AD7478A can now be said
to dissipate 5.1 mW for 2 µs during each conversion cycle. With
a throughput rate of 100 kSPS, the average power dissipated
during each cycle is (2/10) ⫻ (5.1 mW) = 1.02 mW. Figure 12
shows the power versus the throughput rate when using the
power-down mode between conversions with both 5 V and 3 V
supplies.
The power-down mode is intended for use with throughput
rates of approximately 333 kSPS and under, since at higher
sampling rates there is no power saving made by using the
power-down mode.
THROUGHPUT – kSPS
100
0.1
0
POWER – mW
10
1
0.01
50 100 150 200 250 300 350
V
DD
= 5V, SCLK = 20MHz
V
DD
= 3V, SCLK = 20MHz
Figure 12. Power vs. Throughput
SERIAL INTERFACE
Figures 13, 14, and 15 show the detailed timing diagrams for
serial interfacing to the AD7476A, AD7477A, and AD7478A,
respectively. The serial clock provides the conversion clock and
also controls the transfer of information from the AD7476A/
AD7477A/AD7478A during conversion.
The CS signal initiates the data transfer and conversion process.
The falling edge of CS puts the track-and-hold into hold mode and
takes the bus out of three-state; the analog input is sampled at this
point. Also, the conversion is initiated at this point.
For the AD7476A, the conversion will require 16 SCLK cycles to
complete. Once 13 SCLK falling edges have elapsed, the track-and-
hold will go back into track on the next SCLK rising edge, as shown
in Figure 13 at Point B. On the 16th SCLK falling edge, the SDATA
line will go back into three-state. If the rising edge of CS occurs
before 16 SCLKs have elapsed, the conversion will be terminated
and the SDATA line will go back into three-state; otherwise, SDATA
returns to three-state on the 16th SCLK falling edge, as shown in
Figure 13. Sixteen serial clock cycles are required to perform the
conversion process and to access data from the AD7476A.
For the AD7477A, the conversion will require 14 SCLK cycles
to
complete. Once 13 SCLK falling edges have elapsed, the track-
and-hold will go back into track on the next rising edge as
shown in Figure 14 at Point B. If the rising edge of CS occurs
before 14 SCLKs have elapsed, the conversion will be terminated
and the SDATA line will go back into three-state. If 16 SCLKs
are considered in the cycle, SDATA will return to three-state on
the 16th SCLK falling edge, as shown in Figure 14.
For the AD7478A, the conversion will require 12 SCLK cycles
to complete. The track-and-hold will go back into track on the
rising edge after the 11th falling edge, as shown in Figure 15 at
Point B. If the rising edge of
CS
occurs before 12 SCLKs have
CS
SCLK
SDATA
t2t6
t3t4t7
t5t8
tCONVERT
tQUIET
ZERO ZERO ZERO DB11 DB10 DB2 DB1 DB0
B
THREE-STATETHREE-
STATE
Z
4 LEADING ZEROS
12 345 1314 15 16
t1
1/THROUGHPUT
Figure 13. AD7476A Serial Interface Timing Diagram
SCLK 1513 15
4 LEADING ZEROS
THREE-STATE
t
4
234 16
t
5
t
3
t
2
DB9 DB8 DB0 ZERO
t
6
t
7
t
8
14
ZERO
ZERO
ZERO
Z
t
1
1/ THROUGHPUT
ZERO
2 TRAILING ZEROS
SDATA
t
CONVERT
t
QUIET
B
THREE-STATE
CS
Figure 14. AD7477A Serial Interface Timing Diagram
REV. C
AD7476A/AD7477A/AD7478A
–19–
elapsed, the conversion will be terminated and the SDATA line
will go back into three-state. If 16 SCLKs are considered in the
cycle, SDATA will return to three-state on the 16th SCLK
falling edge, as shown in Figure 15.
CS
going low clocks out the first leading zero to be read in by
the microcontroller or DSP. The remaining data is then clocked
out by subsequent SCLK falling edges beginning with the sec-
ond leading zero. Thus, the first falling clock edge on the serial
clock has the first leading zero provided and also clocks out the
second leading zero. For the AD7476A, the final bit in the data
transfer is valid on the 16th falling edge, having been clocked
out on the previous (15th) falling edge.
In applications with a slower SCLK, it is possible to read in data
on each SCLK rising edge. In this case, the first falling edge of
SCLK will clock out the second leading zero, which can be read
in the first rising edge. However, the first leading zero that was
clocked out when
CS
went low will be missed, unless it was not
read in the first falling edge. The 15th falling edge of SCLK will
clock out the last bit and it could be read in the 15th rising
SCLK edge.
If CS goes low just after one SCLK falling edge has elapsed,
CS
will clock out the first leading zero as it did before, and it may
be read in the SCLK rising edge. The next SCLK falling edge
will clock out the second leading zero, and it may be read in the
following rising edge.
AD7478A in a 12 SCLK Cycle Serial Interface
For the AD7478A, if CS is brought high in the 12th rising edge
after the four leading zeros and the eight bits of the conversion
have been provided, the part can achieve a 1.2 MSPS throughput
rate. For the AD7478A, the track-and-hold goes back into track
in the 11th rising edge. In this case, a f
SCLK
= 20 MHz and a
throughput of 1.2 MSPS give a cycle time of t
2
+10.5 (1/f
SCLK
) +
t
ACQ
= 833 ns. With t
2
= 10 ns min, this leaves t
ACQ
to be 298 ns.
This 298 ns satisfies the requirement of 225 ns for t
ACQ
. From
Figure 16, t
ACQ
is comprised of 0.5 (1/f
SCLK
) + t
8
+ t
QUIET
, where
t
8
= 36 ns max. This allows a value of 237 ns for t
QUIET
, satisfying
the minimum requirement of 50 ns.
MICROPROCESSOR INTERFACING
The serial interface on the AD7476A/AD7477A/AD7478A
allows the part to be directly connected to a range of different
microprocessors. This section explains how to interface the
AD7476A/AD7477A/AD7478A with some of the more common
microcontroller and DSP serial interface protocols.
AD7476A/AD7477A/AD7478A to TMS320C541 Interface
The serial interface on the TMS320C541 uses a continuous
serial clock and frame synchronization signals to synchronize the
data transfer operations with peripheral devices, such as the
AD7476A/AD7477A/AD7478A. The CS input allows easy inter-
facing between the TMS320C541 and the AD7476A/AD7477A/
AD7478A without any glue logic required. The serial port of the
TMS320C541 is set up to operate in burst mode (FSM = 1 in
the serial port control register, SPC) with internal serial clock
CLKX (MCM = 1 in the SPC register) and internal frame signal
(TXM = 1 in the SPC register), so both pins are configured as
outputs. For the AD7476A, the word length should be set to 16 bits
(FO = 0 in the SPC register). This DSP only allows frames with
a word length of 16 bits or 8 bits. Therefore, in the case of the
AD7477A and AD7478A where 14 bits and 12 bits were required,
the FO bit would be set up to 16 bits. This means to obtain the
conversion result, 16 SCLKs are needed. In both situations, the
remaining SCLKs will clock out trailing zeros. For the AD7477A,
two trailing zeros will be clocked out in the last two clock cycles;
for the AD7478A, four trailing zeros will be clocked out.
CS
SCLK 113 15
SDATA
4 LEADING ZEROS
THREE-STATE
t
4
234 16
t
5
t
3
t
2
THREE-STATE
DB7
t
6
t
7
t
8
14
ZERO
ZERO
ZERO
Z
t
1
1/ THROUGHPUT
ZERO ZERO ZERO ZERO
11 12
4 TRAILING ZEROS
t
CONVERT
t
QUIET
B
Figure 15. AD7478A Serial Interface Timing Diagram
SCLK
t1
1511
SDATA
THREE-STATE DB7 DB6 DB0
ZERO
ZERO
ZERO
Z
4 LEADING ZEROS
234
t2
t8
12
1/THROUGHPUT
tACQ
10.5(1/
fSCLK
)
tCONVERT
tQUIET
B
THREE-STATE
CS
Figure 16. AD7478A in a 12 SCLK Cycle Serial Interface
REV. C–20–
AD7476A/AD7477A/AD7478A
To summarize, the values in the SPC register are
FO = 0
FSM = 1
MCM = 1
TXM = 1
The format bit, FO, may be set to 1 to set the word length to
eight bits in order to implement the power-down mode on the
AD7476A/AD7477A/AD7478A.
The connection diagram is shown in Figure 17. It should be noted
that for signal processing applications, it is imperative that the
frame synchronization signal from the TMS320C541 provides
equidistant sampling.
AD7476A/
AD7477A/
AD7478A*SCLK
SDATA
CS
CLKX
CLKR
FSX
FSR
TMS320C541*
*ADDITIONAL PINS OMITTED FOR CLARITY.
DR
Figure 17. Interfacing to the TMS320C541
AD7476A/AD7477A/AD7478A to ADSP-218x
The ADSP-218x family of DSPs are interfaced directly to the
AD7476A/AD7477A/AD7478A without any glue logic required.
The SPORT control register should be set up as follows:
TFSW = RFSW = 1, Alternate Framing
INVRFS = INVTFS = 1, Active Low Frame Signal
DTYPE = 00, Right Justify Data
ISCLK = 1, Internal Serial Clock
TFSR = RFSR = 1, Frame Every Word
IRFS = 0, Sets Up RFS as an Input
ITFS = 1, Sets Up TFS as an Output
SLEN = 1111, 16 Bits for the AD7476A
SLEN = 1101, 14 Bits for the AD7477A
SLEN = 1011, 12 Bits for the AD7478A
To implement the power-down mode, SLEN should be set to
0111 to issue an 8-bit SCLK burst. The connection diagram is
shown in Figure 18. The ADSP-218x has the TFS and RFS of
the SPORT tied together, with TFS set as an output and RFS
set as an input. The DSP operates in alternate framing mode, and
the SPORT control register is set up as described. The frame
synchronization signal generated on the TFS is tied to CS, and,
as with all signal processing applications, equidistant sampling is
necessary. However, in this example, the timer interrupt is used
to control the sampling rate of the ADC and, under certain
conditions, equidistant sampling may not be achieved.
The timer registers, for example, are loaded with a value that will
provide an interrupt at the required sample interval. When an
interrupt is received, a value is transmitted with TFS/DT
(ADC control word). The TFS is used to control the RFS and
thus the reading of data. The frequency of the serial clock is set in
the SCLKDIV register. When the instruction to transmit with
TFS is given, i.e., TX0 = AX0, the state of the SCLK is checked.
The DSP will wait until the SCLK has gone high, low, and high
before transmission will start. If the timer and SCLK values are
chosen such that the instruction to transmit occurs on or near
the rising edge of SCLK, the data may be transmitted or it may
wait until the next clock edge.
For example, the ADSP-2111 has a master clock frequency of
16 MHz. If the SCLKDIV register is loaded with the value 3,
an SCLK of 2 MHz is obtained and eight master clock periods will
elapse for every one SCLK period. If the timer registers are loaded
with the value 803, 100.5 SCLKs will occur between interrupts and
subsequently between transmit instructions. This situation will result
in nonequidistant sampling as the transmit instruction is occurring
on an SCLK edge. If the number of SCLKs between interrupts is a
whole integer figure of N, equidistant sampling will be implemented
by the DSP.
AD7476A/
AD7477A/
AD7478A*
SCLK
SDATA
CS
SCLK
DR
RFS
TFS
ADSP-218x*
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 18. Interfacing to the ADSP-218x
AD7476A/AD7477A/AD7478A to DSP563xx Interface
The connection diagram in Figure 19 shows how the AD7476A/
AD7477A/AD7478A can be connected to the SSI (synchronous
serial interface) of the DSP563xx family of DSPs from Motorola.
The SSI is operated in synchronous and normal mode (SYN = 1
and MOD = 0 in Control Register B, CRB) with internally gener-
ated word frame sync for both Tx and Rx (Bits FSL1 = 0 and
FSL0 = 0 in CRB). Set the word length in Control Register A
(CRA) to 16 by setting Bits WL2 = 0, WL1 = 1, and WL0 = 0
for the AD7476A. The word length for the AD7478A can be set
to 12 bits (WL2 = 0, WL1 = 0, and WL0 = 1). This DSP does not
offer the option for a 14-bit word length, so the AD7477A word
length will be set up to 16 bits, the same as the AD7476A. For the
AD7477A, the conversion process will use 16 SCLK cycles,
with the last two clock periods clocking out two trailing zeros to
fill the 16-bit word.
To implement the power-down mode on the AD7476A/AD7477A/
AD7478A, the word length can be changed to eight bits by setting
Bits WL2 = 0, WL1 = 0, and WL0 = 0 in CRA. The FSP bit in
the CRB register can be set to 1, meaning the frame goes low
and a conversion starts. Likewise, by means of the Bits SCD2,
SCKD, and SHFD in the CRB register, it will be established that
the Pins SC2 (the frame sync signal) and SCK in the serial port
will be configured as outputs and the MSB will be shifted first.
REV. C
AD7476A/AD7477A/AD7478A
–21–
To summarize,
MOD = 0
SYN = 1
WL2, WL1, and WL0 depend on the word length
FSL1 = 1 and FSL0 = 0
FSP = 1, Negative Frame Sync
SCD2 = 1
SCKD = 1
SHFD = 0
It should be noted that for signal processing applications, it is
imperative that the frame synchronization signal from the DSP563xx
will provide equidistant sampling.
AD7476A/
AD7477A
AD7478A*
SDATA
SCLK
CS
DSP563xx*
SCK
SRD
SC2
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 19. Interfacing to the DSP563xx
APPLICATION HINTS
Grounding and Layout
The printed circuit board that houses the AD7476A/AD7477A/
AD7478A should be designed such that the analog and digi-
tal sections are separated and confined to certain areas of the
board. This facilitates the use of ground planes that can be
separated easily. A minimum etch technique is generally best
for ground planes because it gives the best shielding. Digital and
analog ground planes should be joined at only one place. If the
AD7476A/AD7477A/AD7478A is in a system where multiple
devices require an AGND to DGND connection, the connection
should still be made at one point only, a star ground point that
should be established as close as possible to the AD7476A/
AD7477A/AD7478A.
Avoid running digital lines under the device as these will couple
noise onto the die. The analog ground plane should be allowed to
run under the AD7476A/AD7477A/AD7478A to avoid noise
coupling. The power supply lines to the AD7476A/AD7477A/
AD7478A should use as large a trace as possible to provide low
impedance paths and reduce the effects of glitches on the power
supply line. Fast switching signals like clocks should be shielded
with digital grounds to avoid radiating noise to other sections of
the board, and clock signals should never be run near the analog
inputs. Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each other.
This will reduce the effects of feedthrough through the board.
Amicrostrip technique is by far the best but is not always possible
with a double-sided board. In this technique, the component side
of the board is dedicated to ground planes while signals are placed
on the solder side.
Good decoupling is also very important. The supply should be
decoupled with, for instance, a 680 nF 0805 to GND. When using
the SC70 package in applications where the size of the compo-
nents is of concern, a 220 nF 0603 capacitor, for example, could
be used instead. However, in that case, the decoupling may not be
as effective and may result in an approximate SINAD degradation
of 0.3 dB. To achieve the best performance from these decoupling
components, the user should endeavor to keep the distance
between the decoupling capacitor and the V
DD
and GND pins to a
minimum with short track lengths connecting the respective pins.
Figures 20 and 21 show the recommended positions of the decou-
pling capacitor for the MSOP and SC70 packages, respectively.
As can be seen in Figure 20, for the MSOP package, the decoup-
ling capacitor has been placed as close as possible to the IC with
short track lengths to V
DD
and GND pins. The decoupling capacitor
could also be placed on the underside of the PCB directly under-
neath the IC, between the V
DD
and GND pins attached by vias.
This method is not recommended on PCBs above a standard
1.6 mm thickness. The best performance will be seen with the
decoupling capacitor on the top of the PCB next to the IC.
Figure 20. Recommended Supply Decoupling Scheme
for the AD7476A/AD7477A/AD7478A MSOP Package
Similarly, for the SC70 package, the decoupling capacitor
should be located as close as possible to the V
DD
and the GND
pins. Because of its pinout, i.e., V
DD
being next to GND, the
decoupling capacitor can be placed extremely close to the IC.
The decoupling capacitor could be placed on the underside of
the PCB directly under the V
DD
and GND pins, but as before,
the best performance will be achieved with the decoupling
capacitor on the same side as the IC.
Figure 21. Recommended Supply Decoupling Scheme
for the AD7476A/AD7477A/AD7478A SC70 Package
Evaluating the AD7476A/AD7477A Performance
The evaluation board package includes a fully assembled and tested
evaluation board, documentation, and software for controlling
the board from the PC via the EVAL-BOARD CONTROLLER.
The EVAL-BOARD CONTROLLER can be used in conjunction
with the AD7476ACB/AD7477ACB evaluation board, as well
as many other Analog Devices evaluation boards ending in the
CB designator, to demonstrate/evaluate the ac and dc performance
of the AD7476A/AD7477A.
The software allows the user to perform ac (fast Fourier transform)
and dc (histogram of codes) tests on the AD7476A/AD7477A. See
the evaluation board application note for more information.
REV. C–22–
AD7476A/AD7477A/AD7478A
OUTLINE DIMENSIONS
8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
0.23
0.08
0.80
0.40
8ⴗ
0ⴗ
85
4
1
4.90
BSC
PIN 1
0.65 BSC
3.00
BSC
SEATING
PLANE
0.15
0.00
0.38
0.22
1.10 MAX
3.00
BSC
COMPLIANT TO JEDEC STANDARDS MO-187AA
COPLANARITY
0.10
6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
0.22
0.08 0.46
0.36
0.26
8ⴗ
4ⴗ
0ⴗ
0.30
0.15
1.00
0.90
0.70
SEATING
PLANE
1.10 MAX
3
5 4
2
6
1
2.00 BSC
PIN 1
2.10 BSC
0.65 BSC
1.25 BSC
1.30 BSC
0.10 MAX
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203AB
REV. C
AD7476A/AD7477A/AD7478A
–23–
Revision History
Location Page
3/04—Data Sheet changed from REV. B to REV. C.
Added U.S. Patent number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to AD7476A/AD7477A/AD7478A to ADSP-218x section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1/04—Data Sheet changed from REV. A to REV. B.
Changes to AD7476A SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to AD7476A SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to AD7477A SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Changes to AD7478A SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Changes to TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Changes to AD7476A/AD7477A/AD7478A to ADSP-218x section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2/03—Data Sheet changed from REV. 0 to REV. A.
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Change to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Changes to AD7476A/AD7477A/AD7478A to DSP563xx Interface section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
C02930–0–3/04(C)
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