TD62593,594,597,598AFN TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62593AFNG, TD62594AFNG, TD62597AFNG, TD62598AFNG 8CH SINGLE DRIVER : COMMON EMITTER The TD62593, 4, 7, 8AFNG are comprised of eight NPN Transistor Arrays. Applications include relay, hammer, lamp and display (LED) drivers. This devices are a product for the Pb free(Sn-Ag). FEATURES Package Type : SSOP18pin (0.65 mm pitch) High Sustaining Voltage Output : 50 V (MIN) Low Saturation Voltage : VCE (sat) = 0.8 V @IOUT = 150 mA*Inputs Compatible with Various type Logic. TD62593, TD62597AFNG : RIN = 2.7 k TTL, 5 V CMOS TD62594, TD62598AFNG : RIN = 10.5 k 6~15 V PMOS, CMOS Weight: 0.09 g (Typ.) PIN CONNECTION (TOP VIEW) TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG SCHEMATICS (EACH DRIVER) TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG TD62593AFNG RIN=2.7k TD62594AFNG RIN=10.5k Note: TD62597AFNG RIN=2.7k TD62598AFNG RIN=10.5k The input and output parasitic diodes cannot be used as clamp diodes. 1 2005-03-29 TD62593,594,597,598AFN MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIC SYMBOL RATING UNIT Collector-Emitter Voltage VCEO 50 V Collector-Base Voltage VCBO 50 V Clamp Diode Reverse Voltage VR (Note 1) 50 V IC 200 mA / ch VIN -0.5~30 V Collector Current Input Voltage Power Dissipation PD (Note 2) 0.96 W Operating Temperature Topr -40~85 C Storage Temperature Tstg -55~150 C Note 1: Except TD62593AFNG, TD62594AFNG Note 2: On Glass Epoxy PCB (50 x 50 x1.6 mm Cu 40%) RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Collector-Emitter Voltage VCEO 0 50 V Collector-Base Voltage VCBO 0 50 V IC 0 150 mA / ch Collector Current Clamp Diode Reverse Voltage VR (Note 1) 7 50 V Input Voltage VIN 0 25 V Input Current IIN 0 10 mA 2.4 25 7.0 25 0.4 W MIN TYP. MAX UNIT 10 A Input Voltage (Output On) TD62593AFNG TD62597AFNG TD62594AFNG TD62598AFNG Power Dissipation V VIN (ON) PD (Note 2) Note 1: Except TD62593AFNG, TD62594AFNG Note 2: On Glass Epoxy PCB (50 x 50 x 1.6 mm Cu 40%) ELECTRICAL CHARACTERISTICS (Ta = 25C) SYMBOL TEST CIR- CUIT ICEX 1 Output Saturation Voltage VCE (sat) 2 DC Current Transfer Ratio hFE 2 IIN (ON) 3 CHARACTERISTIC Output Leakage Current Input Current TD62593AFNG TD62597AFNG TD62594AFNG TD62598AFNG Turn-On Delay tON Turn-Off Delay tOFF 4 TEST CONDITION VCE = 50 V, VIN = 0 IC = 10 mA, IIN = 0.4 mA 0.2 IC = 150 mA, IIN = 3.0 mA 0.8 VCE = 10 V, IC = 10 mA 50 VIN = 2.4 V, IC = 50 mA 0.9 VIN = 7.0 V, IC = 50 mA 0.9 0.1 3.0 V mA VOUT = 50 V, RL = 330 2 s 2005-03-29 TD62593,594,597,598AFN TEST CIRCUIT 1. ICEX 2. hFE, VCE (sat) 3. IIN (ON) 4. tON, tOFF Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 5 ns, tf 10 ns Note 2: See below Input Condition TYPE NUMBER RIN VIH TD62593AFNG, TD62597AFNG 0 3V TD62594AFNG, TD62598AFNG 0 10 V Note 3: CL includes probe and jig capacitance PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 3 2005-03-29 TD62593,594,597,598AFN TD62594AFNG TD62598AFNG TD62593AFNG TD62597AFNG 4 2005-03-29 TD62593,594,597,598AFN PACKAGE DIMENSIONS SSOP18-P-225-0.65 Unit: mm Weight: 0.09 g (Typ.) 5 2005-03-29 TD62593,594,597,598AFN About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 6 2005-03-29