Technical Data DS4312 Effective December 2015 Supersedes December 2007 HC9 High current power inductors Applications Product description * Surface mount inductors designed for higher speed switch mode applications requiring lower inductance, low voltage and high current * Design utilizes high temperature powder iron material with a non-organic binder to eliminate thermal aging * Inductance Range from 0.2H to 47.0H * Current Range from 3.65 amps to 95.0 amps * Frequency Range 1kHz to 500kHz * Multi-phase regulators * Voltage Regulator Modules (VRMs) * Distributed power systems DC-DC converters * Desktop and server VRMs and EVRDs * Point-of-Load (POL) modules * Field Programmable Gate Array (FPGA) DC-DC converters * Battery power systems * High current power supplies * Data networking and storage systems Environmental data * Storage temperature range (component): -40C to +155C * Operating temperature range: -40C to +155C (Ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020D compliant Pb HC9 High current power inductors Technical Data DS4312 Effective December 2015 Product specifications Part number6 OCL1 (H) 15% lrms2 (amps) lsat3 (amps) 20% rolloff lsat4 (amps) 30% rolloff DCR (m) maximum @ 20C Volt-sec5 (V-s) HC9-R20-R 0.218 46.7 65 95 0.50 2.87 HC9-R47-R 0.544 33.7 40 57 0.88 4.78 HC9-1R0-R 1.04 23.7 28 41 1.87 6.70 HC9-1R5-R 1.70 21.0 22 32 2.27 8.46 HC9-2R2-R 2.53 17.2 18 26 3.37 10.4 HC9-3R3-R 3.52 14.3 15 22 4.87 12.4 HC9-4R3-R 4.67 13.0 13.2 19.1 5.90 14.4 HC9-6R8-R 7.45 10.3 11.4 15.1 9.40 18.1 HC9-100-R 10.9 8.50 8.6 12.5 14.0 22.0 HC9-220-R 22.4 6.30 6.0 8.7 25.7 31.5 HC9-330-R 34.5 4.42 4.8 7.0 48.8 37.3 HC9-470-R 49.2 3.65 3.9 5.7 72.3 44.8 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25C 2. Irms: DC current for an approximately T of 40C without core loss. Derating is necessary for AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155C under worst case conditions verified in the end application. 3. Peak current for approximately 20% rolloff @20C 4. Peak current for approximately 30% rolloff @20C 5. Applied Volt-Time product (V-s) across the inductor. This value represents the applied V-s at operating frequency necessary to generate additional core loss which contributes to the 40C temperature rise. De-rating of the Irms is required to prevent excessive temperature rise. The 100% Vs rating is equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option). 6. Part number definition: HC9-xxx-R HC9= Product code and size xxx = Inductance in H. R = decimal point. If no R is present last character equals number of zeros. -R suffix = RoHS compliant Dimensions-mm HC9-xxx-R Part marking: HC9= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are 0.2 millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information-mm Supplied in tape and reel packaging, 450 parts per reel, 13" diameter reel. HC9-xxx-R 2 www.eaton.com/elx HC9 High current power inductors Technical Data DS4312 Effective December 2015 Rolloff Core loss www.eaton.com/elx 3 HC9 High current power inductors Technical Data DS4312 Effective December 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. DS4312 December 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Eaton: HC9-R20-R HC9-R47-R HC9-1R0-R HC9-1R5-R HC9-100-R HC9-2R2-R HC9-220-R HC9-3R3-R HC9-330-R HC9-4R3-R HC9-470-R HC9-6R8-R