TD62593,594,597,598AFN
2005-03-29
1
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62593AFNG, TD62594AFNG, TD62597AFNG, TD62598AFNG
8CH SINGLE DRIVER : COMMON EMITTER
The TD62593, 4, 7, 8AFNG are comprised of eight NPN
Transistor Arrays.
Applications include relay, hammer, lamp and display (LED)
drivers.
This devices are a product for the Pb free(Sn-Ag).
FEATURES
Package Type : SSOP18pin (0.65 mm pitch)
High Sustaining Voltage Output : 50 V (MIN)
Low Saturation Voltage : VCE (sat) = 0.8 V
@IOUT = 150 mA·Inputs Compatible with Various type Logic.
TD62593, TD62597AFNG : RIN = 2.7 kΩ TTL, 5 V CMOS
TD62594, TD62598AFNG : RIN = 10.5 kΩ 6~15 V PMOS, CMOS
PIN CONNECTION (TOP VIEW)
TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG
SCHEMATICS (EACH DRIVER)
TD62593AFNG, TD62594AFNG TD62597AFNG, TD62598AFNG
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Weight: 0.09 g (Typ.)
TD62593AFNG RIN=2.7kΩ
TD62594AFNG RIN=10.5
k
TD62597AFNG RIN=2.7kΩ
TD62598AFNG RIN=10.5
k
TD62593,594,597,598AFN
2005-03-29
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MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Collector−Emitter Voltage VCEO 50 V
Collector−Base Voltage VCBO 50 V
Clamp Diode Reverse Voltage VR (Note 1) 50 V
Collector Current IC 200 mA / ch
Input Voltage VIN −0.5~30 V
Power Dissipation PD (Note 2) 0.96 W
Operating Temperature Topr −40~85 °C
Storage Temperature Tstg −55~150 °C
Note 1: Except TD62593AFNG, TD62594AFNG
Note 2: On Glass Epoxy PCB (50 × 50 ×1.6 mm Cu 40%)
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Collector−Emitter Voltage VCEO 0 ― 50 V
Collector−Base Voltage VCBO 0 ― 50 V
Collector Current IC 0 ― 150
mA /
ch
Clamp Diode Reverse Voltage VR (Note 1) 7 ― 50 V
Input Voltage VIN 0 ― 25 V
Input Current IIN 0 ― 10 mA
TD62593AFNG
TD62597AFNG 2.4 ― 25
Input Voltage
(Output On) TD62594AFNG
TD62598AFNG
VIN (ON)
7.0 ― 25
V
Power Dissipation PD (Note 2) ― ― 0.4 W
Note 1: Except TD62593AFNG, TD62594AFNG
Note 2: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC SYMBOL
TEST
CIR−
CUIT
TEST CONDITION MIN TYP. MAX UNIT
Output Leakage Current ICEX 1 VCE = 50 V, VIN = 0 ― ― 10 µA
IC = 10 mA, IIN = 0.4 mA ― ― 0.2
Output Saturation Voltage VCE (sat) 2
IC = 150 mA, IIN = 3.0 mA ― ― 0.8
V
DC Current Transfer Ratio hFE 2 VCE = 10 V, IC = 10 mA 50 ― ―
TD62593AFNG
TD62597AFNG VIN = 2.4 V, IC = 50 mA ― ― 0.9
Input Current
TD62594AFNG
TD62598AFNG
IIN (ON) 3
VIN = 7.0 V, IC = 50 mA ― ― 0.9
mA
Turn−On Delay tON ― 0.1 ―
Turn−Off Delay tOFF
4 VOUT = 50 V, RL = 330 Ω
― 3.0 ―
µs
TD62593,594,597,598AFN
2005-03-29
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TEST CIRCUIT
1. ICEX 2. hFE, VCE (sat) 3. IIN (ON)
4. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: See below
Input Condition
TYPE NUMBER RIN VIH
TD62593AFNG, TD62597AFNG 0 Ω 3 V
TD62594AFNG, TD62598AFNG 0 Ω 10 V
Note 3: CL includes probe and jig capacitance
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short−circuit between outputs, air contamination fault, or fault by improper grounding.
TD62593,594,597,598AFN
2005-03-29
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TD62593AFNG
TD62597AFNG
TD62594AFNG
TD62598AFNG
TD62593,594,597,598AFN
2005-03-29
5
PACKAGE DIMENSIONS
SSOP18−P−225−0.65 Unit: mm
Weight: 0.09 g (Typ.)
TD62593,594,597,598AFN
2005-03-29
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature
= 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
= 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EBA
RESTRICTIONS ON PRODUCT USE
