DATASHEET ISL3179E, ISL3180E FN6365 Rev. 6.00 Nov 9, 2017 High ESD Protected, +125C, 40Mbps, 3.3V, Full Fail-Safe RS-485/RS-422 Transceivers The ISL3179E and ISL3180E are high ESD protected (see Table 2 on page 2), 3.3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each device has low bus currents (+220A/-150A), so they present a "1/5 unit load" to the RS-485 bus. This allows up to 160 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. Features Receiver (Rx) inputs feature a "full fail-safe" design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. * High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . . up to 40Mbps The ISL3180E is configured for full duplex applications. The ISL3179E half duplex version multiplexes the Rx inputs and Tx outputs to allow a transceiver with an output disable function in 8 Ld packages. * Full fail-safe (open, shorted, terminated/undriven) receiver Hot plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. * High ESD protection on RS-485 I/O pins - ISL3179E. . . . . . . . . . . . . . . . . . . . . . . . . 16.5kV IEC61000 - ISL3180E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12kV HBM - Class 3 HBM level on all other pins (ISL3179E) . . . . . >9kV * Specified for +125C operation * 5V tolerant logic inputs * 1/5 unit load allows up to 160 devices on the bus * Hot plug - Tx and Rx outputs remain three-state during power-up * Low quiescent current . . . . . . . . . . . . . . . . . . . . . . . 4mA (max) * Low current shutdown mode . . . . . . . . . . . . . . . . . 1A (max) * -7V to +12V common-mode input voltage range Related Literature * For a full list of related documents, visit our website - ISL3179E and ISL3180E product pages * Three-state Rx and Tx outputs * 16/16.5ns (max) Tx/Rx propagation delays; 1.5ns (max) skew * Operates from a single +3.3V supply (10% tolerance) Applications * Current limiting and thermal shutdown for driver overload protection * Motor controller/position encoder systems * Pb-free (RoHS compliant) * Factory automation TABLE 1. KEY DIFFERENCES BETWEEN HIGH-SPEED INTERFACE FAMILY OF PARTS * Field bus networks * Security networks PART NUMBER * Building environmental control systems * Industrial/process control networks FULL/HALF DUPLEX VCC (V) VOD (V) DATA RATE (Mbps) Half 3.3 1.5 40 ISL3180E Full 3.3 1.5 40 ISL3159E Half 5 2.1 40 ISL3259E Half 5 2.1 100 ISL3179E +3.3V +3.3V (SOIC AND MSOP PIN NUMBERS SHOWN) + 8 0.1F 0.1F + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 RO 1 FIGURE 1. TYPICAL OPERATING CIRCUIT - ISL3179E FN6365 Rev. 6.00 Nov 9, 2017 Page 1 of 18 ISL3179E, ISL3180E Ordering Information PART NUMBER (Note 4, 5) PART MARKING TEMP. RANGE (C) PACKAGE (RoHS Compliant) PKG. DWG. # ISL3179EFBZ (Note 1) 3179 EFBZ -40 to +125 8 Ld SOIC M8.15 ISL3179EFUZ (Note 1) 179FZ -40 to +125 8 Ld MSOP M8.118 ISL3179EFRZ (Note 2) 79FZ -40 to +125 10 Ld DFN L10.3x3C ISL3179EIBZ (Note 1) 3179 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3179EIUZ (Note 1) 179IZ -40 to +85 8 Ld MSOP M8.118 ISL3179EIRZ (Note 2) 79IZ -40 to +85 10 Ld DFN L10.3x3C ISL3180EIBZ (Note 3) ISL3180 EIBZ -40 to +85 14 Ld SOIC M14.15 NOTES: 1. Add "-T" suffix for 2.5k unit tape or "-T7A" suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications. 2. Add "-T" suffix for 6k unit tape or "-T7A" suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications. 3. Add "-T" suffix for 2.5k unit tape and reel options. Refer to TB347 for details on reel specifications. 4. Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. For Moisture Sensitivity Level (MSL), refer to the product information page for the ISL3179E and the ISL3180E. For more information about MSL, refer to TB363. TABLE 2. SUMMARY OF FEATURES PART NUMBER HALF/FULL DUPLEX DATA RATE (Mbps) RS-485 PIN ESD LEVEL HOT PLUG? RX/TX ENABLE? QUIESCENT ICC (mA) LOW POWER SHUTDOWN? PIN COUNT ISL3179E HALF 40 16.5kV IEC61000 YES YES 2.6 YES 8, 10 ISL3180E FULL 40 12kV HBM YES YES 2.6 YES 14 FN6365 Rev. 6.00 Nov 9, 2017 Page 2 of 18 ISL3179E, ISL3180E Pin Configurations RO 1 R RE 2 DE 3 DI 4 D ISL3180E (14 LD SOIC) TOP VIEW ISL3179E (10 LD DFN) TOP VIEW ISL3179E (8 LD SOIC, MSOP) TOP VIEW 8 VCC RO 1 10 VCC NC 1 7 B/Z RE 2 9 NC RO 2 8 B/Z RE 3 6 A/Y DE 3 5 GND DI 4 7 A/Y DE 4 NC 5 6 GND DI 5 Truth Table EP 14 VCC 13 NC R 12 A 11 B 10 Z D GND 6 9 Y GND 7 8 NC Truth Table RECEIVING TRANSMITTING INPUTS INPUTS OUTPUTS OUTPUT RE DE Half Duplex DE Full Duplex 0 0 X VAB -0.05V 1 0 0 X -0.05V > VAB > -0.2V Undetermined High-Z 0 0 X VAB -0.2V 0 High-Z* 0 0 X Inputs Open/Shorted 1 1 0 X X High-Z* 1 1 X X High-Z RE DE DI B/Z A/Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z 1 0 X High-Z* NOTE: *Shutdown Mode A-B RO NOTE: *Shutdown Mode Pin Descriptions PIN FUNCTION RO Receiver output: If A-B -50mV, RO is high; If A-B -200mV, RO is low; If A and B are unconnected (floating) or shorted, or connected to a terminated bus that is undriven, RO is high. RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn't required, connect RE directly to GND. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and they are high impedance when DE is low. If the Tx enable function is not required, connect DE to VCC through a 1k or greater resistor. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. This is also the potential of the DFN's exposed metal pad. A/Y 16.5kV IEC61000 ESD protected RS-485/RS-422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1. ISL3179E only. B/Z 16.5kV IEC61000 ESD protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1. ISL3179E only. A 12kV HBM ESD protected RS-485/RS-422 level, noninverting receiver input. ISL3180E only. B 12kV HBM ESD protected RS-485/RS-422 level, inverting receiver input. ISL3180E only. Y 12kV HBM ESD protected RS-485/RS-422 level, noninverting driver output. ISL3180E only. Z 12kV HBM ESD protected RS-485/RS-422 level, inverting driver output. ISL3180E only. VCC System power supply input (3.0V to 3.6V). NC No internal connection. EP The exposed metal pad on the bottom of the DFN; connect to GND. FN6365 Rev. 6.00 Nov 9, 2017 Page 3 of 18 ISL3179E, ISL3180E Typical Operating Circuits (SOIC AND MSOP PIN NUMBERS SHOWN) +3.3V +3.3V + 8 0.1F 0.1F + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 RO 1 R D GND GND 5 5 FIGURE 2. ISL3179E (PIN NUMBERS FOR SOIC) +3.3V +3.3V + 14 VCC 2 RO R A 12 0.1F 0.1F RT + 14 9 Y B 11 VCC D 10 Z 3 RE DE 4 4 DE 5 DI DI 5 RT Z 10 Y 9 D RE 3 11 B R 12 A GND RO 2 GND 6, 7 6, 7 FIGURE 3. ISL3180E FN6365 Rev. 6.00 Nov 9, 2017 Page 4 of 18 ISL3179E, ISL3180E Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A, B, Y, Z, A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short-circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . Refer to "Electrical Specifications" Thermal Resistance (Typical) JA (C/W) JC (C/W) 8 Ld SOIC Package (Note 6) . . . . . . . . . . . . 160 N/A 14 Ld SOIC Package (Note 6) . . . . . . . . . . . 91 N/A 8 Ld MSOP Package (Note 6) . . . . . . . . . . . 132.5 N/A 10 Ld DFN Package (Notes 7, 8) . . . . . . . . 46 3.5 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65C to +150C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to TB493 Operating Conditions Temperature Range ISL3179EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C ISL3179EI, ISL3180EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. Refer to TB379 for details. 7. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. 8. JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with "direct attach" features. Refer to TB379 for details. Electrical Specifications operating temperature range. (Note 9) PARAMETER Test Conditions: VCC = 3.0V to 3.6V; Typicals are at VCC = 3.3V, TA = +25C. Boldface limits apply across the TEMP (C) MIN (Note 19) TYP MAX (Note 19) UNIT RL = 100 (RS-422) (Figure 4A), (Note 18) Full 2 2.3 - V V SYMBOL TEST CONDITIONS DC CHARACTERISTICS Driver Differential VOUT Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States VOD RL = 54 (RS-485) (Figure 4A) Full 1.5 2.1 VCC No load Full - - VCC RL = 60, -7V VCM 12V (Figure 4B), (Note 18) Full 1.5 2 - V VOD RL = 54 or 100 (Figure 4A) Full - 0.01 0.2 V VOC RL = 54 or 100 (Figure 4A) Full - 2 2.5 V VOC RL = 54 or 100 (Figure 4A) Full - 0.02 0.2 V Logic Input High Voltage VIH DI, DE, RE Full 2 - - V Logic Input Low Voltage VIL DI, DE, RE Full - - 0.8 V Logic Input Current IIN1 DI = DE = RE = 0V or VCC Input Current (A, B, A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or 3.6V Y or Z Output Leakage Current Driver Short-Circuit Current, VO = High or Low IOZ IOSD1 Full -2 - 2 A VIN = 12V Full - - 220 A VIN = -7V Full -160 - - A DE = 0V, -7V VY or VZ 12V, ISL3180E only Full -40 - 40 A DE = VCC, -7V VY or VZ 12V (Note 11) Full - - 250 mA Receiver Differential Threshold Voltage V TH -7V VCM 12V Full -200 - -50 mV Receiver Input Hysteresis V TH VCM = 0V 25 - 28 - mV Receiver Output High Voltage VOH IO = -12mA, VID = -50mV Full VCC - 0.5 - - V FN6365 Rev. 6.00 Nov 9, 2017 Page 5 of 18 ISL3179E, ISL3180E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Typicals are at VCC = 3.3V, TA = +25C. Boldface limits apply across the operating temperature range. (Note 9) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP (C) MIN (Note 19) TYP MAX (Note 19) UNIT Receiver Output Low Voltage VOL IO = +10mA, VID = -200mV Full - - 0.4 V Receiver Output Low Current IOL VOL = 1V, VID = -200mV Full 25 - - mA Three-State (high impedance) Receiver Output Current IOZR 0.4V VO 2.4V Full -1 0.015 1 A Receiver Input Resistance RIN -7V VCM 12V Full 54 80 - k Receiver Short-Circuit Current IOSR 0V VO VCC Full 20 - 110 mA DI = DE = 0V or VCC Full - 2.6 4 mA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.05 1 A IEC61000-4-2, Air-gap Discharge Method 25 - 16.5 - kV IEC61000-4-2, Contact Discharge Method 25 - 9 - kV Human Body Model, from bus pins to GND 25 - 16.5 - kV All Pins ISL3179E Only Human Body Model, per JEDEC 25 - >9 - kV Machine Model, per JEDEC 25 - >400 - V RS-485 Pins (A, B, Y, Z) ISL3180E Only IEC61000-4-2, Air-gap Discharge Method 25 - 4 - kV IEC61000-4-2, Contact Discharge Method 25 - 5 - kV SUPPLY CURRENT No-Load Supply Current (Note 10) ICC Shutdown Supply Current ISHDN ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) ISL3179E Only All Pins ISL3180E Only Human Body Model, from bus pins to GND 25 - 12 - kV Human Body Model, per JEDEC 25 - 3 - kV Machine Model, per JEDEC 25 - 150 - V DRIVER SWITCHING CHARACTERISTICS Maximum Data Rate fMAX VOD 1.5V, RD = 54, CL = 100pF (Figure 7) Full 40 60 - Mbps Driver Differential Output Delay tDD RD = 54, CD = 50pF (Figure 5) Full - 11 16 ns Prop Delay Part-to-Part Skew tSKP-P RD = 54, CD = 50pF (Figure 5), (Note 17) Full - - 4 ns Driver Differential Output Skew tSKEW RD = 54, CD = 50pF (Figure 5) Full - 0 1.5 ns Driver Differential Rise or Fall Time tR, tF RD = 54, CD = 50pF (Figure 5) Full - 4 7 ns Driver Enable to Output High tZH RL = 110, CL = 50pF, SW = GND (Figure 6), (Note 12) Full - 18 25 ns Driver Enable to Output Low tZL RL = 110, CL = 50pF, SW = VCC (Figure 6), (Note 12) Full - 16 25 ns Driver Disable from Output High tHZ RL = 110, CL = 50pF, SW = GND (Figure 6) Full - 15 25 ns Driver Disable from Output Low tLZ RL = 110, CL = 50pF, SW = VCC (Figure 6) Full - 18 25 ns (Note 14) Full 60 - 600 ns Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 110, CL = 50pF, SW = GND (Figure 6), (Notes 14, 15) Full - - 1000 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 110, CL = 50pF, SW = VCC (Figure 6), (Notes 14, 15) Full - - 1000 ns Full 40 60 - Mbps Full - 10 16.5 ns Full - - 4 ns RECEIVER SWITCHING CHARACTERISTICS Maximum Data Rate Receiver Input to Output Delay Prop Delay Part-to-Part Skew FN6365 Rev. 6.00 Nov 9, 2017 fMAX VID = 1.5V tPLH, tPHL Figure 8 tSKP-P Figure 8, Note 17 Page 6 of 18 ISL3179E, ISL3180E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Typicals are at VCC = 3.3V, TA = +25C. Boldface limits apply across the operating temperature range. (Note 9) (Continued) PARAMETER TEMP (C) MIN (Note 19) TYP MAX (Note 19) UNIT Figure 8 Full - 0 1.5 ns SYMBOL Receiver Skew | tPLH - tPHL | tSKD TEST CONDITIONS Receiver Enable to Output High tZH RL = 1k, CL = 15pF, SW = GND (Figure 9), (Note 13) Full - 10 15 ns Receiver Enable to Output Low tZL RL = 1k, CL = 15pF, SW = VCC (Figure 9), (Note 13) Full - 11 15 ns Receiver Disable from Output High tHZ RL = 1k, CL = 15pF, SW = GND (Figure 9) Full - 10 15 ns tLZ RL = 1k, CL = 15pF, SW = VCC (Figure 9) Full - 10 15 ns (Note 14) Full 60 - 600 ns Receiver Disable from Output Low Time to Shutdown tSHDN Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1k, CL = 15pF, SW = GND (Figure 9), (Notes 14, 16) Full - - 1000 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1k, CL = 15pF, SW = VCC (Figure 9), (Notes 14, 16) Full - - 1000 ns NOTES: 9. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 10. Supply current specification is valid for loaded drivers when DE = 0V. 11. Applies to peak current. Refer to "Typical Performance Curves" on page 9 for more information. 12. Because of the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 13. Because of the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 14. These ICs are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. Refer to "Low Power Shutdown Mode" on page 13. 15. Keep RE = VCC, and set the DE signal low time >700ns to ensure that the device enters SHDN. 16. Set the RE signal high time >700ns to ensure that the device enters SHDN. 17. This is the part-to-part skew between any two units tested with identical test conditions (Temperature, VCC, etc.). 18. VCC = 3.3V 5%. 19. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z Z DI VOD D 375 DE Y Y RL/2 FIGURE 4A. VOD AND VOC VOD D VOC RL = 60 VCM -7V TO +12V 375 FIGURE 4B. VOD WITH COMMON-MODE LOAD FIGURE 4. DC DRIVER TEST CIRCUITS FN6365 Rev. 6.00 Nov 9, 2017 Page 7 of 18 ISL3179E, ISL3180E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPHL tPLH VCC DE Z DI RD D CD OUT (Z) VOH OUT (Y) VOL Y 90% DIFF OUT (Y - Z) SIGNAL GENERATOR +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH - tPHL| FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 110 VCC D SIGNAL GENERATOR SW Y GND 50pF 3V DE (Note 14) tZH, tZH(SHDN) (Note 14) PARAMETER OUTPUT RE DI SW tHZ Y/Z X 1/0 GND tLZ Y/Z X 0/1 VCC tZH Y/Z 0 (Note 12) 1/0 GND tZL Y/Z 0 (Note 12) 0/1 VCC tZH(SHDN) Y/Z 1 (Note 15) 1/0 GND tZL(SHDN) Y/Z 1 (Note 15) 0/1 VCC 1.5V 1.5V 0V OUTPUT HIGH tHZ VOH - 0.5V 50% OUT (Y, Z) VOH 0V tZL, tZL(SHDN) tLZ (Note 14) VCC OUT (Y, Z) 50% OUTPUT LOW VOL + 0.5V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6A. TEST CIRCUIT FIGURE 6. DRIVER ENABLE AND DISABLE TIMES VCC DE + Z DI 54 D CL VOD Y SIGNAL GENERATOR 3V DI 0V - CL +VOD DIFF OUT (Y - Z) -VOD FIGURE 7A. TEST CIRCUIT 0V FIGURE 7B. MEASUREMENT POINTS FIGURE 7. DRIVER DATA RATE FN6365 Rev. 6.00 Nov 9, 2017 Page 8 of 18 ISL3179E, ISL3180E Test Circuits and Waveforms (Continued) RE +1.5V +3V 15pF B R A A RO 1.5V 1.5V 0V tPLH tPHL VCC SIGNAL GENERATOR 1.7V RO 1.7V 0V FIGURE 8A. TEST CIRCUIT FIGURE 8B. MEASUREMENT POINTS FIGURE 8. RECEIVER PROPAGATION DELAY RE GND B A R 1k RO VCC (Note 14) 3V GND SW SIGNAL GENERATOR RE 15pF 1.5V 1.5V 0V PARAMETER DE A SW tHZ 0 +1.5V GND tLZ 0 -1.5V VCC tZH (Note 13) 0 +1.5V GND tZL (Note 13) 0 -1.5V VCC tZH(SHDN) (Note 16) 0 +1.5V GND tZL(SHDN) (Note 16) 0 -1.5V VCC tZH, tZH(SHDN) (Note 14) OUTPUT HIGH tHZ VOH - 0.5V 1.5V RO VOH 0V tZL, tZL(SHDN) (Note 14) tLZ VCC RO 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 9B. MEASUREMENT POINTS FIGURE 9A. TEST CIRCUIT FIGURE 9. RECEIVER ENABLE AND DISABLE TIMES Typical Performance Curves VCC = 3.3V, TA = +25C; unless otherwise specified 90 DRIVER OUTPUT CURRENT (mA) +85C +25C 70 RD = 33 +125C 60 50 RD = 54 40 30 RD = 100 20 10 0 0 0.5 1.0 1.5 2.0 2.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 3.0 3.3 FIGURE 10. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FN6365 Rev. 6.00 Nov 9, 2017 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.40 80 2.35 2.30 RD = 100 2.25 2.20 2.15 2.10 2.05 2.00 RD = 54 1.95 1.90 -40 -15 10 35 60 TEMPERATURE (C) 85 110 FIGURE 11. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE Page 9 of 18 125 ISL3179E, ISL3180E Typical Performance Curves VCC = 3.3V, TA = +25C; unless otherwise specified (Continued) 2.40 150 Y OR Z = LOW 2.35 100 OUTPUT CURRENT (mA) DE = VCC, RE = X OR DE = GND, RE = GND 2.30 ICC (mA) 50 0 2.25 2.20 -50 2.15 Y OR Z = HIGH -100 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 2.10 -40 12 10 35 60 85 110 125 TEMPERATURE (C) FIGURE 12. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FIGURE 13. SUPPLY CURRENT vs TEMPERATURE 0.25 13.0 |tPLH - tPHL| 12.5 0.20 12.0 PROPAGATION DELAY (ns) -15 11.0 SKEW (ns) 11.5 tPLH 10.5 tPHL 10.0 0.15 0.10 9.5 0.05 9.0 8.5 -15 10 35 60 85 0 -40 110 125 -15 10 TEMPERATURE (C) 0 5 RO 0 3 2 1 Y-Z 0 -1 -2 -3 TIME (5ns/DIV) FIGURE 16. DRIVER AND RECEIVER WAVEFORMS FN6365 Rev. 6.00 Nov 9, 2017 RECEIVER OUTPUT (V) 5 DRIVER INPUT (V) DI 60 85 125 110 FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE RDIFF = 54, CD = 50pF 35 TEMPERATURE (C) RDIFF = 54, CD = 50pF DI 5 0 5 RO 0 3 2 1 0 -1 Y-Z -2 -3 TIME (5ns/DIV) FIGURE 17. DRIVER AND RECEIVER WAVEFORMS Page 10 of 18 DRIVER INPUT (V) 8.0 -40 ISL3179E, ISL3180E 0 5.0 RO 0 DRIVER+CABLE DELAY 3.0 DI = 2Mbps 0 5.0 A-B 0 -1.5 -3.0 TIME (10ns/DIV) RO 0 (~160ns) 1.5 5 3.0 DRIVER+CABLE DELAY 1.5 (~720ns) A-B 0 -1.5 -3.0 TIME (200ns/DIV) FIGURE 18. DRIVER AND RECEIVER WAVEFORMS DRIVING 100' (31m) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120) FIGURE 19. DRIVER AND RECEIVER WAVEFORMS DRIVING 500' (152m) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120) RECEIVER OUTPUT CURRENT (mA) 60 VOL +25C 50 VOH +25C VOL +85C 40 VOL +125C VOH +125C 30 VOH +85C 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.3 RECEIVER OUTPUT VOLTAGE (V) FIGURE 20. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE Die Characteristics SUBSTRATE AND DFN THERMAL PAD POTENTIAL (POWERED UP): GND PROCESS: Si Gate BiCMOS FN6365 Rev. 6.00 Nov 9, 2017 DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) DI = 40Mbps DRIVER INPUT (V) VCC = 3.3V, TA = +25C; unless otherwise specified (Continued) RECEIVER INPUT (V) RECEIVER INPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves Page 11 of 18 ISL3179E, ISL3180E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 receivers on each bus, assuming one unit load devices. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any mix of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common-mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for cable lengths as long as 4000ft (~1200m), so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Receiver (Rx) Features This transceiver utilizes a differential input receiver for maximum noise immunity and common-mode rejection. Input sensitivity is 200mV, as required by the RS-422 and RS-485 specifications. Receiver inputs function with common-mode voltages as great as +9/-7V outside the power supplies (+12V and -7V), making them ideal for long networks, or industrial environments, where induced voltages are a realistic concern. The receiver input resistance of 50k surpasses the RS-422 specification of 4k, and is five times the RS-485 "Unit Load" (UL) requirement of 12k minimum. Thus, the ISL3179E is known as a "one-fifth UL" transceiver, and there can be up to 160 devices on the RS-485 bus while still complying with the RS-485 loading specification. The receiver is a "full fail-safe" version that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). Rx outputs deliver large low state currents (typically 28mA at VOL = 1V) to ease the design of optically coupled isolated networks. Receivers easily meet the 40Mbps data rate supported by the driver, and the receiver output is tri-statable through the active low RE input. Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 1.5V across a 54 load (RS-485), and at least 2V across a 100 load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. Driver outputs are not slew rate limited, so faster output transition times allow data rates of at least 40Mbps. Driver outputs are tri-statable through the active high DE input. FN6365 Rev. 6.00 Nov 9, 2017 For parallel applications, bit-to-bit skews between any two transmitter and receiver pairs are guaranteed to be no worse than 8ns (4ns max for any two Tx, 4ns max for any two Rx). ESD Protection All pins on the ISL3179E include Class 3 (>9kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of 16.5kV HBM (ISL3179E) or 12kV HBM (ISL3180E), and 16.5kV (ISL3179E) or 4kV (ISL3180E) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that can destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common-mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (for example, transient suppression diodes) and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard's lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into the ISL3179E's RS-485 pins allows the design of equipment meeting Level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is more difficult to obtain repeatable results. The ISL3179E RS-485 pins withstand 16.5kV air-gap discharges, while the ISL3180E RS-485 pins withstand 4kV. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kV. The RS-485 pins of the ISL3179E survive 9kV contact discharges, while the ISL3180E's RS-485 pins withstand 5kV. Hot Plug Function When a piece of equipment powers up, a period of time occurs in which the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3179E and ISL3180E incorporate a Page 12 of 18 ISL3179E, ISL3180E DE, DI = VCC RE = GND 2.5V 2.3V 2 VCC 0 4 RL = 1k 2 0 A/Y ISL3179E RL = 1k RO ISL3179E 4 2 0 RECEIVER OUTPUT (V) DRIVER Y OUTPUT (V) 4 VCC (V) "hot plug" function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~2.4V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. TIME (40s/DIV) FIGURE 21. HOT PLUG PERFORMANCE (ISL3179E) vs ISL83485 WITHOUT HOT PLUG CIRCUITRY Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000ft, but the maximum system data rate decreases as the transmission length increases. Devices operating at 40Mbps are limited to lengths less than 100ft. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common-mode signals, which are effectively rejected by the differential receiver in this IC. Built-in Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These transmitters meet this requirement using driver output short circuit current limits and on-chip thermal shutdown circuitry. The driver output stages incorporate short-circuit current limiting circuitry, which ensures that the output current never exceeds the RS-485 specification, even at the common-mode voltage range extremes. In the event of a major short-circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about +15C. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode The BiCMOS transceivers use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 50nA trickle. The devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 12, 13, 14, 15 and 16 at the end of "Electrical Specifications" on page 5 for more information. Proper termination is imperative to minimize reflections. In pointto-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. The ISL3179E and ISL3180E may also be used at slower data rates over longer cables, but some limitations apply. The Rx is optimized for high speed operation, so its output may glitch if the Rx input differential transition times are too slow. Keeping the transition times below 500ns, which equates to the Tx driving a 1000ft (305m) CAT 5 cable, yields excellent performance over the full operating temperature range. FN6365 Rev. 6.00 Nov 9, 2017 Page 13 of 18 ISL3179E, ISL3180E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE Nov 9, 2017 FN6365.6 Added the Related Literature section. Updated the Receiving Truth Table on page 3. Updated the header/footer. Aug 25, 2015 FN6365.5 Added Key Differences table to page 1. Jul 8, 2015 FN6365.4 Reformatted datasheet to newest template and standards. Features, page 1 - Changed: "- Class 3 HBM Level on all Other Pins.....>9kV" to: "- Class 3 HBM level on all other pins (ISL3179E).....>9kV" Pin Description on page 3 - Added row for EP pin and added to description of GND. Elec Spec table, page 6 ESD Performance section: Added "ISL3179E Only" to All Pins and changed Test Conditions for HBM and Machine Model to "per JEDEC". - Added 2 rows for "All Pins, ISL3180E Only" Updated note references on Figures 6B and 9B. Die Characteristics section on page 11: removed Transistor Count ESD Protection on page 12 - removed "and ISL3180E" from 1st sentence. Added Revision History table and About Intersil section. Updated POD L10.3x3C on page 16 from rev 2 to rev 4. Changes since rev 2: - Removed package outline and included center to center distance between lands on recommended land pattern. - Removed Note 4 "Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip." since it is not applicable to this package. Renumbered notes accordingly. - Tiebar Note 4 updated From: Tiebar shown (if present) is a non-functional feature. To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). Updated POD M8.15 on page 17 from rev 3 to rev 4. Changes since rev 3: - Changed Note 1 "1982" to "1994" About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information page found at www.intersil.com. For a listing of definitions and abbreviations of common terms used in our documents, visit www.intersil.com/glossary. You can report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. (c) Copyright Intersil Americas LLC 2007-2017. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6365 Rev. 6.00 Nov 9, 2017 Page 14 of 18 ISL3179E, ISL3180E Package Outline Drawing For the most recent package outline drawing, see M8.118. M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 4, 7/11 5 3.00.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.90.15 3.00.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 0.15 0.25 33 0.85010 H DETAIL "X" C SEATING PLANE 0.25 - 0.36 0.08 M C A-B D 0.10 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN FN6365 Rev. 6.00 Nov 9, 2017 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. Page 15 of 18 ISL3179E, ISL3180E Package Outline Drawing For the most recent package outline drawing, see L10.3x3C. L10.3x3C 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 4, 3/15 3.00 5 PIN #1 INDEX AREA A B 10 5 PIN 1 INDEX AREA 1 2.38 3.00 0.50 2 10 x 0.25 6 (4X) 0.10 C B 1.64 TOP VIEW 10x 0.40 BOTTOM VIEW (4X) 0.10 M C B SEE DETAIL "X" (10 x 0.60) (10x 0.25) 0.90 MAX 0.10 C BASE PLANE 2.38 0.20 C SEATING PLANE 0.08 C SIDE VIEW (8x 0.50) 1.64 2.80 TYP C TYPICAL RECOMMENDED LAND PATTERN 0.20 REF 4 0.05 DETAIL "X" NOTES: FN6365 Rev. 6.00 Nov 9, 2017 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 6. Compliant to JEDEC MO-229-WEED-3 except for E-PAD dimensions. Page 16 of 18 ISL3179E, ISL3180E Package Outline Drawing For the most recent package outline drawing, see M8.15. M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8 0 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW "B" TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW "A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 20. Dimensioning and tolerancing per ANSI Y14.5M-1994. 21. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 22. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 23. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 24. Terminal numbers are shown for reference only. 25. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 26. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 27. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6365 Rev. 6.00 Nov 9, 2017 Page 17 of 18 ISL3179E, ISL3180E Package Outline Drawing For the most recent package outline drawing, see M14.15. M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.220.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45 4 4 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 indentifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN FN6365 Rev. 6.00 Nov 9, 2017 Page 18 of 18 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Intersil: ISL3179EFBZ ISL3179EFBZ-T ISL3179EFBZ-T7A ISL3179EFRZ ISL3179EFRZ-T ISL3179EFUZ ISL3179EFUZ-T ISL3179EIBZ ISL3179EIBZ-T ISL3179EIBZ-T7A ISL3179EIRZ ISL3179EIRZ-T ISL3179EIUZ ISL3179EIUZ-T ISL3180EIBZ ISL3180EIBZ-T ISL3179EFUZ-T7A ISL3179EIRZ-T7A ISL3179EFRZ-T7A ISL3179EIUZ-T7A